HSMC-C110 [AVAGO]
High Performance ChipLED; 高性能型ChipLED
| 型号： | HSMC-C110 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | High Performance ChipLED |
| 文件： | 总11页 (文件大小：421K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HSMx-C110/C170/C190/C191/C150
HighPerformanceChipLED
DataSheet
HSMA-C110/C170/C190/C191/C150
HSML-C110/C170/C190/C191/C150
HSMC-C110/C170/C190/C191/C150
HSMZ-C110/C170/C190
Description
Features
These chip-type LEDs utilize Aluminum Indium Gal-
lium Phosphide (AlInGaP) material technology. The
AlInGaP material has a very high luminous efficiency,
capable of producing high light output over a wide
range of drive currents. The available colors in this
surface mount series are 592 nm Amber, 605 nm
Orange, 626 nm Red for AS AlInGaP and 631 nm red
for TS AlInGaP.
• High brightness AlInGaP material
• Small size
• Industry standard footprint
• Diffusedoptics
• Top emitting or right angle emitting
• Available in 3 colors (red, orange, amber)
• Compatible with IR soldering
• Available in 8 mm tape on 7" diameter reel
• Reel sealed in zip locked moisture barrier bags
All packages are binned by both color and intensity,
except for red color.
These ChipLEDs come either in two top emitting
packages (HSMx-C170/C190/C191/C150) or in a side
emitting package (HSMx-C110). The right angle
ChipLEDs are suitable for applications such as LCD
backlighting. The top emitting ChipLEDs with wide
viewing angle are suitable for light piping and direct
backlighting of keypads and panels. In order to facili-
tate pick and place operation, these ChipLEDs are
shipped in tape and reel, with 4000 units per reel for
HSMx-C170/C190/C191 and 3000 units per reel for
HSMx-C110/C150.
Applications
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbolindicator
• Microdisplays
• Small message panel signage
These packages are compatible with IR soldering
process.
Package Dimensions
CATHODE
LINE
LED DIE
CATHODE
MARK
LED DIE
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
3.2 (0.126 )
0.62 (0.024)
2.0 (0.079 )
POLARITY
CLEAR
EPOXY
1.4
(0.055)
POLARITY
DIFFUSED
EPOXY
1.5 (0.059)
0.3 (0.012)
PC BOARD
PC BOARD
0.8 (0.031)
0.5 (0.020)
0.3 (0.012)
1.6 (0.063 )
CATHODE LINE
0.4 ± 0.15
3.2 (0.126 )
0.4 ± 0.15
(0.016 ± 0.006)
(0.016 ± 0.006)
0.8 (0.031)
CATHODE LINE
1.0 (0.039)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C110
HSMx-C170
CATHODE
MARK
CATHODE
MARK
LED DIE
LED DIE
0.8 (0.031)
0.4 (0.016)
0.8 (0.031)
0.4 (0.016)
1.6
(0.063 )
1.6
(0.063 )
1.0
(0.039)
1.0
(0.039)
POLARITY
POLARITY
0.3 (0.012)
0.3 (0.012)
DIFFUSED EPOXY
DIFFUSED EPOXY
PC BOARD
PC BOARD
0.6 (0.023)
0.3 (0.012)
0.8 (0.031)
0.3 (0.012)
CATHODE LINE
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C191
HSMx-C190
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
CATHODE
MARK
LED DIE
Package Dimensions, continued
1.6 (0.063)
0.8 (0.031)
3.2 (0.126 )
2.0 (0.079)
DIFFUSED
EPOXY
POLARITY
0.6 (0.024)
1.1 (0.043)
PC BOARD
0.5 (0.020)
0.50 ± 0.2
CATHODE LINE
0.50 ± 0.2
(0.020 ± 0.008)
(0.020 ± 0.008)
SOLDERING
TERMINAL
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMx-C150
Device Selection Guide
Footprint
(mm)
AS AlInGaP
Amber
AS AlInGaP
Orange
AS AlInGaP
Red
TS AlInGaP
Red
Package
Description
[1,2]
1.6 x 0.8 x 0.8
2.0 x 1.25 x 0.8
3.2 x 1.0 x 1.5
1.6 x 0.8 x 0.6
3.2 x 1.6 x 1.1
HSMA-C190
HSMA-C170
HSMA-C110
HSMA-C191
HSMA-C150
HSML-C190
HSML-C170
HSML-C110
HSML-C191
HSML-C150
HSMC-C190
HSMC-C170
HSMC-C110
HSMC-C191
HSMC-C150
HSMZ-C190
HSMZ-C170
HSMZ-C110
Untinted, Diffused
Untinted, Diffused
Untinted, Nondiffused
Untinted, Diffused
Untinted, Diffused
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Absolute Maximum Ratings
T = 25°C
A
HSMA-C110/170/190/191/150
HSML-C110/170/190/191/150
HSMC-C110/170/190/191/150
Parameter
HSMZ-C110/170/190
Units
mA
mW
V
[1,2]
DC Forward Current
Power Dissipation
25
25
60
65
Reverse Voltage (I = 100 µA)
5
5
R
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
95
95
°C
–30 to +85
–40 to +85
–30 to +85
–40 to +85
°C
°C
See reflow soldering profile (Figure 7 & 8)
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive currents above 5 mA are recommended for best long term performance.
