HLMP-RB11-D00XX [AVAGO]
4 mm Super Oval Precision Optical Performance AlInGaP and InGaN LEDs; 4毫米超椭圆精密光学性能的AlInGaP和InGaN LED灯
| 型号： | HLMP-RB11-D00XX |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | 4 mm Super Oval Precision Optical Performance AlInGaP and InGaN LEDs |
| 文件： | 总9页 (文件大小：240K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-RG10
4mmSuperOvalPrecisionOpticalPerformance
AlInGaP and InGaN LEDs
DataSheet
SunPower Series
HLMP-RG10, HLMP-SG10, HLMP-RL10, HLMP-SL10,
HLMP-RD11, HLMP-SD11, HLMP-RL11, HLMP-SL11,
HLMP-RM11, HLMP-SM11, HLMP-RB11, HLMP-SB11
Description
Features
These Precision Optical Performance Oval LEDs are
specifically designed for Full Color/Video and
Passenger Information signs. The oval shaped
radiation pattern (60° x 120°) and high luminous
intensity ensure that these devices are excellent for
wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
These lamps have very smooth, matched radiation
patterns ensuring consistent color mixing in full color
applications, message uniformity across the viewing
angle of the sign.
• Well defined spatial radiation pattern
• Viewing angle:
major axis 120°
minor axis 60°
• High luminous output
• Two red and amber intensity levels:
AlInGaP (bright) and AlInGaP II (brightest)
• Colors:
626/ 630 nm red
590/ 592 nm amber526 nm green
470 nm blue
High efficiency LED materials are used in these lamps:
Aluminum Indium Gallium Phosphide (AlInGaP) for
Red and Amber color and Indium Gallium Nitride
(InGaN) for Blue and Green. There are two families
of red and amber lamps, AlInGaP and the higher
performance AlInGaP II. Each lamp is made with an
advanced optical grade epoxy offering superior high
temperature and high moisture resistance in outdoor
applications. The package epoxy contains both uv-a
and uv-b inhibitors to reduce the effects of long term
exposure to direct sunlight.
• Superior resistance to moisture
• UV resistant epoxy
Benefits
• Viewing angle designed for wide field of view
applications
• Superior performance for outdoor environments
• Radiation pattern matched for red, green, and blue for
full color sign
Applications
• Full color signs
Designers can select parallel (where the axis of the
leads is parallel to the wide axis of the oval radiation
pattern) or perpendicular orientation. Both lamps are
available in tinted version.
CAUTION: The Blue a nd Gr een LEDs a r e Cla ss 1 ESD sensitive. Plea se obser ve a ppr opr ia te
pr eca utions dur ing ha ndling a nd pr ocessing. Refer to Ava go Technologies Applica tion Note AN-1142
for a dditiona l deta ils.
Package Dimensions
21.0
(0.827)
MIN.
9.50 ± 0.50
(0.374 ± 0.007)
1.0
(0.039)
MIN.
A
6.30 ± 0.20
(0.248 ± 0.008)
CATHODE
LEAD
0.44 ± 0.20
(0.017 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
4.0 ± 0.20
(0.157 ± 0.008)
2.54 ± 0.30
(0.100 ± 0.012)
0.80
(0.016)
+0.10
+0.10
–0.04
MAX. EPOXY MENISCUS
0.40
–0
0.45
+0.004
–0.000)
+0.004
–0.002)
(0.016
(0.018
21.0
MIN.
(0.827)
9.50 ± 0.50
(0.374 ± 0.007)
1.0
(0.039)
MIN.
B
6.30 ± 0.20
(0.248 ± 0.008)
CATHODE
LEAD
0.44 ± 0.20
(0.017 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
4.0 ± 0.20
(0.157 ± 0.008)
2.54 ± 0.30
(0.100 ± 0.012)
0.80
(0.016)
+0.10
+0.10
–0.04
MAX. EPOXY MENISCUS
0.40
–0
0.45
+0.004
–0.000)
+0.004
–0.002)
(0.016
(0.018
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Device Selection Guide for AlInGaP
Color and
Dominant
Wavelength
Luminous
Intensity
I (mcd) at 20 mA
Leads with
Stand-Offs
Leadframe
Package
Drawing
V
Part Number
λ (nm) Typ.
d
Min.
240
240
400
400
Max.
Orientation
Perpendicular
Parallel
HLMP-SG10-JM000
HLMP-RG10-JM000
HLMP-SL10-LP0xx
HLMP-RL10-LP0xx
Red 626
680
Yes
Yes
Yes
Yes
A
B
A
B
Red 626
680
Amber 590
Amber 590
1150
1150
Perpendicular
Parallel
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
2
Device Selection Guide for AlInGaP II
Color and
Dominant
Wavelength
Luminous
Intensity
I (mcd) at 20 mA
V
Leads with
Stand-Offs
Leadframe
Orientation
Package
Drawing
Part Number
λ (nm) Typ.
d
Min.
240
400
400
180
400
400
240
400
400
520
520
180
180
310
400
400
Max.
