ADS1286U/2K5 [BB]

12-Bit Micro Power Sampling ANALOG-TO-DIGITAL CONVERTER; 12位微功耗采样模拟数字转换器
ADS1286U/2K5
型号: ADS1286U/2K5
厂家: BURR-BROWN CORPORATION    BURR-BROWN CORPORATION
描述:

12-Bit Micro Power Sampling ANALOG-TO-DIGITAL CONVERTER
12位微功耗采样模拟数字转换器

转换器 模数转换器 光电二极管
文件: 总14页 (文件大小:141K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
ADS1286  
ADS1286  
ADS1286  
12-Bit Micro Power Sampling  
ANALOG-TO-DIGITAL CONVERTER  
FEATURES  
DESCRIPTION  
SERIAL INTERFACE  
The ADS1286 is a 12-bit, 20kHz analog-to-digital  
converter with a differential input and sample and hold  
amplifier and consumes only 250µA of supply cur-  
rent. The ADS1286 offers an SPI and SSI compatible  
serial interface for communications over a two or three  
wire interface. The combination of a serial two wire  
interface and micropower consumption makes the  
ADS1286 ideal for remote applications and for those  
requiring isolation.  
GUARANTEED NO MISSING CODES  
20kHz SAMPLING RATE  
LOW SUPPLY CURRENT: 250µA  
APPLICATIONS  
REMOTE DATA ACQUISITION  
ISOLATED DATA ACQUISITION  
TRANSDUCER INTERFACE  
The ADS1286 is available in a 8-pin plastic mini DIP  
and a 8-lead SOIC.  
BATTERY OPERATED SYSTEMS  
Control  
SAR  
VREF  
DOUT  
+In  
CDAC  
Serial  
Interface  
DCLOCK  
CS/SHDN  
–In  
Comparator  
S/H Amp  
International Airport Industrial Park  
Mailing Address: PO Box 11400, Tucson, AZ 85734  
Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111  
Twx: 910-952-1111 Internet: http://www.burr-brown.com/  
Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132  
©1996 Burr-Brown Corporation  
PDS-1335B  
Printed in U.S.A. October, 1998  
SBAS053  
SPECIFICATIONS  
At TA = TMIN to TMAX, +VCC = +5V, VREF = +5V, fSAMPLE = 12.5kHz, , fCLK = 16 • fSAMPLE, unless otherwise specified.  
ADS1286, ADS1286A  
ADS1286K, ADS1286B  
ADS1286C, ADS1286L  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
UNITS  
ANALOG INPUT  
Full-Scale Input Range  
Absolute Input Voltage  
+In – (–In)  
+In  
0
–0.2  
–0.2  
VREF  
VCC +0.2  
+0.2  
V
V
V
–In  
Capacitance  
Leakage Current  
25  
±1  
pF  
µA  
SYSTEM PERFORMANCE  
Resolution  
No Missing Codes  
Integral Linearity  
Differential Linearity  
Offset Error  
Gain Error  
Noise  
Power Supply Rejection  
12  
Bits  
Bits  
12  
±1  
±0.5  
0.75  
±2  
50  
82  
±2  
±1.0  
±3  
±0.75  
±0.5  
±0.25  
±1  
±0.75  
LSB  
LSB  
LSB  
LSB  
µVrms  
dB  
±8  
SAMPLING DYNAMICS  
Conversion Time  
Acquisition Time  
12  
Clk Cycles  
Clk Cycles  
kHz  
1.5  
Small Signal Bandwidth  
500  
DYNAMIC CHARACTERISTICS  
Total Harmonic Distortion  
V
V
V
V
IN = 5.0Vp-p at 1kHz  
IN = 5.0Vp-p at 5kHz  
IN = 5.0Vp-p at 1kHz  
IN = 5.0Vp-p at 1kHz  
–85  
–83  
72  
dB  
dB  
dB  
dB  
SINAD  
Spurious Free Dynamic Range  
90  
REFERENCE INPUT  
REF Input Range  
Input Resistance  
1.25  
2.5  
5000  
5000  
0.01  
2.4  
VCC+0.05V  
V
CS = VCC  
CS = GND, fCLK = 0Hz  
CS = VCC  
tCYC 640µs, fCLK 25kHz  
tCYC = 80µs, fCLK = 200kHz  
MΩ  
MΩ  
µA  
µA  
µA  
Current Drain  
2.5  
20  
20  
2.4  
DIGITAL INPUT/OUTPUT  
Logic Family  
Logic Levels:  
VIH  
VIL  
VOH  
CMOS  
IIH = +5µA  
IIL = +5µA  
IOH = 250µA  
IOL = 250µA  
3
0.0  
3
+VCC  
0.8  
+VCC  
0.4  
V
V
V
V
VOL  
0.0  
Data Format  
Straight Binary  
POWER SUPPLY REQUIREMENTS  
Power Supply Voltage  
VCC  
+4.50  
5
200  
250  
5.25  
400  
500  
3
V
Quiescent Current, VANA  
tCYC 640µS, fCLK 25kHz  
µA  
µA  
µA  
tCYC = 90µS, fCLK = 200kHz  
Power Down  
CS = VCC  
TEMPERATURE RANGE  
Specified Performance  
ADS1286, K, L  
ADS1286A, B, C  
0
–40  
+70  
+85  
°C  
°C  
Specifications same as grade to the left.  
