HSMS-281C [AVAGO]
Surface Mount RF Schottky Barrier Diodes; 表面贴装射频肖特基势垒二极管型号: | HSMS-281C |
厂家: | AVAGO TECHNOLOGIES LIMITED |
描述: | Surface Mount RF Schottky Barrier Diodes |
文件: | 总10页 (文件大小:457K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HSMS-281x
Surface Mount RF Schottky Barrier Diodes
Data Sheet
Description/Applications
Features
These Schottky diodes are specifically designed for both • Surface Mount Packages
analog and digital applications. This series offers a wide
range of specifications and package configurations to
give the designer wide flexibility. The HSMS‑281x series of
• Low Flicker Noise
• Low FIT (Failure in Time) Rate*
diodes features very low flicker (1/f) noise.
• Six‑sigma Quality Level
• Single, Dual and Quad Versions
• Tape and Reel Options Available
• Lead‑free
Note that Avago’s manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent
sites on the wafer, assuring the highest degree of match.
• For more information see the Surface Mount Schottky
Reliability Data Sheet.
Pin Connections and Package Marking
Package Lead Code Identification, SOT-23/SOT-143
(Top View)
COMMON
ANODE
3
COMMON
CATHODE
3
1
2
3
6
5
4
SINGLE
3
SERIES
3
1
2
1
2
1
2
1
2
#4
#0
#2
#3
UNCONNECTED
PAIR
RING
BRIDGE
QUAD
Notes:
QUAD
3
4
3
4
3
4
1. Package marking provides orientation and identification.
2. See “Electrical Specifications”for appropriate package marking.
1
2
1
2
1
2
#5
#7
#8
Package Lead Code Identification, SOT-323
(Top View)
Package Lead Code Identification, SOT-363
(Top View)
SERIES
SINGLE
HIGH ISOLATION
UNCONNECTED
TRIO
UNCONNECTED PAIR
6
5
4
6
5
4
B
C
1
2
3
1
2
3
COMMON
ANODE
COMMON
CATHODE
K
L
E
F
Absolute Maximum Ratings[1] TC = 25°C
Symbol
Parameter
Unit
Amp
V
SOT-23/SOT-143
1
SOT-323/SOT-363
If
Forward Current (1 μs Pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance[2]
1
PIV
Tj
Same as VBR
150
Same as VBR
150
°C
Tstg
°C
‑65 to 150
500
‑65 to 150
150
θjc
°C/W
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.
Electrical Specifications TC = 25°C, Single Diode[3]
Maximum Maximum
Minimum Maximum Forward
Reverse
Leakage
Typical
Dynamic
Part
Package
Breakdown Forward
Voltage
VF (V) @
IF (mA)
Maximum
Number Marking Lead
Voltage
VBR (V)
Voltage
VF (mV)
IR (nA) @ Capacitance Resistance
VR (V)
HSMS[4]
Code
Code Configuration
CT (pF)
RD (Ω)[5]
2810
2812
2813
2814
2815
2817
2818
281B
281C
281E
281F
281K
B0
B2
B3
B4
B5
B7
B8
B0
B2
B3
B4
BK
0
2
3
4
5
7
8
B
C
E
F
K
Single
20
410
1.0 35 200 15
1.2
15
Series
Common Anode
Common Cathode
Unconnected Pair
Ring Quad[4]
Bridge Quad[4]
Single
Series
Common Anode
Common Cathode
High Isolation
Unconnected Pair
Unconnected Trio
281L
BL
L
Test Conditions
IR = 10 mA IF = 1 mA
VF = 0 V
f = 1 MHz
IF = 5 mA
Notes:
1. ∆VF for diodes in pairs and quads in 15 mV maximum at 1 mA.
2. ∆CTO for diodes in pairs and quads is 0.2 pF maximum.
3. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
4. See section titled “Quad Capacitance.”
5. RD = RS + 5.2Ω at 25°C and If = 5 mA.
2
Quad Capacitance
Linear Equivalent Circuit Model Diode Chip
R
j
Capacitance of Schottky diode quads is measured using
an HP4271 LCR meter. This instrument effectively isolates
individual diode branches from the others, allowing ac‑
curate capacitance measurement of each branch or each
diode. The conditions are: 20 mV R.M.S. voltage at 1 MHz.
