HSMH-A100-M80J2 [AVAGO]
Surface Mount LED Indicator; 表面贴装LED指示灯
| 型号： | HSMH-A100-M80J2 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Surface Mount LED Indicator |
| 文件： | 总13页 (文件大小：330K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HSMx-A10x-xxxxx PLCC-2
Surface Mount LED Indicator
Data Sheet
Description
Features
This family of SMT LEDs is packaged in the industry
standard PLCC-2 package. These SMT LEDs have high
reliability performance and are designed to work under
a wide range of environmental conditions. This high
reliability feature makes them ideally suited to be used
under harsh interior automotive as well as interior signs
application conditions.
•
•
•
Industry standard PLCC-2 package
High reliability LED package
High brightness using AlInGaP and InGaN dice tech-
nologies
•
•
•
Available in full selection of colors
Super wide viewing angle at 120˚
To facilitate easy pick & place assembly, the LEDs
are packed in EIA-compliant tape and reel. Every reel will
be shipped in single intensity and color bin, except red
color, to provide close uniformity.
Available in 8 mm carrier tape on 7 inch reel (2000
pieces)
•
Compatible with both IR and TTW soldering process
Applications
These LEDs are compatible with IR solder reflow process.
Due to the high reliability feature of these products, they
can also be mounted using through-the-wave soldering
process.
•
Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
The super wide viewing angle at 120˚ makes these
LEDs ideally suited for panel, push button, or general
backlighting in automotive interior, office equipment,
industrial equipment, and home appliances. The flat
top emitting surface makes it easy for these LEDs
to mate with light pipes. With the built-in reflector
pushing up the intensity of the light output, these LEDs
are also suitable to be used as LED pixels in interior elec-
tronic signs.
•
•
Electronic signs and signals
– Interior full color sign
– Variable message sign
Office automation, home appliances, industrial
equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
CAUTION: HSMN,M,K and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precau-
tions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
ꢁ.8 0.ꢁ
ꢁ.ꢁ 0.ꢁ
ꢂ.9 0.ꢁ
0.ꢂ TYP.
0.8 0.ꢂ
ꢀ.ꢁ 0.ꢁ
ꢀ.5 0.ꢁ
0.8 0.ꢀ
0.5 0.ꢂ
CATHODE MARKING
(ANODE MARKING FOR AlGaAs DEVICES)
TOP MOUNT
ꢁ.8 0.ꢁ
ꢁ.ꢁ 0.ꢁ
ꢂ.9 0.ꢁ
5.ꢁ 0.ꢁ
ꢀ.ꢁ 0.ꢁ
0.ꢂ TYP.
CATHODE MARKING
REVERSE MOUNT
0.5 0.ꢂ
NOTE: ALL DIMENSIONS IN MILLIMETERS.
2
Device Selection Guide
Red
Part Number
Min. Iv (mcd)
4.0
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
GaP
HSMS-A100-J00J1
HSMS-A100-L00J1
HSMS-A100-H70J2
HSMS-A100-J80J2
HSMH-A100-L00J1
HSMH-A100-N00J1
HSMH-A100-L70J2
HSMH-A100-M80J2
HSMH-A100-Pꢀ0J1
HSMC-A100-J00J1
HSMC-A100-Q00J1
HSMC-A100-R00J1
HSMC-A101-S00J1
HSMZ-A100-T00J1
HSMC-A100-Pꢀ0J1
HSMC-A101-R80J1
HSMZ-A100-S80J1
15.0
-
20
20
10
10
20
20
10
10
20
20
20
20
20
20
20
20
20
10.0
15.0
-
GaP
ꢀ.0
-
8.0
GaP
5.0
-
15.5
GaP
10.0
15.0
-
AlGaAs
AlGaAs
AlGaAs
AlGaAs
AlGaAs