TIMING CHARACTERISTICS  
fCLK = 200kHz, TA = TMIN to TMAX  
.
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
tSMPL  
tSMPL (MAX)  
tCONV  
tdDO  
tdis  
Analog Input Sample Time  
Maximum Sampling Frequency  
Conversion Time  
See Operating Sequence  
ADS1286  
1.5  
2.0  
20  
Clk Cycles  
kHz  
See Operating Sequence  
See Test Circuits  
12  
85  
25  
50  
30  
70  
60  
Clk Cycles  
Delay TIme, DCLOCKto DOUT Data Valid  
Delay TIme, CSto DOUT Hi-Z  
Delay TIme, DCLOCKto DOUT Enable  
Output Data Remains Valid After DCLOCK↓  
DOUT Fall Time  
150  
50  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
See Test Circuits  
ten  
See Test Circuits  
100  
thDO  
tf  
CLOAD = 100pF  
15  
30  
See Test Circuits  
100  
100  
0
tr  
DOUT Rise Time  
See Test Circuits  
tCSD  
tSUCS  
Delay Time, CSto DCLOCK↓  
Delay Time, CSto DCLOCK↑  
See Operating Sequence  
See Operating Sequence  
®
ADS1286  
2
ABSOLUTE MAXIMUM RATINGS(1)  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
Electrostatic discharge can cause damage ranging from per-  
formance degradation to complete device failure. Burr-  
Brown Corporation recommends that all integrated circuits  
be handled and stored using appropriate ESD protection  
methods.  
+VCC ..................................................................................................... +6V  
Analog Input ....................................................... –0.3V to (+VCC + 300mV)  
Logic Input ......................................................... –0.3V to (+VCC + 300mV)  
Case Temperature ......................................................................... +100°C  
Junction Temperature .................................................................... +150°C  
Storage Temperature ..................................................................... +125°C  
External Reference Voltage .............................................................. +5.5V  
NOTE: (1) Stresses above these ratings may permanently damage the device.  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet  
published specifications.  
PIN CONFIGURATION  
VREF  
+In  
1
2
3
4
8
7
6
5
+VCC  
DCLOCK  
DOUT  
ADS1286  
–In  
GND  
CS/SHDN  
8-Pin Mini PDIP  
8-Lead SOIC  
PIN ASSIGNMENTS  
PIN  
NAME  
DESCRIPTION  
1
2
3
4
5
6
VREF  
+In  
Reference Input.  
Non Inverting Input.  
–In  
Inverting Input. Connect to ground or remote ground sense point.  
Ground.  
GND  
CS/SHDN  
DOUT  
Chip Select when low, Shutdown Mode when high.  
The serial output data word is comprised of 12 bits of data. In operation the data is valid on the falling edge of DCLOCK. The  
second clock pulse after the falling edge of CS enables the serial output. After one null bit the data is valid for the next 12 edges.  
Data Clock synchronizes the serial data transfer and determines conversion speed.  
7
8
DCLOCK  
+VCC  
Power Supply.  
