HSMN-A431-T50M2 [AVAGO]
Surface Mount LED Indicator; 表面贴装LED指示灯
| 型号： | HSMN-A431-T50M2 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Surface Mount LED Indicator |
| 文件： | 总10页 (文件大小：584K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HSMx-A43x-xxxxx
Surface Mount LED Indicator
Data Sheet
Description
Features
• Industry Standard PLCC-4
• High reliability LED package
• High brightness using AllnGaP and InGaN dice tech-
nologies
• High optical efficiency
• Narrow Viewing angle at 30°
• Available in 8mm carrier tape on 7-inch reel
• Compatible with both IR and TTW soldering process
The Power PLCC-4 SMT LED with Lens are high-performance
PLCC-4 package size SMT LEDs targeted mainly in Automo-
tive & Electronics Signs and Signals (ESS) markets. These
top-mount single-chip packages with focused radiation
offer high brightness in beam direction and are excellent
for interior automotive, indoor and outdoor sign and indus-
trial applications. With additional lens in 30° variants, these
products are especially fitting to applications for traffic
lights, CHMSL and displays.
The PLCC-4 package family is able to dissipate heat better
compared to the PLCC-2 packages. In proportion to this
increase in driving current, this family of LEDs is able to
produce higher light output compared to the conventional
PLCC-2 SMT LEDs.
Applications
Interior automotive
• Instrument panel backlighting
• Central console backlighting
• Cabin backlighting
• Navigation and audio system
• Dome lighting
As an extension of the standard flat top PLCC-4 SMT LEDs,
the Power PLCC-4 with Lens device is able to provide fo-
cused beams within narrow viewing angles (30°) meeting
the market’s requirements for focused radiation and high
brightness in beam directions.
• Push button backlighting
Exterior automotive
The Power PLCC-4 SMT LED with 30° is ideal for panel, push
button, or general backlighting in automotive interior
& exterior, sign, office equipment, industrial equipment
and home appliances applications. This package design
coupled with careful selection of component materials al-
low the Power PLCC-4 SMT LED with Lens to perform with
higher reliability in a larger temperature range -40°C to
100°C. This high reliability feature is crucial to allow the
Power PLCC-4 SMT LED with Lens to do well in harsh envi-
ronments such as its target Automotive & ESS markets. The
Power PLCC4 SMT LED with Lens package is also designed
to be compatible with both IR-solder re-flow and through-
the-wave soldering.
• Turn signals
• CHMSL
• Rear Combination Lamp
• Side repeaters
Electronic signs and signals
• Interior and exterior full color sign
• Variable message sign
• Garden lighting
Office automation, home appliances, industrial equipment
• Front panel backlighting
• Push button backlighting
• Display backlighting
CAUTION: HSMN, HSMM-A43x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
The new Avago Technologies Power PLCC-4 SMT LED with
30° Lens will carry the part number HSMx- A43xxxxxx. The
high brightness AlInGaP and InGaN dice technologies
utilized will provide the product brightness that meets
the Automotive and ESS markets requirements. The Lens
package will complement and complete the existing AlIn-
Gap & InGaN color standard Power-PLCC-4 LED that Avago
Technologies offers, providing customers an extra Lens
option from one supplier.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel will be
shipped in single intensity and color bin (except for red
color), to provide close uniformity
Package Dimensions
Note: All dimensions in mm
Electrical connection between all cathodes is recommended
2
Device Selection Guide
Test Current
Dice
Technology
Color
Part Number
Min. I (mcd) Typ. I (mcd) Max. I (mcd) (mA)
V
V
V
Red
HSMC-A430-W50M1 1125.00
2300.00
3550.00
50
50
50
50
50
50
50
50
50
30
30
30
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
InGaN
HSMC-A431-X90M1
HSMJ-A430-W50M1
HSMJ-A431-X90M1
HSMV-A430-Y90M1
HSML-A431-X90M1
2240.00
1125.00
2240.00
3500.00
2240.00
4000.00
2300.00
4500.00
6000.00
4500.00
3000.00
5000.00
4700.00
2400.00
950.00
7150.00
3550.00
7150.00
11250.00
7150.00
4500.00
-
Red Orange
Orange
Amber
HSMA-A430-W90M1 1400.00
HSMA-A431-Y00M1
HSMA-A431-X90M1
2850.00
2240.00
7150.00
4500.00
1400.00
900.00
Green
Blue
HSMM-A430-W90M2 1400.00
HSMN-A430-U50M2
HSMN-A431-T50M2
450.00
285.00
InGaN
360.00
InGaN
Notes:
1. The luminous intensity I , is measured at the mechanical axis of the lamp package.
V
The actual peak of the spatial radiation pattern may not be aligned with this axis.
