HLMP-LB65-231ZZ [AVAGO]
Single Color LED, Blue, Tinted Diffused, 3.8mm, ROHS COMPLIANT, PLASTIC PACKAGE-2;
| 型号： | HLMP-LB65-231ZZ |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Single Color LED, Blue, Tinted Diffused, 3.8mm, ROHS COMPLIANT, PLASTIC PACKAGE-2 |
| 文件： | 总10页 (文件大小：210K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-LM65, HLMP-LB65
Precision Optical Performance Green and Blue
New 4mm Standard Oval LEDs
Data Sheet
Description
Features
This Precision Optical Performance Oval LEDs are specifi-
cally designed for full color/video and passenger infor-
mation signs. The oval shaped radiation pattern and high
luminous intensity ensure that these devices are excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
The package epoxy contains both UV-A and UV-B inhibi-
tors to reduce the effects of long term exposure to direct
sunlight.
ꢀ Well defined spatial radiation pattern
ꢀ High brightness material
ꢀ Available in green and blue color
Green InGaN 525nm
Blue InGaN 470nm
ꢀ Superior resistance to moisture
ꢀ Standoff Package
ꢀ Tinted and diffused
Applications
ꢀ Typical viewing angle 50° x100°
ꢀ Full color signs
Package Dimensions
NOTE:
21.ꢀ
ꢀ.827
1. MEASURED AT BASE OF LENS.
MIN.
7.26 ꢀ.2ꢀ
ꢀ.286 ꢀ.ꢀꢀ8
1.ꢀ
ꢀ.ꢀ39
MIN.
3.ꢀꢀ ꢀ.2ꢀ
1.25 ꢀ.2ꢀ
ꢀ.118 ꢀ.ꢀꢀ8
CATHODE LEAD
ꢀ.ꢀ49 ꢀ.ꢀꢀ8
2.54 ꢀ.3ꢀ
3.8ꢀ ꢀ.2ꢀ
ꢀ.1ꢀꢀ ꢀ.ꢀ12
ꢀ.1496 ꢀ.ꢀꢀ8
1ꢀ.ꢀꢀ ꢀ.5ꢀ
ꢀ.394 ꢀ.ꢀ2ꢀ
ꢀ.5ꢀ ꢀ.1ꢀ
ꢀ.ꢀ2ꢀ ꢀ.ꢀꢀ4
Sq Typ.
ꢀ.8ꢀ
ꢀ.ꢀ31
MAX. EPOXY MENISCUS
Notes:
All dimensions in millimeters (inches).
Tolerance is 0.20mm unless other specified
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide
Color and Dominant
Wavelength ꢁd (nm) Typ
Luminous Intensity
Iv (mcd) at 2ꢀ mA-Min
Luminous Intensity
Iv (mcd) at 2ꢀ mA-Max
[1]
[1]
Part Number
HLMP-LM65-Z30xx
HLMP-LB65-RU0xx
Green 525
Blue 470
2400
550
5040
1150
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
Part Numbering System
HLMP - L x 65 - x x x xx
Packaging Option
DD: Ammo packs
ZZ: Flexi Ammopacks
Color Bin Selection
0: Full Distribution
Maximum Intensity Bin
Refer to selection guide
Minimum Intensity Bin
Refer to Device Selection Guide.
Color
M: Green 525
B: Blue 470
Package
L: 4mm Standard Oval 50°x100°
Note: Please refer to AB 5337 for complete information about part numbering system
2
Absolute Maximum Ratings
T = 25°C
J
Parameter
Green/ Blue
30
Unit
mA
mA
mW
V
DC Forward Current [1]
Peak Forward Current
Power Dissipation
100 [2]
114
Reverse Voltage
5 (IR =10μA)
110
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
°C
-40 to +85
-40 to +100
°C
°C
Notes:
1. Derate linearly as shown in Figure 2.
2. Duty Factor 10%, frequency 1KHz.
Electrical / Optical Characteristics
T = 25°C
J
Parameter
Symbol Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
Green
VF
V
IF = 20 mA
2.8
2.8
3.2
3.2
3.8
3.8
Blue
Reverse Voltage
Green
VR
V
IR = 10 μA
IF = 20 mA
5
5
Blue
Dominant Wavelength [1]
nm
nm
ꢁd
Green
Blue
520
460
525
470
540
480
Peak Wavelength
Green
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
ꢁPEAK
516
464
Blue
Thermal Resistance
240
°C/W
lm/W
LED Junction-to-Cathode lead
RꢂJ-PIN
Luminous Efficacy [2]
Emitted Luminous Power/Emitted
Radiant Power
ꢃV
Green
Blue
530
65
Luminous Efficiency [3]
Luminous Flux/ Electrical Power
IF = 20 mA
ꢃe
Green
Blue
60
13
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = I /ꢃV where I is the luminous intensity in candelas and ꢃV
V
V
is the luminous efficacy in lumens/watt.
3. ηe = φ / I x V , where φ is the emitted luminous flux, I is electrical forward current and V is the forward voltage.
V
F
F
V
F
F
3
InGaN Green
1.ꢀ
ꢀ.9
ꢀ.8
ꢀ.7
ꢀ.6
ꢀ.5
ꢀ.4
ꢀ.3
ꢀ.2
ꢀ.1
1ꢀꢀ
8ꢀ
BLUE
GREEN
6ꢀ
4ꢀ
2ꢀ
ꢀ.ꢀ
38ꢀ
ꢀ
43ꢀ
48ꢀ
53ꢀ
58ꢀ
63ꢀ
ꢀ
1
2
3
4
5
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 1. Relative Intensity vs Wavelength
Figure 2. Forward Current vs Forward Voltage
35
3ꢀ
25
2ꢀ
15
1ꢀ
5
3.5
3.ꢀ
2.5
2.ꢀ
1.5
1.ꢀ
ꢀ.5
ꢀ.ꢀ
BLUE
GREEN
ꢀ
ꢀ
2ꢀ
4ꢀ
6ꢀ
8ꢀ
1ꢀꢀ
ꢀ
2ꢀ
4ꢀ
6ꢀ
8ꢀ
1ꢀꢀ
12ꢀ
T A - AMBIENTTEMPERATURE - °C
DC FORWARD CURRENT - mA
Figure 3. Relative Intensity vs Forward Current
Figure 4. Maximum Forward Current vs Ambient Temperature
1ꢀ
8
6
4
2
ꢀ
BLUE
-2
-4
-6
GREEN
-8
-1ꢀ
ꢀ
2ꢀ
4ꢀ
6ꢀ
8ꢀ
1ꢀꢀ
FORWARD CURRENT - mA
Figure 5. Relative dominant wavelength vs Forward Current
4
1.ꢀ
ꢀ.8
ꢀ.6
ꢀ.4
ꢀ.2
ꢀ.ꢀ
1.ꢀ
ꢀ.8
ꢀ.6
ꢀ.4
ꢀ.2
ꢀ.ꢀ
BLUE
GREEN
BLUE
GREE
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
6ꢀ
9ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
6ꢀ
9ꢀ
ANGULAR DISPLACEMENT - DEGREE
ANGULAR DISPLACEMENT - DEGREE
Figure 6. Radiation Pattern – Major Axis
Figure 7. Radiation Pattern – Minor Axis
ꢀ.3
ꢀ.2
ꢀ.1
ꢀ
1ꢀ
BLUE
GREEN
BLUE
GREEN
1
-ꢀ.1
-ꢀ.2
-ꢀ.3
ꢀ.1
-4ꢀ
-2ꢀ
ꢀ
2ꢀ
4ꢀ
6ꢀ
8ꢀ
1ꢀꢀ 12ꢀ
-4ꢀ
-2ꢀ
ꢀ
2ꢀ
4ꢀ
6ꢀ
8ꢀ
1ꢀꢀ 12ꢀ
TJ - JUNCTION TEMPERATURE - °C
TJ - JUNCTION TEMPERATURE - °C
Figure 9. Relative Forward Voltage vs Junction Temperature
Figure 8. Relative Light Output vs Junction Temperature
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Intensity (mcd) at 2ꢀ mA
Bin
R
Min
550
Max
660
800
S
660
T
800
960
U
V
960
1150
1380
1660
1990
2400
2900
3500
4200
5040
1150
1380
1660
1990
2400
2900
3500
4200
W
X
Y
Z
1
2
3
Tolerance for each bin limit isꢄ 15%
5
Green Color Bin Table
Blue Color Bin Table
Min
Min
Dom
Max
Dom
Max
Dom
Bin
Xmin
Ymin
Xmax Ymax
Bin
Dom
Xmin
Ymin
Xmax Ymax
1
520.0
524.0
528.0
532.0
536.0
524.0 0.0743 0.8338 0.1856 0.6556
0.1650 0.6586 0.1060 0.8292
1
460.0
464.0 0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
2
3
4
5
528.0 0.1060 0.8292 0.2068 0.6463
0.1856 0.6556 0.1387 0.8148
2
3
4
5
464.0
468.0
472.0
476.0
468.0 0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
532.0 0.1387 0.8148 0.2273 0.6344
0.2068 0.6463 0.1702 0.7965