PACKAGE/ORDERING INFORMATION  
PACKAGE  
DRAWING  
NUMBER(1)  
INTEGRAL  
LINEARITY  
TEMPERATURE  
RANGE  
PRODUCT  
PACKAGE  
ADS1286P  
±2  
±2  
±1  
±2  
±2  
±1  
±2  
±2  
±1  
±2  
±2  
±1  
0°C to +70°C  
0°C to +70°C  
Plastic DIP  
Plastic DIP  
Plastic DIP  
SOIC  
006  
006  
006  
182  
182  
182  
006  
006  
006  
182  
182  
182  
ADS1286PK  
ADS1286PL  
ADS1286U  
0°C to +70°C  
0°C to +70°C  
ADS1286UK  
ADS1286UL  
ADS1286PA  
ADS1286PB  
ADS1286PC  
ADS1286UA  
ADS1286UB  
ADS1286UC  
0°C to +70°C  
SOIC  
0°C to +70°C  
SOIC  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
Plastic DIP  
Plastic DIP  
Plastic DIP  
SOIC  
SOIC  
SOIC  
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix  
C of Burr-Brown IC Data Book.  
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN  
assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject  
to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not  
authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.  
®
3
ADS1286  
TYPICAL PERFORMANCE CURVES  
At TA = +25, VCC = +5V, VREF = +5V, fSAMPLE = 12.5kHz, fCLK = 16 • fSAMPLE, unless otherwise specified.  
REFERENCE CURRENT vs SAMPLE RATE  
REFERENCE CURRENT vs TEMPERATURE  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
0
2
4
6
8
10  
12  
–55  
–55  
1
–40  
–25  
0
25  
70  
85  
85  
5
Sample Rate (kHz)  
Temperature (°C)  
CHANGE IN OFFSET vs TEMPERATURE  
CHANGE IN OFFSET vs REFERENCE VOLTAGE  
5
4.5  
4
0.6  
0.4  
3.5  
3
0.2  
0
2.5  
2
–0.2  
–0.4  
–0.6  
1.5  
1
0.5  
0
–40  
–25  
0
25  
70  
1
2
3
4
5
Reference Voltage (V)  
Temperature (°C)  
CHANGE IN INTEGRAL LINEARITY AND DIFFERENTIAL  
LINEARITY vs REFERENCE VOLTAGE  
CHANGE IN GAIN vs REFERENCE VOLTAGE  
0.10  
0.05  
4
3.5  
3
Change in Differential  
Linearity (LSB)  
0.00  
2.5  
2
–0.05  
–0.10  
–0.15  
–0.20  
1.5  
1
Change in Integral  
Linearity (LSB)  
0.5  
0
1
2
3
4
5
2
3
4
Reference Voltage (V)  
Reference Voltage (V)  
®
ADS1286  
4
TYPICAL PERFORMANCE CURVES (CONT)  
At TA = +25, VCC = +5V, VREF = +5V, fSAMPLE = 12.5kHz, fCLK = 16 • fSAMPLE, unless otherwise specified.  
EFFECTIVE NUMBER OF BITS  
vs REFERENCE VOLTAGE  
DIFFERENTIAL LINEARITY ERROR vs CODE  
12  
11.75  
11.5  
11.25  
11  
3.0  
2.0  
1.0  
0
10.75  
10.5  
10.25  
10  
–1.0  
–2.0  
–3.0  
0.1  
1
10  
10  
0
0
2048  
Code  
4095  
Reference Voltage (V)  
SPURIOUS FREE DYNAMIC RANGE  
AND SIGNAL-TO-NOISE RATIO vs FREQUENCY  
SIGNAL-TO-(NOISE + DISTORTION)  
vs FREQUENCY  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Spurious Free Dynamic Range  
Signal-to-Noise Ratio  
0.1  
1
10  
0.1  
1
Frequency (kHz)  
Frequency (kHz)  
SIGNAL-TO-(NOISE + DISTORTION) vs INPUT LEVEL  
TOTAL HARMONIC DISTORTION vs FREQUENCY  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
0.1  
1
10  
–40  
–35  
–30  
–25  
–20  
–15  
–10  
–5  
Frequency (kHz)  
Input Level (dB)  
®
5
ADS1286  
TYPICAL PERFORMANCE CURVES (CONT)  
At TA = +25, VCC = +5V, VREF = +5V, fSAMPLE = 12.5kHz, fCLK = 16 • fSAMPLE, unless otherwise specified.  
