AW36413CSR [AWINIC]
High Efficiency, Dual 1.5A Flash LED Driver;
| 型号： | AW36413CSR |
| 厂家： | 
AWINIC |
| 描述： | High Efficiency, Dual 1.5A Flash LED Driver |
| 文件： | 总37页 (文件大小：2656K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AW36413
July 2018 V1.4
High Efficiency, Dual 1.5A Flash LED Driver
FEATURES
GENERAL DESCRIPTION
Support Flash and Indicator 2in1 application
The AW36413 is a dual LED flash driver that
provides a high level of adjustability within a small
solution size. The AW36413 utilizes a 2MHz or
Support Dual Color Temperature Flash LED
Application
4MHz
fixed-frequency
synchronous
boost
1.5A Total Allowed LED Current During Operation
(ILED1+ILED2≤1.5A)
converter to provide power to the dual 1.5A
constant current LED sources. The dual 128 levels
current sources provide the flexibility to adjust the
current of LED1 and LED2 in Flash/Torch/IR
modes. The total allowed LED Current during
operation is 1.5A (ILED1+ILED2 ≤ 1.5A). The
AW36413 provides three IVFM protection modes
to prevent system reset or shutdown under low
battery condition.
Flash：11.35mA~1.5A，128 levels
11.72mA/level
Torch：2.55mA~372mA，128 levels
2.91mA/level
Indicator：0.02mA~372mA，128*128 levels
0.02mA/level
Flash Timeout：40ms~1.6s，16 levels
Flash/Torch/Indicator/IR Mode
The AW36413 is controlled via an I2C-compatible
interface. The main features of the AW36413
include: flash/torch current, flash timeout duration,
IVFM, TX interrupt, and NTC thermistor monitor.
The AW36413 also provides hardware flash and
hardware torch pins (STROBE and TORCH/TEMP)
to control Flash/Torch events.
High Efficiency: 85%
Optimized Flash LED Current During Low Battery
Conditions (IVFM)
Hardware Strobe Enable (STROBE)
Hardware Torch Enable (TORCH/TEMP)
Remote NTC Monitoring
The 2MHz or 4MHz switching frequency options,
overvoltage protection (OVP), and adjustable
current limit allow for the use of tiny, low-profile
inductors and 10-µF ceramic capacitors. The
device operates over a –40°C to +85°C ambient
temperature range.
Synchronization Input for RF Power Amplifier
Pulse Events (TX)
400kHz I2C：AW36413（I2C Address=0x6B）
0.4mm Pitch，CSP-12 Package
Compatible with AW3643, AW3644, AW36414
The AW36413 is available in small 0.4mm pitch
1.626mm×1.332mm CSP-12 package.
APPLICATION
Smartphone Camera Flash
TYPICAL APPLICATION CIRCUIT
L 1μH 3A
VIN
CIN
10μF
IN
SW
10V
OUT
COUT
10μF
10V
AW36413CSR
TORCH/TEMP
LED1
STROBE
HWEN
TX
SDA
SCL
D1
D2
Flash
LED
MCU
LED2
GND
Flash
LED
Fig 1
Typical Application Circuit of AW36413
All trademarks are the property of their respective owners.
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1
Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
PIN CONFIGURATION AND TOP MARK
AW36413CSR Pin Configuration
(Top View)
AW36413CSR Top Mark
(Top View)
GND
SW
IN
SDA
SCL
A
B
C
D
STROBE
HWEN
TORCH
/TEMP
OUT
LED2
TX
LED1
1
2
3
343A–AW36413CSR
XXXX–Manufacture Tracking Code
Fig 2
Pin Configuration and Top Mark
PIN DEFINITION
No.
NAME
TYPE
DESCRIPTION
Ground
A1
GND
Ground
Input voltage connection. Connect IN to GND with a 10µF or larger ceramic
capacitor.
A2
IN
Power
Serial data input/output of the I2C interface.
Switch pin of the step-up DC-DC convertor.
I/O
A3
B1
SDA
SW
Power
Active high hardware flash enable. Drive STROBE high to turn on Flash pulse.
Internal pull down resistor of 300kΩ between STROBE and GND.
B2
B3
C1
STROBE
SCL
I/O
I/O
Serial clock input of the I2C interface.
Step-up DC-DC converter output. Connect a 10µF ceramic capacitor between
OUT and GND.
OUT
Power
Active high enable pin. High = Standby, Low = Shutdown/Reset. Internal pull
down resistor of 300kΩ between HWEN and GND.
C2
HWEN
I/O
Torch terminal input or threshold detector for NTC temperature sensing and
current scale back.
C3
D1
D2
D3
TORCH/TEMP
LED2
I/O
Power
I/O
High-side current source output for flash LED2.
Power amplifier synchronization input. Internal pull down resistor of 300kΩ
between TX and GND.
TX
Power
LED1
High-side current source output for flash LED1.
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
ORDERING INFORMATION
Moisture
Sensitivity
Level
Part
Number
Environmental
Information
Temperature
Package
Marking
Delivery Form
AW36413
CSR
3000 units/
1.626mm×1.332mm
CSP-12
343A
MSL1
ROHS+HF
-40°C ～85°C
XXXX
Tape and Reel
AW36413
Shipping
R: Tape & Reel
Package Type
CS: CSP
AWINIC FLASH LED DRIVER SERIES
Product
Channels
Type
Description
Package
High Efficiency, Dual Independent 1.5A Flash LED
Driver
AW3644
2
Boost
CSP-12
High Efficiency, Dual Independent 1.5A Flash LED
Driver
AW36414
AW3643
2
2
2
1
1
1
1
1
1
Boost
Boost
Boost
Boost
Boost
CSP-12
CSP-12
CSP-12
CSP-12
CSP-9
High Efficiency, Dual 1.5A Flash LED Driver
High Efficiency, Dual 1.5A Flash LED Driver
High Efficiency, 1.5A Flash LED Driver
High Efficiency, 1.5A Flash LED Driver
AW36413
AW3648
AW3642
Charge
Pump
Flash Current & Flash Timer Programmable 1A Flash
LED Driver
AW3641E
AW36402
AW36404
AW36406
DFN-10L
DFN-6L
DFN-8L
DFN-8L
Current
Sink
200mA 1-wire Configurable Front Flash LED Driver
with Ultra Small Package
Current
Sink
400mA 1-wire Configurable Front Flash LED Driver
with Ultra Small Package
Current
Sink
600mA PWM Configurable Front Flash LED Driver
with Ultra Small Package
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
TYPICAL APPLICATION CIRCUITS
L 1μH 3A
VIN
CIN
10μF
IN
SW
10V
OUT
COUT
10μF
10V
AW36413CSR
TORCH/TEMP
LED1
LED2
STROBE
HWEN
TX
SDA
SCL
D1
D2
Flash
LED
MCU
GND
Flash
LED
Fig 3
Notice for Typical Application Circuits:
AW36413 Application Circuit
1: Please place CIN，COUT as close to the chip as possible.
2: Connect the inductor on the top layer close to the SW pin.
3: For the sake of driving capability, the power lines, output lines, and the connection lines of L and LED
should be short and wide as possible. .