HLMP-RD11-J0000
HLMP-RD11-LP000
HLMP-RD11-LPT00
HLMP-RL11-H0000
HLMP-RL11-LP000
HLMP-RL11-LPRxx
HLMP-SD11-J0000
HLMP-SD11-LP000
HLMP-SD11-LPT00
HLMP-SD11-MN0xx
HLMP-SD11-MNTxx
HLMP-SL11-H0000
HLMP-SL11-HL0xx
HLMP-SL11-KN0xx
HLMP-SL11-LP0xx
HLMP-SL11-LPRxx
Red 630
-
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Parallel
B
B
B
B
B
B
A
A
A
A
A
A
A
A
A
A
Red 630
1150
1150
-
Parallel
Red 630
Parallel
Amber 592
Amber 592
Amber 592
Red 630
Parallel
1150
1150
-
Parallel
Parallel
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Perpendicular
Red 630
1150
1150
880
880
-
Red 630
Red 630
Red 630
Amber 592
Amber 592
Amber 592
Amber 592
Amber 592
520
880
1150
1150
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
Device Selection Guide for InGaN
Color and
Dominant
Wavelength
Luminous
Intensity
I (mcd) at 20 mA
Leads with
Stand-Offs
Leadframe
Orientation
Package
Drawing
V
Part Number
λ (nm) Typ.
d
Min.
400
180
520
180
65
Max.
HLMP-SM11-LP0xx
HLMP-RM11-H00xx
HLMP-RM11-M00xx
HLMP-SB11-H00xx
HLMP-RB11-D00xx
HLMP-RB11-H00xx
Green 526
Green 526
Green 526
Blue 470
Blue 470
Blue 470
1150
Yes
Yes
Yes
Yes
Yes
Yes
Perpendicular
Parallel
A
B
B
A
B
B
-
-
-
-
-
Parallel
Perpendicular
Parallel
180
Parallel
Notes:
4. The luminous intensity is measured on the mechanical axis of the lamp package.
5. The optical axis is closely aligned with the package mechanical axis.
6. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
3
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Opt ions
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin; Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin & V Select ions
F
0: No Color Bin Limitation
R: Amber Color Bins 1, 2, 4, and 6 with V Maximum of 2.6 V
F
T: Red Color with V Maximum of 2.6 V
F
Maximum Int ensit y Bin
0: No Iv Bin Limitation
Minimum Int ensit y Bin
Refer t o Device Select ion Guide
Color
B: 470 nm Blue
D: 630 nm Red
G: 626 nm Red
L: 590/592 nm Amber
M: 526 nm Green
Package
R: 4 mm 60º x 120º Oval, Parallel
S: 4 mm 60º x 120º Oval, Perpendicular
Absolute Maximum Ratings
T = 25°C
A
Parameter
DC Forward Current[1]
Blue and Green
30 mA
Amber and Red
50 mA
Peak Pulsed Forward Current
Average Forward Current
Reverse Voltage (IR = 100 µA)
Power Dissipation
100 mA
100 mA
30 mA
30 mA
5 V
5 V
120 mW
120 mW
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
130°C
130°C
–40°C to +80°C
–40°C to +100°C
–40°C to +100°C
–40°C to +120°C
Note:
1. Derate linearly as shown in Figures 6 and 7.
4
Electrical/ Optical Characteristics
T = 25°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Typical Viewing Angle[1]
2θ1/ 2
deg
Major
Minor
120
60
Forward Voltage
V
F
V
IF = 20 mA
Red (λd = 626 nm)
Red (λd = 630 nm)
Amber (λd = 590 nm)
Amber (λd = 592 nm)
Blue (λd = 470 nm)
Green (λd = 526 nm)
1.9
2.0
2.02
2.15
3.5
2.4
2.4[2]
2.4
2.4[2]
4.0
4.0
3.5
Reverse Voltage
Amber and Red
Blue and Green
V
R
V
IR = 100 µA
5
5
20
–
Peak Wavelength
Red (λd = 626 nm)
Red (λd = 630 nm)
Amber (λd = 590 nm)
Amber (λd = 592 nm)
λPEAK
nm
Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
635
639
592
594
LED Indicators
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Blue (λd = 470 nm)
Green (λd = 526 nm)
467
524
Spectral Halfwidth
∆λ1/ 2
nm
Wavelength Width at
Red (λd = 626/ 630 nm)
Amber (λd = 590/ 592 nm)
Blue (λd = 470 nm)
17
17
20
35
Spectral Distribution
1/ 2 Power Point at IF = 20 mA
Green (λd = 526 nm)
Capacitance
All Colors
C
pF
V = 0, F = 1 MHz
F
40
Thermal Resistance
All Colors
RθJ-PIN
ηv
°C/ W
lm/W
LED Junction-to-Cathode
Lead
240
Luminous Efficacy[3]
Red (λd = 626 nm)
Red (λd = 630 nm)
Amber (λd = 590 nm)
Amber (λd = 592 nm)
Blue (λd = 470 nm)
Green (λd = 526 nm)
Emitted Luminous Power/
Emitted Radiant Power
150
155
480
500
70
540
Notes:
1. 2θ1/ 2 is the off-axis angle where the luminous intensity is the on-axis intensity.
