HSMZ-C430-RU001 [AVAGO]
SINGLE COLOR LED, RED, PLASTIC PACKAGE-2;
| 型号： | HSMZ-C430-RU001 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | SINGLE COLOR LED, RED, PLASTIC PACKAGE-2 光电 |
| 文件： | 总8页 (文件大小：491K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HSMx-C430-xxxxx
HighPerformanceSurfaceMountLEDs
DataSheet
Features
Description
• Very low thermal impedance
• Smooth, consistent spatial radiation pattern
• Viewing angle: 30°
This evolutionary package design allows the optical
designer flexibility to minimize the quantity of LEDs
required without trading off the ultimate optical
perfor-mance.Thisslimpackagecanbeeasilycoupled
with secondary optics to efficiently distribute light,
providing a total low-profile structure.
• 3.2 x 2.8 mm footprint
• High luminous output
• Compatible with IR solder reflow
• Colors available: red, amber, and red orange
• Available in 8 mm tape on 7" (178 mm) diameter reels
• Tinted, nondiffused epoxy
These LEDs have a very low package thermal
resistance that efficiently dissipates heat out of the
LED package to its surrounding, e.g., a circuit board.
High-efficiency LED dice are used in these LED
components. AlInGaP (Aluminium Indium Gallium
Phosphide) for Red, Red Orange, and Amber, is
capable of producing high light output.
Applications
• Variable message sign
• Traffic/ rail signal
• Emergency/ warning signs
• Decorative devices
• Backlighting
These solid-state surface mount LEDs are designed
with a reflector cup and dome, which provide
directional lighting. The reflector cup focuses the
light more efficiently to provide a higher intensity
compared to a nonreflector cup equivalent part.
• Automotive
Benefits
• High package thermal dissipation capability
All packages are compatible with IR soldering
processes and are shipped in tape and reel with 2000
units per reel.
• Lens design capability to efficiently distribute light into
desirable angle
• Small footprint to overcome space count
• High flux output in surface mount package
Device Selection Guide
[1]
Total Flux φ (mlm) @ 50 mA
v
Part Number
Min.
1275
1615
980
Typ.
2700
3200
2200
Max.
4830
6320
3680
Color
Parts per Reel
2000
HSMZ-C430-RU001
HSMV-C430-SV001
HSMU-C430-QT001
Note:
TS AlInGaP Red
TS AlInGaP Red Orange
TS AlInGaP Amber
2000
2000
1. φv is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
Package Dimensions
3.210 (0.126)
CATHODE LINE (GOLD TRACE)
2.8 (0.111)
1.4 (0.055)
POLARITY
2.1 (0.080)
0.7 (0.028)
0.5 (0.02)
2.8
(0.111)
0.5 (0.02)
0.9 (0.036)
GREEN
CATHODE
MARKING
CATHODE PAD
ANODE PAD
HEAT SINK PAD
0.6 (0.024)
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3. HEAT SINK PAD IS CONNECTED TO CATHODE PAD BY PRODUCT DESIGN.
4. DO NOT USE HEAT SINK PAD AS CATHODE.
5. HEAT SINK PAD NEEDS TO BE INDEPENDENT FOR EACH UNIT (IF ARRANGED IN-LINE OR IN MATRIX FORM).
6. DO NOT CONNECT ALL THE HEAT SINKS TOGETHER AS THIS WILL LEAD TO SHORT CIRCUIT.
7. ILLUSTRATION ON HEAT SINK DESIGN FOR MATRIX AND IN-LINE ARRANGEMENT DESIGN SHOWN IN APPLICATION NOTES.
2
HSM x - C4 xx - x x x xx
Packaging Opt ion
01: Tape and Reel on 8 mm Tape, 7 inch Reel
Color Bin Select ion
0: Full Color Distribution
Max. Flux Bin (Refer to Flux Bin Table)
Min. Flux Bin (Refer to Flux Bin Table)
View ing Angle
Dice Color
U: TS AlInGaP Amber
V: TS AlInGaP Red Orange
Z: TS AlInGaP Red
Absolute Maximum Ratings at T = 25˚C
A
Parameter
AlInGaP
Units
mA
mA
mW
V
[1]
DC Forward Current
70
[2]
Peak Pulsing Current
Power Dissipation
Reverse Voltage
200
200
5
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
110
˚C
–40 to +100
–55 to +100
˚C
˚C
See IR reflow profile (Figure 7)
Notes:
1. Derate linearly as shown in Figure 4.
2. Pulse condition of 1/100 duty factor and 1 msec width.
3
Electrical Characteristics at T = 25˚C
A
Forward Voltage
V (Volts)
Reverse Voltage
V (Volts)
Capacitance C
Thermal
Resistance
(pF), V = 0,
F
R
F
@ I = 50 mA
@ I = 100 µA
Min.
f = 1 MHz
Typ.
Rθ (˚C/W)
J-PIN
Typ.
F
R
Device
Typ.
Max.