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
25.0
50.0
-
12.5
-
ꢀ2.0
20.0
-
62.0
40.0
-
100.0
4.0
100.0
100.0
140.0
220.0
ꢀ50.0
-
-
6ꢀ.0
-
100.0
160.0
250.0
40.0
-
-
-
100.0
ꢀ95.0
620.0
125.0
200.0
-
-
Red Orange
Part Number
Min. Iv (mcd)
6ꢀ.0
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
HSMJ-A100-Q00J1
HSMJ-A101-S00J1
HSMV-A100-T00J1
HSMJ-A100-Qꢀ0J1
HSMJ-A100-R40J1
HSMJ-A101-R80J1
HSMV-A100-S80J1
100.0
-
20
20
20
20
20
20
20
160.0
250.0
6ꢀ.0
200.0
-
ꢀ50.0
-
-
-
-
-
155.0
ꢀ15.0
ꢀ95.0
620.0
100.0
125.0
200.0
Orange
Part Number
Min. Iv (mcd)
4.0
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
GaP
HSMD-A100-J00J1
HSMD-A100-L00J1
HSMD-A100-J7PJ2
HSMD-A100-K4PJ2
HSML-A100-Q00J1
HSML-A101-S00J1
HSML-A100-Q7PJ1
HSML-A100-R7PJ1
HSML-A101-R8WJ1
15.0
-
20
20
10
10
20
20
20
20
20
10.0
15.0
-
GaP
5.0
-
12.5
20.0
-
GaP
6.ꢀ
-
GaP
6ꢀ.0
100.0
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
160.0
80.0
220.0
-
-
-
-
200.0
ꢀ15.0
ꢀ95.0
125.0
125.0
ꢀ
Device Selection Guide, continued
Yellow/Amber
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
GaP
HSMY-A100-J00J1
HSMY-A100-L00J1
HSMY-A100-Jꢀ5J2
HSMY-A100-K45J2
HSMA-A100-Q00J1
HSMA-A101-S00J1
HSMU-A100-S00J1
HSMA-A100-Qꢀ5J1
HSMA-A100-R45J1
HSMA-A101-R8WJ1
HSMU-A100-S4WJ1
4.0
12.0
-
20
20
10
10
20
20
20
20
20
20
20
10.0
4.0
12.0
-
GaP
-
10.0
20.0
-
GaP
6.ꢀ
-
GaP
6ꢀ.0
160.0
160.0
6ꢀ.0
100.0
125.0
160.0
100.0
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
220.0
-
ꢀ20.0
-
-
-
-
-
155.0
ꢀ15.0
ꢀ95.0
500.0
Yellow Green
Part Number
Min. Iv (mcd)
4.0
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
GaP
HSMG-A100-J02J1
HSMG-A100-K72J2
HSME-A100-M02J1
HSME-A100-N82J1
18.0
-
20
10
20
20
8.0
-
20.0
-
GaP
16.0
70.0
-
AlInGaP
AlInGaP
ꢀ0.0
100.0
Emerald Green
Part Number
Min. Iv (mcd)
2.5
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
GaP
HSMG-A100-H01J1
HSMG-A100-Gꢀ1J2
HSMG-A100-H41J2
HSME-A100-L01J1
HSME-A100-MꢀPJ1
8.0
-
20
10
10
20
20
1.6
-
4.0
8.0
-
GaP
2.5
-
GaP
10.0
40.0
-
AlInGaP
AlInGaP
16.0
40.0
Green
Part Number
Min. Iv (mcd)
100.0
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
InGaN
HSMM-A101-R00J1
HSMM-A100-S00J1
HSMM-A101-Q7PJ1
HSMM-A101-R7PJ1
HSMM-A101-R8PJ1
HSMM-A100-S8PJ1
200.0
-
20
20
20
20
20
20
160.0
ꢀ50.0
-
InGaN
80.0
-
-
-
-
200.0
ꢀ15.0
ꢀ95.0
620.0
InGaN
125.0
InGaN
125.0
InGaN
200.0
InGaN
4
Device Selection Guide, continued
Cyan
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
InGaN
HSMK-A101-R00J1
HSMK-A100-S00J1
HSMK-A100-S8WJ1
HSMK-A101-QꢀWJ1
HSMK-A101-R4WJ1
100.0
160.0
200.0
6ꢀ.0
170.0
-
20
20
20
20
20
280.0
-
InGaN
-
-
-
620.0
155.0
ꢀ15.0
InGaN
InGaN
100.0
InGaN
Blue
Part Number
Min. Iv (mcd)
4.0
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
GaN
HSMB-A100-J00J1
HSMB-A100-J70J2
HSMB-A100-K80J2
HSMN-A101-N00J1
HSMN-A100-P00J1
HSMN-A101-N7YJ1
HSMN-A100-P8YJ1
15.0
-
20
10
10
20
20
20
20
5.0
-
12.5
25.0
-
GaN
8.0
-
GaN
25.0
40.0
ꢀ0.0
50.0
50.0
InGaN
InGaN
InGaN
InGaN
70.0
-
-
-
80.0
155.0
Note:
1. The luminous intensity, I , is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
v
aligned with this axis.