4096 POINT FFT  
PEAK-TO-PEAK NOISE vs REFERENCE VOLTAGE  
10  
9
8
7
6
5
4
3
2
1
0
0
–25  
–50  
–75  
–100  
–125  
0
2
4
6
0.1  
–55  
–55  
1
10  
85  
85  
Frequency (kHz)  
Reference Voltage (V)  
POWER SUPPLY REJECTION vs RIPPLE FREQUENCY  
VRIPPLE = 20mV  
CHANGE GAIN vs TEMPERATURE  
0
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
0.15  
0.1  
0.05  
0
–0.05  
–0.1  
–0.15  
–40  
–25  
0
25  
70  
1
10  
100  
1000  
10000  
Ripple Frequency (kHz)  
Temperature (°C)  
POWER DOWN SUPPLY CURRENT  
vs TEMPERATURE  
SUPPLY CURRENT vs TEMPERATURE  
3
2.5  
2
400  
350  
300  
250  
200  
150  
100  
fSAMPLE = 12.5kHz  
1.5  
1
fSAMPLE = 1.6kHz  
0.5  
0
–55  
–40  
–25  
0
25  
70  
85  
–40  
–25  
0
25  
70  
Temperature (°C)  
Temperature (°C)  
®
ADS1286  
6
TYPICAL PERFORMANCE CURVES (CONT)  
At TA = +25, VCC = +5V, VREF = +5V, fSAMPLE = 12.5kHz, fCLK = 16 • fSAMPLE, unless otherwise specified.  
DIGITAL INPUT LINE THRESHOLD  
vs SUPPLY VOLTAGE  
INTEGRAL LINEARITY ERROR vs CODE  
3.0  
2.0  
3
2.5  
2
1.0  
0
1.5  
1
–1.0  
–2.0  
–3.0  
0.5  
0
0
2048  
Code  
4095  
3
3.25 3.5 3.75  
4
4.25 4.5 4.75  
5
5.25 5.5  
Supply Voltage (V)  
INPUT LEAKAGE CURRENT vs TEMPERATURE  
10  
1
0.1  
0.01  
–55  
–40  
–25  
0
25  
70  
85  
Temperature (°C)  
®
7
ADS1286  
TIMING DIAGRAMS AND TEST CIRCUITS  
1.4V  
VOH  
VOL  
3kΩ  
DOUT  
DOUT  
Test Point  
tr  
tf  
100pF  
CLOAD  
Voltage Waveforms for DOUT Rise and Fall Times tr, and tf  
Load Circuit for tdDO, tr, and tf  
Test Point  
DCLOCK  
VIL  
VCC  
tdDO  
t
dis Waveform 2, ten  
3kΩ  
DOUT  
VOH  
VOL  
tdis Waveform 1  
DOUT  
100pF  
CLOAD  
thDO  
Voltage Waveforms for DOUT Delay Times, tdDO  
Load Circuit for tdis and tden  
VIH  
CS/SHDN  
CS/SHDN  
DCLOCK  
DOUT  
Waveform 1(1)  
90%  
10%  
1
2
tdis  
DOUT  
Waveform 2(2)  
VOL  
DOUT  
B11  
ten  
Voltage Waveforms for tdis  
NOTES: (1) Waveform 1 is for an output with internal conditions such that  
the output is HIGH unless disabled by the output control. (2) Waveform 2  
is for an output with internal conditions such that the output is LOW unless  
disabled by the output control.  
Voltage Waveforms for ten  
®
ADS1286  
8
tCYC  
CS/SHDN  
DCLOCK  
POWER  
DOWN  
tSUCS  
tCSD  
NULL  
BIT  
NULL  
BIT  
HI-Z  
HI-Z  
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0(1)  
B11 B10 B9 B8  
DOUT  
(MSB)  
tSMPL  
tCONV  
tDATA  
Note: (1) After completing the data transfer, if further clocks are applied with CS  
LOW, the ADC will output LSB-First data then followed with zeroes indefinitely.  
tCYC  
CS/SHDN  
DCLOCK  
DOUT  
tSUCS  
POWER DOWN  
tCSD  
NULL  
HI-Z  
HI-Z  
BIT  
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11  
(2)  
(MSB)  
tSMPL  
tCONV  
tDATA  
Note: (2) After completing the data transfer, if further clocks are applied with CS  
LOW, the ADC will output zeroes indefinitely.  
tDATA: During this time, the bias current and the comparator power down and the reference input  
becomes a high impedance node, leaving the CLK running to clock out LSB-First data or zeroes.  