472.0 0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
536.0 0.1702 0.7965 0.2469 0.6213
0.2273 0.6344 0.2003 0.7764
476.0 0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
540.0 0.2003 0.7764 0.2659 0.6070
0.2469 0.6213 0.2296 0.7543
480.0 0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
Tolerance for each bin limit is ꢄ 0.5nm
Tolerance for each bin limit is ꢄ 0.5nm
Note:
1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago
representative for further information.
Avago Color Bin on CIE 1931 Chromaticity Diagram
1.000
0.800
1
2
3
4
Green
5
0.600
0.400
0.200
0.000
Blue
1
4
2
0.000
0.200
0.400
X
0.600
0.800
6
Precautions:
Lead Forming:
ꢀ The leads of an LED lamp may be preformed or cut to
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
length prior to insertion and soldering on PC board.
ꢀ For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Avago Technologies LED Configuration
ꢀ If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
CATHODE
ꢀ Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
ꢀ LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
InGaN Device
ꢀ Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
ꢀ At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
1.59mm
ꢀ If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
ꢀ ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
ꢀ Recommended PC board plated through holes (PTH)
size for LED component leads.
ꢀ Recommended soldering condition:
LED component
lead size
Plated through
hole diameter
Wave
Soldering
Manual Solder
Dipping
[1, 2]
Diagonal
0.45 x 0.45 mm
0.636 mm
0.98 to 1.08 mm
Pre-heat temperature 105°C Max.
-
(0.018x 0.018 inch) (0.025 inch)
0.50 x 0.50 mm 0.707 mm
(0.020x 0.020 inch) (0.028 inch)
(0.039 to 0.043 inch)
Preheat time
Peak temperature
Dwell time
60 sec Max
260°C Max.
5 sec Max.
-
1.05 to 1.15 mm
(0.041 to 0.045 inch)
260°C Max.
5 sec Max
ꢀ Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
Refer to application note AN5334 for more information about
soldering and handling of high brightness TH LED lamps.
ꢀ Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
7
Example of Wave Soldering Temperature Profile for TH LED
26ꢀ°C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C 5°C
(maximum peak temperature = 260°C)
1ꢀ5°C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
6ꢀ sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
6.35 1.30
0.25 0.0512
12.70 1.00
0.50 0.0394
CATHODE
20.5 1.00
0.8071 0.0394
9.125 0.625
0.3593 0.025
18.00 0.50
0.7087 0.0197
12.70 0.30
0.50 0.0118
4.00 0.20
0.1575 0.0079
TYP.
Ø
VIEW A - A
0.70 0.20
0.276 0.0079
8
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
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DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR
AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAIN-
TENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS.
CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUP-
PLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1148EN - February 10, 2010
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