HSMQ-C197 [AVAGO]
High Performance Chip LED; 高性能LED芯片
| 型号： | HSMQ-C197 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | High Performance Chip LED |
| 文件： | 总12页 (文件大小：455K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HSMx-C1xx
High Performance Chip LED
Data Sheet
HSMQ-C110, HSMQ-C120, HSMQ-C150,
HSMQ-C170, HSMQ-C177, HSMQ-C190,
HSMQ-C191, HSMQ-C197, HSMQ-C265,
HSMR-C110, HSMR-C120, HSMR-C130,
HSMR-C150, HSMR-C170, HSMR-C177,
HSMR-C190, HSMR-C191, HSMR-C197,
HSMR-C265
Description
Features
These small chip-type LEDs utilize high efficient and
highbrightnessInGaNmaterialtodelivercompetitively
priced high performance blue and green. These 520
nm green and 470 nm blue are unique hues which
provide color differentiation to a product.
• High brightness
• Small size
• Industrial standard footprint
• Diffused optics
• Top emitting or right angle emitting
• Compatible with IR soldering
• Compatible for use with light piping
• Available in 8 mm tape on 7" diameter reel
• Reel sealed in zip locked moisture barrier bags
These ChipLEDs come in either top emitting packages
(HSMx-C130, C150, C170, C177, C190, C191, C197),
in side emitting packages (HSMx-C110, C120) or in a
reverse mount package (C265). The side emitting
package is especially suitable for LCD backlighting
application. The top emitting packages, with their
wideviewingangle, aresuitablefordirectbacklighting
application or being used with light pipes. In order to
facilitate pick and place operation, these ChipLEDs
areshippedintapeandreelwith4000unitsperreelfor
HSMx-C120, C130, C170, C177, C190, C191 and
C197 packages, and 3000 units per reel for HSMx-
C110, C150 and C265 packages. All packages are
Applications
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol indicator
compatible with IR soldering and binned by both color • Microdisplays
and intensity.
• Small message panel signage
CAUTION: HSMQ-Cxxx and HSMR-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please
observe appropriate precautions during handling and processing. Refer to Avago Technologies Application
Note AN-1142 for additional details.
Package Dimensions
CATHODE
LINE
CATHODE
MARK
LED DIE
1.ꢀ (ꢀ.ꢀ39)
1.25 (ꢀ.ꢀ09)
2.6 (ꢀ.1ꢀ2 )
3.2 (ꢀ.126 )
2.ꢀ (ꢀ.ꢀ79 )
ꢄOLARITY
CLEAR
EꢄOXY
1.0
(ꢀ.ꢀ55)
ꢄOLARITY
DIꢅꢅꢂSED
EꢄOXY
1.5 (ꢀ.ꢀ59)
ꢀ.3 (ꢀ.ꢀ12)
ꢄC BOARD
ꢄC BOARD
ꢀ.8 (ꢀ.ꢀ31)
ꢀ.3 (ꢀ.ꢀ12)
ꢀ.5 (ꢀ.ꢀ2ꢀ)
1.6 (ꢀ.ꢀ63 )
CATHODE LINE
3.2 (ꢀ.126 )
ꢀ.0 ꢀ.15
(ꢀ.ꢀ16 ꢀ.ꢀꢀ6)
ꢀ.0 ꢀ.15
(ꢀ.ꢀ16 ꢀ.ꢀꢀ6)
ꢀ.8 (ꢀ.ꢀ31)
CATHODE LINE
1.ꢀ (ꢀ.ꢀ39)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C17ꢀ
HSMx-C11ꢀ
CATHODE
MARK
CATHODE
MARK
ꢀ.8 (ꢀ.ꢀ31)
ꢀ.8 (ꢀ.ꢀ31)
1.6
(ꢀ.ꢀ63 )
1.6
(ꢀ.ꢀ63 )
1.ꢀ
(ꢀ.ꢀ39)
1.ꢀ
(ꢀ.ꢀ39)
ꢄOLARITY
ꢄOLARITY
ꢀ.3 (ꢀ.ꢀ12)
ꢀ.3 (ꢀ.ꢀ12)
DIꢅꢅꢂSED EꢄOXY
ꢄC BOARD
DIꢅꢅꢂSED EꢄOXY
ꢄC BOARD
ꢀ.8 (ꢀ.ꢀ31)
ꢀ.3 (ꢀ.ꢀ12)
ꢀ.6 (ꢀ.ꢀ23)
ꢀ.3 (ꢀ.ꢀ12)
CATHODE LINE
CATHODE LINE
ꢀ.3 ꢀ.15
(ꢀ.ꢀ12 ꢀ.ꢀꢀ6)
ꢀ.3 ꢀ.15
(ꢀ.ꢀ12 ꢀ.ꢀꢀ6)
ꢀ.3 ꢀ.15
(ꢀ.ꢀ12 ꢀ.ꢀꢀ6)
ꢀ.3 ꢀ.15
(ꢀ.ꢀ12 ꢀ.ꢀꢀ6)
ꢀ.7 (ꢀ.ꢀ28) MIN.
