HSMS-280F-TR2 [AVAGO]
Mixer Diode, Silicon, SC-70, 3 PIN;
| 型号： | HSMS-280F-TR2 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Mixer Diode, Silicon, SC-70, 3 PIN |
| 文件： | 总10页 (文件大小：243K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HSMS-280x
Surface Mount RF Schottky Barrier Diodes
Data Sheet
Description/Applications
Features
These Schottky diodes are specifically designed for both
analog and digital applications. This series offers a wide
range of specifications and package configurations to
give the designer wide flexibility. The HSMS‑280x series
of diodes is optimized for high voltage applications.
•
•
•
•
•
•
•
Surface Mount Packages
High Breakdown Voltage
Low FIT (Failure in Time) Rate*
Six‑sigma Quality Level
Single, Dual and Quad Versions
Tape and Reel Options Available
Lead‑free Option Available
Note that Avago’s manufacturing techniques assure that
dicefoundinpairsandquadsaretakenfromadjacentsites
on the wafer, assuring the highest degree of match.
*
For more information see the Surface Mount Schottky Reli‑
ability Data Sheet.
Package Lead Code Identification, SOT-323
(Top View)
Package Lead Code Identification, SOT-363
(Top View)
HIGH ISOLATION
UNCONNECTED
TRIO
SERIES
SINGLE
UNCONNECTED PAIR
6
5
4
6
5
4
B
C
1
2
3
1
2
3
COMMON
ANODE
COMMON
CATHODE
K
L
COMMON
CATHODE QUAD
COMMON
ANODE QUAD
6
1
6
1
5
4
6
1
6
1
5
4
E
F
2
3
2
3
M
N
BRIDGE
QUAD
RING
QUAD
Package Lead Code Identification, SOT-23/SOT-143
(Top View)
5
4
5
4
COMMON
ANODE
COMMON
CATHODE
3
2
3
2
3
SINGLE
3
SERIES
3
P
R
3
1
2
1
2
1
2
1
2
#4
#0
#2
#3
UNCONNECTED
PAIR
BRIDGE
QUAD
3
4
3
4
1
2
1
2
#5
#8
Pin Connections and Package Marking, SOT-363
Notes:
1
2
3
6
5
4
1. Package marking provides orientation and identification.
2. See “Electrical Specifications”for appropriate package marking.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
Absolute Maximum Ratings[1] TC = 25°C
Symbol
If
Parameter
Unit
Amp
V
SOT-23/SOT-143
1
SOT-323/SOT-363
1
Forward Current (1 µs Pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance[2]
PIV
Tj
Same as VBR
150
Same as VBR
150
°C
Tstg
θjc
°C
‑65 to 150
500
‑65 to 150
150
°C/W
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
Electrical Specifications TA = 25°C, Single Diode [3]
Minimum
Breakdown
Voltage
Maximum
Forward
Voltage
VF (mV)
Maximum
Forward
Voltage
Maximum
Reverse
Leakage
Typical
Dynamic
Resistance
RD (Ω)[5]
Part
Package
Marking
Code
Maximum
Capacitance
CT (pF)
Number
Lead
HSMS[4]
Code Configuration
VBR (V)
VF (V) @ IF (mA) IR (nA) @ VR (V)
2800
2802
2803
2804
2805
2808
280B
280C
280E
280F
A0
A2
A3
A4
A5
A8
A0
A2
A3
A4
0
2
3
4
5
8
B
C
E
F
Single
Series
Common Anode
Common Cathode
Unconnected Pair
Bridge Quad[4]
Single
Series
70
410
1.0 @ 15
200 @ 50
2.0
35
Common Anode
Common Cathode
High Isolation
Unconnected Pair
280K
AK
K
280L
280M
280N
280P
280R
AL
H
L
M
N
P
Unconnected Trio
Common Cathode Quad
Common Anode Quad
Bridge Quad
N
AP
O
R
Ring Quad
Test Conditions
IR = 10 mA
IF = 1 mA
VF = 0 V
f = 1 MHz
IF = 5 mA
Notes:
1. DVF for diodes in pairs and quads in 15 mV maximum at 1 mA.
2. DCTO for diodes in pairs and quads is 0.2 pF maximum.
3. Effective Carrier Lifetime (t) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
4. See section titled “Quad Capacitance.”
5. RD = RS + 5.2Ω at 25°C and If = 5 mA.
2
A
B
Quad Capacitance
C1
C2
C3
Capacitance of Schottky diode quads is measured using
an HP4271 LCR meter. This instrument effectively isolates
individual diode branches from the others, allowing
accurate capacitance measurement of each branch or
each diode. The conditions are: 20 mV R.M.S. voltage at 1
MHz. Avago defines this measurement as “CM”, and it is
equivalent to the capacitance of the diode by itself. The
equivalent diagonal and adjacent capacitances can then
be calculated by the formulas given below.