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
ABSOLUTE MAXIMUM RATINGS(NOTE1)
PARAMETERS
IN, SW, OUT, LED1, LED2
Range
Unit
V
-0.3 to 6
HWEN, SCL, SDA, STROBE, TORCH/TEMP, TX
Continuous power dissipation
−0.3 to (VIN+0.3)
Internally limited
V
Max Junction Temperature TJMAX
Storage Temperature TSTG
155
-65 to 150
260
℃
℃
Maximum lead temperature (soldering)
Junction to Ambient Thermal Resistance θJA
℃
79.2
℃/W
HBM
±2000
±1500
V
V
ESD, All Pins(NOTE2)
CDM
+IT：+200
-IT：-200
Latch-Up (Test method: JEDEC STANDARD NO.78D)
mA
RECOMMENDED OPERATING CONDITIONS
PARAMETERS
Range
Unit
VIN
2.7 to 5.5
V
Junction temperature (TJ)
Ambient temperature (TA)
-40 to 125
-40 to 85
℃
℃
NOTE1: Conditions out of those ranges listed in “absolute maximum ratings” may cause permanent damages
to the device. In spite of the limits above, functional operation conditions of the device should within the
ranges listed in “recommended operating conditions”. Exposure to absolute-maximum-rated conditions for
prolonged periods may affect device reliability.
NOTE2: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. Test
method: MIL-STD-883J Method 3015.9
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
ELECTRICAL CHARACTERISTICS
Typical limits tested at TA=25℃. Minimum and maximum limits apply over the full operating ambient
temperature range(-40℃≤TA≤85℃). Unless otherwise specified, VIN=3.6V, HWEN= VIN.
Symbol
Description
Test Condition
Min
Typ
Max
Unit
Vin Supply
VIN
IQ
Input operating range
2.7
5.5
0.8
V
Quiescent supply current
Device not switching, pass mode
0.4
3
mA
Device disabled, HWEN=1.8V
ISB
Standby supply current
Shutdown supply current
10
1
2.5V≤VIN≤5.5V
Device disabled, HWEN=0V
ISD
0.1
2.5V≤VIN≤5.5V
Falling VIN
Rising VIN
2.5
2.6
V
Under voltage lockout
threshold
UVLO
V
Current Source Specifications
VOUT=4V,
flash code=0x7F=1.5A
-7%
1.5
7%
A
ILED1/2
Current source accuracy
VOUT=4V,
torch code=0x3F=186mA
-10%
186
10%
mA
ON threshold
OFF threshold
4.85
4.75
5
5.15
5.05
VOUT over-voltage protect
threshold
VOVP
V
4.9
Boost Converter Specifications
RPMOS
RNMOS
PMOS switch on-resistance
NMOS switch on-resistance
85
60
1.9
2.8
2
mΩ
mΩ
Reg 0x07, bit[0]=0
Reg 0x07, bit[0]=1
Reg 0x07, bit[1]=0
Reg 0x07, bit[1]=1
-12%
-12%
-6%
12%
12%
6%
ICL
Switch current limit
Switching frequency
A
FSW
MHz
-6%
4
6%
Input voltage flash monitor
trip threshold
VIVFM
INTC
Reg 0x02, bits[3:1]=”000”
-3%
-6%
-6%
2.9
50
3%
6%
6%
V
V
NTC current
NTC comparator trip
threshold
VTRIP
Reg 0x09, bit[3:1]=”100”
0.6
Thermal shutdown threshold
Thermal shutdown hysteresis
155
20
TSD
℃
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
Symbol
Description
Test Condition
Min
Typ
Max
Unit
I2C-Compatible Interface Specifications(SCL,SDA)
VIL
Input logic low
Input logic high
Output logic low
0
0.4
VIN
0.4
V
V
V
VIH
VOL
1.2
ILOAD=3mA
HWEN, STROBE, TORCH/TEMP, TX Voltage Specifications
VIL
Input logic low
0
0.4
VIN
V
V
VIH
RPD
Input logic high
1.2
Internal pull down resistors
300
mΩ
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
I2C INTERFACE TIMING
Symbol
Description
Min
Typ
Max
Units
FSCL
Interface Clock frequency
400
kHz
ns
SCL
SDA
200
250
TDEGLITCH Deglitch time
ns
s
s
s
s
s
s
s
s
s
s
THD:STA
TLOW
(Repeat-start) Start condition hold time
Low level width of SCL
0.6
1.3
0.6
0.6
0
THIGH
TSU:STA
THD:DAT
TSU:DAT
TR
High level width of SCL
(Repeat-start) Start condition setup time
Data hold time
Data setup time
0.1
Rising time of SDA and SCL
Falling time of SDA and SCL
Stop condition setup time
Time between start and stop condition
0.3
0.3
TF
TSU:STO
TBUF
0.6
1.3
VIH
SDA
SCL
VIL
tBUF
tLOW
tHIGH
tR
tSP
tF
VIH
VIL
tHD:STA
tHD:DAT
tSU:DAT
tSU:STA
tSU:STO
Stop
Start
Start
Stop
Fig 4
I2C INTERFACE TIMING
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
TYPICAL CHARACTERISTICS
Ambient temperature is 25°C, input voltage is 3.6 V, HWEN = IN, CIN = COUT = 2×10 µF and L=1 µH, unless
otherwise noted .
1.6
1.4
1.2
1
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
0
16
32
48
64
80
96
112
128
0
16
32
48
64
80
96
112
128
LED1 Flash Code (dec#)
LED2 Flash Code (dec#)
Fig 5. LED1 Flash Current vs Brightness Code
Fig 6. LED2 Flash Current vs Brightness Code
0.4
0.4
0.36
0.32
0.28
0.24
0.2
0.36
0.32
0.28
0.24
0.2
0.16
0.12
0.08
0.04
0
0.16
0.12
0.08
0.04
0
0
16
32
48
64
80
96
112
128
0
16
32
48
64
80
96
112
128
LED1 Torch Code (dec#)
LED2 Torch Code (dec#)
Fig 7. LED1 Torch Current vs Brightness Code
Fig 8. LED2 Torch Current vs Brightness Code
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
BRC = 63
BRC = 55
BRC = 47
BRC = 39
BRC = 31
BRC = 23
BRC = 15
BRC = 7
BRC = 127
BRC = 119
BRC = 111
BRC = 103
BRC = 95
BRC = 87
BRC = 79
BRC = 71
BRC = 0
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
Fig 9. LED1 Flash Current vs Input Voltage
Fig 10. LED1 Flash Current vs Input Voltage
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
Typical Characteristics (continued)
Ambient temperature is 25°C, input voltage is 3.6 V, HWEN = IN, CIN = COUT = 2×10 µF and L=1 µH, unless
otherwise noted .
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
BRC = 63
BRC = 55
BRC = 47
BRC = 39
BRC = 31
BRC = 23
BRC = 15
BRC = 7
BRC = 127
BRC = 119
BRC = 111
BRC = 103
BRC = 95
BRC = 87
BRC = 79
BRC = 71
BRC = 0
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
Fig 11. LED2 Flash Current vs Input Voltage
Fig 12. LED2 Flash Current vs Input Voltage
1.60
1.58
1.56
1.54
1.52
1.50
1.48
1.46
1.44
1.42
1.40
1.10
1.08
1.06
1.04
1.02
1.00
0.98
0.96
0.94
0.92
0.90
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
ILED=1.5A
fSW=2Mhz
Flash
ILED=1.006A fSW=2Mhz Flash
Fig 13. LED1/2 Flash Current vs Input Voltage
Fig14. LED1/2 Flash Current vs Input Voltage
0.87
0.85
0.83
0.81
0.79
0.77
0.75
0.73
0.71
0.69
0.67
0.60
0.58
0.56
0.54
0.52
0.50
0.48
0.46
0.44
0.42
0.40
LED1
LED2
LED1
LED2
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
ILED=0.747A fSW=2Mhz
Flash
ILED=0.501A fSW=2Mhz Flash
Fig 15. LED1 & LED2 Current vs Input Voltage
Fig16. LED1 & LED2 Current vs Input Voltage
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
Typical Characteristics (continued)
Ambient temperature is 25°C, input voltage is 3.6 V, HWEN = IN, CIN = COUT = 2×10 µF and L=1 µH, unless
otherwise noted .
