ADS1610 [BB]
16-Bit, 10 MSPS ANALOG-TO-DIGITAL CONVERTER; 16位， 10 MSPS模拟数字转换器
| 型号： | ADS1610 |
| 厂家： | 
BURR-BROWN CORPORATION |
| 描述： | 16-Bit, 10 MSPS ANALOG-TO-DIGITAL CONVERTER |
| 文件： | 总26页 (文件大小：667K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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ADS1610
SBAS344C–AUGUST 2005–REVISED OCTOBER 2006
16-Bit, 10 MSPS
ANALOG-TO-DIGITAL CONVERTER
The ADS1610 ∆Σ topology provides key system-level
FEATURES
design advantages with respect to anti-alias filtering
and clock jitter. The design of the user's front-end
anti-alias filter is simplified since the on-chip digital
filter greatly attenuates out-of-band signals. The
ADS1610s filter has a brick wall response with a very
flat passband (±0.0002dB of ripple) followed
immediately by a very wide stop band (5MHz to
55MHz). Clock jitter becomes especially critical when
digitizing high frequency, large-amplitude signals.
The ADS1610 significantly reduces clock jitter
sensitivity by an effective averaging of clock jitter as
a result of oversampling the input signal.
•
•
•
•
•
•
•
High-Speed, Wide Bandwidth ∆Σ ADC
10MSPS Output Data Rate
4.9MHz Signal Bandwidth
86dBFS Signal-to-Noise Ratio
–94dB Total Harmonic Distortion
95dB Spurious-Free Dynamic Range
On-Chip Digital Filter Simplifies Anti-Alias
Requirements
•
SYNC Pin for Simultaneous Sampling with
Multiple ADS1610s
Output data is supplied over a parallel interface and
easily connects to TMS320 digital signal processors
(DSPs). The power dissipation can be adjusted with
an external resistor, allowing for reduction at lower
operating speeds.
•
•
•
•
Low 3µs Group Delay
Parallel Interface
Directly Connects to TMS320 DSPs
Out-of-Range Alert Pin
With its outstanding high-speed performance, the
ADS1610 is well-suited for demanding applications in
data acquisition, scientific instruments, test and
measurement equipment, and communications. The
ADS1610 is offered in a TQFP64 package and is
specified from –40°C to 85°C.
APPLICATIONS
•
•
•
Scientific Instruments
Test Equipment
Communications
DESCRIPTION
AVDD VREFP VREFN VMID RBIAS VCAP
Bias Circuits
DVDD
The ADS1610 is
delta-sigma (∆Σ) analog-to-digital converter (ADC)
a high-speed, high-precision,
PD
SYNC
CLK
with 16-bit resolution operating from a 5V analog and
MODE0
MODE1
Parallel
Interface
a
3V digital supply. Featuring an advanced
AINP
AINN
∆Σ
Modulator
Digital
Filter
multi-stage analog modulator combined with an
on-chip digital decimation filter, the ADS1610
achieves 86 dBFS signal-to-noise ratio (SNR) in a
5MHz signal bandwidth; while the total harmonic
distortion is -94dB.
RD
DRDY
OTR
DOUT[15:0]
ADS1610
AGND
DGND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
ADS1610
www.ti.com
SBAS344C–AUGUST 2005–REVISED OCTOBER 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ADS1610 passes
1.5K CDM testing. ADS1610 passes 1kV human body model testing (TI Standard is 2kV).