2. Iv tolerance 12ꢀ
Part Numbering System
HSM x - A X X X - X
X
X X X
1
2
3
4
5
6 7 8 9
Packaging Option
Colot Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (T =25°C)
A
Parameters
HSMC/A
70 mA
200 mA
180 mW
5V
HSMV
HSMM/N
30 mA
90 mA
114 mW
4V
[1]
DC Forward Current
70 mA
200 mA
240 mW
5V
[2]
Peak Forward Current
Power Dissipation
Reverse Voltage
Junction Temperature
110 °C
Operating Temperature
Storage Temperature
Notes:
- 40 °C to + 100 °C
- 40 °C to + 100 °C
1. Derate linearly as shown in Figure 4.
2. Duty factor = 10ꢀ, Frequency = 1kHz
3
Optical Characteristics (T = 25 °C)
A
Peak
Wavelength
Viewing Angle
Luminous
[2]
Dominant Wave- 2θ
Efficacy
½
[1]
[3]
λ
(nm)
length λ (nm) (Degrees)
η
(lm/W)
PEAK
D
V
Dice
Typical
635
621
623
609
592
518
468
Typical
626
615
617
605
590
525
470
Typical
30
Typical
150
240
263
320
480
500
75
Color
Part Number
HSMC-A43x
HSMJ-A43x
HSMV-A430
HSML-A431
HSMA-A43x
HSMM-A430
HSMN-A43X
Technology
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
InGaN
Red
Red
Orange
30
30
Orange
Amber
Green
Blue
30
30
30
InGaN
30
Notes:
1. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the device.
D
2. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = I / η , where I is the luminous intensity
V
V
V
in candelas and η is the luminous efficacy in lumens / watt.
V
Electrical Characteristics (T = 25 °C)
A
Forward Voltage V (Volts)@I =50 mA
Reverse Voltage V @100mA
Reverse Voltage V @10mA
F
F
R
R
Typical
2.2
Maximum
Minimum
Minimum
Part Number
HSMC/J/L/A
HSMV
2.5
3.4
5
5
-
-
2.8
Forward Voltage V (Volts)@I =30 mA
Reverse Voltage V @100mA
Reverse Voltage V @10mA
F
F
R
R
Typical
Maximum
Minimum
Minimum
Part Number
HSMM/N
3.9
4.6
-
5
AlInGaP Orange
AlInGaP Amber
1
0.8
AlInGaP Red Orange
InGaN
Green
0.6
InGaN
Blue
AlInGaP Red
0.4
0.2
0
380
430
480
530
580
630
680
730
780
WAVELENGTH - nm
Figure 1. Relative Intensity Vs. Wavelength
4
80
70
60
50
40
30
20
10
HSMV
HSMC/J/L/A
HSMM/N
4
0
0
1
2
3
5
FORWARD VOLTAGE - V
Figure 2. Forward Current Vs. Forward Voltage
1.4
1.2
1.2
1.0
1.0
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
0
5
10 15 20 25 30 35 40 45 50 55 60 65 70 75
0
5
10
15
20
25
30
35
DC FORWARD CURRENT - mA
DC FORWARD CURRENT - mA
Figure 3a. Relative Intensity Vs. Forward Current (AlInGaP).
Figure 3b. Relative Intensity Vs. Forward Current (InGaN).
Figure 4a. Maximum Forward Current Vs. Ambient Temperature.
Figure 4b. Maximum Forward Current Vs. Ambient Temperature.
Derated Based on T max= 110°C (AlInGaP)
Derated Based on T max= 110°C (InGaN)
J
J
5
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
Figure 5. Radiation Pattern
X
X
2.60
(0.103)
0.40 (0.016)
1.10
(0.043)
Y
Y
0.50
(0.020)
4.50 (0.178)
1.50 (0.059)
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
DIMENSIONS IN mm (INCHES).
Figure 6a. Recommended Soldering Pad Pattern (IR Reflow).
SOLDER RESIST
X
X
0.5 (0.020)
6.1 (0.240)
2.8 (0.110)
Y
2.0 (0.079)
2.0 (0.079)
6.0 (0.236)
1.0 (0.039)
Y
3.0 (0.118)
DIMENSIONS IN mm (INCHES).
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
SOLDER RESIST
Figure 6b. Recommended Soldering Pad Pattern (TTW).
6
Figure 7. Soft Tip Vacuum Pick-up Tool for Extracting SMT LED Components from Carrier Tape.
10 to 20 SEC.
255 ˚C +5˚C
-0˚C
217˚C
-6˚C/SEC MAX.
3˚C/SEC MAX.
125˚C +/- 25˚C
60-150 SEC.
