HLMP-KB45 [AVAGO]
General purpose leads;
| 型号： | HLMP-KB45 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | General purpose leads |
| 文件： | 总8页 (文件大小：259K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-DB25, HLMP-KB45
T-1¾ (5 mm), T-1 (3 mm)
Blue LED Lamps
Data Sheet
Description
Features
These blue LEDs are designed in industry standard T-1 and
T-1¾ package with clear and non diffused optics. They are
also available in tape and reel, and ammo-pack option for
ease of handling and use.
•ꢀ Popular T-1¾ and T-1 diameter packages
•ꢀ General purpose leads
•ꢀ Reliable and rugged
•ꢀ Available on tape and reel
•ꢀ Binned for color and intensity
These blue lamps are ideal for use as indicators and for
general purpose lighting. Blue lamps offer color differen-
tiation as blue is attractive and not widely available.
Applications
•ꢀ Status indicators
•ꢀ Small message panel
•ꢀ Running and decorative lights for commercial use
Package Dimensions
HLMP-KB45
HLMP-DB25
3.18 (0.125)
2.67 (0.105)
5.08 (0.200)
4.57 (0.180)
3.43 (0.135)
2.92 (0.115)
9.19 (0.352)
8.43 (0.332)
4.70 (0.185)
6.35 (0.250)
4.19 (0.165)
5.58 (0.220)
1.02 (0.040)
NOM.
0.89 (0.035)
0.64 (0.025)
23.0
MIN.
23.0
MIN.
(0.90)
(0.90)
0.45 (0.018)
SQUARE NOMINAL
0.45 (0.018)
SQUARE NOM.
CATHODE
1.27 (0.050)
NOM.
2.54 (0.100) NOM.
1.27 (0.050)
NOM.
6.10 (0.240)
5.59 (0.220)
CATHODE
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.
2.54 (0.100)
NOM.
CAUTION: Devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate pre-
cautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Selection Guide
Luminous Intensity Iv (mcd)
Part Number
Package
T-1
Viewing Angle
Min.
30
Max.
HLMP-KB45-A0000
HLMP-DB25-B0000
40
25
–
–
T-1¾
40
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Option
00: Bulk
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Viewing Angle
25: 25 degrees
45: 40 degrees
Color Options
B: Blue
Package Options
D: T-1¾ (5 mm)
K: T-1 (3 mm)
Absolute Maximum Ratings at T = 25°C
A
Parameter
Blue
70
Units
mA
Peak Forward Current
DC Current[1]
30
mA
Reverse Voltage
Not recommended for reverse bias
Transient Forward Current[2] (10 µsec Pulse)
LED Junction Temperature
350
mA
°C
115
Operating Temperature
–20 to +80
–30 to +100
250°C for 3 seconds
260°C for 5 seconds
°C
Storage Temperature
°C
Wave Soldering Temperature [1.59 mm (0.063 in.) from Body]
Solder Dipping Temperature [1.59 mm (0.063 in.) from Body]
Notes:
1. Derate linearly from 50°C as shown in Figure 6.
2. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that this device be operated at peak currents above the Absolute Maximum Peak Forward Current.
2
Optical Characteristics at T = 25°C
A
Color, Dominant
Luminous Intensity
Wavelength
Peak Wavelength
(nm)
Typ.
464
464
Viewing Angle
[1]
[2]
I (mcd) @ I = 20 mA
l
d
(nm)
l
2q
1/2
Degrees
V
F
PEAK
Part Number
HLMP-DB25-B0000
HLMP-KB45-A0000
Notes:
Min.
Typ.
470
470
Typ.
25
40
30
40
1. The dominant wavelength, l , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
d
device.
2.
q
is the off-axis angle at which the luminous intensity is half of the axial luminous intensity.
1/2
Electrical Characteristics at T = 25°C
A
Thermal Resistance
Rq (°C/W)
J-PIN
Junction to
Forward Voltage
V (Volts)
F
Speed
Response
Capacitance
C (pF), V = 0,
F
@ I = 20 mA
t (ns)
s
f = 1 MHz
Cathode Lead
F
Part Number
Typ.
3.2
3.2
Max.
3.8
Typ.
500
500
Typ.
Typ.