0.45
0.44
0.43
0.42
0.41
0.40
0.39
0.38
0.37
0.36
0.35
0.34
0.33
0.32
0.31
0.30
0.45
0.44
0.43
0.42
0.41
0.40
0.39
0.38
0.37
0.36
0.35
0.34
0.33
0.32
0.31
0.30
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
ILED=0.372A
fSW=2Mhz
Torch
ILED=0.372A
fSW=4Mhz
Torch
Fig 17. LED1/2 Torch Current vs Input Voltage
Fig 18. LED1/2 Torch Current vs Input Voltage
0.25
0.24
0.23
0.22
0.21
0.20
0.19
0.18
0.17
0.16
0.15
0.25
0.24
0.23
0.22
0.21
0.20
0.19
0.18
0.17
0.16
0.15
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
ILED=0.186A
fSW=2Mhz
Torch
ILED=0.186A
fSW=4Mhz
Torch
Fig 19. LED1/2 Torch Current vs Input Voltage
Fig 20. LED1/2 Torch Current vs Input Voltage
0.45
0.44
0.43
0.42
0.41
0.40
0.39
0.38
0.37
0.36
0.35
0.34
0.33
0.32
0.31
0.30
0.25
0.24
0.23
0.22
0.21
0.20
0.19
0.18
0.17
0.16
0.15
LED1
LED2
LED1
LED2
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
ILED=0.372A
fSW=2Mhz
Torch
ILED=0.186A
fSW=2Mhz
Torch
Fig 21. LED1 & LED2 Current vs Input Voltage
Fig 22. LED1 & LED2 Current vs Input Voltage
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
Typical Characteristics (continued)
Ambient temperature is 25°C, input voltage is 3.6 V, HWEN = IN, CIN = COUT = 2×10 µF and L=1 µH, unless
otherwise noted .
100
95
90
85
80
75
70
65
60
55
50
100
95
90
85
80
75
70
65
60
55
50
VLED = 3.1V
VLED = 3.3V
VLED = 3.5V
VLED = 3.8V
VLED = 4.1V
VLED = 4.4V
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VIN (V)
VIN (V)
ILED=1.5A
fSW=2Mhz Flash
ILED=1.5A
VLED=3.5V
fSW=2Mhz Flash
Fig23. LED Efficiency vs Input Voltage
Fig24. LED Efficiency vs Input Voltage
100
95
90
85
80
75
70
65
60
55
50
100
95
90
85
80
75
70
65
60
55
50
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VIN (V)
VIN (V)
ILED=1.006A
VLED=3.2V
fSW=2Mhz Flash
ILED=1.006A
VLED=3.2V
fSW=4Mhz Flash
Fig25. LED Efficiency vs Input Voltage
Fig26. LED Efficiency vs Input Voltage
100
95
90
85
80
75
70
65
60
55
50
100
95
90
85
80
75
70
65
60
55
50
2.5
3.0
3.5
4.0
4.5
5.0
Torch
5.5
2.5
3.0
3.5
4.0
4.5
5.0
Torch
5.5
VIN (V)
VIN (V)
ILED=0.186A VLED=2.75V
fSW=2Mhz
ILED=0.372A VLED=2.9V
fSW=2Mhz
Fig 28. LED Efficiency vs Input Voltage
Fig 27. LED Efficiency vs Input Voltage
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
Typical Characteristics (continued)
Ambient temperature is 25°C, input voltage is 3.6 V, HWEN = IN, CIN = COUT = 2×10 µF and L=1 µH, unless
otherwise noted .
2.150
2.125
2.100
2.075
2.050
2.025
2.000
1.975
1.950
1.925
1.900
4.300
4.250
4.200
4.150
4.100
4.050
4.000
3.950
3.900
3.850
3.800
2.5 2.75
3
3.25 3.5 3.75
4
4.25 4.5 4.75
5
2.5 2.75
3
3.25 3.5 3.75
4
4.25 4.5 4.75
5
VIN (V)
VIN (V)
Fig 29. 2-Mhz Frequency vs Input Voltage
Fig 30. 4-Mhz Frequency vs Input Voltage
10
9
8
7
6
5
4
3
2
1
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
HWEN=1.8 V
I2C=1.8 V
HWEN=1.8 V
I2C=0 V
Fig 31. Standby Current vs Input Voltage
Fig 32. Standby Current vs Input Voltage
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.5
3
3.5
4
4.5
I2C=VIN
5
5.5
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
HWEN=VIN
HWEN=VIN
I2C=0 V
Fig 33. Standby Current vs Input Voltage
Fig 34. Standby Current vs Input Voltage
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AW36413
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Typical Characteristics (continued)
Ambient temperature is 25°C, input voltage is 3.6 V, HWEN = IN, CIN = COUT = 2×10 µF and L=1 µH, unless
otherwise noted .
2.20
2.16
2.12
2.08
2.04
2.00
1.96
1.92
1.88
1.84
1.80
1.76
1.72
1.68
1.64
1.60
2.20
2.16
2.12
2.08
2.04
2.00
1.96
1.92
1.88
1.84
1.80
1.76
1.72
1.68
1.64
1.60
2.5
2.7
2.9
3.1
3.3
3.5
3.7
3.9
4.1
4.3
2.5
2.7
2.9
3.1
3.3
3.5
3.7
3.9
4.1
4.3
VIN (V)
VIN (V)
ILED=1.5A
fSW=2MHz
ICL=1.9A
VLED=4.5V
ILED=1.5A
fSW=4MHz
ICL=1.9A
VLED=4.5V
Fig 35. Inductor Current Limit vs Input Voltage
Fig 36. Inductor Current Limit vs Input Voltage
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9
VIN (V)
fSW=2MHz
ICL=2.8A
VIN (V)
fSW=4MHz
ICL=2.8A
ILED=1.5A
VLED=4.5V
ILED=1.5A
VLED=4.5V
Fig 37. Inductor Current Limit vs Input Voltage
Fig 38. Inductor Current Limit vs Input Voltage
VOUT (2V/DIV)
VOUT (2V/DIV)
ILED (500mA/DIV)
IIN (1A/DIV)
ILED (500mA/DIV)
IIN (1A/DIV)
TIME (500 μs/DIV)
TIME (500 μs/DIV)
ILED1/2=1006mA
fSW=2Mhz
VLED=3.4V
ILED1/2=1006mA
fSW=2Mhz
VLED=3.4V
Fig 40. Ramp Down
Fig 39. Ramp Up
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Typical Characteristics (continued)
Ambient temperature is 25°C, input voltage is 3.6 V, HWEN = IN, CIN = COUT = 2×10 µF and L=1 µH, unless
otherwise noted .
TX Signal
VOUT (2V/DIV)
VIN (50mV/DIV)
ILED (800mA/DIV)
IIN (800mA/DIV)
ILED (200mA/DIV)
IIN (500mA/DIV)
TIME (500 μs/DIV)
fSW=2Mhz VLED=3.18V
TIME (2 ms/DIV)
ILED1=ILED2=746.9mA
VIVFM=3.2V
ILED1=ILED2=746.9mA
fSW=2Mhz
VLED=3.18V
Fig 41. TX Interrupt
Fig 42. IVFM – Stop and Hold
VIN (50mV/DIV)
VIN (50mV/DIV)
ILED (200mA/DIV)
IIN (500mA/DIV)
ILED (200mA/DIV)
IIN (500mA/DIV)
TIME (500 μs/DIV)
TIME (500 μs/DIV)
fSW=2Mhz VLED=3.18V
ILED1=ILED2=746.9mA
fSW=2Mhz
VLED=3.18V
VIVFM=3.2V
ILED1=ILED2=746.9mA
VIVFM=3.2V
Fig 43. IVFM – Down
Fig 44. IVFM – Up and Down
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AW36413
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DETAILED FUNCTIONAL DESCRIPTION
The AW36413 is a high-power white LED flash driver capable of delivering up to 1.5A in either of the two
parallel LEDs. The total allowed LED current during operation is 1.5A (ILED1+ILED2≤1.5A). The device
incorporates a 2MHz or 4MHz constant frequency-synchronous current-mode PWM boost converter and dual
high-side current sources to regulate the LED current over the 2.7V to 5.5V input voltage range.
