HLMP-N305#002 [AVAGO]
T-1 SINGLE COLOR LED, YELLOW, 3mm, PLASTIC PACKAGE-2;
| 型号： | HLMP-N305#002 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 SINGLE COLOR LED, YELLOW, 3mm, PLASTIC PACKAGE-2 光电 |
| 文件： | 总11页 (文件大小：280K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-N305, HLMP-NG0x, HLMP-NL06
T-1 (3 mm) Auto Insertable LED Lamps
Data Sheet
Features
Description
• T-1 (3 mm) auto insertable package
• AlInGaP SunPower intensity
• High light output
This family of 3 mm LED Lamps is capable of withstand-
ing automatic insertion and wave soldering processes.
Designed with a thick epoxy flange and soft leadframe
material, it is ideal for clinch and cut operations.
• Tinted diffused and tinted non-diffused lens options
• Wide viewing angle
Applications
• Variety of colors
• General purpose
• Available with straight or formed lead tape and reel
• High volume manufacturing
options
Device Selection Guides
High Brightness Lamps
Package
Luminous Intensity,
Viewing Angle,
Package
1
2θ /
2
Color
Part Number
Tinted
Diffused
Diffused
Min. Iv @ 20 mA
Outline
Red
HLMP-NG05
HLMP-NG07
HLMP-NL06
µ
µ
µ
90.2
90.2
96.2
45
60
60
A
B
B
Amber
High Efficiency Lamps
Package
Tinted
X
Luminous Intensity,
Min. Iv @ 10 mA
14.7
Viewing Angle,
1
2θ /
2
Package
Outline
A
Color
Part Number
GaP Yellow
HLMP-N305
45
Note:
1
1
1. 2θ / is the off axis angle where the luminous intensity is
/ the on axis intensity.
2
2
Package Dimensions
Package Outline “A”
SEATING PLANE
5.9 0.5
(0.23 0.02)
23.0
(0.91)
1.0 0.5
(0.04 0.02)
3.5 0.3
(0.14 0.01)
CATHODE MARKS
0.65 (0.03) MAX.
0.4 0.2
(0.02 0.01)
4.4 0.3
3.1 0.2
2.5 0.3
(0.10 0.01)
(0.17 0.01) (0.12 0.01)
+ 0.1
0.4 0.2
(0.01 0.01)
0.45 0.10
(0.02 0.007)
0.4
0
+ 0.00
- 0.00
(0.2
)
2.0 (0.08) REF.
3.4 0.2
(0.13 0.01)
Package Outline “B”
1.0 MIN.
5.70 0.5
23.0 MIN.
3.50 0.30
CATHODE FLAT
0.65 MAX.
CATHODE LEAD
0.44 0.2
3.80 0.30 3.10 0.20
2.54 0.3
0.8 MAX. EPOXY MENISCUS
+ 0.1
– 0
0.4
2.0
3.60
NOTES:
1. All dimensions are in millimeters (inches).
2. Leads are mild steel with tin plating.
3. Epoxy meniscus of 0.8 mm (0.03 in.) Maximum may extend to the leads.
4. For PCB hole recommendations, see the Precautions section.
Part Numbering System
H L M P - N x x x
#
x x x
Mechanical Option
002: Tape & Reel, Straight Leads
Viewing Angle Options
05: 45 Degree
06, 07: 60 Degree
Color Options
3: GaP Yellow
G: AlInGaP Red
L: AlInGaP Amber
2
Absolute Maximum Ratings at T = 25 ºC
A
AlInGaP
Amber & Red
Parameter
Yellow
20
Units
mA
V
DC Forward Current[1]
30[2,3]
Reverse Voltage (Ir = 100 µA)
Junction Temperature, Tjmax
Storage Temperature Range
Operating Temperature Range
5
110
°C
-40 to +85
-20 to +85
°C
-40 to +85
°C
Notes:
1. See Figure 4 for maximum current derating vs. ambient temperature.
2. Suggested minimum DC current: 10 mA.
3. Maximum Peak Pulsed Forward Current: 50 mA, 30 mA average.
Electrical Characteristics at T = 25ºC
A
Capacitance
C (pF) ,
Vf = 0, f = 1 MHz
Thermal
Resistance
Speed of Response
τ (ns)
s
-t
Forward Voltage Vf (Volts)
Rθ
Time Constant e /τ
J-PIN
s
Part Number
HLMP-N30x
HLMP-NL06[1]
HLMP-NG0x[1]
Typ.
2.00
2.02
1.90
Max.
2.6
If (mA)
10
Typ.
15
(°C/W)
290
Typ.
90
2.4
20
40
240
20
2.4
20
40
240
20
Note:
1. Please contact your Avago Sales Representative about operating currents below 10 mA.
Optical Characteristics at T = 25 ºC
A
Luminous
Efficacy
Width
Typ. Dominant
Wavelength
Luminous Intensity
Typ. Peak
Typ. Spectral
Part Number
HLMP-NG05
HLMP-NG07
HLMP-NL06
HLMP-N305
Min.
