HSMS-280X-TR2G [AVAGO]
Surface Mount RF Schottky Barrier Diodes; 表面贴装射频肖特基势垒二极管
| 型号： | HSMS-280X-TR2G |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Surface Mount RF Schottky Barrier Diodes |
| 文件： | 总10页 (文件大小：196K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HSMS-280x
Surface Mount RF Schottky Barrier Diodes
Data Sheet
Description/Applications
Features
These Schottky diodes are specifically designed for both ꢀ Surface Mount Packages
analog and digital applications. This series offers a wide
range of specifications and package configurations to
give the designer wide flexibility. The HSMS-280x series
ꢀ High Breakdown Voltage
ꢀ Low FIT (Failure in Time) Rate*
of diodes is optimized for high voltage applications.
ꢀ Six-sigma Quality Level
ꢀ Single, Dual and Quad Versions
ꢀ Tape and Reel Options Available
ꢀ Lead-free
Note that Avago’s manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent sites
on the wafer, assuring the highest degree of match.
*
For more information see the Surface Mount Schottky Reliability
Data Sheet.
Package Lead Code Identification, SOT-323 (Top View)
Package Lead Code Identification, SOT-363 (Top View)
HIGH ISOLATION
UNCONNECTED
TRIO
SERIES
SINGLE
UNCONNECTED PAIR
6
5
4
6
5
4
B
C
1
2
3
1
2
3
K
L
COMMON
ANODE
COMMON
CATHODE
COMMON
COMMON
CATHODE QUAD
ANODE QUAD
6
1
6
1
5
4
6
1
6
1
5
4
E
F
2
3
2
3
M
N
BRIDGE
QUAD
RING
QUAD
5
4
5
4
Package Lead Code Identification, SOT-23/SOT-143 (Top View)
2
3
2
3
P
R
COMMON
ANODE
3
COMMON
CATHODE
3
SINGLE
3
SERIES
3
1
2
1
2
1
2
1
2
#4
#0
#2
#3
UNCONNECTED
PAIR
BRIDGE
QUAD
3
4
3
4
1
2
1
2
#5
#8
Pin Connections and Package Marking, SOT-363
Notes:
1
2
3
6
5
4
1. Package marking provides orientation and identification.
2. See “Electrical Specifications”for appropriate package marking.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
Absolute Maximum Ratings[1] TC = 25°C
Symbol
Parameter
Unit
Amp
V
SOT-23/SOT-143
SOT-323/SOT-363
If
Forward Current (1 μs Pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance[2]
1
1
PIV
Tj
Same as VBR
150
Same as VBR
150
°C
Tstg
ꢁjc
°C
-65 to 150
500
-65 to 150
150
°C/W
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
Electrical Specifications TA = 25°C, Single Diode [3]
Minimum
Breakdown
Voltage
Maximum
Forward
Voltage
VF (mV)
Maximum
Forward
Voltage
Maximum
Reverse
Leakage
Typical
Dynamic
Resistance
RD (Ω)[5]
Part
Package
Marking
Code
Maximum
Capacitance
CT (pF)
Number
Lead
HSMS[4]
Code Configuration
VBR (V)
VF (V) @ IF (mA) IR (nA) @ VR (V)
2800
2802
2803
2804
2805
2808
280B
280C
280E
280F
A0
A2
A3
A4
A5
A8
A0
A2
A3
A4
0
2
3
4
5
8
B
C
E
F
Single
Series
Common Anode
Common Cathode
Unconnected Pair
Bridge Quad[4]
Single
Series
70
410
1.0 @ 15
200 @ 50
2.0
35
Common Anode
Common Cathode
High Isolation
Unconnected Pair
280K
AK
K
280L
280M
280N
280P
280R
AL
H
L
M
N
P
Unconnected Trio
Common Cathode Quad
Common Anode Quad
Bridge Quad
N
AP
O
R
Ring Quad
Test Conditions
IR = 10 mA
IF = 1 mA
VF = 0 V
f = 1 MHz
IF = 5 mA
Notes:
1. DVF for diodes in pairs and quads in 15 mV maximum at 1 mA.
2. DCTO for diodes in pairs and quads is 0.2 pF maximum.
3. Effective Carrier Lifetime (t) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
4. See section titled “Quad Capacitance.”
5. RD = RS + 5.2Ω at 25°C and If = 5 mA.
2
Quad Capacitance
A
B
C1
C2
C3
Capacitance of Schottky diode quads is measured using
an HP4271 LCR meter. This instrument effectively isolates
individual diode branches from the others, allowing
accurate capacitance measurement of each branch or
each diode. The conditions are: 20 mV R.M.S. voltage at 1
MHz. Avago defines this measurement as “CM”, and it is
equivalent to the capacitance of the diode by itself. The
equivalent diagonal and adjacent capacitances can then
be calculated by the formulas given below.
C
C4
The equivalent adjacent capacitance is the capacitance
between points A and C in the figure below. This capaci-
tance is calculated using the following formula
1
C
ADJACENT = C1 + ____________
In a quad, the diagonal capacitance is the capacitance
between points A and B as shown in the figure below.
The diagonal capacitance is calculated using the follow-
ing formula
1
1
1
–– + –– + ––
C2 C3 C4
This information does not apply to cross-over quad
diodes.
C1 x C2
C3 x C4
CDIAGONAL = _______ + _______
C1 + C2 C3 + C4
Linear Equivalent Circuit, Diode Chip
SPICE Parameters
Parameter
Units
HSMS-280x
75
R
j
BV
CJ0
EG
IBV
IS
V
pF
eV
A
1.6
R
S
0.69
E-5
A
3.00E-08
1.08
30
C
N
j
RS
PB
PT
M
ꢀ
V
RS = series resistance (see Table of SPICE parameters)
Cj = junction capacitance (see Table of SPICE parameters)
0.65
2
8.33 X 10-5 nT
Ib + Is
Rj =
0.5
where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, K
n = ideality factor (see table of SPICE parameters)
Note:
To effectively model the packaged HSMS-280x product,
please refer to Application Note AN1124.
3
Typical Performance, TC = 25°C (unless otherwise noted), Single Diode
100
100,000
1000
100
10,000
10
1000
100
1
10
1
TA = +125C
TA = +75C
TA = +25C
TA = –25C
0.1
TA = +125C
TA = +75C
TA = +25C
10
1
0.01
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
0
10
20
30
40
50
0.1
1
10
I – FORWARD CURRENT (mA)
F
100
V
– FORWARD VOLTAGE (V)
V
– REVERSE VOLTAGE (V)
F
R
Figure 1. Forward Current vs. Forward Voltage
at Temperatures.
Figure 2. Reverse Current vs. Reverse Voltage
at Temperatures.
Figure 3. Dynamic Resistance vs. Forward
Current.
2
30
10
30
I
(Left Scale)
F
10
1.5
1
V
(Right Scale)
F
0.5
1
1
0
0.3
0.2
0.3
1.4
0
10
20
30
40
50
0.4
0.6
0.8
1.0
1.2
V
– REVERSE VOLTAGE (V)
V
- FORWARD VOLTAGE (V)
R
F
Figure 4. Total Capacitance vs. Reverse
Voltage.
Figure 5. Typical Vf Match, Pairs and Quads.
4
Applications Information Introduction —
Product Selection
0.026
Avago’s family of Schottky products provides unique
solutions to many design problems.
0.079
The first step in choosing the right product is to select the
diode type. All of the products in the HSMS-280x family
use the same diode chip, and the same is true of the
HSMS-281x and HSMS-282x families. Each family has a dif-
ferent set of characteristics which can be compared most
easily by consulting the SPICE parameters in Table 1.
0.039
0.022
Dimensions in inches
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323
Products.
A review of these data shows that the HSMS-280x family
has the highest breakdown voltage, but at the expense of
a high value of series resistance (Rs). In applications which
do not require high voltage the HSMS-282x family, with a
lower value of series resistance, will offer higher current
carrying capacity and better performance.The HSMS-281x
family is a hybrid Schottky (as is the HSMS-280x), offering
lower 1/f or flicker noise than the HSMS-282x family.
Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout for the miniature SOT-
363 (SC-70, 6 lead) package is shown in Figure 7 (dimen-
sions are in inches). This layout provides ample allowance
for package placement by automated assembly equip-
ment without adding parasitics that could impair the
performance.