ꢀ.7 (ꢀ.ꢀ28) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C19ꢀ
HSMx-C191
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ꢀ.1 ꢁꢁ ( ꢀ.ꢀꢀ0 IN.) ꢂNLESS OTHERꢃISE SꢄECIꢅIED.
2
Package Dimensions, continued
CATHODE MARK
CATHODE
MARK
1.25
(0.049)
1.6 (0.063)
2.00 (0.079)
3.2 (0.126 )
POLARITY
DIFFUSED
2.0 (0.079)
POLARITY
DIFFUSED EPOXY
0.40 (0.016)
EPOXY
0.6 (0.024)
1.1 (0.043)
PC BOARD
PC BOARD
0.16 (0.006)
CATHODE LINE
0.50 0.20
(0.020 0.00ꢀ)
0.5 (0.020)
0.50 0.20
CATHODE LINE
(0.020 0.00ꢀ)
0.40 0.15
(0.016 0.006)
0.40 0.15
(0.016 0.006)
1.10 (0.043) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C150
HSMx-C177
CATHODE MARK
LED DIE
CATHODE MARK
ꢀ.3 (ꢀ.ꢀ12)
ꢀ.6 (ꢀ.ꢀ20)
1.6 (ꢀ.ꢀ63)
0.ꢀ0
(0.031)
1.60
(0.063)
POLARITY
ꢄOLARITY
1.2 (ꢀ.ꢀ07)
CLEAR EꢄOXY
ꢄC BOARD
DIFFUSED EPOXY
0.40 (0.016)
1.ꢀ (ꢀ.ꢀ39)
PC BOARD
0.16 (0.006)
ꢀ.5 (ꢀ.ꢀ2ꢀ)
CATHODE LINE
3 – ꢀ.3 (ꢀ.ꢀ12)
0.30 0.15
(0.012 0.006)
CATHODE LINE
0.70 (0.02ꢀ) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C197
HSMx-C12ꢀ
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ꢀ.1 ꢁꢁ ( ꢀ.ꢀꢀ0 IN.) ꢂNLESS OTHERꢃISE SꢄECIꢅIED.
3
Package Dimensions, continued
3.4 (0.134)
CATHODE
MARK (ETCHED)
CATHODE
MARK
LED DIE
LED DIE
0.ꢀ (0.031)
(0.625)
1.25 (0.049)
1.6
(0.063)
GREEN SOLDER MASK
POLARITY
POLARITY
1.15
(0.045)
1.2
(0.047)
UNDIFFUSED
EPOXY
0.23 (0.009)
0.35 (0.014)
0.12 (0.005)
DIFFUSED EPOXY
PCB BOARD
1.1 (0.043)
1.1 (0.043)
PC BOARD
0.3 (0.012)
CATHODE LINE
CATHODE LINE
0.3 0.15
(0.012 0.006)
0.3 0.15
(0.012 0.006)
0.50 0.15
(0.020 0.006)
0.50 0.15
(0.020 0.006)
0.7 (0.02ꢀ) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C265
HSMx-C130
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS 0.1 ꢁꢁ ( 0.004 IN.) UNLESS OTHERꢂISE SPECIFIED.