C
C4
The equivalent adjacent capacitance is the capacitance
between points A and C in the figure below. This capaci‑
tance is calculated using the following formula
1
CADJACENT = C1 + ____________
In a quad, the diagonal capacitance is the capacitance
between points A and B as shown in the figure below.
The diagonal capacitance is calculated using the follow‑
ing formula
1
1
1
–– + –– + ––
C2 C3 C4
This information does not apply to cross‑over quad
diodes.
C1 x C2
C3 x C4
CDIAGONAL = _______ + _______
C1 + C2 C3 + C4
SPICE Parameters
Linear Equivalent Circuit, Diode Chip
Parameter
Units
HSMS-280x
75
R
j
BV
CJ0
EG
IBV
IS
V
R
pF
eV
A
1.6
S
0.69
E‑5
A
3.00E‑08
1.08
30
C
j
N
RS = series resistance (see Table of SPICE parameters)
Cj = junction capacitance (see Table of SPICE parameters)
RS
PB
PT
M
Ω
V
0.65
2
8.33 X 10-5 nT
Rj =
Ib + Is
0.5
where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, °K
n = ideality factor (see table of SPICE parameters)
Note:
To effectively model the packaged HSMS-280x product,
please refer to Application Note AN1124.
3
Typical Performance, TC = 25°C (unless otherwise noted), Single Diode
100
100,000
1000
100
10,000
10
1000
100
1
10
1
TA = +125°C
TA = +75°C
TA = +25°C
TA = –25°C
0.1
TA = +125°C
TA = +75°C
TA = +25°C
10
1
0.01
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
0
10
20
30
40
50
0.1
1
10
I – FORWARD CURRENT (mA)
F
100
V
– FORWARD VOLTAGE (V)
V
– REVERSE VOLTAGE (V)
F
R
Figure 1. Forward Current vs.
Forward Voltage at Temperatures.
Figure 2. Reverse Current vs.
Reverse Voltage at Temperatures.
Figure 3. Dynamic Resistance vs.
Forward Current.
2
30
30
I
(Left Scale)
F
10
10
1.5
1
∆V (Right Scale)
F
0.5
1
1
0
0.3
0.2
0.3
1.4
0
10
20
30
40
50
0.4
0.6
0.8
1.0
1.2
V
– REVERSE VOLTAGE (V)
V
- FORWARD VOLTAGE (V)
R
F
Figure 4. Total Capacitance vs.
Reverse Voltage.
Figure 5. Typical V Match, Pairs and
f
Quads.
4
0.026
Applications Information Introduction —
Product Selection
Avago’sfamilyofSchottkyproductsprovidesuniquesolu‑
tions to many design problems.
0.079
The first step in choosing the right product is to select the
diode type. All of the products in the HSMS‑280x family
usethesamediodechip,andthesameistrueoftheHSMS‑
281x and HSMS‑282x families. Each family has a different
set of characteristics which can be compared most easily
by consulting the SPICE parameters in Table 1.
0.039
0.022
Dimensions in inches
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products.
A review of these data shows that the HSMS‑280x family
has the highest breakdown voltage, but at the expense of
a high value of series resistance (Rs). In applications which
do not require high voltage the HSMS‑282x family, with a
lower value of series resistance, will offer higher current
carryingcapacityandbetterperformance.TheHSMS‑281x
family is a hybrid Schottky (as is the HSMS‑280x), offering
lower 1/f or flicker noise than the HSMS‑282x family.
Assembly Instructions
SOT-363 PCB Footprint
ArecommendedPCBpadlayoutfortheminiatureSOT‑363
(SC‑70, 6 lead) package is shown in Figure 7 (dimensions
are in inches). This layout provides ample allowance for
package placement by automated assembly equipment
without adding parasitics that could impair the perfor‑
mance.
Ingeneral,theHSMS‑282xfamilyshouldbethedesigner’s
first choice, with the ‑280x family reserved for high volt‑
age applications and the HSMS‑281x family for low flicker
noise applications.