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
–0.3 to +6
UNIT
AVDD to AGND
DVDD to DGND
AGND to DGND
V
V
V
–0.3 to +3.6
–0.3 to +0.3
100, Momentary
10, Continuous
-0.3 to AVDD + 0.3
-0.3 to DVDD + 0.3
150
Input current, II
mA
Analog I/O to AGND
V
Digital I/O to DGND
V
Maximum junction temperature, TJ
Operating free-air temperature range, TA
Storage temperature range, Tstg
Lead temperature (soldering, 10s)
°C
°C
°C
°C
-40 to +105
-60 to +150
260
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
ELECTRICAL CHARACTERISTICS
All specifications at –40°C to 85°C, AVDD = 5V, DVDD = 3V, fCLK = 60MHz, VREF = 3V, MODE = 00, VCM = 2.5V, and RBIAS
= 19kΩ (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ANALOG INPUT
VID(AINP - AINN)
Differential input voltage (AINP-AINN)
Common-mode input voltage
±VREF
V
V
VIC(AINP + AINN)/2
2.5
Absolute input voltage (AINP or AINN
with respect to AGND)
VIHA
–0.1
4.2
V
DYNAMIC SPECIFICATIONS
f
CLK
10ǒ Ǔ
60 MHz
Data rate
MSPS
dBFS
Signal-to-noise ration relative to
full-scale(1)
SNR
fIN = 100kHz, –2dBFS
83
86
(1) For reference, this dynamic specification is extrapolated to full-scale and is thus dBFS. Subsequent dynamic specifications are dBc (dB),
which is: Specification (in dBc) = Specification (in dBFS) + AIN (input amplitude in dBFS). For more information see Understanding and
comparing datasheets for high-speed ADCs.
2
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SBAS344C–AUGUST 2005–REVISED OCTOBER 2006
ELECTRICAL CHARACTERISTICS (continued)
All specifications at –40°C to 85°C, AVDD = 5V, DVDD = 3V, fCLK = 60MHz, VREF = 3V, MODE = 00, VCM = 2.5V, and RBIAS
= 19kΩ (unless otherwise noted).
PARAMETER
TEST CONDITIONS
fIN = 100kHz, –2dBFS
fIN = 100kHz, –6dBFS
fIN = 100kHz, –20dBFS
fIN = 1MHz, –2dBFS
fIN = 1MHz, –6dBFS
fIN = 1MHz, –20dBFS
fIN = 4MHz, –2dBFS
fIN = 4MHz, –6dBFS
fIN = 4MHz, –20dBFS
fIN = 100kHz, –2dBFS
fIN = 100kHz, –6dBFS
fIN = 100kHz, –20dBFS
fIN = 1MHz, –2dBFS
fIN = 1MHz, –6dBFS
fIN = 1MHz, –20dBFS
fIN = 4MHz, –2dBFS
fIN = 4MHz, –6dBFS
fIN = 4MHz, –20dBFS
fIN = 100kHz, –2dBFS
fIN = 100kHz, –6dBFS
fIN = 100kHz, –20dBFS
fIN = 1MHz, –2dBFS
fIN = 1MHz, –6dBFS
fIN = 1MHz, –20dBFS
fIN = 4MHz, –2dBFS
fIN = 4MHz, –6dBFS
fIN = 4MHz, –20dBFS
fIN = 100kHz, –2dBFS
fIN = 100kHz, –6dBFS
fIN = 100kHz, –20dBFS
fIN = 1MHz, –2dBFS
fIN = 1MHz, –6dBFS
fIN = 1MHz, –20 dBFS
fIN = 4MHz, –2dBFS
fIN = 4MHz, –6dBFS
fIN = 4MHz, –20dBFS
MIN
81
TYP
84
MAX
UNIT
77
80
66
83
SNR
Signal-to-noise ratio
80
dB
66
79.5
76
83
79
65
–90
–95
–95
–91
–93
–95
–109
–105
–95
83
–83
–85
THD
Total harmonic distortion
dB
dB
dB
–100
–100
79
65
82
SINAD
Signal-to-noise and distortion
79
65
83
79
65
85
90
90
96
96
94
SFDR
Spurious-free dynamic range
94
96
100
100
109
105
95
Excludes jitter of CLK
