HLMP-HM59-QT0DD [AVAGO]
SINGLE COLOR LED, GREEN, 5mm, PLASTIC PACKAGE-2;
| 型号： | HLMP-HM59-QT0DD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | SINGLE COLOR LED, GREEN, 5mm, PLASTIC PACKAGE-2 光电 |
| 文件： | 总7页 (文件大小：377K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-Hxxx
5 mm Standard Oval Super Bright
Precision Optical Performance
Red,Green and Blue LEDs
Data Sheet
LED Part Numbers
HLMP-HD57, HLMP-HM59, HLMP-HB59
Description
Features
These Precision Optical Performance Oval LEDs are
specifically designed for full color/video and
passenger information signs. The oval shaped
radiation pattern and high luminous intensity
ensure these devices are excellent for wide field of
view outdoor applications where a wide viewing
angle and readability in sunlight are essential. These
lamps have very smooth, matched radiation patterns
ensuring consistent color mixing in full color
applications, message uniformity across the viewing
angle of the sign. High efficiency LED material is
used in these lamps: Aluminium Indium Gallium
Phosphide (AlInGaP) for red and Indium Gallium
Nitride (InGaN) for blue and green.
• Well defined spatial radiation pattern
• High brightness material
• Available in red, green and blue color
• New flip chip InGaN technology with protective diode
for blue and green
• ESD class 3
Benefits
• Viewing angle designed for wide field of view
applications
• Superior performance for outdoor environments
Applications
• Full color signs
• Commercial outdoor advertising
Package Dimensions
NOTE: MEASURED JUST ABOVE FLANGE.
1.50 0.15
(0.05ꢀ 0.00ꢁ)
10.85 0.50
(0.427 0.01ꢀ)
3.80
(0.150)
0.50 0.10
0.70
SQ. TYP.
MAX.
(0.020 0.004)
(0.028)
2.54
(0.10)
5.20
(0.204)
CATHODE
LEAD
1.50
(0.05ꢀ)
MAX.
1.00
(0.03ꢀ)
MIN.
7.00
(0.275)
24.00
(0.ꢀ45)
MIN.
Device Selection Guide
Luminous Intensity Iv (mcd) at 20 mA
Typical Dominant
Part Number
Color
Wavelength λ (nm)
Minimum
0.68
Typical
0.87
Maximum
1.90
Lens Type
d
HLMP-HD57-NR0xx
HLMP-HM59-QT0xx
Red
630
530
470
Tinted, diffused
Tinted, diffused
Tinted, diffused
Green
Blue
1.15
1.70
3.20
HLMP-HB59-KN0xx
0.31
0.50
0.88
Notes:
1. Tolerance for luminous intensity measurement is 15%.
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. The dominant wavelength, λ , is derived from the Chromaticity Diagram and represents the color of the lamp.
d
5. LEDlightoutputisbrightenoughtocauseinjuriestotheeyes.PrecautionsmustbetakentopreventlookingdirectlyattheLEDwithoutpropersafetyequipment.
Part Numbering System
HLMP - x x 5x - x x x xx
Mechanical Option
00: Bulk
DD: Ammo pack
Color Bin Option
0: Full color bin distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Color
B: Blue 470 nm
M: Green 530 nm
R: Red 630 nm
Package
H: 5 mm Standard Oval
Absolute Maximum Ratings at T = 25˚C
A
Parameter
Red
Blue and Green
Units
mA
mA
mA
mW
°C
[1]
DC Forward Current
50
30
[2]
Peak Pulsed Forward Current
100
100
Average Forward Current
Power Dissipation
30
30
130
105
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
130
130
–40 to +100
–40 to +120
–40 to +85
–40 to +100
°C
°C
Notes:
1. Derate linearly as shown in Figure 3.
2. Duty factor 30%, frequency 1 KHz.
2
Electrical/Optical Characteristics
T = 25°C
A
Value
Min.
Parameters
Symbol
Typ.
Max.
Units
Test Condition
I = 20 mA
Forward Voltage
V
C
V
F
V
F
Red
Green
Blue
2.20
3.20
3.40
2.40
4.00
4.00
Capacitance
Red
pF
V = 0, f = 1 MHz
F
40
53
53
Green
Blue
[1]
Reverse Voltage
R
V
Red
Green
Blue
5.0
0.6
0.6
I = 100 µA
R
I = 10 µA
R
R
I = 10 µA
Thermal Resistance
Rθ
240
°C/W
LED Junction to cathode lead
J-PIN
[2,3]
Dominant Wavelength
λ
nm
I = 20 mA
F
d
Red
Green
Blue
622
520
460
630
530
470
634
540
480
Peak Wavelength
λ
nm
Peak of wavelength of
spectral distribution at
I = 20 mA
F
PEAK
Red
Green
Blue
639
523
466
Spectral Half Width
∆λ
Wavelength width at spectral
distribution power point at
I = 20 mA
F
1/2
Red
Green
Blue
17
30
21
[4]
Luminous Efficacy
η
v
lm/W
Emitted luminous power/
Emitted radiant power
Red
Green
Blue
155
588
62
Notes:
1. The reverse voltage of blue and green is equivalent to the forward voltage of the protective chip at I = 10 µA.
R
2. The dominant wavelength, λ , is derived from the Chromaticity Diagram and represents the color of the lamp.
d
3. Tolerance for each color bin limit is 0.5 nm.
4. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/η , where Iv is the luminous intensity in candelas and
v
η is the luminous efficacy in lumens/watt.
v
3
40
30
20
2.5
2.0
1.5
1.0
0.5
0
1.0
0.5
0
BLUE
GREEN
RED
R
= 585 °C/W
θJ-A
RED
R
= 780 °C/W
θJ-A
BLUE & GREEN
10
0
0
20
40
60
80
100
0
10
20
30
40
50
380 430 480 530 580 ꢁ30 ꢁ80 730
DC FORWARD CURRENT – mA
AMBIENT TEMPERATURE – °C
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
Figure 2. Relative luminous intensity vs.
forward current.