Device Selection Guide
[1], [2]
Package Dimension (mm)
InGaN Green
InGaN Blue
Package Description
3.2(L) x 1.5(W) x 1.0(H)
1.6(L) x 1.0(W) x 0.6(H)
1.6(L) x 0.8(W) x 0.35(H)
3.2(L) x 1.6(W) x 1.1(H)
2.0(L) x 1.25(W) x 0.8(H)
2.0(L) x 1.25(W) x 0.4(H)
1.6(L) x 0.8(W) x 0.8(H)
1.6(L) x 0.8(W) x 0.6(H)
1.6(L) x 0.8(W) x 0.4(H)
3.4(L) x 1.25(W) x 1.1(H)
HSMQ-C110
HSMQ-C120
–
HSMQ-C150
HSMQ-C170
HSMQ-C177
HSMQ-C190
HSMQ-C191
HSMQ-C197
HSMQ-C265
HSMR-C110
HSMR-C120
HSMR-C130
HSMR-C150
HSMR-C170
HSMR-C177
HSMR-C190
HSMR-C191
HSMR-C197
HSMR-C265
Untinted, Non-diffused
Untinted, Non-diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Non-diffused
Notes: 1. Dimensions in mm. 2. Tolerance 0.1 mm unless otherwise noted.
Absolute Maximum Ratings at T = 25˚C
A
HSMQ-Cxxx
Parameter
DC Forward Current
Power Dissipation
HSMR-Cxxx
Units
mA
mW
V
[1]
20
78
5
Reverse Voltage (I = 100 µA)
R
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
95
˚C
˚C
˚C
–30 to +85
–40 to +85
See reflow soldering profile (Figures 11 & 12)
Note: 1. Derate linearly as shown in Figure 4.
4
Electrical Characteristics at T = 25˚C
A
Forward Voltage
Reverse Breakdown
Capacitance C
Thermal
V (Volts)
V (Volts)
(pF), V = 0,
Resistance
F
R
F
@ I = 20 mA
@ I = 100 µA
f = 1 MHz
Typ.
Rθ
(˚C/W)
J–PIN
F
R
Part Number
Typ.
3.4
3.4
3.4
3.4
3.4
3.4
3.4
3.4
3.4
3.4
Max.
Min.
Typ.
450
450
450
450
300
300
350
350
300
300
HSMQ-C110/C150
HSMR-C110/C150
HSMQ-C120
HSMR-C120/C130
HSMQ-C170/C190/C191
HSMR-C170/C190/C191
HSMQ-C177/C197
HSMR-C177/C197
HSMQ-C265
3.9
3.9
3.9
3.9
3.9
3.9
3.9
3.9
3.9
3.9
5
5
5
5
5
5
5
5
5
5
140
140
100
100
110
110
110
110
65
HSMR-C265
V Tolerance: 0.1 V
F
65
Optical Characteristics at T = 25˚C
A
Luminous
Intensity
Color,
Dominant
Viewing
Angle
Luminous
Efficacy
Peak
I (mcd)
@ 20 mA
Min.
Wavelength Wavelength
2 θ
Degrees
Typ.
η
V
1/2
V
[1]
[2]
[3]
λ
(nm)
λ
(nm)
(lm/w)
Typ.
peak
d
Part Number
HSMQ-C110
HSMQ-C120
Color
Green
Green
Typ.
Typ.
Typ.
45
45
45
45
45
18
18
18
18
18
18
150
145
145
145
140
60
55
55
55
55
520
520
520
520
520
469
469
469
469
469
469
527
527
527
527
527
473
473
473
473
473
473
130
155
140
130
150
130
155
145
140
130
150
500
500
500
500
500
88
88
88
88
88
HSMQ-C150/170/190/191 Green
HSMQ-C177/197
HSMQ-C265
HSMR-C110
HSMR-C120
HSMR-C130
HSMR-C150/170/190/191 Blue
HSMR-C177/197
HSMR-C265
Green
Green
Blue
Blue
Blue
Blue
Blue
45
88
Notes:
1. The luminous intensity, I , ismeasured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.
V
2. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
d
3. θ is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
[1]
Color Bin Limits
Blue Color Bins
[1]
[1]
InGaN Green Color Bins
Dom. Wavelength (nm)
Dom. Wavelength (nm)
Bin ID
Min.
460.0
465.0
470.0
475.0
Max.
465.0
470.0
475.0
480.0
Bin ID
A
B
C
Min.
515.0
520.0
525.0
530.0
Max.
520.0
525.0
530.0
535.0
A
B
C
D
D
Tolerance: 1 nm
Tolerance: 1 nm
Note:
1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago
representative for information on currently available bins.