In general, the HSMS-282x family should be the designer’s
first choice, with the -280x family reserved for high voltage
applications and the HSMS-281x family for low flicker
noise applications.
0.026
Assembly Instructions
SOT-323 PCB Footprint
0.079
A recommended PCB pad layout for the miniature SOT-
323 (SC-70) package is shown in Figure 6 (dimensions
are in inches). This layout provides ample allowance for
package placement by automated assembly equipment
without adding parasitics that could impair the perfor-
mance.
0.039
0.018
Dimensions in inches
Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363
Products.
Table 1. Typical SPICE Parameters
Parameter
Units
V
HSMS-280x
75
HSMS-281x HSMS-282x
BV
25
15
CJ0
EG
pF
eV
A
1.6
1.1
0.7
0.69
1 E-5
3 E-8
1.08
30
0.69
1 E-5
4.8 E-9
1.08
10
0.69
1 E-4
2.2 E-8
1.08
6
IBV
IS
A
N
RS
Ω
V
PB (VJ)
PT (XTI)
M
0.65
2
0.65
2
0.65
2
0.5
0.5
0.5
5
SMT Assembly
Reliable assembly of surface mount components is a
complex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reflow temperatures faster
than those with a greater mass.
zones. The preheat zones increase the temperature of the
board and components to prevent thermal shock and
begin evaporating solvents from the solder paste. The
reflow zone briefly elevates the temperature sufficiently
to produce a reflow of the solder.
The rates of change of temperature for the ramp-up and
cool-down zones are chosen to be low enough to not
cause deformation of the board or damage to compo-
nents due to thermal shock. The maximum temperature
in the reflow zone (TMAX) should not exceed 260°C.
Avago’s SOT diodes have been qualified to the time-
temperature profile shown in Figure 8. This profile is
representative of an IR reflow type of surface mount as-
sembly process.
These parameters are typical for a surface mount assem-
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reflow of solder.
After ramping up from room temperature, the circuit
board with components attached to it (held in place
with solder paste) passes through one or more preheat
tp
Critical Zone
Tp
T
to Tp
L
Ramp-up
T
L
tL
Ts
max
Ts
min
Ramp-down
ts
Preheat
25
t 25° C to Peak
Time
Figure 8. Surface Mount Assembly Profile.
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Reflow Parameter
Lead-Free Assembly
3°C/ second max
150°C
Average ramp-up rate (Liquidus Temperature (TS(max) to Peak)
Preheat
Temperature Min (TS(min)
)
Temperature Max (TS(max)
Time (min to max) (tS)
)
200°C
60-180 seconds
3°C/second max
217°C
Ts(max) to TL Ramp-up Rate
Time maintained above:
Temperature (TL)
Time (tL)
60-150 seconds
260 +0/-5°C
Peak Temperature (TP)
Time within 5 °C of actual Peak temperature (tP)
Ramp-down Rate
20-40 seconds
6°C/second max
8 minutes max
Time 25 °C to Peak Temperature
Note 1: All temperatures refer to topside of the package, measured on the package body surface
6
Part Number Ordering Information
No. of
Part Number
Devices
10000
3000
Container
13”Reel
HSMS-280x-TR2G
HSMS-280x-TR1G
HSMS-280x-BLKG
7”Reel
100
antistatic bag
x = 0, 2, 3, 4, 5, 8, B, C, E, F, K, L, M, N, P, R
Package Dimensions
Outline 23 (SOT-23)
Outline SOT-323 (SC-70 3 Lead)
e1
e2
e1
E1
E
XXX
E1
E
XXX
e
L
B
e
C
L
D
DIMENSIONS (mm)
B
C
SYMBOL
MIN.
0.80
0.00
0.15
0.08
1.80
1.10
MAX.
1.00
0.10
0.40
0.25
2.25
1.40
A
A1
B
D
DIMENSIONS (mm)
A
SYMBOL
MIN.