The AW36413 PWM DC-DC boost converter switches and boosts the output to maintain at least VHR across
each of the current sources (LED1/2). This minimum headroom voltage ensures that both current sources
remain in regulation. If the input voltage is above the LED voltage + current source headroom voltage, the
device would not switch, but turns the PMOS on continuously (Pass mode). In Pass mode the difference
between (VIN – ILED × RPMOS) and the voltage across the LED is dropped across the current source.
The AW36413 has three logic inputs including a hardware Flash Enable (STROBE), a hardware Torch Enable
(TORCH/TEMP, TORCH = default), and a Flash Interrupt input (TX) designed to interrupt the flash pulse
during high battery-current conditions. These logic inputs have internal 300kΩ (typical) pull-down resistors to
GND.
Additional features of the AW36413 include an internal comparator for LED thermal sensing via an external
NTC thermistor and an input voltage monitor that can reduce the Flash current during low VIN conditions. It
also has a Hardware Enable (HWEN) pin that can be used to reset the state of the device and the registers by
pulling the HWEN pin to ground.
Control is done via an I2C-compatible interface. This includes adjustment of the Flash and Torch current
levels, changing the Flash Timeout Duration, and changing the switch current limit. Additionally, there are flag
and status bits that indicate flash current timeout, LED over-temperature condition, LED failure (open/short),
device thermal shutdown, TX interrupt, and VIN under-voltage conditions.
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AW36413
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FUNCTIONAL BLOCK DIAGRAM
SW
AW36413
OVP
IN
Thermal Shutdown
Protection
VOVP
UVLO
IVFM
OUT
OSC
Boost Controller
2/4Mhz
INTC=50uA
NTC
monitor
Current
Limit
TORCH/TEMP
STROBE
TX
LED1
LED2
FB
Select
Control Logic
/Regsiter
HWEN
I2C
Interface
LED & OUT
Short Detect
SDA
SCL
GND
FEATURE DESCRIPTION
HWEN & I2C INTERFACE
AW3643 has a logic input HWEN pin to enable/disable the device. When HWEN is set low, the device goes
into shutdown mode, the I2C interface is disabled and all I2C registers are reset to default. In shutdown mode
the device does not respond to any I2C command. When HWEN is set high, the device goes into standby
mode, the I2C interface is enabled, and the device can respond to I2C command.
There are two kinds of power-up sequences, shown in Figure 45 and Figure 46.
If HWEN is tied to IN pin in application, once IN goes above around VPOR (2.0V), HWEN should stay high for at
least twait=2ms time before any I2C command can be accepted.
If HWEN is driven by a GPIO, once HWEN goes from low to high, HWEN should stay high for at least
twait=2ms time before any I2C command can be accepted.
HWEN=IN
twait≥2ms
I2C command
Fig 45
Power-Up Sequence with HWEN Tied to IN
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IN
HWEN
twait≥2ms
I2C command
Fig 46
Power-Up Sequence with HWEN Driven by GPIO
FLASH MODE
In Flash Mode, the LED current sources (LED1/2) provide 128 target current levels from 11.35mA to 1.5A.
The total allowed LED current during operation is 1.5A (ILED1+ILED2≤1.5A). The Flash currents are
adjusted via the LED1 and LED2 Flash Brightness Registers. Flash mode is activated by the Enable
Register(setting M1, M0 to ‘11’), or by pulling the STROBE pin HIGH when the pin is enabled (Enable
Register). Once the Flash sequence is activated the current source (LED1/2) ramps up to the programmed
Flash current by stepping through all current steps until the programmed current is reached.
When the device is enabled in Flash Mode through the Enable Register, all mode bits in the Enable Register
are cleared after a flash timeout event.
TORCH MODE
In Torch mode, the LED current sources (LED1/2) provide 128 target current levels from 2.55mA to 372mA.
The Torch currents are adjusted via the LED1 and LED2 Torch Brightness Registers. Torch mode is activated
by the Enable Register (setting M1, M0 to ‘10’), or by pulling the TORCH/TEMP pin HIGH when the pin is
enabled (Enable Register) and set to Torch Mode. Once the TORCH sequence is activated the active current
sources (LED1/2) ramps up to the programmed Torch current by stepping through all current steps until the
programmed current is reached. The rate at which the current ramps is determined by the value chosen in the
Timing Register.
Torch Mode is not affected by Flash Timeout or by a TX Interrupt event.
IR MODE
In IR Mode, the target LED current is equal to the value stored in the LED1/2 Flash Brightness Registers.
When IR mode is enabled (setting M1, M0 to ‘01’), the boost converter turns on and set the output equal to the
input (pass-mode). At this point, toggling the STROBE pin enables and disables the LED1/2 current sources
(if enabled). The strobe pin can only be set to be Level sensitive, meaning all timing of the IR pulse is
externally controlled. In IR Mode, the current sources do not ramp the LED outputs to the target. The current
transitions immediately from off to on and then on to off.
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BOOST
PASS
VOUT
OFF
STROBE
ILED1
ILED2
M1,M0=‘01’
LED1,LED2=‘11’
STROBE EN=‘1’
M1,M0=‘01’
LED1,LED2=‘10’
STROBE EN=‘1’
M1,M0=‘00’
LED1,LED2=‘10’
STROBE EN=‘1’
Fig 47
IR Mode with Boost
VOUT
STROBE
ILED1
ILED2
M1,M0=‘01’
LED1,LED2=‘11’
STROBE EN=‘1’
M1,M0=‘01’
LED1,LED2=‘10’
STROBE EN=‘1’
M1,M0=‘00’
LED1,LED2=‘10’
STROBE EN=‘1’
Fig 48
IR Mode Pass Only
VOUT
STROBE
ILED1
Flash Timeout Value
ILED2
Timeout Reached
VOUT goes low，
LED1 &LED2 turn off
Timeout
Start
Timeout
Start
Timeout
Start
M1,M0=‘01’
LED1,LED2=‘11’
STROBE EN=‘1’
Timeout
Reset
Timeout
Reset
Fig 49
IR Mode Timeout
SOFT START-UP
Turn on of the AW36413 Torch and Flash modes can be done through the Enable Register. On start-up, when
VOUT is less than VIN the internal synchronous PMOS turns on as a current source and delivers 200mA (typical)
to the output capacitor. During this time the current source (LED) is off. When the voltage across the output
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capacitor reaches 2.2 V (typical) the current source turns on. At turn-on the current source steps through each
FLASH or TORCH level until the target LED current is reached. This gives the device a controlled turn-on and
limits inrush current from the VIN supply.
PASS MODE
The AW36413 starts up in Pass Mode and stays there until Boost Mode is needed to maintain regulation. In
Pass Mode the boost converter does not switch, and the synchronous PMOS turns fully on bringing VOUT up to
VIN – ILED × RPMOS
.
In Pass Mode the inductor current is not limited by the peak current limit. If the voltage
difference between VOUT and VLED falls below VHR, the device switches to Boost Mode.