2. For options -xxRxx, -xxTxx, and -xxVxx, maximum forward voltage, V , is 2.6 V. Please refer to V Bin Table below.
F
F
3. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/ ηv, where Iv is the luminous intensity in candelas and ηv is
the luminous efficacy in lumens/ watt.
5
1.0
50
40
30
20
10
0
BLUE
GREEN
AMBER
RED
RED
0.5
AMBER
2.5
0
1.0
1.5
2.0
3.0
400
450
500
550
WAVELENGTH – nm
600
650
700
V – FORWARD VOLTAGE – V
F
Figure 1. Relative intensity vs. wavelength.
Figure 2. Amber, Red forward current vs.
forward voltage.
35
30
25
20
15
10
2.5
1.5
1.0
0.5
0
2.0
1.5
1.0
0.5
0
5
0
2.0
2.4
2.8
3.2
3.6
4.0
0
10
20
30
40
50
0
5
I
10
15
20
25
30
V – FORWARD VOLTAGE
F
– FORWARD CURRENT – mA
I
– FORWARD CURRENT – mA
F
F
Figure 3. Blue, Green forward current vs.
forward voltage.
Figure 4. Amber, Red relative luminous
intensity vs. forward current.
Figure 5. Blue, Green relative luminous
intensity vs. forward current.
35
30
60
50
40
Rθ = 585° C/ W
j-a
25
20
Rθ = 585° C/ W
j-a
30
20
15
10
5
Rθ = 780° C/ W
j-a
10
0
0
0
20
40
60
80
100
0
20
40
60
80
100
120
T
– AMBIENT TEMPERATURE – °C
T
– AMBIENT TEMPERATURE – °C
A
A
Figure 6. Amber, Red maximum forward
current vs. ambient temperature.
Figure 7. Blue, Green maximum forward
current vs. ambient temperature.
6
1.0
0.8
0.6
0.4
0.2
0
Intensity Bin Limits
(mcd at 20 mA)
Bin Name
Min.
Max.
85
D
E
F
65
85
110
140
180
240
310
400
520
680
880
1150
110
140
180
240
310
400
520
680
880
G
H
J
-90
-75
-60
-45
-30
-15
0
15
30
45
60
75
90
ANGULAR DISPLACEMENT – DEGREES
K
L
M
N
P
Figure 8a. Representative spatial radiation pattern for major axis.
Tolerance for each bin limit is ± 15%.
1.0
0.8
0.6
0.4
0.2
0
[2]
VF Bin Table
Bin Name
Min.
2.0
Max.
2.2
VA
VB
VC
2.2
2.4
2.4
2.6
Tolerance for each bin is ± 0.05 V.
Note:
-90
-75
-60
-45
-30
-15
0
15
30
45
60
75
90
1. Bin categories are established for
classification of products. Products may
not be available in all bin categories.
ANGULAR DISPLACEMENT – DEGREES
Figure 8b. Representative spatial radiation pattern for minor axis.
Color Bin Limits
(nm at 20 mA)
Amber
Color Range (nm)
Blue
Color Range (nm)
Green
Color Range (nm)
Bin ID
Min.
584.5
587.0
589.5
592.0
Max.
587.0
589.5
592.0
594.5
Bin
1
Min.
460.0
464.0
468.0
472.0
476.0
Max.
464.0
468.0
472.0
476.0
480.0
Bin ID
Min.
520.0
524.0
528.0
532.0
536.0
Max.
524.0
528.0
532.0
536.0
540.0
1
2
4
6
1
2
3
4
5
2
3
4
5
Tolerance for each bin limit is ± 0.5 nm.
Tolerance for each bin limit is ± 0.5 nm.
Tolerance for each bin limit is ± 0.5 nm.
Not e:
1. All bin categories are established for
classification of products. Products may
not be available in all bin categories.
Please contact your Avago representa-
tives for further information.
7
Precautions
• Wave soldering parameter must be set and
maintained according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering profile
to ensure the soldering profile used is always
conforming to recommended soldering condition.
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
Soldering Conditions
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
Plated Through
Hole Diameter
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
Diagonal
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
• Recommended soldering conditions:
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Manual Solder
Wave Soldering Dipping
Note: Refer to application note AN1027 for more
information on soldering LED components.
Pre-heat Temperature 105 °C Max.
–
Pre-heat Time
Peak Temperature
Dwell Time
30 sec Max.
250 °C Max.
3 sec Max.
–
260 °C Max.
5 sec Max.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
BOTTOM SIDE
OF PC BOARD
250
200
150
100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
FLUXING
PREHEAT
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
50
30
0
10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
Figure 9. Recommended wave soldering profile.
8
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2793EN
5989-4174EN May 21, 2006
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