Avago defines this measurement as “CM”, and it is equiva‑
lent to the capacitance of the diode by itself. The equiva‑
lent diagonal and adjacent capaci‑tances can then be cal‑
culated by the formulas given below.
R
S
C
j
RS = series resistance (see Table of SPICE parameters)
Cj = junction capacitance (see Table of SPICE parameters)
In a quad, the diagonal capacitance is the capacitance be‑
tween points A and B as shown in the figure below. The
diagonal capacitance is calculated using the following
formula
8.33 X 10-5 nT
Rj =
Ib + Is
where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, °K
C1 x C
C3 x C
4
CDIAGONAL = ______2_ + _______
C1 + C 2 C3 + C 4
n = ideality factor (see table of SPICE parameters)
The equivalent adjacent capacitance is the capacitance
between points A and C in the figure below. This capaci‑
tance is calculated using the following formula
Note:
To effectively model the packaged HSMS-281x product,
please refer to Application Note AN1124.
1
CADJACENT = C 1 + ____________
ESD WARNING:
1
1
1
–– + –– + ––
C 2 C3 C4
Handling Precautions Should Be Taken To Avoid Static Discharge.
SPICE Parameters
This information does not apply to cross‑over quad di‑
odes.
Parameter
Units
HSMS-281x
BV
CJ0
EG
IBV
IS
V
pF
eV
A
25
1.1
0.69
E‑5
A
4.8E‑9
1.08
10
N
RS
PB
PT
M
Ω
V
0.65
2
0.5
3
Typical Performance, TC = 25°C (unless otherwise noted), Single Diode
100
100,000
1000
100
10,000
10
1000
100
1
10
1
TA = +125C
TA = +75C
TA = +25C
TA = –25C
0.1
TA = +125C
TA = +75C
TA = +25C
10
1
0.01
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0
5
10
15
0.1
1
10
100
V
– FORWARD VOLTAGE (V)
V – REVERSE VOLTAGE (V)
R
I
– FORWARD CURRENT (mA)
F
F
Figure 1. Forward Current vs. Forward Voltage at
Temperatures.
Figure 2. Reverse Current vs. Reverse Voltage at
Temperatures.
Figure 3. Dynamic Resistance vs. Forward
Current.
1.25
1
30
10
30
I
(Left Scale)
F
10
0.75
V
(Right Scale)
F
0.50
0.25
0
1
1
0.3
0.2
0.3
1.4
0
2
4
6
8
10 12 14 16
0.4
0.6
0.8
1.0
1.2
V
– REVERSE VOLTAGE (V)
V
- FORWARD VOLTAGE (V)
R
F
Figure 4. Total Capacitance vs. Reverse Voltage.
Figure 5. Typical V Match, Pairs and Quads.
f
4
Applications Information
Assembly Instructions
Introduction — Product Selection
SOT-323 PCB Footprint
Avago’s family of Schottky products provides unique solu‑ A recommended PCB pad layout for the miniature SOT‑
tions to many design problems.
323 (SC‑70) package is shown in Figure 6 (dimensions are
in inches). This layout provides ample allowance for pack‑
age placement by automated assembly equipment with‑
out adding parasitics that could impair the performance.
The first step in choosing the right product is to select
the diode type. All of the products in the HSMS‑282x fam‑
ily use the same diode chip, and the same is true of the
HSMS‑281x and HSMS‑280x families. Each family has a dif‑
ferent set of characteristics which can be compared most
easily by consulting the SPICE parameters in Table 1.
0.026
A review of these data shows that the HSMS‑280x family
has the highest breakdown voltage, but at the expense of
a high value of series resistance (Rs). In applications which
do not require high voltage the HSMS‑282x family, with a
lower value of series resistance, will offer higher current
carrying capacity and better performance.The HSMS‑281x
family is a hybrid Schottky (as is the HSMS‑280x), offering
lower 1/f or flicker noise than the HSMS‑282x family.
0.079
0.039
0.022
Dimensions in inches
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products.
In general, the HSMS‑282x family should be the designer’s
first choice, with the ‑280x family reserved for high volt‑
age applications and the HSMS‑281x family for low flicker
noise applications.
Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout for the miniature SOT‑
363 (SC‑70, 6 lead) package is shown in Figure 7 (dimen‑
sions are in inches). This layout provides ample allowance
for package placement by automated assembly equip‑
ment without adding parasitics that could impair the per‑
formance.
Table 1. Typical SPICE Parameters.
Parameter Units
HSMS-280x HSMS-281x HSMS-282x
BV
V
75
25
15
CJ0
EG
pF
eV
A
1.6
1.1
0.7
0.026
0.69
1 E‑5
3 E‑8
1.08
30
0.69
1 E‑5
4.8 E‑9
1.08
10
0.69
1 E‑4
2.2 E‑8
1.08
6.0
IBV
IS
A
N
0.079
RS
Ω
V
PB (VJ)
PT (XTI)
M
0.65
2
0.65
2
0.65
2
0.039
0.5
0.5
0.5
0.018
Dimensions in inches
Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products.
5
SMT Assembly
The preheat zones increase the temperature of the board
and components to prevent thermal shock and begin
evaporating solvents from the solder paste. The reflow
zone briefly elevates the temperature sufficiently to pro‑
duce a reflow of the solder.
Reliable assembly of surface mount components is a com‑
plex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reflow temperatures faster
than those with a greater mass.
The rates of change of temperature for the ramp‑up and
cool‑down zones are chosen to be low enough to not
cause deformation of the board or damage to compo‑
nents due to thermal shock. The maximum temperature
in the reflow zone (TMAX) should not exceed 260°C.
Avago’s SOT diodes have been qualified to the time‑tem‑
perature profile shown in Figure 8. This profile is repre‑
sentative of an IR reflow type of surface mount assembly
process.
These parameters are typical for a surface mount assem‑
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reflow of solder.
After ramping up from room temperature, the circuit
board with components attached to it (held in place with
solder paste) passes through one or more preheat zones.
tp
Critical Zone
T L to Tp
Tp
T L
Ramp-up
tL
Ts
max
Ts
min
Ramp-down
ts
Preheat
25
t 25° C to Peak
Time
Figure 8. Surface Mount Assembly Profile.
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Reflow Parameter
Lead-Free Assembly
Average ramp‑up rate (Liquidus Temperature (TS(max) to Peak)
3°C/ second max
Preheat
Temperature Min (TS(min)
)
150°C
Temperature Max (TS(max)
)
200°C
Time (min to max) (tS)
60‑180 seconds
3°C/second max
217°C
Ts(max) to TL Ramp‑up Rate
Time maintained above:
Temperature (TL)
Time (tL)
60‑150 seconds
260 +0/‑5°C
20‑40 seconds
6°C/second max
8 minutes max
Peak Temperature (TP)
Time within 5 °C of actual Peak temperature (tP)
Ramp‑down Rate
Time 25 °C to Peak Temperature
Note 1: All temperatures refer to topside of the package, measured on the package body surface
6
Part Number Ordering Information
No. of
Part Number
Devices
10000
3000
Container
13" Reel
HSMS‑281x‑TR2G
HSMS‑281x‑TR1G
HSMS‑281x‑BLKG
7" Reel
100
antistatic bag
x = 0, 2, 3, 4, 5, 7, 8, B, C, E, F, K, L
Package Dimensions
Outline 23 (SOT-23)
Outline SOT-323 (SC-70 3 Lead)
e1
e2
e1
E1
E
XXX
E1
E
XXX
e
L
B
e
C
L
D
DIMENSIONS (mm)
B
D
C
SYMBOL
MIN.
0.80
0.00
0.15
0.08
1.80
1.10
MAX.
1.00
0.10
0.40
0.25
2.25
1.40
A
A1
B
C
D
E1
e
e1
E
DIMENSIONS (mm)
A
SYMBOL
MIN.
0.79
0.000
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
A
A1
B
C
D
E1
e
e1
e2
E
A1
A
0.65 typical
1.30 typical
Notes:
A1
1.80
0.26
2.40
0.46
XXX-package marking
Drawings are not to scale
L
Notes:
XXX-package marking
Drawings are not to scale
L
7
Outline 143 (SOT-143)
Outline SOT-363 (SC-70 6 Lead)
e2
e1
HE
E
B1
E1
L
E
XXX
e
c
D
DIMENSIONS (mm)
L
SYMBOL
E
D
HE
A
A2
A1
e
MIN.