POWER AMPLIFIER SYNCHRONIZATION (TX)
The TX pin is a Power Amplifier Synchronization input. This is designed to reduce the flash LED current and
thus limit the battery current during high battery current conditions such as PA transmit events. When the
AW36413 is engaged in a Flash event, and the TX pin is pulled high, the LED current is forced into Torch
Mode at the programmed Torch current setting. If the TX pin is then pulled low before the Flash pulse
terminates, the LED current returns to the previous Flash current level. At the end of the Flash time-out,
whether the TX pin is high or low, the LED current turns off.
The TX input can be disable by setting bit[7] (TX Enable) to a ‘0’ in the Enable Register(0x01).
INPUT VOLTAGE FLASH MONITOR (IVFM)
The AW36413 has the ability to adjust the flash current based upon the voltage level present at the IN pin
utilizing the Input Voltage Flash Monitor (IVFM). The adjustable threshold ranges from 2.9 V to 3.6 V in
100mV steps as well as adjustable hysteresis, with three different usage modes (Stop and Hold, Down, Up
and Down). The IVFM threshold and hysteresis are controlled by bits[5:3] and bit[2] respectively, in the IVFM
Register(0x02). The Flags2 Register has the IVFM flag bit set when the input voltage crosses the IVFM
threshold value. Additionally, the IVFM threshold sets the input voltage boundary that forces the AW36413 to
either stop ramping the flash current during startup in Stop and Hold Mode, or to actively adjust the LED
current lower in Down Mode, or to continuously adjust the LED current up and down in Up & Down Mode.
Stop and Hold Mode: Stops Current Ramp and holds the level for the remaining flash, If VIN falls below the
IVFM threshold value.
Down Mode: Adjust current down if VIN falls below the IVFM threshold value and stops decreasing once VIN
rises above the IVFM threshold (or plus a hysteresis). The AW36413 will decrease the current throughout
the flash pulse anytime VIN falls below the IVFM threshold, not just once. The flash current will not increase
again until the next flash.
Up & Down Mode: Adjust current down if VIN falls below the IVFM threshold value and adjusts current up if
VIN rise above the IVFM threshold (or plus a hysteresis). In Up & Down mode, the LED current will
continually adjust with the rising and falling of VIN throughout the entire flash pulse.
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Flash Event
VIN
IVFM-Threshold
Stop & Hold
Mode
Target Flash Current
Flash Current with
IVFM Disable
Flash Current
VIN
Hysteresis = 0 or 50mV
IVFM-Threshold
Down
Mode
Flash Current
VIN
Hysteresis = 0 or 50mV
IVFM-Threshold
Up & Down
Mode
Flash Current
Fig 50
IVFM Modes
FLASH TIMEOUT
The Flash Timeout period sets the maximum time of one flash event, whether a flash stop command is
received or not. The AW36413 has 16 timeout levels ranging from 40ms to 1.6s (see TIMING
CONFIGURATION REGISTER (0X08) for more detail). Flash Timeout applies to both Flash and IR modes,
and it continues to count when the Flash mode is forced into Torch mode during a TX high event. The mode
bits are cleared and bit[0] is set in the Flags1 register(0x0A) upon a Flash Timeout. This fault flag can be reset
to ‘0’ by reading back the Flags1 Register (0x0A), or by setting HWEN to ‘0’, or by setting the SW RESET bit
to a ‘1’, or by removing power to the AW36413.
CURRENT LIMIT
When the inductor current limit is reached, the AW36413 terminates the charging phase of the switching cycle
until the next switching period. If the over-current condition persists, the device operates continuously in
current limit. The AW36413 features two selectable inductor current limits(1.9A and 2.8A) that are
programmable by bit[0] in Boost configuration Register(0x07).
Since the current limit is sensed in the NMOS switch, there is no mechanism to limit the current when the
device operates in Pass Mode (current does not flow through the NMOS in pass mode). The mode bits are
not cleared upon a Current Limit event, but a flag bit[3] is set in the Flags1 register(0x0A).
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This fault flag can be reset to ‘0’ by reading back the Flags1 Register (0x0A), or by setting HWEN to ‘0’, or by
setting the SW RESET bit to a ‘1’, or by removing power to the AW36413.
NTC THERMISTOR INPUT (TORCH/TEMP)
The TORCH/TEMP pin, when set to TEMP mode, serves as a threshold detector and bias source for negative
temperature coefficient (NTC) thermistors. When the voltage at TEMP goes below the programmed threshold,
bit[0] is set to a ‘1’, and the AW36413 is placed into standby mode. The NTC threshold voltage is adjustable
from 200 mV to 900 mV in 100-mV steps. The NTC bias current is set to 50µA. The NTC detection circuitry
can be enabled or disabled via the Enable Register. If enabled, the NTC block turns on and off during the start
and stop of a Flash/Torch event.
Additionally, the NTC input looks for an open NTC connection and a shorted NTC connection. If the NTC input
falls below 100 mV, the NTC short flag is set(bit[4] in the Flags2 Register), and the AW36413 is forced into
standby mode. If the NTC input rises above 2.3 V, the NTC Open flag is set(bit[3] in the Flags2 Register), and
the AW36413 is forced into standby mode. These fault detections can be individually disabled/enabled via the
NTC Open Fault Enable bit and the NTC Short Fault Enable bit in Temp register(0x09)
VIN
VOPEN
INTC
TORCH/
TEMP
Control
Logic
VTRIP
RNTC
VSHORT
Fig 51
Temp Detection Diagram
The AW36413 is not available for operation until Flags2 register is cleared. The three NTC fault flags can be
reset to ‘0’ by reading back the Flags2 Register (0x0B), or by setting HWEN to ‘0’, or by setting the SW
RESET bit to a ‘1’, or by removing power to the AW36413.
UNDERVOLTAGE LOCKOUT (UVLO)
The AW36413 has an internal comparator that monitors the voltage at IN and forces the AW36413 into
standby if the input voltage drops to 2.5 V. If the UVLO monitor threshold is tripped, the UVLO flag bit is set in
the Flags1 Register (0x0A). If the input voltage rises above 2.5 V, the AW36413 is not available for operation
until there is an I2C read of the Flags1 Register (0x0A). Upon a read, the Flags1 register is cleared, and
normal operation can resume if the input voltage is greater than 2.5 V.
VOUT SHORT FAULT
The Output Short Fault flag reads back a ‘1’ if the device is active in Flash or Torch mode and the boost output
experiences a short condition. VOUT short condition occurs if the voltage at OUT goes below 2.3V (typ.) while
the device is in Torch or Flash mode. There is a deglitch time of 2.048ms before the VOUT Short flag is valid.
The mode bits are cleared upon an the VOUT short fault. The AW36413 is not available for operation until
VOUT Fault flags is cleared. The VOUT Short Faults can be reset to ‘0’ by reading back the Flags1 Register
(0x0A), or by setting HWEN to ‘0’, or by setting the SW RESET bit to a ‘1’, or by removing power to the
AW36413.
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LED SHORT FAULT
The LED Short Fault flags read back a ‘1’ if the device is active in Flash or Torch mode and either active LED
output experiences a short condition. An LED short condition is determined if the voltage at LED1 or LED2
goes below 500mV (typ.) while the device is in Torch or Flash mode. There is a deglitch time of 256μs before
the LED Short Fault flag is valid. The mode bits are cleared upon an LED short fault. The AW36413 is not
available for operation until the LED Short Fault flags is cleared. The LED Short Faults can be reset to ‘0’ by
reading back the Flags1 Register (0x0A), or by setting HWEN to ‘0’, or by setting the SW RESET bit to a ‘1’, or
by removing power to the AW36413.