MAX. 120 SEC.
TIME
Figure 8b. Recommended Pb-free Reflow Soldering Profile.
Figure 8a. Recommended SnPb Reflow Soldering Profile
Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT
LED Indicator Components.
Figure 9. Recommended Wave Soldering Profile.
7
TRAILER
COMPONENT
LEADER
200 mm MIN. FOR ∅ 180 REEL.
200 mm MIN. FOR ∅ 330 REEL.
480 mm MIN. FOR ∅ 180 REEL.
960 mm MIN. FOR ∅ 330 REEL.
C
A
USER FEED DIRECTION
Figure 10. Tape Leader and Trailer Dimensions
Figure 11. Tape Dimensions
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 12. Reeling Orientation.
8
Moisture Sensitivity
Intensity Bin Select (X X )
5 6
Individual reel will contain parts from one half bin only
This product is qualified as Moisture Sensitive Level 2a per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
X
Min Iv Bin
5
X
0
3
4
5
7
8
9
6
Full Distribution
A. Storage before use
3 half bins starting from X 1
5
-
Unopen moisture barrier bag (MBB) can be stored at
<40°C/90ꢀRH for 12 months. If the actual shelf life has
exceeded 12 months and the HIC indicates that baking
is not required, then it is safe to reflow the LEDs per the
original MSL rating.
4 half bins starting from X 1
5
5 half bins starting from X 1
5
3 half bins starting from X 2
5
4 half bins starting from X 2
5
-
It is not recommended to open the MBB prior to assem-
bly (e.g. for IQC).
5 half bins starting from X 2
5
Intensity Bin Limits
B. Control after opening the MBB
Bin ID
W1
W2
X1
X2
Y1
Min (mcd)
1125.00
1400.00
1800.00
2240.00
2850.00
3550.00
4500.00
5600.00
7150.00
9000.00
11250.00
14000.00
Max (mcd)
1400.00
1800.00
2240.00
2850.00
3550.00
4500.00
5600.00
7150.00
9000.00
11250.00
14000.00
18000.00
-
The humidity indicator card (HIC) shall be read immedi-
ately upon opening of MBB.
-
The LEDs must be kept at <30°C / 60ꢀRH at all time and
all high temperature related process including solder-
ing, curing or rework need to be completed within 672
hours.
C. Control for unfinished reel
Y2
-
For any unuse LEDs, they need to be stored in sealed
MBB with desiccant or desiccator at <5ꢀRH.
Z1
Z2
D. Control of assembled boards
11
-
If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to be
stored in sealed MBB with desiccant or desiccator at
<5ꢀRH to ensure no LEDs have exceeded their floor life
of 672 hours.
12
21
22
Tolerance of each bin limit = 12ꢀ
E. Baking is required if:
-
-
“10ꢀ”or “15ꢀ”HIC indicator turns pink.
The LEDs are exposed to condition of >30°C / 60ꢀ RH at
any time.
-
The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60 5°C for 20 hours.
9
Color Bin Select (X )
7
Green
Min. (nm)
515.0
520.0
525.0
530.0
Max. (nm)
520.0
Individual reel will contain parts from 1 full bin only
A
B
525.0
X7
C
D
530.0
0
Full Distribution
A and B only
535.0
Z
Y
W
V
U
T
B and C only
Amber
Min. (nm)
582.0
584.5
587.0
589.5
592.0
594.5
Max. (nm)
584.5
587.0
589.5
592.0
594.5
597.0
C and D only
A
B
C
D
E
D and E only
E and F only
F and G only
S
G and H only
Q
P
A, B and C only
B, C and D only
C, D and E only
D, E and F only
E, F and G only
F, G and H only
A, B, C and D only
E, F G and H only
F
N
M
L
Red
Min. (nm) Max. (nm)
Full Distri-
bution
K
1
Tolerance of each bin limit = 1nm
2
Packaging Option (X X )
8 9
Option
M1
Test Current Package Type
Reel Size
13 inch
13 inch
Color Bin Limits
50mA
30mA
Top Mount
Top Mount
Blue
A
Min. (nm)
Max. (nm)
465.0
M2
460.0
465.0
470.0
475.0
B
470.0
Forward Voltage Bin Table
For HSMV – A43x-xxxxx only
C
475.0
D
480.0
Bin
VA
VB
VC
VD
VE
Min.
1.9
2.2
2.5
2.8
3.1
Max.
2.2
2.5
2.8
3.1
3.4
Cyan
A
Min. (nm)
490.0
495.0
500.0
505.0
Max. (nm)
495.0
B
500.0
C
505.0
D
510.0
Tolerance for each bin limit = 0.1V
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0313EN
AV02-0208EN - August 29, 2007
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