3
Electrical Characteristics
T = 25°C
A
Forward Voltage
V (Volts)
Reverse Breakdown
V (Volts)
Capacitance C
Thermal
Resistance
(pF), V = 0,
F
R
F
@ I = 20 mA
Typ. Max.
@ I = 100 µA
Min.
f = 1 MHz
Typ.
Rθ = (°C/W)
J-PIN
F
R
Parameter Number
HSMA-C110
Typ.
600
600
600
600
300
300
300
300
1.9
1.9
1.9
2.2
1.9
1.9
1.9
2.2
2.4
2.4
2.4
2.8
2.4
2.4
2.4
2.6
5
5
5
5
5
5
5
5
45
45
45
35
45
45
45
35
HSML-C110
HSMC-C110
HSMZ-C110
HSMA-C170/190/191/150
HSML-C170/190/191/150
HSMC-C170/190/191/150
HSMZ-C170/190
Optical Characteristics
T = 25°C
A
Luminous
Intensity
Color,
Dominant
Viewing
Angle
Luminous
Efficacy
Peak
I (mcd)
@ 20 mA
Wavelength
(nm)
Wavelength 2 θ
η
v
(lm/w)
Typ.
v
1/2
[1]
[2]
[3]
Part
λ
λ
(nm)
Degrees
Typ.
peak
d
Number
Color
Min.
28.5
28.5
28.5
28.5
28.5
28.5
45
Typ.
Typ.
595
595
609
609
637
637
643
643
Typ.
592
592
605
605
626
626
631
631
HSMA-C110
AS Amber
95
90
130
170
130
170
130
170
130
170
480
480
370
370
155
155
122
122
HSMA-C170/190/191/150 AS Amber
HSML-C110 AS Orange
HSML-C170/190/191/150 AS Orange
HSMC-C110 AS Red
HSMC-C170/190/191/150 AS Red
95
90
95
90
HSMZ-C110
HSMZ-C170/190
Notes:
TS Red
TS Red
170
165
45
1. The luminous intensity, I , is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the
v
lamp package.
2. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
d
3. θ is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
4
[1]
Color Bin Limits
[1]
Orange Color Bins
Dom. Wavelength (nm)
Bin ID
Min.
597.0
600.0
603.0
606.0
609.0
612.0
Max.
600.0
603.0
606.0
609.0
612.0
615.0
A
B
C
D
E
F
Tolerance: ± 1 nm.
[1]
Amber Color Bins
Dom. Wavelength (nm)
Bin ID
Min.
Max.
584.5
587.0
589.5
592.0
594.5
597.0
A
582.0
584.5
587.0
589.5
592.0
594.5
B
C
D
E
F
Tolerance: ±1 nm.
Note:
1. Bincategoriesareestablishedforclassificationofproducts.Products
maynotbe available inallcategories.Please contactyourAvagorepre-
sentative forinformationoncurrentlyavailable bins.
[1]
Light Intensity (Iv) Bin Limits
Intensity (mcd)
Intensity (mcd)
Bin ID
Min.
0.11
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
Max.
Bin ID
N
Min.
Max.