OVERVOLTAGE PROTECTION (OVP)
The output voltage is limited to typically 5 V. In situations such as an open LED, the AW36413 raises the
output voltage in order to try and keep the LED current at its target value. When VOUT reaches 5 V (typ.) the
overvoltage comparator trips and turns off the internal NMOS. When VOUT falls below the “VOVP Off
Threshold”, the AW36413 begins switching again. The mode bits are cleared, and the OVP Fault flag is set,
when an OVP condition is present for three rising OVP edges. This prevents momentary OVP events from
forcing the device to shut down. The AW36413 is not available for operation until the OVP Fault flag is cleared.
The OVP Fault can be reset to ‘0’ by reading back the Flags2 Register (0x0A), or by setting HWEN to ‘0’, or by
setting the SW RESET bit to a ‘1’, or by removing power to the AW36413.
THERMAL SHUTDOWN (TSD)
When the AW36413 die temperature reaches 155°C, the thermal shutdown detection circuit trips, forcing the
AW36413 into standby and writing a ‘1’ to the Thermal Shutdown Fault flag of the Flags1 Register (0x0A) .
The AW36413 is only allowed to restart after the Thermal Shutdown Fault flag is cleared. The Thermal
Shutdown Faults can be reset to ‘0’ by reading back the Flags1 Register (0x0A), or by setting HWEN to ‘0’, or
by setting the SW RESET bit to a ‘1’, or by removing power to the AW36413. Upon restart, if the die
temperature is still above 155°C, the AW36413 resets the Fault flag and re-enters standby.
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PROGRAMMING
CONTROL TRUTH TABLE
MODE1
MODE0
STROBE EN
TORCH EN
STROBE PIN
TORCH PIN
ACTION
Standby
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
1
1
X
X
0
1
1
0
1
0
1
1
1
X
X
X
X
X
X
X
X
Pos edge
Ext Torch
Pos edge
X
Ext Flash
0
Pos edge
Standalone Torch
Standalone Flash
Standalone Flash
Int Torch
Pos edge
0
Pos edge
Pos edge
X
X
X
X
X
X
X
Int Flash
X
0
IRLED Standby
IRLED Standby
IRLED enabled
Pos edge
I2C INTERFACE
Data Validation
When SCL is high level, SDA level must be constant. SDA can be changed only when SCL is low level.
SDA
SCL
Data Line
Stable
Data Valid
Change
of Data
Allowed
Fig 52
Data Validation Diagram
I2C Start/Stop
I2C start: SDA changes form high level to low level when SCL is high level.
I2C stop: SDA changes form low level to high level when SCL is high level.
SDA
SCL
S/Sr
P
P: STOP condition
S: START condition
Sr: START Repeated condition
Fig 53
Start and Stop Conditions
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ACK (Acknowledgement)
ACK means the successful transfer of I2C bus data. After master sends 8bits data, SDA must be released;
SDA is pulled to GND by slave device when slave acknowledges.
When master reads, slave device sends 8bit data, releases the SDA and waits for ACK from master. If ACK is
send and I2C stop is not send by master, slave device sends the next data. If ACK is not send by master, slave
device stops to send data and waits for I2C stop.
Data Output
by Transmiter
Not Acknowledge（NACK）
Data Output
by Receiver
Acknowledge（ACK）
SCL From
Master
1
2
8
9
Clock Pulse for
START
Acknowledgement
condition
Fig 54
Acknowledgement Diagram
Write Cycle
One data bit is transferred during each clock pulse. Data is sampled during the high state of the serial clock
(SCL). Consequently, throughout the clock’s high period, the data should remain stable. Any changes on the
SDA line during the high state of the SCL and in the middle of a transaction, aborts the current transaction.
New data should be sent during the low SCL state. This protocol allows a single data line to transfer both
command/control information and data using the synchronous serial clock.
Each data transaction is composed of a Start Condition, a number of byte transfers (set by the software) and
a Stop Condition to terminate the transaction. Every byte written to the SDA bus must be 8 bits long and is
transferred with the most significant bit first. After each byte, an Acknowledge signal must follow.
In a write process, the following steps should be followed:
Table 1 Master device generates START condition. The “START” signal is generated by lowering the
SDA signal while the SCL signal is high.
b) Master device sends slave address (7-bit) and the data direction bit (r/w = 0).
c) Slave device sends acknowledge signal if the slave address is correct.
d) Master sends control register address (8-bit)
e) Slave sends acknowledge signal
f) Master sends data byte to be written to the addressed register
g) Slave sends acknowledge signal
h) If master will send further data bytes the control register address will be incremented by one after
acknowledge signal (repeat step 6, 7)
i)
Master generates STOP condition to indicate write cycle end
SCL
SDA
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
R/WAck
A6 A5 A4 A3 A2 A1 A0
Device Address
A7 A6 A5 A4 A3 A2 A1 A0
Register Address
D7 D6 D5 D4 D3 D2 D1 D0
Write Data
Ack
Stop
Start
Fig 55 I2C Write Timing
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AW36413
July 2018 V1.4
Read Cycle
In a read cycle, the following steps should be followed:
a) Master device generates START condition
b) Master device sends slave address (7-bit) and the data direction bit (r/w = 0).
c) Slave device sends acknowledge signal if the slave address is correct.
d) Master sends control register address (8-bit)
e) Slave sends acknowledge signal
f) Master generates STOP condition followed with START condition or REPEAT START condition
g) Master device sends slave address (7-bit) and the data direction bit (r/w = 1).
h) Slave device sends acknowledge signal if the slave address is correct.
i)
j)
Slave sends data byte from addressed register.
If the master device sends acknowledge signal, the slave device will increase the control register
address by one, then send the next data from the new addressed register.
k) If the master device generates STOP condition, the read cycle is ended.
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
SCL
SDA
R/W
Ack
A6 A5 A4 A3 A2 A1 A0
A7 A6 A5 A4 A3 A2 A1 A0
Ack
start
Device Address
Register Address
0
1
2
3
4
5
6
7
8
0
1
...
6
7
8
……
Using
Repeat start……
Ack
A6 A5 A4 A3 A2 A1 A0
D7 D6 …… D1 D0
Ack
R/W
RS
stop
Write Data
Device Address
Separated……
Read/write
transaction ……
1
...
6
7
8
0
1
2
3
4
5
6
7
8
0
Ack
A6 A5 A4 A3 A2 A1 A0
D1 D0
D7 D6
R/W
……
Ack
P
S
Device Address
Write Data
stop
Fig 56 I2C Read Timing
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AW36413
July 2018 V1.4
REGISTER CONFIGURATION
REGISTER LIST
Register name
Chip ID Register
Address(HEX)
0x00
Read/Write
Read
Default Value
0x36
0x80
0x01
0Xbf
0x3F
0Xbf
0x3F
0x09
0x1A
0x08
0x00
0x00
0x12
0x00
0x7F
Enable Register
0x01
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read
IVFM Register
0x02
LED1 Flash Brightness Register
0x03
0x04
LED2 Flash Brightness Register
LED1 Torch Brightness Register
0x05
LED2 Torch Brightness Register
Boost Configuration Register
Timing Configuration Register
Temp Register
0x06
0x07
0x08
0x09
Flags1 Register
0x0A
Flags2 Register
0x0B
Read
Device ID Register
0x0C
0x0D
0x39
Read
Last Flash Register
Read
Indicator Current Register
Read/Write
REGISTER DETAILED DESCRIPTION
Chip ID Register (0x00)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Chip ID: “00110110”
Enable Register (0x01)
Bit 7
Bit 6
Bit 5
Strobe
Enable
0=Disabled
(Default)
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TX Pin
Enable
0=Disabled
1=Enabled
(Default)
Strobe Type
0=Level
Triggered
(Default)
1=Edge
Torch/Temp
Pin Enable
0=Disabled
(Default)
Mode Bits: M1, M0
00=Standby (Default)
01=IR Drive
10=Torch
11=Flash
LED2 Enable
0=OFF
(Default)
1=ON
LED1 Enable
0=OFF
(Default)
1=ON
1=Enabled
1=Enabled
Triggered
Note:
In Edge or Level Strobe Mode, it is recommended that the trigger pulse width be set greater than 1ms to
ensure proper turn-on of the device.
