HLMP-K105-KL0A1 [AVAGO]
T-1 SINGLE COLOR LED, DEEP RED, 5mm, PLASTIC PACKAGE-2;
| 型号： | HLMP-K105-KL0A1 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 SINGLE COLOR LED, DEEP RED, 5mm, PLASTIC PACKAGE-2 光电 |
| 文件： | 总8页 (文件大小：263K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-D101/D105, HLMP-K101/K105
3
T-1 / (5 mm), T-1 (3 mm),
4
High Intensity, Double Heterojunction
AlGaAs Red LED Lamps
Data Sheet
Description
Features
These solid-state LED lamps utilize newly developed
double heterojunction (DH) AlGaAs/GaAs material tech-
nology. This LED material has outstanding light output
efficiency over a wide range of drive currents. The color is
deep red at the dominant wavelength of 637 nanometers.
These lamps may be DC or pulse driven to achieve desired
light output.
• Exceptional brightness
• Wide viewing angle
• Outstanding material efficiency
• Low forward voltage
• CMOS/MOS compatible
• TTL compatible
• Deep red color
Applications
• Bright ambient lighting conditions
• Moving message panels
• Portable equipment
• General use
Package Dimensions
0.89 (0.035)
0.64 (0.025)
6.10 (0.240)
5.59 (0.220)
SQUARE TYP.
0.55 (0.022)
0.40 (0.016)
0.65 (0.026) max
5.08 (0.200)
4.57 (0.180)
CATHODE LEAD
9.19 (0.362)
8.43 (0.332)
1.27(0.050)
NOM.
2.54 (0.100) NOM.
25.40(1.00)
MINIMUM
A
1.14 (.045)
0.51 (.020)
2.79 (.110)
2.29 (.090)
24.1(.95) MIN.
1.52 (.060)
1.02 (.040)
3.43 (.135)
2.92 (.115)
0.65 (0.026) max.
3.17 (.125)
2.67 (.105)
Ø
(0.022) 0.55
(0.016) 0.40
SQ. TYP.
4.70 (.185)
4.19 (.165)
6.35 (.250)
5.58 (.220)
B
C
Notes:
1. All dimensions are in mm (inches).
2. An epoxy meniscus may extend about 1 mm (0.040") down the leads.
3. For PCB hole recommendations, see the Precautions section.
Selection Guide
Luminous Intensity Iv (mcd) at 20 mA
[1]
1/2
Degree
2θ
Package
Outline
Package Description
Device HLMP-
D101
Min.
35.2
35.2
35.2
138.0
138.0
200.0
22.0
22.0
35.2
35.2
Typ.
Max.
T-1 3/4 Red Tinted Diffused
70.0
70.0
70.0
240.0
240.0
290.0
45.0
45.0
65.0
65.0
–
65
A
A
A
B
B
B
C
C
C
C
D101-J00xx
D101-JK0xx
D105
–
65
112.8
65
T-1 3/4 Red Untinted Non-diffused
T-1 Red Tinted Diffused
–
24
D105-M00xx
D105-NO0xx
K101
–
24
580.0
24
–
–
–
–
60
K101-I00xx
K105
60
T-1 Red Untinted Non-diffused
Note:
45
K105-J00xx
45
1
1.
θ
is the off axis angle from lamp centerline where the luminous intensity is / the on-axis value.
1
/
2
2
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
A1: Right Angle Housing, Uneven Leads, T1
A2: Right Angle Housing, Even Leads, T1
3
B1: Right Angle Housing, Uneven Leads, T-1 /
4
3
B2: Right Angle Housing, Even Leads, T-1 /
DD, UQ: Ammo Pack
4
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Lens Type
01: Tinted, Diffused
05: Untinted, Nondiffused
Color Options
1: AlGaAs Red
Package Options
3
D: T-1 /
K: T-1
4
2
Absolute Maximum Ratings at T = 25°C
A
Parameter
Value
Peak Forward Current[1,2]
Average Forward Current[2]
DC Current[3]
300 mA
20 mA
30 mA
Power Dissipation
87 mW
5 V
Reverse Voltage (IR = 100 μA)
Transient Forward Current (10 μs Pulse)[4]
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Notes:
500 mA
110°C
-20 to +100°C
-40 to +100°C
1. Maximum I
at f = 1 kHz, DF = 6.7%.
PEAK
2. Refer to Figure 6 to establish pulsed operating conditions.
3. Derate linearly as shown in Figure 5.
4. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds.
It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
Electrical/Optical Characteristics at T = 25°C
A
Symbol
VF
Description
Min.
Typ.
1.8
Max.