5
[1]
Light Intensity (Iv) Bin Limits
Intensity (mcd)
Intensity (mcd)
Bin ID
Min.
0.11
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
Max.
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
28.50
Bin ID
Min.
Max.
A
N
P
Q
R
S
T
28.50
45.00
B
45.00
71.50
C
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
D
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
E
F
G
U
V
W
X
Y
H
J
K
L
M
Tolerance: 15%
Notes:
1. Bin categories are established for classification of products. Products may not be available in all catego-
ries. Please contact your Avago representative for information on currently available bins.
2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv bin limits.
100
90
BLUE
GREEN
ꢀ0
70
60
50
40
30
20
10
0
400
500
600
700
ꢂAVELENGTH – nꢁ
Figure 1. Relative intensity vs. wavelength.
25
20
15
10
1.2
100
1.0
0.ꢀ
0.6
0.4
0.2
0
10
Rθ
Rθ
= 500°C/ꢂ
= 600°C/ꢂ
J-A
J-A
BLUE
BLUE
2.5
GREEN
1
GREEN
10
5
0
0.1
0
10 20 30 40 50 60 70 ꢀ0 90
0
5
15
20
25
2.0
3.0
3.5
4.0
T
– AMBIENT TEMPERATURE – °C
I
– FORꢂARD CURRENT – ꢁA
V
– FORꢂARD VOLTAGE – V
A
F
F
Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward
current.
Figure 4. Maximum forward current vs.
ambient temperature.
6
100
ꢀ0
60
40
20
0
-90
-70
-50
-30
-10
10
30
50
70
90
ANGLE
100
ꢀ0
60
40
20
0
-90
-70
-50
-30
-10
10
30
50
70
90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C110.
100
90
ꢀ0
70
60
50
40
30
20
10
0
-90 -ꢀ0 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 ꢀ0 90
ANGLE
100
90
ꢀ0
70
60
50
40
30
20
10
0
-90 -ꢀ0 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 ꢀ0 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMx-C120.
7
100
90
ꢀ0
70
60
50
40
30
20
10
0
-90 -ꢀ0 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 ꢀ0 90
ANGLE
Figure 7. Relative intensity vs. angle for HSMx-C177 and C197.
100
90
ꢀ0
70
60
50
40
30
20
10
0
-90 -ꢀ0 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 ꢀ0 90
ANGLE
Figure 8. Relative intensity vs. angle for HSMx-C130.
100
90
ꢀ0
70
60
50
40
30
20
10
0
-90 -ꢀ0 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 ꢀ0 90
ANGLE
Figure 9. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
100
90
ꢀ0
70
60
50
40
30
20
10
0
-90 -ꢀ0 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 ꢀ0 90
ANGLE
Figure 10. Relative intensity vs. angle for HSMx-C265.
8
10 SEC. MAX.
10 to 30 SEC.
230°C MAX.
255 - 260 °C
3 °C/SEC. MAX.
4°C/SEC. MAX.
3°C/SEC. MAX.
140-160°C
217 °C
200 °C
4°C/SEC.
6 °C/SEC. MAX.
MAX.
150 °C
OVER 2 MIN.
3 °C/SEC. MAX.
TIME
100 SEC. MAX.
60 - 120 SEC.
Figure 11. Recommended reflow soldering profile.
TIME
(Acc. to J-STD-020C)
Figure 12. Recommended Pb-free reflow soldering profile.
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.0 (0.039)
1.2 (0.047)
0.2 (0.00ꢀ)
CENTERING
BOARD
1.2
(0.047)
1.2
(0.047)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
0.9
(0.035)
Figure 13. Recommended soldering pattern for HSMx-C110.
Figure 14. Recommended soldering pattern for HSMx-C170/177.
0.ꢀ (0.031)
1.5 (0.059)
0.ꢀ
(0.031)
0.ꢀ
(0.031)
0.7
(0.02ꢀ)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 15. Recommended soldering pattern
for HSMx-C130/190/191/197.
Figure 16. Recommended soldering pattern for HSMx-C150.
0.4 (0.016)
2.2 (0.0ꢀ7) DIA. PCB HOLE
0.4 (0.016)
0.7 (0.02ꢀ)
1.25 (0.049)
0.15 (0.006)
CENTERING
BOARD
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
0.ꢀ
(0.031)
1.2
(0.047)
0.ꢀ
(0.031)
Figure 17. Recommended soldering pattern for HSMx-C120.