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IVFM Register (0x02)
Bit 7
Bit 6
UVLO
Circuitry
0=Disabled
(Default)
Bit 5
Bit 4
Bit 3
Bit 2
IVFM
Hysteresis
0=0 mV
Bit 1
Bit 0
RFU
IVFM Levels
000=2.9 V (Default)
001=3.0 V
010=3.1 V
011=3.2 V
IVFM Mode Selection
00=Disabled
01=Stop and Hold Mode
(Default)
(Default)
1=50 mV
1=Enabled
10=Down Mode
100=3.3 V
11=Up and Down Mode
101=3.4 V
110=3.5 V
111=3.6 V
LED1 Flash Brightness Register (0x03)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 1
Bit 1
Bit 1
Bit 0
Bit 0
Bit 0
Bit 0
LED2 Flash Current Override
0=LED2 Flash Current is not set to LED1 Flash
Current
1=LED2 Flash Current is set to LED1 Flash Current
(Default)
LED1 Flash Brightness Levels
IFLASH(mA)≈(Brightness Code*11.72 mA)+11.35 mA
0000000=11.35 mA
……………
0111111=746.9 mA (Default)
……………
1111111=1.5 A
LED2 Flash Brightness Register (0x04)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
RFU
LED2 Flash Brightness Levels
IFLASH(mA)≈(Brightness Code*11.72 mA)+11.35 mA
0000000=11.35 mA
……………
0111111=746.9 mA (Default)
……………
1111111=1.5 A
LED1 Torch Brightness Register (0x05)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
LED2 Torch Current Override
0=LED2 Torch Current is not set to LED1 Torch
Current
1=LED2 Torch Current is set to LED1 Torch Current
(Default)
LED1 Torch Brightness Levels
ITORCH(mA)≈(Brightness Code*2.91 mA)+2.55 mA
0000000=2.55 mA
……………
0111111=186 mA (Default)
……………
1111111=372 mA
LED2 Torch Brightness Register (0x06)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
RFU
LED2 Torch Brightness Levels
ITORCH(mA)≈(Brightness Code*2.91 mA)+2.55 mA
0000000=2.55 mA
……………
0111111=186 mA (Default)
……………
1111111=372 mA
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AW36413
July 2018 V1.4
Boost Configuration Register (0x07)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Boost
Frequency
Select
0=2 MHz
(Default)
1=4 MHz
Bit 0
Software
Reset Bit
0=Not Reset
(Default)
RFU
RFU
RFU
LED Pin
Short Fault
Detect
0=Disabled
1=Enabled
(Default)
Boost Mode
0=Normal
(Default)
1=Pass Mode
Only
Boost
Current Limit
0=1.9A
1=2.8A
(Default)
1=Reset
Timing Configuration Register (0x08)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RFU
Torch Current Ramp time
000=No Ramp
001=1 ms (Default)
010=32 ms
Flash Time-out Duration
0000=40 ms
0001=80 ms
0010=120 ms
011=64 ms
0011=160 ms
100=128 ms
0100=200 ms
101=256 ms
0101=240 ms
110=512 ms
0110=280 ms
111=1024 ms
0111=320 ms
1000=360 ms
1001=400 ms
1010=600 ms (Default)
1011=800 ms
1100=1000 ms
1101=1200 ms
1110=1400 ms
1111=1600 ms
Temp Register (0x09)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RFU
TORCH
Polarity
0=Active High 0=Disabled
(Default)
(Pull-down
Resister
Enabled)
1=Active Low
(Pull-down
Resister
NTC Open
Fault Enable
NTC Short
Fault Enable
0=Disabled
(Default)
TEMP Detect Voltage Thresholds
000=200 mV
001=300 mV
010=400 mV
011=500 mV
100=600 mV (Default)
101=700 mV
110=800 mV
TORCH/TEM
P
Function
Select
(Default)
1=Enabled
0=TORCH
(Default)
1=TEMP
1=Enabled
111=900 mV
Disabled)
Flags1 Register (0x0A)
Bit 7
TX Flag
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
VOUT Short
Fault
LED1 Short
Fault
LED2 Short
Fault
Current Limit Thermal
UVLO Fault
Flash
Time-Out
Flag
Flag
Shutdown
(TSD) Fault
Flags2 Register (0x0B)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RFU
RFU
RFU
NTC Short
Fault
NTC Open
Fault
IVFM Trip
Flag
OVP Fault
TEMP Trip
Fault
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AW36413
July 2018 V1.4
Device ID Register (0x0C)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RFU
RFU
Device ID
“010”
Silicon Revision Bits
“010”
Last Flash Register (0x0D)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RFU
The value stored is always the last current value the IVFM detection block set ILED=IFLASH-TARGET*((code+1)/128)
Indicator Current Register (0x39)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RFU
The indicator current IINDICATOR=ITORCH-TARGET*((indicator current code+1)/128)
Note:
In Torch, Flash, or IR mode, the Register(0x69) value Must be 0x00(default), and the Indicator Current
Register(0x39) value Must be 0x7f(default).
To set the indicator current level, the action must be done as follows:
1) Set the Register(0x69) value to 0x02, enable the indicator current setting.
2) Set the Indicator Current Register(0x39) value to the desired value.
3) Set the Register(0x69) value to 0x00(default), disable the indicator current setting.
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
APPLICATION INFORMATION
The AW36413 can drive two flash LEDs at currents up to 1.5 A per LED. The total allowed LED current
during operation is 1.5A (ILED1+ILED2≤1.5A). The 2MHz/4MHz DC-DC boost regulator allows for the use of
small value discrete external components. Below are some peripheral selection guidelines.
OUTPUT CAPACITOR SELECTION
The AW36413 is designed to operate with a 10µF ceramic output capacitor. When the boost converter is
running, the output capacitor supplies the load current during the boost converter on-time. When the NMOS
switch turns off, the inductor energy is discharged through the internal PMOS switch, supplying power to the
load and restoring charge to the output capacitor. This causes a sag in the output voltage during the on-time
and a rise in the output voltage during the off-time. The output capacitor is therefore chosen to limit the output
ripple to an acceptable level depending on load current and input/output voltage differentials and also to
ensure the converter remains stable.
Larger capacitors such as a 22µF or capacitors in parallel can be used if lower output voltage ripple is desired.
To estimate the output voltage ripple considering the ripple due to capacitor discharge (ΔVQ) and the ripple
due to the capacitors ESR (ΔVESR) use the following equations:
For continuous conduction mode, the output voltage ripple due to the capacitor discharge is:
(VOUT VIN ) ILED
VQ
VOUT f COUT
The output voltage ripple due to the output capacitors ESR is found by:
L
VOUT ILED I
VIN (VOUT VIN )
VOUT f L
VESR RESR
IL
VIN
2
Where
In ceramic capacitors the ESR is very low so the assumption is that 80% of the output voltage ripple is due to
capacitor discharge and 20% from ESR. Table 1 lists different manufacturers for various output capacitors
and their case sizes suitable for use with the AW36413.
INPUT CAPACITOR SELECTION
Choosing the correct size and type of input capacitor helps minimize the voltage ripple caused by the
switching of the AW36413 boost converter and reduce noise on the boost converter’s input pin that can feed
through and disrupt internal analog signals. In the typical application circuit a 10-µF ceramic input capacitor
works well. It is important to place the input capacitor as close as possible to the AW36413 input (IN) pin. This
reduces the series resistance and inductance that can inject noise into the device due to the input switching
currents. Table 1 lists various input capacitors recommended for use with the AW36413.