source
Aperture jitter
Aperture delay
2
4
ps, rms
ns
3
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SBAS344C–AUGUST 2005–REVISED OCTOBER 2006
ELECTRICAL CHARACTERISTICS (Continued)
All specifications at –40°C to 85°C, AVDD = 5V, DVDD = 3V, fCLK = 60MHz, VREF = 3V, MODE = 00, VCM = 2.5V, and RBIAS
= 19kΩ (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL FILTER CHARACTERISTICS
f
CLK
4.4ǒ Ǔ
Passband
0
MHz
dB
60 MHz
Passband ripple
±0.0002
f
CLK
4.6ǒ Ǔ
–0.1dB attenuation
60 MHz
Passband transition
MHz
f
CLK
4.9ǒ Ǔ
60 MHz
–3.0dB attenuation
Stop band
5.6
80
54.4
MHz
dB
Stop band attentuation
See Figure 34
60 MHz
3.0ǒ Ǔ
td(grp)
Group delay
Settling time
µs
µs
f
CLK
60 MHz
5.5ǒ Ǔ
ts
To ±0.001%
f
CLK
STATIC SPECIFICATIONS
Resolution
No missing codes
Shorted input
1V input
16
Bits
LSB (rms)
LSB
Input rms noise
1.0
±0.4
±1.5
±0.5
0.05
5
1.4
Integral nonlinearity
2.5V input
LSB
Differential nonlinearity
LSB
VIO
Offset error
T = 25°C
%FS
Offset drift
ppm/°C
%FS
G(ERR)
G
Gain error
T = 25°C
±0.3(1)
10
Gain drift
Excluding reference drift
ppm/°C
dB
CMRR
PSRR
Common-mode rejection ratio
Supply-voltage rejection ratiio
At DC
At DC
60
80
dB
VOLTAGE REFERENCE
Vref
Reference voltage, (VREFP - VREFN)
2.9
3.6
0.9
2.2
3.0
4.0
1.0
2.5
3.1
4.4
1.1
3.8
V
V
V
V
VREFP
VREFN
VMID
DIGITAL INPUT/OUTPUT
VIH
VIL
High-level input voltage
0.7DVDD
DGND
DVDD
V
V
Low-level input voltage
High-level output voltage
Low-level output voltage
Input leakage current
0.3DVDD
VOH
VOL
Ilkg
IOH = –50µA
0.8DVDD
V
IOL = 50µA
0.2DVDD
V
DGND < VDIGITAL INPUT < DVDD
±10
µA
POWER-SUPPLY REQUIREMENTS
VAVDD
VDVDD
IAVDD
IDVDD
AVDD voltage
DVDD voltage
AVDD current
DVDD current
4.9
2.7
5.0
3.0
150
70
5.1
3.6
V
V
170
80
mA
mA
960
4
1100
PD
Power dissipation
mW
PD = low
(1) There is a constant gain error of 3.8% in addition to the variable gain eror of ±0.3%. Therefore, the gain error is 3.8 ±0.3%.
4
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SBAS344C–AUGUST 2005–REVISED OCTOBER 2006
DEVICE INFORMATION
PIN CONFIGURATION
HTQFP
(TOP VIEW)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
2
48
AGND
AVDD
AGND
AINN
NC
47 NC
3
46
45
44
NC
4
NC
5
AINP
DOUT[15]
AGND
AVDD
RBIAS
AGND
AVDD
6
43 DOUT[14]
42
7
DOUT[13]
8
41 DOUT[12]
40 DOUT[11]
ADS1610
9
10
39
DOUT[10]
AGND 11
AVDD 12
38 DOUT[9]
37 DOUT[8]
13
14
15
36
35
34
NC
MODE0
MODE 1
DOUT[7]
DOUT[6]
DOUT[5]
NC 16
33 DOUT[4]
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
TERMINAL FUNCTIONS
TERMINAL
ANALOG/DIGITAL
INPUT/OUTPUT
DESCRIPTION
NAME
AGND
NO.
1, 3, 6, 9, 11, 55
Analog
Analog
Analog ground
AVDD
AINN
AINP
RBIAS
NC
2, 7, 10, 12
Analog supply
4
Analog input
Analog input
Analog
Negative analog input
Positive analog input
Analog bias setting resistor
Must be left unconnected.