0.026
Assembly Instructions
SOT-323 PCB Footprint
0.079
ArecommendedPCBpadlayoutfortheminiatureSOT‑323
(SC‑70) package is shown in Figure 6 (dimensions are in
inches).Thislayoutprovidesampleallowanceforpackage
placement by automated assembly equipment without
adding parasitics that could impair the performance.
0.039
0.018
Dimensions in inches
Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products.
Table 1. Typical SPICE Parameters
Parameter
Units
V
HSMS-280x
75
HSMS-281x HSMS-282x
BV
25
15
CJ0
EG
pF
eV
A
1.6
1.1
0.7
0.69
1 E‑5
3 E‑8
1.08
30
0.69
1 E‑5
4.8 E‑9
1.08
10
0.69
1 E‑4
2.2 E‑8
1.08
6
IBV
IS
A
N
RS
Ω
V
PB (VJ)
PT (XTI)
M
0.65
2
0.65
2
0.65
2
0.5
0.5
0.5
5
The preheat zones increase the temperature of the board
and components to prevent thermal shock and begin
evaporatingsolventsfromthesolderpaste.Thereflowzone
briefly elevates the temperature sufficiently to produce a
reflow of the solder.
SMT Assembly
Reliable assembly of surface mount components is a com‑
plex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reflow temperatures faster
than those with a greater mass.
The rates of change of temperature for the ramp‑up and
cool‑down zones are chosen to be low enough to not
causedeformationoftheboardordamagetocomponents
due to thermal shock. The maximum temperature in the
reflow zone (TMAX) should not exceed 235°C.
Avago’s SOT diodes have been qualified to the time‑
temperature profile shown in Figure 8. This profile is
representative of an IR reflow type of surface mount as‑
sembly process.
These parameters are typical for a surface mount assem‑
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reflow of solder.
After ramping up from room temperature, the circuit
board with components attached to it (held in place with
solder paste) passes through one or more preheat zones.
250
200
TMAX
150
Reflow
Zone
100
Preheat
Zone
Cool Down
Zone
50
0
0
60
120
180
240
300
TIME (seconds)
Figure 8. Surface Mount Assembly Profile.
Part Number Ordering Information
No. of
Part Number
Devices
10000
3000
100
Container
HSMS‑280x‑TR2*
HSMS‑280x‑TR1*
HSMS‑280x‑BLK*
13”Reel
7”Reel
antistatic bag
x = 0, 2, 3, 4, 5, 8, B, C, E, F, K, L, M, N, P, R
For lead‑free option, the part number will have the
character "G" at the end, eg. HSMS‑280x‑TR2G for a
10,000 lead‑free reel.
6
Package Dimensions
Outline 23 (SOT-23)
Outline SOT-323 (SC-70 3 Lead)
e2
e1
e1
E1
E
XXX
E1
E
XXX
e
L
e
L
B
C
B
D
D
DIMENSIONS (mm)
C
SYMBOL
MIN.
0.80
0.00
0.15
0.10
1.80
1.10
MAX.
1.00
0.10
0.40
0.20
2.25
1.40
DIMENSIONS (mm)
A
A1
B
SYMBOL
MIN.
0.79
0.000
0.37
0.086
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.152
3.13
1.50
1.02
2.04
0.60
2.70
0.69
A
A
A1
B
C
A
D
A1
E1
e
C
0.65 typical
1.30 typical
1.80 2.40
D
A1
e1
E
E1
e
Notes:
XXX-package marking
Drawin s are not to scale
L
0.425 typical
e1
e2
E
g
Notes:
XXX-package marking
Drawings are not to scale
L
Outline 143 (SOT-143)
Outline SOT-363 (SC-70 6 Lead)
e2
DIMENSIONS (mm)
e1
SYMBOL
MIN.
1.15
1.80
1.80
0.80
0.80
0.00
0.10
MAX.
1.35
2.25
2.40
1.10
1.00
0.10
0.40
E
D
B1
E1
HE
E
HE
A
A2
A1
Q1
e
E
XXX
0.650 BCS
e
b
0.15
0.10
0.10
0.30
0.20
0.30
c
L
D
L
B
C
e
Q1
DIMENSIONS (mm)
c
A1
A2
A
D
SYMBOL
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.04
0.60
2.65
0.69
A
A1
B
A
b
L
B1
C
A1
D
E1
e
e1
e2
E
Notes:
XXX-package marking
Drawings are not to scale
L
7
For Outlines SOT-23, -323
Device Orientation
REEL
TOP VIEW
END VIEW
4 mm
CARRIER
TAPE
8 mm
ABC
ABC
ABC
ABC
USER
FEED
DIRECTION
Note: "AB" represents package marking code.