FIGURE 1. ADS1286 Operating Sequence.  
leaving the DCLOCK running to clock out the LSB first  
data or zeroes. If the CS input is not running rail-to-rail, the  
input logic buffer will draw current. This current may be  
large compared to the typical supply current. To obtain the  
lowest supply current, bring the CS pin to ground when it is  
low and to supply voltage when it is high.  
SERIAL INTERFACE  
The ADS1286 communicates with microprocessors and other  
external digital systems via a synchronous 3-wire serial inter-  
face. DCLOCK synchronizes the data transfer with each bit  
being transmitted on the falling DCLOCK edge and captured  
on the rising DCLOCK edge in the receiving system. A falling  
CS initiates data transfer as shown in Figure 1. After CS falls,  
the second DCLOCK pulse enables DOUT. After one null bit,  
the A/D conversion result is output on the DOUT line. Bringing  
CS high resets the ADS1286 for the next data exchange.  
1000  
TA = 25°C  
V
CC = 5V  
VREF = 5V  
CLK = 16 • fSAMPLE  
100  
10  
1
f
MICROPOWER OPERATION  
With typical operating currents of 250µA and automatic  
shutdown between conversions, the ADS1286 achieves ex-  
tremely low power consumption over a wide range of  
sample rates (see Figure 2). The auto-shutdown allows the  
supply current to drop with sample rate.  
0.1k  
1k  
10k  
100k  
SHUTDOWN  
Sample Rate (kHz)  
The ADS1286 is equipped with automatic shutdown fea-  
tures. The device draws power when the CS pin is LOW and  
shuts down completely when the pin is HIGH. The bias  
circuit and comparator powers down and the reference input  
becomes high impedance at the end of each conversion  
FIGURE 2. Automatic Power Shutdown Between Conver-  
sions Allows Power Consumption to Drop with  
Sample Rate.  
®
9
ADS1286  
MINIMIZING POWER DISSIPATION  
REDUCED REFERENCE  
OPERATION  
In systems that have significant time between conversions,  
the lowest power drain will occur with the minimum CS  
LOW time. Bringing CS LOW, transferring data as quickly  
as possible, and then bringing it back HIGH will result in the  
lowest current drain. This minimizes the amount of time the  
device draws power. After a conversion the A/D automati-  
cally shuts down even if CS is held LOW. If the clock is left  
running to clock out LSB-data or zero, the logic will draw a  
small amount of current (see Figure 3).  
The effective resolution of the ADS1286 can be increased  
by reducing the input span of the converter. The ADS1286  
exhibits good linearity and gain over a wide range of  
reference voltages (see Typical Performance Curves “ Change  
in Linearity vs Reference Voltage” and “Change in Gain vs  
Reference Voltage”). However, care must be taken when  
operating at low values of VREF because of the reduced LSB  
size and the resulting higher accuracy requirement placed on  
the converter. The following factors must be considered  
when operating at low VREF values:  
6.00  
TA = 25°C  
VCC = +5V  
1. Offset  
2. Noise  
5.00  
V
REF = +5V  
f
CLK = 16 • fSAMPLE  
4.00  
3.00  
2.00  
1.00  
0.00  
OFFSET WITH REDUCED VREF  
CS = LOW  
(GND)  
The offset of the ADS1286 has a larger effect on the output  
code. When the ADC is operated with reduced reference  
voltage. The offset (which is typically a fixed voltage)  
becomes a larger fraction of an LSB as the size of the LSB  
is reduced. The Typical Performance Curve “Change in  
Offset vs Reference Voltage” shows how offset in LSBs is  
related to reference voltage for a typical value of VOS. For  
example, a VOS of 122µV which is 0.1 LSB with a 5V  
reference becomes 0.5LSB with a 1V reference and 2.5LSBs  
with a 0.2V reference. If this offset is unacceptable, it can be  
corrected digitally by the receiving system or by offsetting  
the negative input of the ADS1286.  
CS HIGH  
(VCC  
)
0.1  
1
10  
100  
Sample Rate (kHz)  
FIGURE 3. Shutdown Current with CS HIGH is Lower than  
with CS LOW.  