5
8
13, 16, 27, 28, 45–48
—
MODE
PD
14, 15
Digital input
Digital input; active low
Digital
Control for four output modes (See MODE SELECTION section)
17
Power-down
Digital supply
Digital ground
Digital reset
Chip-select
DVDD
DGND
SYNC
CS
18, 26, 49, 50, 52, 53
19, 25, 51, 54
Digital
20
21
Digital input; active low
Digital input; active low
5
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TERMINAL FUNCTIONS (continued)
TERMINAL
ANALOG/DIGITAL
INPUT/OUTPUT
DESCRIPTION
NAME
NO.
22
RD
Digital input; Active low
Digital output
Digital output
Digital output
Digital input
Analog
Read enable
OTR
23
Analog inputs out-of-range
Data ready
DRDY
DOUT[15:0]
CLK
24
29–44
56
Data output. DOUT[15] is the MSB and DOUT[0] is the LSB.
Clock input
AGND2
AVDD2
VCAP
57
Analog ground for AVDD2
Analog supply for modulator clocking
Bypass capacitor
58
Analog
59
Analog
VREFN
VMID
60, 61
62
Analog
Negative reference voltage
Midpoint voltage
Analog
VREFP
63, 64
Analog
Positive reference voltage
TIMING SPECIFICATIONS
t2
t1
CLK
t2
t3
t4
t4
DRDY
t6
t5
DOUT[15:0]
Data N
Data N + 1
Data N + 2
Figure 1. Data Retrieval Timing
RD, CS
t7
t8
DOUT[15:0]
Figure 2. DOUT Inactive/Active Timing
6
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SBAS344C–AUGUST 2005–REVISED OCTOBER 2006
CLK
DRDY
t11
SYNC
t9
t10
Valid Data
DOUT[15:0]
Figure 3. Reset Timing
Timing Specifications(1)
DESCRIPTION
MIN TYP MAX
16.667
UNIT
ns
t1
CLK period (1/fCLK)
1/t1 fCLK
1
60
MHz
ns
t2
t3
t4
t5
t6
t7
t8
t9
CLK pulse width, high or low
45%
55%
CLK to DRDY high (propagation delay)
DRDY pulse width, high or low
Previous data valid (hold time)
New data valid (setup time)
12
ns
3 t1
ns
0
ns
5
ns
RD and/or CS inactive (high) to DOUT high impedance
RD and/or CS active (low) to DOUT active
15
15
12
ns
ns
Delay from SYNC active (low) to all-zero DOUT[15:0]
ns
t10 Delay from SYNC inactive (high) to non-zero DOUT[15:0]
21 DRDY
DRDY
t11 Delay from SYNC inactive (high )to valid DOUT[15:0] (time – 55 DRDY cycles; required for digital
filter to settle).
55
(1) Output load = 10pF|| 500kΩ.
7
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SBAS344C–AUGUST 2005–REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
At TA = 25°C, RBIAS = 19kΩ, AVDD = 5V, DVDD = 3V, fCLK = 60MHz, VREF = 3V, MODE = 00,and VCM = 2.5V (unless
otherwise noted).
SPECTRAL RESPONSE
SPECTRAL RESPONSE
0
20
40
60
80
0
20
40
60
80
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
100
120
140
160
100
120
140
160
0
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Frequency (MHz)
0
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Frequency (MHz)
Figure 4.
Figure 5.
SPECTRAL RESPONSE
SPECTRAL RESPONSE
0
0
−
−
−
−
−
−
−
−
20
40
60
80
20
40
60
80
−
−
−
−
−
−
−
−
100
120
140
160
100
120
140
160
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Frequency (MHz)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Frequency (MHz)
Figure 6.
Figure 7.
SPECTRAL RESPONSE
SPECTRAL RESPONSE
0
0
−
−
−
−
−
−
−
−
20
40
60
80
20
40
60
80
−
−
−
−
−
−
−
−
100
120
140
160
100
120
140
160
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Frequency (MHz)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Frequency (MHz)
Figure 8.
Figure 9.