90.2
90.2
96.2
14.7
If (mA)
20
Wavelength (nm)
(nm)
Half Width
(lm/W)
150
635
635
592
583
626
17
17
17
36
20
626
150
20
590
480
10
585
500
Notes:
1. The luminous intensity, lv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the device.
3. The radiant intensity, le, in watts per steradian, may be found from the equation le = lv/h , where lv is the luminous intensity in candelas and h
v
v
is the luminous efficacy in lumens/watt.
3
HIGH BRIGHTNESS LAMPS
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
AlInGaP AMBER
AlInGaP RED
500
550
600
650
700
WAVELENGTH – nm
HIGH EFFICIENCY LAMPS
ORANGE
1.0
EMERALD GREEN
HIGH
PERFORMANCE
GREEN
HIGH
EFFICIENCY
RED
0.5
YELLOW
0
500
550
600
650
700
WAVELENGTH – nm
Figure 1. Relative intensity vs. peak wavelength.
HIGH BRIGHTNESS LAMPS
50
HIGH EFFICIENCY LAMPS
GREEN,
EMERALD GREEN
90
80
70
60
50
40
30
AlInGaP RED
YELLOW
HIGH
40
30
20
10
0
20
EFFICIENCY
RED/ORANGE
AlInGaP AMBER
10
0
0
0.5
1.0
1.5
2.0
2.5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
V – FORWARD VOLTAGE – V
F
V – FORWARD VOLTAGE – V
F
Figure 2. Forward current vs. forward voltage.
4
HIGH BRIGHTNESS LAMPS
AlInGaP
YELLOW
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
2.0
1.5
1.0
DH As AlGaAs
0.5
0
0
10
20
30
40
0
5
10
– DC CURRENT PER LED – mA
DC
15
20
25
30
I – DC FORWARD CURRENT – mA
I
F
Figure 3. Relative luminous intensity vs. forward current.
AlInGaP
40
35
30
25
Rq = 500° C/W
JA
20
15
10
5
Rq = 650° C/W
JA
Rq = 750° C/W
JA
0
0
10 20 30 40 50 60 70 80 90
T – AMBIENT TEMPERATURE – °C
A
Figure 4. Maximum forward DC current vs. ambient temperature.
5
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGULAR DISPLACEMENT – DEGREES
Figure 5. Representative spatial radiation pattern for 45° viewing angle.
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Representative spatial radiation pattern for 60° viewing angle.
6
Intensity Bin Limits
Color
Amber Color Bin Limits
Intensity Range (mcd)
(nm at 20 mA)
Bin
H
I
Min.
Max.
Bin Name
Min.
Max.
13.8
27.6
1
2
4
6
584.5
587.0
589.5
592.0
587.0
589.5
592.0
594.5
22.0
44.0
J
35.2
70.4
K
L
56.4
112.8
90.2
180.4
Tolerance for each bin limit is 0.5 nm.
M
N
O
P
138.0
200.0
290.0
500.0
700.0
1000.0
1400.0
2000.0
2900.0
4200.0
6000.0
8700.0
12600.0
18200.0
14.7
276.0
400.0
580.0
Red/Orange
/Red-Orange
1000.0
1400.0
2000.0
2800.0
4000.0
5800.0
8400.0
12000.0
17400.0
25200.0
36400.0
29.4
Q
R
S
T
U
V
W
X
Y
Z
G
H
I
23.5
47.0
37.6
75.2
J
60.1
120.2
K
L
96.2
192.4
147.0
212.0
300.0
450.0
700.0
1000.0
1600.0
2600.0
4000.0
6500.0
10000.0
16000.0
294.0
M
N
O
P
424.0
Yellow/Amber
600.0
900.0
1400.0
2000.0
3200.0
5200.0
8000.0
13000.0
20000.0
30000.0
Q
R
S
T
U
V
W
Maximum tolerance for each bin limit is 18ꢀ.
7
Color Categories
Color
Lambda (nm)
Min.
Category #
Max.
1
3
2
4
5
582.0
584.5
587.0
589.5
592.0
584.5
587.0
589.5
592.0
593.0
Yellow
Tolerance for each bin limit is 0.5 nm.
Taping Options
Straight Lead
#2CA
Option
#002
#2CD
Dimension “B”
Dimension “H”
–
–
–
20.5 1.0
18.0 1.0
20.5 1.0
(0.81 0.04) (0.71 0.04) (0.81 0.04)
Formed Lead
#2UN
Option
#2UK
#2UL
#2UM
#2UP
#2UQ
#2UR
Dimension “B”
12.0 1.0
9.0 1.0
10.0 1.0
11.0 1.0
13.0 1.0
14.0 1.0
15.0 1.0
(0.47 0.04) (0.35 0.04)
(0.39 0.04)
(0.43 0.04) (0.51 0.04) (0.55 0.04) (0.59 0.04)
Dimension “H”
16.0 1.0
(0.63 0.04)
Units: mm (inches)
8
Tape Outline Drawing
0.0 1.0
(0.00 0.04)
6.4 1.ꢁ
(0.25 0.05)
12.ꢀ 1.0
(0.50 0.04)
CATHODE
LEAD
5.1 0.ꢀ
(0.20 0.0ꢁ)
DIMENSION "H"
(SEE TABLE)
2.5 (0.10) MAX.