Figure 18. Recommended soldering pattern for HSMx-C265.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
9
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 19. Reeling orientation.
ꢀ.0 1.0 (0.315 0.039)
10.50 1.0 (0.413 0.039)
Ø 13.1 0.5
(Ø 0.516 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 0.5
(0.11ꢀ 0.020)
59.60 1.00
17ꢀ.40 1.00
(7.024 0.039)
(2.346 0.039)
4.0 0.5
(0.157 0.020)
5.0 0.5
(0.197 0.020)
6
PS
Figure 20. Reel dimensions.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
10
DIM. C
(SEE TABLE 1)
4.00 (0.157)
CATHODE
1.50 (0.059)
0.20 0.05
0.23 0.05
(0.00ꢀ 0.002) (0.009 0.002)
FOR HSMR-C130
1.75 (0.069)
3.50 0.05
(0.13ꢀ 0.002)
DIM. A
(SEE TABLE 1)
ꢀ.00 0.30
(0.315 0.012)
DIM. B
CARRIER TAPE
COVER TAPE
(SEE TABLE 1)
USER FEED
DIRECTION
2.00 0.05
(0.079 0.002)
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A DIM. B
DIM. C
HSMx-C110/120
POSITION IN
PART NUMBER
0.10 (0.004) 0.10 (0.004)
3.40 (0.134) 1.70 (0.067)
1.90 (0.075) 1.15 (0.045)
3.50 (0.13ꢀ) 1.ꢀꢀ (0.074)
2.30 (0.091) 1.45 (0.057)
2.30 (0.091) 1.40 (0.055)
1.75 (0.069) 0.90 (0.035)
1.ꢀ5 (0.073) 0.ꢀꢀ (0.035)
1.75 (0.069) 0.95 (0.037)
0.10 (0.004)
1.20 (0.047)
0.75 (0.030)
1.27 (0.050)
0.95 (0.037)
0.60 (0.024)
0.90 (0.035)
0.ꢀ5 (0.033)
0.60 (0.024)
HSMx-C110 SERIES
HSMx-C120 SERIES
HSMx-C150 SERIES
HSMx-C170 SERIES
HSMx-C177 SERIES
HSMx-C190 SERIES
HSMx-C191 SERIES
HSMx-C197 SERIES
CARRIER TAPE
DIM. A
(SEE TABLE 1)
R 1.0 0.05
(0.039 0.002)
FOR HSMx-C110
DIM. B
(SEE TABLE 1)
R 0.5 0.05
(0.020 0.002)
FOR HSMx-C120
DIM. C
(SEE TABLE 1)
4.00 (0.157)
CATHODE
1.50 (0.059)
0.20 0.05
(0.00ꢀ 0.002)
1.75 (0.069)
3.50 0.05
(0.13ꢀ 0.002)
DIM. A
(SEE TABLE 1)
ꢀ.00 0.30
(0.315 0.012)
DIM. B
CARRIER TAPE
(SEE TABLE 1)
USER FEED
DIRECTION
2.00 0.05
(0.079 0.002)
COVER TAPE
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A DIM. B
0.10 (0.004) 0.10 (0.004)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057)
DIM. C
PART NUMBER
0.10 (0.004)
1.30 (0.051)
Figure 21. Tape dimensions.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
11
END
START
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
THERE SHALL BE A
MOUNTED ꢂITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 ꢁꢁ
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED ꢂITH COVER
TAPE.
MINIMUM OF
230 ꢁꢁ
MINIMUM OF 160 ꢁꢁ
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED ꢂITH COVER
TAPE.
Storage Condition:
5 to 30°C @ 60% RH max.
Baking is required under the
condition:
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Figure 22. Tape leader and trailer dimensions.
a) Humidity Indicator Card is
>10% when read at 23 5°C
b) Device exposed to factory
conditions <30°C/60% RH
more than 672 hours.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS 0.1 ꢁꢁ ( 0.004 IN.) UNLESS OTHERꢂISE SPECIFIED.
Baking recommended condition:
60 5°C for 20 hours.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0521EN
AV02-0977EN January 10, 2008
相关型号：
©2020 ICPDF网 联系我们和版权申明