QFBR-5592Z [AVAGO]

Versatile Link The Versatile Fiber Optic Connection; 多功能连接的通用光纤连接
QFBR-5592Z
型号: QFBR-5592Z
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

Versatile Link The Versatile Fiber Optic Connection
多功能连接的通用光纤连接

光纤
文件: 总4页 (文件大小:96K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PCN: V11-016-E47540-MA  
Product Change Notice  
Issue Date: July 29, 2011  
Change Type:  
Receivers  
- Change to improved mold compound  
- Change to alternate photo diode source  
- Change of Lead frame base material  
Transmitters  
- Change to improved mold compound  
Description and Extent of Change:  
1. Qualify improved mold compound to achieve better moisture sensitivity level (from MSL 4 to MSL 3)  
Parts Affected:  
HFBR-1505AFZ  
HFBR-1505AZ  
HFBR-1505CFZ  
HFBR-1505CZ  
HFBR-1506AFZ  
HFBR-1506AMZ  
HFBR-1515BFZ  
HFBR-1515BZ  
HFBR-1517Z  
HFBR-1525EZ  
HFBR-1526Z  
HFBR-1527Z  
HFBR-1528Z  
HFBR-1531Z  
HFBR-1532Z  
HFBR-1533Z  
HFBR-1537Z  
QFBR-1548Z  
QFBR-1549Z  
QFBR-1551Z  
QFBR-1561Z  
QFBR-1570Z  
QFBR-1573Z  
QFBR-1585Z  
QFBR-T081Z  
QFBR-T501Z  
QFBR-T515EZ  
QFBR-T518Z  
QFBR-T519Z  
QFBR-T521Z  
QFBR-T531Z  
QFBR-TT02Z  
QFBR-TT03Z  
QFBR-TT06Z  
QFBR-TT09Z  
QFBR-521TZ  
QFBR-T631Z  
HFBR-1520Z  
HFBR-1521Z  
HFBR-1522Z  
HFBR-1523Z  
HFBR-1524Z  
2. Qualify improved mold compound to achieve better moisture sensitivity level (from MSL 4 to MSL 3)  
and  
3. Qualify new leadframe base material to improve matching of coefficient of thermal expansion  
Parts Affected:  
HFBR-2505CFZ  
HFBR-2505CZ  
HFBR-2521Z  
HFBR-2522Z  
HFBR-2523Z  
HFBR-2523Z-00A  
HFBR-2524Z  
HFBR-2531Z  
HFBR-2532Z  
HFBR-2533Z  
HFBR-2541Z  
QFBR-2548Z  
QFBR-2551Z  
QFBR-2573Z  
QFBR-521RZ  
QFBR-R521Z  
QFBR-R531Z  
QFBR-TR04Z  
QFBR-TR05Z  
QFBR-TR10Z  
QFBR-5591Z  
QFBR-5592Z  
QFBR-5594Z  
QFBR-5595Z  
4. Qualify alternate photo diode supplier and improved mold compound:  
Parts Affected:  
QFBR-R518Z  
HFBR-2510Z  
HFBR-2526Z  
HFBR-2536Z  
Reasons for Changes:  
1. Improved mold compound:  
to improve moisture sensitivity level from MSL 4 to MSL 3 and to harmonize the mold compound in use.  
The improved mold compound has been qualified and used in other Avago products since 2007.  
2. New leadframe base material:  
to improve the matching of coefficient-of-thermal-expansion. Lead frame layout remains unchanged. All  
other 650nm transmitters from Avago have been qualified and shipped with this lead frame material for  
more than 15 years.  
3. New photodiode:  
to qualify alternative photo diode supplier. The alternate supplier and its photo diode is already qualified  
and used in other Avago products since 2007.  
Effect of Change on Fit, Form, Function, Quality or Reliability:  
Reliability qualifications have been performed to ensure product reliability before the implementation date.  
Detailed product characterizations were performed to ensure product compliance to datasheet.  
Effective Date of Change:  
The approximate dates for sample availability, qualification completion and effective date of change for the  
above changes are shown in the table below. Timing of shipment, on or after the Target Date of the changed  
part will vary by part number depending on customer demand, and inventory levels.  
Sample  
availability  
Qualification  
completion  
Target Date  
of change  
Samples are available  
WW1130  
WW1145  
Qualification Plan:  
HFBR1521Z  
HFBR1527Z  
HFBR2521Z  
HFBR2526Z  
Test  
Reference  
Condition  
Test Points  
Assessment  
Assessment  
Assessment  
Assessment  
Result  
Result  
Result  
Result  
24hrs bake @125°C,  
192 +5/0 hrs soak at 30°C  
/60%RH,  
1x wavesolder 260°C/+  
5°C, 10s  
Moisture Level  
MSL3 Definition (MLD)  
MSL – 3  
0/11  
Pass  
0/11  
Pass  
0/11  
Pass  
SAM: check  
Delamination @ 0hrs and  
after solder  
JEDEC 020D.1  
24hrs bake @125°C,  
96 +5/0 hrs soak at 30°C  
/60%RH,  
1x wavesolder 260°C/+  
5°C, 10s  
Moisture Level  
MSL4 Definition (MLD)  
MSL – 4  
0/11  
0/33  
Pass  
Pass  
Temperature  
Cycling  
(TMCL)  
MILSTD883  
Method 1010  
200cyc, 500cyc, and  
1000cyc @ 25°C  
TMCL  
uB85/85  
B85/85  
HTOL  
Ta = 40°C to +100°C  
0/33  
0/22  
Pass  
Pass  
0/33  
0/22  
Pass  
Pass  
0/33  
Pass  
TX: Unbiased  
Damp Heat  
(UB85/85)  
MILSTD202  
Method 103  
Ta= 85°C, RH=85%  
Vcc=5,25V,  
168hrs, 500hrs and  
1000hrs @ 25°C  
RX: Biased Damp  
Heat (B85/85)  
0/22  
0/22  
0/11  
0/11  
Pass  
Pass  
Pass  
Pass  
0/22  
0/22  
0/11  
0/11  
Pass  
Pass  
Pass  
Pass  
High Temperature  
Operating Life  
(HTOL)  
Section 5.18 (GR‐  
468CORE)  
168hrs, 500hrs and  
1000hrs @ 25°C  
Ta = 85°C, Vcc=5,25V  
0/22  
0/11  
0/11  
Pass  
Pass  
Pass  
0/22  
0/11  
0/11  
Pass  
Pass  
Pass  
1500g (peak), 0.5ms,  
5 pulses/surface, 6  
surfaces  
Mechanical Shock  
(MS)1  
MILSTD883  
Method 2002B  
MS/MV  
Post MS/MV  
20 – 2000HZ, 20 G  
4min/cycle, 4cycle/axis,  
3 axis  
Mechanical  
Vibration (MV)1  
MILSTD883  
Method 2007A  
___________________________________________________________________________________________  
These changes have been reviewed and approved by Avago Technologies engineers and managers per Avago  
Technologies procedure: Change Control and Customer Notification, A-5962-6052-80.  
Please contact your Avago Technologies field sales engineer or Contact Center (http://www.avagotech.com/contact/ ) for  
any questions or support requirements. Please return any response as soon as possible, but not to exceed 30 days.  

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