11.0
(0.4ꢁ)
MAX.
9.1 0.6
(0.ꢁ6 0.0ꢁ)
14.0 1.ꢀ
(0.55 0.0ꢀ)
18.0 1.0
(0.ꢀ1 0.04)
2.5 0.ꢁ
(0.10 0.01)
A
A
4.0 0.2
(0.16 0.01)
∅
TYP.
12.ꢀ 0.ꢁ
(0.50 0.01)
VIEW A–A
0.ꢀ 0.2
(0.0ꢁ 0.01)
Straight Lead
0.0 1.0
(0.00 0.04)
6.4 1.ꢁ
(0.25 0.05)
12.ꢀ 1.0
(0.50 0.04)
CATHODE
LEAD
DIMENSION "B"
(SEE TABLE)
ꢁ.9 0.ꢀ
(0.15 0.0ꢁ)
DIMENSION "H"
(SEE TABLE)
2.5 (0.10) MAX.
11.0
(0.4ꢁ)
MAX.
9.1 0.6
(0.ꢁ6 0.0ꢁ)
14.0 1.ꢀ
(0.55 0.0ꢀ)
18.0 1.0
(0.ꢀ1 0.04)
2.5 0.ꢁ
(0.10 0.01)
A
A
4.0 0.2
(0.16 0.01)
∅
TYP.
12.ꢀ 0.ꢁ
(0.50 0.01)
VIEW A–A
0.ꢀ 0.2
(0.0ꢁ 0.01)
Formed Lead
9
Package Options
Lead Option
Recommended Assembly Condition
• A single-sided phenolic printed circuit board (PCB) is
preferred. Double-sided PCB and other materials may
cause greater lead stress. Recommended through-
hole diameter is 0.98 to 1.08 mm. Leadlength below
the PCB should be 1.5 to 2.0 mm, and the clinching
angle (angle between the lead and PCB) should be 30
10 degrees.
Ammo Pack
(1000 pcs.)
Tape & Reel
(2000 pcs.)
Straight Lead
Formed Lead
#2C —
#2U —
#002
–
•ꢀ If SMT devices and an adhesive are used on the same
pcb as these lamps, the adhesive should be cured
before the lamps are auto-inserted. If curing must
be done after lamp insertion, the cure
temperature and time should not exceed 140°C,
100 seconds. This is the temperature of the surface
normal to the IR source.
AMMO PACK (for All options except #002)
TAPE & REEL (for option #002 only)
REELING ORIENTATION
CLOCKWISE
ADHESIVE TAPE MUST BE
FACING TOWARDS THE
OUTSIDE OF THE REEL.
ANODE LEAD LEAVES
THE REEL FIRST.
110 (4.33) DIA.
PROTECTIVE
CARDBOARD
336 (13.23) DIA.
DIMENSIONS IN MILLIMETERS (INCHES).
Precautions
Lead Forming
• Wavesolderingparametermustbesetandmaintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• CaremustbetakenduringPCBassemblyandsoldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended PC board plated through hole sizes
for LED component leads:
• Recommended soldering conditions:
LED Component
Lead Size
Plated Through
-Hole Diameter
Diagonal
Wave Soldering
Pre-heat Temperature
Pre-heat Time
Dipping
Manual Solder
Lead size (typ.)
0.45 × 0.45 mm
(0.018 × 0.018 in.) (0.025 in)
0.636 mm
0.98 to 1.08 mm
(0.039 to 0.043 in)
105 °C Max.
30 sec Max.
250 °C Max.
3 sec Max.
–
–
Dambar shear-
off area (max.)
0.65 mm
(0.026 in)
0.919 mm
(0.036 in)
Peak Temperature
Dwell Time
260 °C Max.
5 sec Max.
Lead size (typ.)
0.50 × 0.50 mm
(0.020 × 0.020 in.) (0.028 in)
0.707 mm
1.05 to 1.15 mm
(0.041 to 0.045 in)
Dambar shear-
off area (max.)
0.70 mm
(0.028 in)
0.99 mm
(0.039 in)
Note: Refer to application note AN1027 for more information on
soldering LED components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
250
200
150
100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150
SOLDER WAVE TEMPERATURE = 245
AIR KNIFE AIR TEMPERATURE = 390
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
°C (100°C PCB)
FLUXING
°C
°C
50
30
SOLDER: SN63; FLUX: RMA
PREHEAT
20 30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
0
10
40
50
60
70
80
90 100
TIME – SECONDS
Figure 7. Recommended wave soldering profile.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5989-4257EN
AV02-1014EN - July 25, 2013
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