RC INPUT FILTERING  
It is possible to filter the inputs with an RC network as  
shown in Figure 4. For large values of CFILTER (e.g., 1µF),  
the capacitive input switching currents are averaged into a  
net DC current. Therefore, a filter should be chosen with a  
small resistor and large capacitor to prevent DC drops across  
the resistor. The magnitude of the DC current is approxi-  
mately IDC = 20pF x VIN/tCYC and is roughly proportional to  
VIN. When running at the minimum cycle time of 64µs, the  
input current equals 1.56µA at VIN = 5V. In this case, a filter  
resistor of 75will cause 0.1LSB of full-scale error. If a  
larger filter resistor must be used, errors can be eliminated  
by increasing the cycle time.  
NOISE WITH REDUCED VREF  
The total input referred noise of the ADS1286 can be  
reduced to approximately 200µV peak-to-peak using a ground  
plane, good bypassing, good layout techniques and minimiz-  
ing noise on the reference inputs. This noise is insignificant  
with a 5V reference but will become a larger fraction of an  
LSB as the size of the LSB is reduced.  
For operation with a 5V reference, the 200µV noise is only  
0.15LSB peak-to-peak. In this case, the ADS1286 noise will  
contribute virtually no uncertainty to the output code. How-  
ever, for reduced references, the noise may become a signifi-  
cant fraction of an LSB and cause undesirable jitter in the  
output code. For example, with a 2.5V reference this same  
200µV noise is 0.3LSB peak-to-peak. If the reference is  
further reduced to 1V, the 200µV noise becomes equal to  
0.8LSBs and a stable code may be difficult to achieve. In  
this case averaging multiple readings may be necessary.  
IDC  
RFILTER  
VIN  
ADS1286  
CFILTER  
FIGURE 4. RC Input Filtering.  
®
ADS1286  
10  
+5V  
+5V  
+5V  
R8  
46k  
0.4V  
0.3V  
R7  
10Ω  
R9  
1kΩ  
R1  
150kΩ  
OPA237  
D1  
C2  
0.1µF  
U2  
R3  
500kΩ  
R10  
1kΩ  
C1  
10µF  
MUX  
R6  
1MΩ  
R2  
59kΩ  
VREF  
0.2V  
0.1V  
DCLOCK  
DOUT  
R11  
1kΩ  
C3  
0.1µF  
ADS1286  
TC1  
A0  
TC2  
TC3  
CS/SHDN  
A1  
Thermocouple  
R12  
1kΩ  
U1  
C4  
10µF  
R4  
1kΩ  
U3  
C5  
0.1µF  
R5  
500Ω  
µP  
ISO Thermal Block  
3-Wire  
Interface  
U4  
FIGURE 5. Thermocouple Application Using a MUX to Scale the Input Range of the ADS1286.  
+VCC  
REF200  
(100µA)  
0.1µF  
VREF  
1
8
DCLOCK  
DOUT  
2
µP  
ADS1286  
RTD  
CS/SHDN  
3
4
FIGURE 6. ADS1286 with RTD Sensor.  
®
11  
ADS1286  
PACKAGE OPTION ADDENDUM  
www.ti.com  
8-Aug-2006  
PACKAGING INFORMATION  
Orderable Device  
ADS1286P  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
PDIP  
P
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
ADS1286PA  
PDIP  
PDIP  
PDIP  
PDIP  
PDIP  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
P
P
P
P
P
P
P
D
D
D
D
D
D
D
D
D
D
D
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
ADS1286PB  
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
ADS1286PBG4  
ADS1286PC  
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
ADS1286PG4  
ADS1286PK  
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
ADS1286PL  
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
ADS1286U  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
ADS1286U/2K5  
ADS1286U/2K5G4  
ADS1286UA  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
ADS1286UA/2K5  
ADS1286UA/2K5G4  
ADS1286UAG4  
ADS1286UB  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
ADS1286UBG4  
ADS1286UC  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
100 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
ADS1286UCG4  
100 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
ADS1286UG4  
ADS1286UK  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
8
8
100  
TBD  
Call TI  
Call TI  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
ADS1286UKG4  
ADS1286UL  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
8
8
8
8
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
ADS1286UL/2K5  
ADS1286ULG4  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
8-Aug-2006  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
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in which TI products or services are used. Information published by TI regarding third-party products or services  
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Use of such information may require a license from a third party under the patents or other intellectual property  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
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www.ti.com/audio  
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www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
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Security  
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