A
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
28.50
28.50
45.00
B
C
P
Q
45.00
71.50
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
D
R
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
E
S
F
G
T
U
H
V
J
W
X
Y
K
L
M
Tolerance: ± 15%.
Note:
1. Bincategories are establishedforclassificationofproducts.Products maynotbe available inall
categories.PleasecontactyourAvagorepresentativeforinformationoncurrentlyavailablebins.
5
1.0
AS AlInGaP
RED
AS AlInGaP
AMBER
AS AlInGaP
ORANGE
0.5
TS AlInGaP
RED
0
500
550
600
650
700
750
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
100
30
25
20
15
10
5
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
AS AlInGaP
10
HSMx-C110
HSMx-C150/170/
190/191
TS AlInGaP
1
0
0.1
0
5
10
I – FORWARD CURRENT – mA
F
15
20
25
30
0
20
40
60
80
100
1.5
1.7
1.9
2.1
2.3
2.5
T
– AMBIENT TEMPERATURE – °C
V
– FORWARD VOLTAGE – V
A
F
Figure 3. Luminous intensity vs. forward
current.
Figure 4. Maximum forward current vs.
ambient temperature.
Figure 2. Forward current vs. forward voltage.
6
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C110.
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
7
10 - 30 SEC.
255 - 260 °C
3 °C/ SEC. MAX.
217 °C
200 °C
10 SEC. MAX.
6 °C/ SEC. MAX.
230°C MAX.
150 °C
4°C/SEC. MAX.
–3°C/SEC.
140-160°C
3 °C/ SEC. MAX.
4°C/SEC.
100 SEC. MAX.
60 - 120 SEC.
MAX.
OVER 2 MIN.
TIME
TIME
(Acc. to J-STD-020C)
Figure 7. Recommended reflow soldering profile.
Figure 8. Recommended Pb-free reflow soldering profile.
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.0 (0.039)
1.2 (0.047)
0.2 (0.008)
1.2
(0.047)
1.2
(0.047)
CENTERING
BOARD
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
0.9
(0.035)
Figure 10. Recommended soldering pattern for HSMx-C170.
Figure 9. Recommended soldering pattern for HSMx-C110.
0.8 (0.031)
1.5 (0.059)
0.8
(0.031)
0.8
(0.031)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
0.7
(0.028)
Figure 11. Recommended soldering pattern for HSMx-C190 and C191.
Figure 12. Recommended soldering pattern for HSMx-C150.
Note: All dimensions in millimeters (inches).
8
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 13. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
5.0 ± 0.5
(0.197 ± 0.020)
6
PS
Figure 14. Reel dimensions.
Note: All dimensions in millimeters (inches).
9
DIM. C
(SEE TABLE 1)
4.00 (0.157)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
CARRIER TAPE
COVER TAPE
USER FEED
DIRECTION
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A DIM. B
± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004)
DIM. C
HSMx-C110
POSITION IN
PART NUMBER
CARRIER TAPE
HSMx-C191 SERIES
HSMx-C190 SERIES
HSMx-C170 SERIES
HSMx-C110 SERIES
HSMx-C150 SERIES
1.86 (0.073)
1.75 (0.069)
2.30 (0.091)
3.40 (0.134)
3.50 (0.138)
0.89 (0.035)
0.90 (0.035)
1.45 (0.057)
1.70 (0.067)
1.88 (0.074)
0.87 (0.034)
0.90 (0.035)
0.95 (0.037)
1.20 (0.047)
1.27 (0.050)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
DIM. B
(SEE TABLE 1)
Figure 15. Tape dimensions.
END
START
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Sur fa ce
Mounting SMT LED Indica tor
Components.
Storage Condition: 5 to 30˚ C
@ 60% RH max.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
Baking is required under the
condition:
a) Humidity Indicator Card is
> 10% when read at 23± 5°C.
b) Device exposed to factory
conditions < 30°C/60% RH
more than 672 hours.
COVER TAPE.
Figure 16. Tape leader and trailer dimensions.
NOTES:
Baking recommended condition:
60 + /– 5˚ C for 20 hours.
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
10
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3604EN
AV02-0112EN January 25, 2007
相关型号：
©2020 ICPDF网 联系我们和版权申明