1.15
1.80
1.80
0.80
0.80
0.00
MAX.
1.35
2.25
2.40
1.10
1.00
0.10
B
C
e
A1
A2
A
DIMENSIONS (mm)
D
SYMBOL
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.04
0.60
2.65
0.69
0.650 BCS
A
A1
B
b
c
L
0.15
0.08
0.10
0.30
0.25
0.46
b
A
B1
C
A1
D
E1
e
e1
e2
E
Notes:
XXX-package marking
Drawings are not to scale
L
For Outlines SOT-23, -323
Device Orientation
REEL
TOP VIEW
4 mm
END VIEW
8 mm
CARRIER
TAPE
ABC
ABC
ABC
ABC
USER
FEED
DIRECTION
Note: "AB" represents package marking code.
"C" represents date code.
COVER TAPE
For Outline SOT-143
For Outline SOT-363
TOP VIEW
4 mm
END VIEW
TOP VIEW
4 mm
END VIEW
8 mm
A B C
A B C
A B C
A B C
8 mm
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" re resents date code.
Note: "AB" represents package marking code.
"C" represents date code.
p
8
Tape Dimensions and Product Orientation
For Outline SOT-23
P
P
D
2
E
F
P
0
W
D
1
t1
Ko
13.5° MAX
8° MAX
9° MAX
B
A
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
D
3.15 0.10
2.77 0.10
1.22 0.10
4.00 0.10
1.00 + 0.05
0.124 0.004
0.109 0.004
0.048 0.004
0.157 0.004
0.039 0.002
0
0
0
BOTTOM HOLE DIAMETER
1
0
PERFORATION
CARRIER TAPE
DIAMETER
PITCH
POSITION
D
P
E
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
WIDTH
W
8.00+0.30 –0.10 0.315+0.012 –0.004
THICKNESS
t1
0.229 0.013
0.009 0.0005
DISTANCE
BETWEEN
CENTERLINE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
F
P
3.50 0.05
0.138 0.002
2.00 0.05
0.079 0.002
2
For Outline SOT-143
P
D
P2
P0
E
F
W
D1
t1
K
0
9° M AX
9° MAX
A0
B
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
D
3.19 0.10
2.80 0.10
1.31 0.10
4.00 0.10
1.00 + 0.25
0.126 0.004
0.110 0.004
0.052 0.004
0.157 0.004
0.039 + 0.010
0
0
0
BOTTOM HOLE DIAMETER
1
0
PERFORATION
DIAMETER
PITCH
POSITION
D
P
E
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
CARRIER TAPE
DISTANCE
WIDTH
THICKNESS
W
t1
8.00+0.30 –0.10 0.315+0.012 –0.004
0.254 0.013
0.0100 0.0005
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
9
Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
P
P
D
2
P
0
E
F
W
C
D
1
t
(CARRIER TAPE THICKNESS)
T (COVER TAPE THICKNESS)
t
1
K
An
An
0
A
B
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
D
2.40 0.10
2.40 0.10
1.20 0.10
4.00 0.10
1.00 + 0.25
0.094 0.004
0.094 0.004
0.047 0.004
0.157 0.004
0.039 + 0.010
0
0
0
BOTTOM HOLE DIAMETER
1
0
PERFORATION
DIAMETER
PITCH
POSITION
D
P
E
1.55 0.05
4.00 0.10
1.75 0.10
0.061 0.002
0.157 0.004
0.069 0.004
CARRIER TAPE
COVER TAPE
DISTANCE
WIDTH
THICKNESS
W
8.00 0.30
0.254 0.02
0.315 0.012
0.0100 0.0008
t
1
WIDTH
TAPE THICKNESS
C
5.4 0.10
0.062 0.001
0.205 0.004
0.0025 0.00004
T
t
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
ANGLE
FOR SOT-323 (SC70-3 LEAD)
FOR SOT-363 (SC70-6 LEAD)
An
8 °C MAX
10 °C MAX
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, AvagoTechnologies, and the A logo are trademarks of AvagoTechnologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 AvagoTechnologies. All rights reserved. Obsoletes 5989-4021EN
AV02-1367EN - May 29, 2009
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