5
Part Numbering System
HSM x - A x x x - x x
x
x x
8 9
1
2
ꢀ
4
5
6
7
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (T = 25°C)
A
Parameters
HSMS/D/Y/G
ꢀ0 mA
HSMH
HSMC/J/L/A
HSME
HSMZ/V/U
HSMM/K/B/N
ꢀ0 mA
[1]
[ꢀ,4]
[4]
[ꢀ,4]
DC Forward Current
ꢀ0 mA
100 mA
60 mW
ꢀ0 mA
20 mA
ꢀ0 mA
100 mA
72 mW
[2]
Peak Forward Current
Power Dissipation
Reverse Voltage
100 mA
6ꢀ mW
100 mA
6ꢀ mW
5 V
100 mA
48 mW
100 mA
114 mW
Junction Temperature
Operating Temperature
110°C
–55°C to +100°C
–55°C to +100°C
Storage Temperature
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty factor = 10%, Frequency = 1 kHz.
ꢀ. Drive current between 10 mA and ꢀ0 mA is recommended for best long term performance.
4. Operation at current below 5 mA is not recommended.
6
Optical Characteristics (T = 25˚C)
A
Viewing
Luminous
Intensity/
Total Flux
Peak
Wavelength
Dominant
Wavelength
Angle
Luminous
Efficacy η
[1]
[2]
[3]
2 θ
1/2
v
Dice
Technology
λ
(nm)
λ (nm)
(Degrees) (lm/W)
I (mcd)/Φ (mlm)
Typ.
PEAK
D
v
v
Color
Part Number
Typ.
6ꢀ5
645
6ꢀ5
6ꢀ9
621
62ꢀ
600
609
58ꢀ
592
594
565
575
558
566
52ꢀ
502
Typ.
626
6ꢀ7
626
6ꢀ0
615
617
602
605
585
590
592
569
570
560
560
525
505
Typ.
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
Typ.
120
6ꢀ
Red
HSMS-A100
HSMH-A100
HSMC-A10x
HSMZ-A100
HSMJ-A10x
HSMV-A100
HSMD-A100
HSML-A10x
HSMY-A100
HSMA-A10x
HSMU-A100
HSMG-A100
HSME-A100
HSMG-A100
HSME-A100
GaP
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
AlGaAs
AlInGaP
AlInGaP
AlInGaP
AlInGaP
GaP
150
155
240
26ꢀ
ꢀ80
ꢀ20
520
480
500
590
560
650
610
500
ꢀ00
Red
Orange
Orange
Amber
AlInGaP
GaP
AlInGaP
AlInGaP
GaP
Yellow
Green
AlInGaP
GaP
Emerald
Green
AlInGaP
Green
Cyan
Blue
HSMM-A10x InGaN
HSMK-A10x
InGaN
HSMB-A100
HSMN-A10x
GaN
InGaN
428
468
462
470
120
120
65
75
0.45
0.45
Notes:
1. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the device.
D
2.
θ
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
ꢀ. Radiant intensity, I in watts/steradian, may be calculated from the equation I = I /η , where I is the luminous intensity in candelas and η is
e
e
v
v
v
v
the luminous efficacy in lumens/watt.
Electrical Characteristics (T = 25˚C)
A
Forward Voltage Reverse Voltage Reverse Voltage
Thermal
V @ 10 µA
R
V (Volts) @ I = 20 mA
V @ 100 µA
R
Resistance
F
F
Part Number
HSMS/D/Y/G
HSMH
Typ.
Max.
Min.
Min.
—
—
—
—
5
Rθ (°C/W)
JP
2.2
1.9
1.9
2.2
ꢀ.9
ꢀ.4
2.6
5
180
180
280
280
280
280
2.6
5
HSMC/J/L/A/E
HSMZ/V/U
HSMB
2.4
5
2.6
5
4.ꢀ
—
—
HSMM/K/N
4.05
5
7
ꢀ5
ꢀ0
ꢁ5
ꢁ0
ꢂ5
ꢂ0
HSMS/D/Y/G
HSMZ/V/U
HSMH
HSMC/J/L/A/E
HSMM/K/N
HSMB
5
0
0
ꢂ
ꢁ
ꢀ
4
5
FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
Figure 1. Relative intensity vs. wavelength.