260
290
HLMP-DB25-B00xx
HLMP-KB45-A00xx
97
3.8
97
30
25
20
15
10
5
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
380
430
480
530
580
630
680
0
1
2
3
4
VF – FORWARD VOLTAGE – V
WAVELENGTH - nm
Figure 1. Relative intensity vs. wavelength
Figure 2. Forward current vs. forward voltage
10
1.6
1.4
1.2
1.0
10 KHz
3 KHz
1 KHz
300 Hz
100 Hz REFRESH RATE
1
1.00E-06
1.00E-05
1.00E-04
1.00E-03
1.00E-02
20
30
40
50
60
70
80
PULSE WIDTH (SECONDS)
IP – PEAK FORWARD CURRENT – mA
Figure 3. Relative intensity vs. peak forward current (300 µs pulse width,
10 ms period)
Figure 4. Maximum Tolerable Peak Current vs Pulse Width
3
1.4
1.2
1.0
0.8
0.6
0.4
0.2
35
30
25
20
15
10
5
0
0
0
5
10
15
20
25
30
0
10 20 30 40 50 60 70 80 90
TA – AMBIENT TEMPERATURE – °C
IF – DC FORWARD CURRENT – mA
Figure 5. Relative luminous intensity vs. forward current
Figure 6. Maximum DC forward current vs. ambient temperature. Derating
based on TJ max. = 115°C
0°
10°
20°
1.0
30°
40°
.8
50°
60°
.6
.4
.2
70°
80°
90°
10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
Figure 7. Relative luminous intensity vs. angular displacement for HLMP-DB25
0°
1.0
10°
20°
30°
.8
40°
50°
.6
.4
.2
60°
70°
80°
90°
10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
Figure 8. Relative luminous intensity vs. angular displacement for HLMP-KB45
4
Soldering/Cleaning
Cleaning agents from the ketone family (acetone, methyl
ethyl ketone, etc.) and from the chlorinated hydrocarbon
family (methylene chloride, trichloro-ethylene, carbon
tetrachloride, etc.) are not recommended for cleaning LED
parts. All of these various solvents attack or dissolve the
encapsulating epoxies used to form the package of plastic
LED parts.
Intensity Bin Limits
Intensity Range (mcd)
Color Bin Limits (nm at 20 mA)
Blue
nm @ 20 mA
Min.
Bin ID
A
B
Min
30
Max
40
Bin ID
Max.
1
2
3
4
5
460.0
464.0
468.0
472.0
476.0
480.0
40
50
464.0
C
50
65
468.0
D
E
65
85
472.0
85
110
140
180
240
310
400
520
680
880
1150
1500
1900
2500
3200
4200
476.0
F
110
140
180
240
310
400
520
680
880
1150
1500
1900
2500
3200
Tolerance for each bin limit is 0.5 nm.
G
H
J
K
L
M
N
P
Q
R
S
T
U
Tolerance for each bin limit is 15ꢀ.
Mechanical Option Matrix
Mechanical
Option Code
Definition
00
Bulk Packaging, minimum increment 500 pcs/bag
Note:
All categories are established for classification of products. Products may not be available in all
categories. Please contact your local Avago representative for further clarification/information.
5
Precautions:
Lead Forming:
•ꢀ Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
•ꢀ The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
•ꢀ For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Note:
1. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
•ꢀ If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
•ꢀ Care must be taken during PCB assembly and soldering
•ꢀ Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
process to prevent damage to the LED component.
•ꢀ LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
•ꢀ At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
1.59 mm
•ꢀ If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
•ꢀ ESD precaution must be properly applied on the
soldering station and by personnel to prevent ESD
damage to the LED component that is ESD sensitive.
For details, refer to Avago application note AN 1142.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
•ꢀ Recommended PC board plated through holes (PTH)
size for LED component leads.
Plated Through
Hole Diameter
LED Component Lead Size
Diagonal
•ꢀ Recommended soldering conditions:
Lead size
(Typical)
0.45 x 0.45 mm
(0.018 x 0.018 in) (0.025 in)
0.636 mm 0.98 to 1.08 mm
(0.039 to 0.043 in)
Wave
Manual Solder
Dipping
Soldering[1],[2]
Dambar shear- 0.65 mm
off area (max)
0.919 mm
(0.036 in)
(0.026 in)
Pre-heat Temperature
Pre-heat Time
105°C Max.
60 sec Max.
250°C Max.
3 sec Max.
–
Lead size
(Typical)
0.50 x 0.50 mm
(0.020 x 0.020 in) (0.028 in)
0.707 mm 1.05 to 1.15 mm
(0.041 to 0.045 in)
–
Peak Temperature
Dwell Time
260°C Max.
5 sec Max.
Dambar shear- 0.70 mm
off area (max) (0.028 in)
0.99 mm
(0.039 in)
Notes:
•ꢀ Over-sizing the PTH can lead to a twisted LED after it is
clinched. On the other hand, undersizing the PTH can
cause difficulty in inserting the TH LED.
1. These conditions refer to measurement with a thermocouple
mounted at the bottom of PCB.
2. To reduce thermal stress experienced by LED, it is recommended
that you use only bottom preheaters.
For more information about soldering and handling of TH
LED lamps, refer to application note AN5334.
6
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR
HOT AIR KNIFE
TURBULENT WAVE
250
Flux: Rosin ꢀux
Solder bath temperature:
200
150
100
245°C 5°C (maximum peaꢁ temperature ꢂ 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum ꢂ 3sec)
Note: Allow for board to be suꢃciently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin ꢀux
Solder bath temperature:
50
245°C 5°C (maximum peaꢁ temperature ꢂ 250°C)
PREHEAT
Dwell time: 1.5 sec – 3.0 sec (maximum ꢂ 3sec)
Note: Allow for board to be suꢃciently cooled to
room temperature before exerting mechanical force.
0
10
20
30
40
50
60
70
80
90
100
TIME (SECONDS)
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
7
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
BIN: Color Bin
Supplier Code:
DATECODE: Date Code
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes 5989-3263EN
AV02-2213EN - July 24, 2014
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