Figure 3. Forward current vs. ambient
temperature.
50
1.020
GREEN
1.015
40
RED
30
1.010
1.005
GREEN
20
BLUE
10
1.000
BLUE
0.995
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
– FORWARD VOLTAGE – V
0
5
10
15
20
25
30
V
DC FORWARD CURRENT – mA
F
Figure 4. Forward current vs. forward
voltage.
Figure 5. Relative dominant wavelength vs.
DC forward current.
1
1
BLUE & GREEN
RED
0.5
0.5
BLUE &
GREEN
RED
0
0
-90 -70 -50 -30 -10 10 30 50 70 90
-90 -70 -50 -30 -10 10 30 50 70 90
ANGULAR DISPLACEMENT – DEGREES
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Spatial radiation pattern – major axis. Figure 7. Spatial radiation pattern – minor axis.
4
Intensity Bin Limits Table
Blue Color Bin Table
Intensity (mcd) at 20 mA
Min. Max.
310 400
Bin
Min. Dom.
Max. Dom.
Xmin.
0.1440
0.1818
0.1374
0.1766
0.1291
0.1699
0.1187
0.1616
0.1063
0.1517
Ymin.
Xmax.
0.1766
0.1374
0.1699
0.1291
0.1616
0.1187
0.1517
0.1063
0.1397
0.0913
Ymax.
0.0966
0.0374
0.1062
0.0495
0.1209
0.0671
0.1423
0.0945
0.1728
0.1327
Bin
K
1
460.0
464.0
0.0297
0.0904
0.0374
0.0966
0.0495
0.1062
0.0671
0.1209
0.0945
0.1423
L
400
520
2
3
4
5
464.0
468.0
472.0
476.0
468.0
472.0
476.0
480.0
M
N
P
520
680
680
880
880
1150
1500
1900
2500
3200
Q
1150
1500
1900
2500
R
S
T
Tolerance for each bin limit is 0.5 nm.
Tolerance for each bin limit is 15%.
Green Color Bin Table
Bin
Min. Dom.
Max. Dom.
Xmin.
0.0743
0.1650
0.1060
0.1856
0.1387
0.2068
0.1702
0.2273
0.2003
0.2469
Ymin.
Xmax.
0.1856
0.1060
0.2068
0.1387
0.2273
0.1702
0.2469
0.2003
0.2659
0.2296
Ymax.
0.6556
0.8292
0.6463
0.8148
0.6344
0.7965
0.6213
0.7764
0.6070
0.7543
1
520.0
524.0
0.8338
0.6586
0.8292
0.6556
0.8148
0.6463
0.7965
0.6344
0.7764
0.6213
2
3
4
5
524.0
528.0
532.0
536.0
528.0
532.0
536.0
540.0
Tolerance for each bin limit is 0.5 nm.
Red Color Range
Min. Dom.
Max. Dom.
Xmin.
Ymin.
Xmax.
Ymax.
622
634
0.6904
0.6726
0.3094
0.3106
0.6945
0.7135
0.2888
0.2865
Tolerance for each bin limit is 0.5 nm.
5
• Wave soldering parameter must be set and
maintained according to recommended
temperature and dwell time in the solder wave.
Customer is advised to periodically check on the
soldering profile to ensure the soldering profile
used is always conforming to recommended
soldering condition.
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut
to length prior to insertion and soldering into PC
board.
• If lead forming is required before soldering, care
must be taken to avoid any excessive mechanical
stress induced to LED package. Otherwise, cut the
leads of LED to length after soldering process at
room temperature. The solder joint formed will
absorb the mechanical stress of the lead cutting
from traveling to the LED chip die attach and
wirebond.
• If necessary, use fixture to hold the LED
component in proper orientation with respect to
the PCB during soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to
cool to room temperature, 25°C, before handling.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely
upon hand operation.
• Special attention must be given to board
fabrication, solder masking, surface plating and
lead holes size and component orientation to
assure solderability.
Soldering Conditions
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• Recommended PC board plated through hole sizes
for LED component leads:
LED Component
Lead Size
Plated Through
Hole Diameter
• The closest LED is allowed to solder on board is
1.59 mm below the body (encapsulant epoxy) for
those parts without standoff.
Diagonal
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
• Recommended soldering conditions:
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Manual Solder
Wave Soldering Dipping
Note: Refer to application note AN1027 for more
information on soldering LED components.
Pre-heat Temperature 105 °C Max.
–
Pre-heat Time
Peak Temperature
Dwell Time
30 sec Max.
250 °C Max.
3 sec Max.
–
260 °C Max.
5 sec Max.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
BOTTOM SIDE
OF PC BOARD
250
200
150
100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
FLUXING
PREHEAT
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
50
30
0
10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
Figure 8. Recommended wave soldering profile.
6
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2803EN
5989-4156EN May 31, 2006
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