Table 2 Recommended Input/ Output Capacitors (X5R/X7R Dielectric)
MANUFACTURER
PART NUMBER
VALUE
CASE
VOLTAGE RATING
TDK
C1608JB0J106M
10μF
0603
6.3V
TDK
C2012JB1A106M
GRM188R60J106M
GRM21BR61A106KE19
10μF
10μF
10μF
0805
0603
0805
10V
6.3V
10V
Murata
Murata
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AW36413
July 2018 V1.4
INDUCTOR SELECTION
The AW36413 is designed to use a 0.47µH or 1µH inductor. When the device is boosting (VOUT > VIN) the
inductor is typically the largest area of efficiency loss in the circuit. Therefore, choosing an inductor with the
lowest possible series resistance is important. Additionally, the saturation rating of the inductor should be
greater than the maximum operating peak current of the AW36413. This prevents excess efficiency loss that
can occur with inductors that operate in saturation. For proper inductor operation and circuit performance,
ensure that the inductor saturation and the peak current limit setting of the AW36413 are greater than IPEAK in
the following calculation:
VIN
2 fSW LVOUT
VOUT VIN
ILED VOUT
VIN
IL
IPEAK
IL
where
And
=2 or 4MHz.
fSW
Table 3 lists various inductors and their manufacturers that work well with the AW36413.
Table 4 Recommended Inductors
MANUFACTURER
L
PART NO.
SIZE
ISAT
RDC
58mΩ
TOKO
1μH
DFE201610P-1R0M
2.0 mm x 1.6 mm x 1.0 mm
3.7A
TOKO
0.47μH
1μH
DFE201610P-R470M
WPN252012H1R0MT
2.0 mm x 1.6 mm x 1.0 mm
2.5mm × 2.0mm ×1.2mm
4.1A
3.4A
32mΩ
48mΩ
Sunlord
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
PCB LAYOUT
LAYOUT GUIDELINES
The high switching frequency and large switching currents of the AW36413 make the choice of layout
important. The following steps should be used as a reference to ensure the device is stable and maintains
proper LED current regulation across its intended operating voltage and current range.
1. Place CIN on the top layer (same layer as the AW36413) and as close to the device as possible. The input
capacitor conducts the driver currents during the low-side MOSFET turn-on and turn-off and can detect
current spikes over 1 A in amplitude. Connecting the input capacitor through short, wide traces to both the
IN and GND pins reduces the inductive voltage spikes that occur during switching which can corrupt the
VIN line.
2. Place COUT on the top layer (same layer as the AW36413) and as close as possible to the OUT and GND
pin. The returns for both CIN and COUT should come together at one point, as close to the GND pin as
possible. Connecting COUT through short, wide traces reduce the series inductance on the OUT and GND
pins that can corrupt the VOUT and GND lines and cause excessive noise in the device and surrounding
circuitry.
3. Connect the inductor on the top layer close to the SW pin. There should be a low-impedance connection
from the inductor to SW due to the large DC inductor current, and at the same time the area occupied by
the SW node should be small so as to reduce the capacitive coupling of the high Dv/Dt present at SW that
can couple into nearby traces.
4. Avoid routing logic traces near the SW node so as to avoid any capacitive coupling from SW onto any
high-impedance logic lines such as TORCH/TEMP, STROBE, HWEN, SDA, and SCL. A good approach
is to insert an inner layer GND plane underneath the SW node and between any nearby routed traces.
This creates a shield from the electric field generated at SW.
5. Terminate the Flash LED cathodes directly to the GND pin of the AW36413. If possible, route the LED
returns with a dedicated path so as to keep the high amplitude LED currents out of the GND plane. For
Flash LEDs that are routed relatively far away from the AW36413, a good approach is to sandwich the
forward and return current paths over the top of each other on two layers. This helps reduce the
inductance of the LED current paths.
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
PACKAGE DESCRIPTION
Bottom View
Top View
C
B
D
D
A
1
2
3
12×∅0.268±0.020
e1
Side View
Symbol
A
NOM Tolerance
0.575
0.195
0.340
0.040
1.626
1.332
0.196
0.400
0
±0.055
±0.020
±0.025
±0.010
A1
A2
A3
D
±0.025
±0.025
NA
E
e1
e2
NA
e3
NA
Note: All dimensions are in millimeter(mm).
LAND PATTERN DATA
0.217
0.209
0.8
0.4
12×∅0.240
0.4
1.2
Note: All dimensions are in millimeter(mm).
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AW36413
July 2018 V1.4
TAPE AND REEL INFORMATION
TAPE DIMENSIONS
REEL DIMENSIONS
P1
P0
P2
K0
W
B0
D1
A0
Cavity
A0：Dimension designed to accommodate the component width
B0：Dimension designed to accommodate the component length
K0：Dimension designed to accommodate the component thickness
W：Overall width of the carrier tape
P0：Pitch between successive cavity centers and sprocket hole
P1：Pitch between successive cavity centers
P2：Pitch between sprocket hole
D0：Reel width
D0
D1：Reel diameter
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q3 Q4
Q3 Q4
Q3 Q4
Q3 Q4
User Direction of Feed
Pocket Quadrants
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Copyright © 2017 SHANGHAI AWINIC TECHNOLOGY CO., LTD
AW36413
July 2018 V1.4
REVISION HISTORY
Vision
V1.0
Date
Change Record
Product Datasheet V1.0 Released
Jan 2017
Jan 2017
May 2017
Jan 2018
V1.1
Modify the Top Mark Description
--page2
Added HWEN & I2C Interface Description
--page17
V1.2
V1.3
Add Moisture Sensitivity Level and Environmental Information –page3
1. Updated Absolute Maximum Ratings
2. Updated Tape and Reel Information
--page5
--page35
V1.4
July 2018
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AW36413
July 2018 V1.4
DISCLAIMER
Information in this document is believed to be accurate and reliable. However, Shanghai AWINIC Technology
Co., Ltd (AWINIC Technology) does not give any representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and shall have no liability for the consequences of use of
such information.
AWINIC Technology reserves the right to make changes to information published in this document, including
without limitation specifications and product descriptions, at any time and without notice. Customers shall
obtain the latest relevant information before placing orders and shall verify that such information is current and
complete. This document supersedes and replaces all information supplied prior to the publication hereof.
AWINIC Technology products are not designed, authorized or warranted to be suitable for use in medical,
military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an
AWINIC Technology product can reasonably be expected to result in personal injury, death or severe property
or environmental damage. AWINIC Technology accepts no liability for inclusion and/or use of AWINIC
Technology products in such equipment or applications and therefore such inclusion and/or use is at the
customer’s own risk.
Applications that are described herein for any of these products are for illustrative purposes only. AWINIC
Technology makes no representation or warranty that such applications will be suitable for the specified use
without further testing or modification.
All products are sold subject to the general terms and conditions of commercial sale supplied at the time of
order acknowledgement.
Nothing in this document may be interpreted or construed as an offer to sell products that is open for
acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other
industrial or intellectual property rights.
Reproduction of AWINIC information in AWINIC data books or data sheets is permissible only if reproduction
is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
AWINIC is not responsible or liable for such altered documentation. Information of third parties may be subject
to additional restrictions.
Resale of AWINIC components or services with statements different from or beyond the parameters stated by
AWINIC for that component or service voids all express and any implied warranties for the associated
AWINIC component or service and is an unfair and deceptive business practice. AWINIC is not responsible or
liable for any such statements.
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