Figure 3. Relative intensity vs. forward current.
35
35
30
25
20
15
10
5
540
530
30
GREEN
HSMS/D/G/
Y/H/Z/V/U
HSMS/D/G/Y/H
HSMC/J/L/A
HSMZ/V/U
520
25
HSMC/J/L/A
510
20
HSME
HSME
CYAN
500
490
480
470
460
HSMM/K/N
HSMB
15
HSMM/K/B/N
10
5
BLUE
0
0
0
5
10 15 20 25 30 35
CURRENT – mA
0
20
40
60
80
100 120
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 5. Dominant wavelength vs. forward
current – InGaN devices.
Figure 4. Maximum forward current vs. ambient
temperature. Derated based on TJMAX = 110˚C,
RθJA = 500˚C/W.
Figure 4b. Maximum Forward Current Vs. Solder
Point Temperature. Derated based on TJMAX =
110°C, RθJP = 180°C/W or 280°C/W.
8
0.5
0.4
0.ꢀ
0.ꢁ
0.ꢂ
0
GaP/AlGaAs/
AlInGaP
-0.ꢂ
-0.ꢁ
-0.ꢀ
InGaN/GaN
50
TEMPERATURE – °C
-ꢂ00
-50
0
ꢂ00
ꢂ50
Figure 6. Forward voltage shift vs. temperature.
Figure 7. Radiation Pattern.
ꢂ0 to ꢀ0 SEC.
ꢁ55 - ꢁ60 °C
ꢀ °C/SEC. MAX.
ꢁꢂ7 °C
ꢁ00 °C
6 °C/SEC. MAX.
ꢂ50 °C
ꢀ °C/SEC. MAX.
ꢂ00 SEC. MAX.
60 - ꢂꢁ0 SEC.
TIME
(Acc. to J-STD-0ꢁ0C)
Figure 8a. Recommended SnPb reflow soldering profile.
Figure 8b. Recommended Pb-free reflow soldering profile.
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
4.50
ꢂ.50
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
ꢁ.60
ꢁ50
ꢁ00
ꢂ50
ꢂ00
FLUXING
PREHEAT
BOTTOM SIDE
OF PC BOARD
50
ꢀ0
TOP SIDE OF
PC BOARD
0
ꢂ0 ꢁ0 ꢀ0 40 50 60 70 80 90 ꢂ00
TIME – SECONDS
CONVEYOR SPEED = ꢂ.8ꢀ M/MIN (6 FT/MIN)
PREHEAT SETTING = ꢂ50°C (ꢂ00°C PCB)
SOLDER WAVE TEMPERATURE = ꢁ45°C
AIR KNIFE AIR TEMPERATURE = ꢀ90°C
AIR KNIFE DISTANCE = ꢂ.9ꢂ mm (0.ꢁ5 IN.)
AIR KNIFE ANGLE = 40°
LEADED SOLDER: SN6ꢀ; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, ꢀ wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
SOLDER RESIST
Figure 9. Recommended wave soldering profile.
Figure 10. Recommended soldering pad pattern.
9
Figure 11. Tape leader and trailer dimensions.
Figure 12. Tape dimensions.
10
Figure 13. Reel dimensions.
Figure 14. Reeling orientation.
11
Color Bin Limits
Emerald
Intensity Bin Select (X X )
Color Bin Select (X )
5
6
7
Individual reel will contain parts
from one half bin only.
Individual reel will contain parts
from one full bin only.