"C" represents date code.
COVER TAPE
For Outline SOT-143
For Outline SOT-363
TOP VIEW
4 mm
END VIEW
TOP VIEW
4 mm
END VIEW
8 mm
A B C
A B C
A B C
A B C
8 mm
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Note: "AB" represents package marking code.
"C" represents date code.
8
Tape Dimensions and Product Orientation
For Outline SOT-23
P
P
D
2
E
F
P
0
W
D
1
t1
Ko
13.5° MAX
8° MAX
9° MAX
B
A
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
0
3.15
±
±
±
±
0.10
0.10
0.10
0.10
0.124
0.109
0.048
0.157
0.039
±
±
±
±
±
0.004
0.004
0.004
0.004
0.002
B
2.77
1.22
4.00
0
K
0
P
D
1
BOTTOM HOLE DIAMETER
1.00 + 0.05
PERFORATION
CARRIER TAPE
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
0.059 + 0.004
P
4.00
1.75
±
±
0.10
0.10
0.157
0.069
±
±
0.004
0.004
0
E
WIDTH
THICKNESS
W
t1
8.00+ 0.30 - 0.10 0.315+ 0.012 - 0.004
0.229
±
0.013
0.05
0.05
0.009
±
0.0005
DISTANCE
BETWEEN
CENTERLINE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50
2.00
±
0.138
±
0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2
±
0.079
±
0.002
For Outline SOT-143
P
D
P2
P0
E
F
W
D1
t1
K
9
°
MAX
9
°
MAX
0
A0
B
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
D
3.19
2.80
1.31
4.00
±
±
±
±
0.10
0.10
0.10
0.10
0.126
0.110
0.052
0.157
±
±
±
±
0.004
0.004
0.004
0.004
0
0
0
BOTTOM HOLE DIAMETER
1.00 + 0.25
0.039 + 0.010
1
0
PERFORATION
DIAMETER
PITCH
POSITION
D
P
E
1.50 + 0.10
4.00
1.75
0.059 + 0.004
0.157
0.069
±
±
0.10
0.10
±
±
0.004
0.004
CARRIER TAPE
DISTANCE
WIDTH
THICKNESS
W
t1
8.00+ 0.30 - 0.10 0.315+ 0.012 - 0.004
0.254 0.013 0.0100 0.0005
±
±
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
P
3.50
2.00
±
0.05
0.138
0.079
±
0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
±
0.05
±
0.002
2
9
Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
P
P
D
2
P
0
E
F
W
C
D
1
t
(CARRIER TAPE THICKNESS)
T (COVER TAPE THICKNESS)
t
1
K
An
An
0
A
B
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
0
2.40
2.40
1.20
4.00
±
±
±
±
0.10
0.10
0.10
0.10
0.094
0.094
0.047
0.157
±
±
±
±
0.004
0.004
0.004
0.004
B
0
K
0
P
BOTTOM HOLE DIAMETER
D
1.00 + 0.25
0.039 + 0.010
1
PERFORATION
DIAMETER
PITCH
POSITION
D
P
E
1.55
4.00
1.75
±
±
±
0.05
0.10
0.10
0.061
0.157
0.069
±
±
±
0.002
0.004
0.004
0
CARRIER TAPE
COVER TAPE
DISTANCE
WIDTH
THICKNESS
W
8.00
±
0.30
±
0.315
0.0100
±
0.012
t
0.254
5.4
0.062
0.02
0.10
0.001
0.05
±
0.0008
1
WIDTH
TAPE THICKNESS
C
T
t
±
0.205
0.0025 ± 0.00004
±
0.004
±
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50
2.00
±
0.138
±
0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
±
0.05
0.079
±
0.002
2
ANGLE
FOR SOT-323 (SC70-3 LEAD)
FOR SOT-363 (SC70-6 LEAD)
An
8
°
C MAX
10 C MAX
°
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies, Limited. All rights reserved. Obsoletes 5989-4020EN
AV02-0533EN - June 21, 2007
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