Unit
V
Test Condition
IF = 20 mA
Forward Voltage
2.2
VR
Reverse Breakdown Voltage
Peak Wavelength
5.0
15.0
645
637
20
V
IR = 100 μA
λp
nm
nm
nm
ns
Measurement at Peak
Note 1
λd
Δλ1/2
Dominant Wavelength
Spectral Line Halfwidth
Speed of Response
τS
30
Exponential Time
Constant, e-t/TS
C
Capacitance
30
pF
VF = 0, f = 1 MHz
RθJ-PIN
Thermal Resistance
260[3]
210[4]
290[5]
°C/W
Junction to Cathode
Lead
ηV
Luminous Efficacy
80
Im/W
Note 2
Notes:
1. The dominant wavelength, λ , is derived from the CIE chromaticity diagram and represents the color of the device.
d
2. The radiant intensity, I , in watts per steradian, may be found from the equation I = l /η , where I is the luminous intensity in candelas and η is
e
e
V
V
V
V
luminous efficacy in lumens/watt.
3. HLMP-D101.
4. HLMP-D105.
5. HLMP-K101/-K105.
3
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage.
Figure 3. Relative luminous intensity vs. dc forward current.
Figure 4. Relative efficiency vs. peak forward current.
Figure 5. Maximum forward dc current vs. ambient temperature.
Derating based on TJ MAX. = 110°C.
Figure 6. Maximum tolerable peak current vs. peak duration
(IPEAK MAX. determined from temperature derated IDC MAX.).
4
Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D101.
Figure 8. Relative luminous intensity vs. angular displacement. HLMP-K101.
Figure 9. Relative luminous intensity vs. angular displacement. HLMP-D105.
Figure 10. Relative luminous intensity vs. angular displacement. HLMP-K105.
5
Intensity Bin Limits
Intensity Range (mcd)
Color
Bin
I
Min.
Max.
Red
24.8
39.6
J
39.6
63.4
K
63.4
101.5
L
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
162.4
M
N
O
P
234.6
340.0
540.0
850.0
Q
R
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
30900.0
S
T
U
V
W
X
Y
Z
Maximum tolerance for each bin limit is 18%.
Mechanical Option Matrix
Mechanical Option Code
Definition
00
01
02
A1
A2
B1
B2
DD
Bulk Packaging, minimum increment 500 pcs/bag
Tape & Reel, crimped leads, minimum increment 1300 pcs (T-13/4)/1800 pcs (T-1)
Tape & Reel, straight leads, minimum increment 1300 pcs (T-13/4)/1800 pcs (T-1)
Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
Right Angle Housing, even leads, minimum increment 500 pcs/bag
Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
Right Angle Housing, even leads, minimum increment 500 pcs/bag
Ammo Pack, straight leads in 2K increment
UQ
Ammo Pack, horizontal leads in 2K increment
Note:
Allcategoriesareestablishedforclassificationofproducts. Productsmaynotbeavailableinallcategories. PleasecontactyourlocalAvagorepresentative
for further clarification/information.
6
Precautions
Lead Forming:
•ꢀ Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
•ꢀ The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
•ꢀ For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Note:
•ꢀ If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
1. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
Soldering and Handling:
•ꢀ Care must be taken during PCB assembly and soldering
•ꢀ Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
process to prevent damage to the LED component.
•ꢀ LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
•ꢀ At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
1.59 mm
•ꢀ If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
•ꢀ ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
•ꢀ Recommended PC board plated through holes (PTH)
size for LED component leads.
LED Component
Lead Size
Diagonal
Plated Through-
Hole Diameter
•ꢀ Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
Lead size (typ.) 0.45 × 0.45 mm
(0.018 × 0.018 in.)
0.636 mm
(0.025 in)
0.98 to 1.08 mm
(0.039 to 0.043 in)
[1],[2]
Pre-heat Temperature 105°C Max.
–
Dambar shear- 0.65 mm
off area (max.) (0.026 in)
0.919 mm
(0.036 in)
Pre-heat Time
60 sec Max.
250°C Max.
3 sec Max.
–
Peak Temperature
260°C Max.
5 sec Max.
Lead size (typ.) 0.50 × 0.50 mm
(0.020 × 0.020 in.)
0.707 mm
(0.028 in)
1.05 to 1.15 mm
(0.041 to 0.045 in)
Dwell Time
Note:
Dambar shear- 0.70 mm
off area (max.) (0.028 in)
0.99 mm
(0.039 in)
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
Note: Refer to application note AN1027 for more information on
soldering LED components.
•ꢀ Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
7
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR
HOT AIR KNIFE
TURBULENT WAVE
250
Flux: Rosin flux
Solder bath temperature:
200
150
100
245°C 5°C (maximum peaꢀ temperature ꢁ 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum ꢁ 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C 5°C (maximum peaꢀ temperature ꢁ 250°C)
50
PREHEAT
Dwell time: 1.5 sec – 3.0 sec (maximum ꢁ 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-0230EN - June 7, 2013
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