Green
Min. (nm)
Max. (nm)
555.5
A
B
552.5
555.5
558.5
561.5
X
Min I Bin
X
5
v
7
558.5
0
Full Distribution
A and B only
C
D
561.5
X
Z
Y
W
V
U
T
6
564.5
0
ꢀ
4
5
7
8
9
Full Distribution
B and C only
ꢀ half bins starting from X 1
C and D only
5
4 half bins starting from X 1
D and E only
5
Yellow
Green
Min. (nm)
564.5
567.5
570.5
57ꢀ.5
Max. (nm)
567.5
5 half bins starting from X 1
E and F only
5
E
ꢀ half bins starting from X 2
F and G only
5
F
570.5
4 half bins starting from X 2
S
G and H only
5
G
H
57ꢀ.5
5 half bins starting from X 2
Q
P
N
M
L
A, B, and C only
B, C, and D only
C, D, and E only
D, E, and F only
E, F, and G only
F, G, and H only
A, B, C, and D only
E, F, G, and H only
B, C, D, and E only
C, D, E, and F only
A, B, C, D, and E only
B, C, D, E, and F only
5
576.5
Intensity Bin Limits
Bin ID
G1
G2
H1
H2
J1
Min. (mcd)
Max. (mcd)
2.24
Amber
Min. (nm)
582.0
584.5
587.0
589.5
592.0
594.5
Max. (nm)
584.5
587.0
589.5
592.0
594.5
597.0
1.80
A
B
C
D
E
K
1
2.24
2.80
2.80
ꢀ.55
2
ꢀ.55
4.50
ꢀ
4.50
5.60
4
J2
5.60
7.20
F
5
K1
K2
L1
7.20
9.00
6
9.00
11.20
14.00
18.00
22.40
28.50
ꢀ5.50
45.00
56.00
71.50
90.00
112.50
140.00
180.00
224.00
285.00
ꢀ55.00
450.00
560.00
715.00
900.00
1125.00
Orange
Min. (nm)
597.0
600.0
60ꢀ.0
606.0
609.0
Max. (nm)
600.0
60ꢀ.0
606.0
609.0
612.0
11.20
14.00
18.00
22.40
28.50
ꢀ5.50
45.00
56.00
71.50
90.00
112.50
140.00
180.00
224.00
285.00
ꢀ55.00
450.00
560.00
715.00
900.00
A
B
C
D
E
Color Bin Limits
L2
Blue
A
Min. (nm)
Max. (nm)
465.0
M1
M2
N1
N2
P1
P2
Q1
Q2
R1
R2
S1
460.0
465.0
470.0
475.0
B
470.0
C
475.0
D
480.0
Red Orange
Min. (nm)
Max. (nm)
616.0
A
B
611.0
616.0
Cyan
A
Min. (nm)
490.0
495.0
500.0
505.0
Max. (nm)
495.0
620.0
B
500.0
C
505.0
Red
Min. (nm)
Max. (nm)
D
510.0
Full Distribution
Tolerance of each bin limit = 1 nm.
S2
T1
T2
Green
Min. (nm)
515.0
520.0
525.0
5ꢀ0.0
Max. (nm)
520.0
U1
U2
V1
V2
A
B
525.0
C
D
5ꢀ0.0
5ꢀ5.0
Tolerance of each bin limit = 12%.
12
Packaging Option (X X )
8
9
Moisture Sensitivity
Option Test Current
Package Type
Reel Size
7 inch
This product is qualified as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the
reliability of the product. Do refer to Avago Application
Note AN5ꢀ05 Handling of Moisture Sensitive Surface
Mount Devices for details.
J1
20 mA
20 mA
20 mA
20 mA
10 mA
10 mA
10 mA
10 mA
Top Mount
J4
Top Mount
1ꢀ inch
7 inch
H1
H4
J2
Reverse Mount
Reverse Mount
Top Mount
1ꢀ inch
7 inch
A. Storage before use
J5
Top Mount
1ꢀ inch
7 inch
-
Unopen moisture barrier bag (MBB) can be stored
at <40°C/90%RH for 12 months. If the actual shelf
life has exceeded 12 months and the HIC indicates
that baking is not required, then it is safe to reflow
the LEDs per the original MSL rating.
H2
H5
Reverse Mount
Reverse Mount
1ꢀ inch
-
It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
-
The humidity indicator card (HIC) shall be read im-
mediately upon opening of MBB.
-
The LEDs must be kept at <ꢀ0°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
-
For any unuse LEDs, they need to be stored
in sealed MBB with desiccant or desiccator at
<5%RH.
D. Control of assembled boards
-
If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB need
to be stored in sealed MBB with desiccant or desic-
cator at <5%RH to ensure no LEDs have exceeded
their floor life of 672 hours.
E. Baking is required if:
-
-
“10%”or “15%”HIC indicator turns pink.
The LEDs are exposed to condition of >ꢀ0°C / 60%
RH at any time.
-
The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60 5°C for 20 hours.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0040EN
AV02-0198EN - May 30, 2007
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