HSMZ-C430
HSMV-C430
HSMU-C430
2.5
3.0
3.0
3.0
5
5
5
30
30
30
90
2.4
90
2.5
90
Optical Characteristics at T = 25˚C
A
Luminous
Color,
Intensity/Total Flux Peak
Dominant
Luminous
Efficacy
η (lm/W) (lm/W)
v
Luminous
Efficiency
I (mcd)
Wavelength Wavelength
Viewing Angle
v
[2]
[3]
[4]
/ Φ (mlm)
λ
(nm)
λ (nm)
d
2 θ Degrees
V
peak
1/2
Part Number Typ.
Typ.
639
631
594
Typ.
627
620
591
Typ.
Typ.
150
210
500
Typ.
HSMZ-C430
HSMV-C430
HSMU-C430
Notes:
1.2
1.2
1.2
30
22
30
27
30
17
2. φ is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
v
3. The dominant wavelength is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
4. θ is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
1.6
1.4
1.2
1.0
0.8
0.6
0.4
80
1.0
AMBER
RED-
70
60
50
ORANGE
0.8
0.6
RED
RED-
ORANGE
40
30
20
10
0
0.4
0.2
0
RED
AMBER
0.2
0
380 430 480 530 580 630 680 730 780
0
20
40
60
80
0
0.5
1.0
1.5
2.0
2.5
3.0
WAVELENGTH – nm
FORWARD VOLTAGE – V
FORWARD CURRENT – mA
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward
voltage.
Figure 3. Relative luminous flux vs. forward
current.
4
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
90
80
70
60
50
Rθ
= 200°C/W
J-A
40
30
20
10
0
Rθ
Rθ
= 300°C/W
= 400°C/W
J-A
J-A
0.1
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
0
10 20 30 40 50 60 70 80 90 100 110
AMBIENT TEMPERATURE – °C
OFF AXIS ANGLE – DEGREES
Figure 4. Maximum DC forward current vs.
ambient temperature.
Figure 5. Radiation pattern.
100
80
20 SEC. MAX.
60
240°C MAX.
3°C/SEC. MAX.
100-150°C
40
183°C
–6°C/SEC.
MAX.
3°C/SEC.
MAX.
20
0
120 SEC. MAX. 60-150 SEC.
0
20 40 60 80 100 120 140 160 180
TIME
TOTAL INCLUDED ANGLE – DEGREES
Figure 7. Recommended reflow soldering
profile (JEDEC J-STD-020-A).
Figure 6. Percent total luminous flux vs. total
included angle.
5
0.60
0.73
2.80
4.26
0.90
3.56
8.50 MIN.
SOLDER RESIST
1.50 x 2
1.50 x 4
8.50 MIN.
PLATED THROUGH HOLE
AS HEAT PIPE CONNECTING
BOTTOM HEAT SINK
METAL HEAT SINK
UNDER SOLDER MASK
D0.35 mm x 8 MIN.
TOP VIEW
BOTTOM VIEW
NOTE: ALL DIMENSIONS IN mm.
Figure 8. Recommended soldering pad pattern.
USER FEED DIRECTION
PRINTED LABEL
CATHODE SIDE
Figure 9. Reel Orientation.
6
180
(7.08)
Ø
21.0
(0.83)
2.0
(0.08)
60.0
(2.36)
Ø
13.0
Ø
(0.51)
LABEL
1.5
(0.06)
TYP.
13.0
(0.51)
10.0
(0.39)
Figure 10. Reel dimensions.
+ 0.1
0
4.0 ± 0.1
Ø1.50
1.75 ± 0.1
3.50 ± 0.05
8.0 ± 0.3
CARRIER TAPE
COVER TAPE
2.00 ± 0.05
USER DIRECTION OF FEED
4.0 ± 0.1
Figure 11. Tape dimensions.
END
START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCHES) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS.
THERE SHALL BE A
MINIMUM OF
230 mm
(9.05 INCHES)
MAY CONSIST
OF CARRIER
AND/OR
MINIMUM OF 160 mm
(6.3 INCHES) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
COVER TAPE.
Figure 12. Tape leader and trailer dimensions.
7
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Sur fa ce
Mounting SMT LED Indica tor
Components.
For more information on using
HSMx-C4xx series SMT LEDs,
refer to Application Note 1266.
Color Bin Category
Amber
Flux Bin Category
Red Orange
Bin ID
Min.
1150
1500
1900
2500
3200
4200
Max.
1500
1900
2500
3200
4200
5500
Bin ID
Min.
584.5
587.0
589.5
592.0
594.5
Max.
587.0
589.5
592.0
594.5
597.0
Bin ID
Min.
Max.
613.5
616.5
619.5
623.5
626.5
Q
R
S
1
2
4
6
7
1
2
3
4
5
610.5
613.5
616.5
619.5
623.5
T
U
V
Tolerance = ± 15%
Red
Full Distribution
Storage Condition:
5 to 30˚ C @ 60% RH max.
Tolerance = ± 0.5 nm
Baking is required under the
condition:
a) The pack has been opened for
more than 1 week.
Baking recommended condition:
60 ± 5˚ C for 20 hours.
This product is qualified as
Moisture Sensitive JEDEC
Level 2A.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
5988-4547EN October 12, 2007
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