0.79
0.000
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
C
D
E1
e
e1
E
A
A1
B
A1
A
0.65 typical
1.30 typical
C
D
Notes:
A1
1.80
0.26
2.40
0.46
XXX-package marking
Drawings are not to scale
E1
e
e1
e2
E
L
Notes:
XXX-package marking
Drawings are not to scale
L
7
Package Dimensions (Continued)
Outline 143 (SOT-143)
Outline SOT-363 (SC-70 6 Lead)
e2
DIMENSIONS (mm)
e1
SYMBOL
E
D
HE
A
MIN.
1.15
1.80
1.80
0.80
0.80
0.00
MAX.
1.35
2.25
2.40
1.10
1.00
0.10
HE
E
B1
A2
A1
e
E
E1
XXX
0.650 BCS
e
b
0.15
0.08
0.10
0.30
0.25
0.46
c
L
D
L
B
C
e
c
A1
A2
A
DIMENSIONS (mm)
D
SYMBOL
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.04
0.60
2.65
0.69
A
A1
B
b
L
A
B1
C
D
E1
e
e1
e2
E
A1
Notes:
XXX-package marking
Drawings are not to scale
L
For Outlines SOT-23, -323
Device Orientation
REEL
TOP VIEW
4 mm
END VIEW
CARRIER
TAPE
8 mm
ABC
ABC
ABC
ABC
USER
FEED
DIRECTION
Note: "AB" represents package marking code.
"C" represents date code.
COVER TAPE
For Outline SOT-143
For Outline SOT-363
TOP VIEW
4 mm
END VIEW
TOP VIEW
4 mm
END VIEW
8 mm
A B C
A B C
A B C
A B C
8 mm
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Note: "AB" represents package marking code.
"C" represents date code.
8
Tape Dimensions and Product Orientation
For Outline SOT-23
P
P
D
2
E
F
P
0
W
D
1
t1
Ko
13.5° MAX
8° MAX
9° MAX
B
A
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
3.15 0.10
2.77 0.10
1.22 0.10
4.00 0.10
1.00+ 0.05
0.124 0.004
0.109 0.004
0.048 0.004
0.157 0.004
0.039 0.002
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
CARRIER TAPE
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
P
E
0
WIDTH
W
8.00+0.30- 0.10 0.315+0.012- 0.004
THICKNESS
t1
0.229 0.013
0.009 0.0005
DISTANCE
BETWEEN
CENTERLINE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
P
3.50 0.05
0.138 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
2.00 0.05
0.079 0.002
2
For Outline SOT-143
P
D
P2
P0
E
F
W
D1
t1
K
0
9°
MAX
9°
MAX
A0
B
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
3.19 0.10
2.80 0.10
1.31 0.10
4.00 0.10
1.00+ 0.25
0.126 0.004
0.110 0.004
0.052 0.004
0.157 0.004
0.039 +0.010
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
P
E
0
CARRIER TAPE
DISTANCE
WIDTH
THICKNESS
W
t1
8.00+0.30- 0.10 0.315+0.012- 0.004
0.254 0.013
0.0100 0.0005
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
P
3.50 0.05
0.138 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
2.00 0.05
0.079 0.002
2
9
Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
P
P
D
2
P
0
E
F
W
C
D
1
t
(CARRIER TAPE THICKNESS)
T (COVER TAPE THICKNESS)
t
1
K
An
An
0
A
B
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
2.40 0.10
2.40 0.10
1.20 0.10
4.00 0.10
1.00 + 0.25
0.094 0.004
0.094 0.004
0.047 0.004
0.157 0.004
0.039 + 0.010
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
DIAMETER
PITCH
POSITION
D
1.55 0.05
4.00 0.10
1.75 0.10
0.061 0.002
0.157 0.004
0.069 0.004
P
E
0
CARRIER TAPE
COVER TAPE
DISTANCE
WIDTH
THICKNESS
W
8.00 0.30
0.254 0.02
0.315 0.012
0.0100 0.0008
t
1
WIDTH
TAPE THICKNESS
C
5.4 0.10
0.062 0.001
0.205 0.004
0.0025 0.00004
0.138 0.002
T
t
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
ANGLE
FOR SOT-323 (SC70-3 LEAD)
FOR SOT-363 (SC70-6 LEAD)
An
8
°
C MAX
10 C MAX
°
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
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Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes 5989-4020EN
AV02-0533EN - April 14, 2010
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