8
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, RBIAS = 19kΩ, AVDD = 5V, DVDD = 3V, fCLK = 60MHz, VREF = 3V, MODE = 00,and VCM = 2.5V (unless
otherwise noted).
SIGNAL-TO-NOISE RATIO,
SIGNAL-TO-NOISE RATIO
vs INPUT FREQUENCY
TOTAL HARMONIC DISTORTION, AND
SPURIOUS-FREE DYNAMIC RANGE vs INPUT
SIGNAL AMPLITUDE
90
85
100
90
V
= 2 dBFS
IN
SFDR
−THD
80
80
75
70
V
= -6 dBFS
70
IN
60
50
40
SNR
V
= -20 dBFS
IN
65
60
30
20
10
f
= 100 kHz
−10
IN
0.01
0.1
1
10
f
- Input Frequency - Mhz
IN
−70
−60
−50
−40
−30
−20
0
Input Signal (dB)
Figure 10.
Figure 11.
TOTAL HARMONIC DISTORTION
vs INPUT FREQUENCY
SPURIOUS-FREE DYNAMIC RANGE
vs INPUT FREQUENCY
-85
-90
110
105
100
95
V
= -20 dBFS
IN
V
= -2 dBFS
IN
V
= -6 dBFS
IN
-95
-100
V
= -6 dBFS
V
= -2 dBFS
IN
IN
-105
-110
V
= -20 dBFS
90
85
IN
0.01
0.1
1
10
0.01
0.1 1
- Input Frequency - Mhz
10
f
- Input Frequency - Mhz
IN
f
IN
Figure 12.
Figure 13.
TOTAL HARMONIC DISTORTION
vs CLK FREQUENCY
SIGNAL-TO-NOISE RATIO
vs CLK FREQUENCY
−80
90
88
86
84
82
80
R
= 25 k
BIAS
R
= 31 k
BIAS
−85
−90
R
= 19 k
BIAS
R
= 37 k
BIAS
−95
R
= 25 k
BIAS
R
= 31 k
BIAS
−100
R
BIAS
= 19 k
R
= 37 k
BIAS
−105
−110
f
= 100 kHz,−6 dBFS
IN
fin = 100 KHz, 6 dBFs
5
6
7
8
9
10
11
5
6
7
8
9
10
11
CLK Frequency, f
(MHz)
CLK
CLK Frequency, f
(MHz)
CLK
Figure 14.
Figure 15.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, RBIAS = 19kΩ, AVDD = 5V, DVDD = 3V, fCLK = 60MHz, VREF = 3V, MODE = 00,and VCM = 2.5V (unless
otherwise noted).
SPURIOUS-FREE DYNAMIC RANGE
vs CLK FREQUENCY
SIGNAL-TO-NOISE RATIO
vs TEMPERATURE
110
105
100
95
90
85
80
R
BIAS
= 19 k
V
= −2 dBFs
= −6 dBFs
in
V
in
75
70
R
BIAS
= 25 k
90
V
= −20 dBFs
in
R
BIAS
= 31 k
fin = 100 kHz, −6 dBFs
85
80
65
60
R
= 37 k
BIAS
fin = 100 KHz
−20
5
6
7
8
9
10
11
−40
0
20
40
60
80
CLK Frequency, f
(MHz)
CLK
Temperature (°C)
Figure 16.
Figure 17.
SPURIOUS-FREE DYNAMIC RANGE
vs TEMPERATURE
TOTAL HARMONIC DISTORTION
vs TEMPERATURE
110
105
100
95
−85
−90
V
= −2 dBFs
in
fin = 100 KHz
V
V
= −6 dBFs
in
= −20 dBFs
V
in
= −6 dBFs
in
−95
−100
V = −20 dBFs
in
V
= −2 dBFs
in
90
−105
−110
fin = 100 KHz
−20
85
−40
−40
−20
0
20
40
60
80
0
20
40
60
80
Temperature (°C)
Temperature (°C)
Figure 19.
INL ERROR
Figure 18.
INL ERROR
vs INPUT VOLTAGE
vs INPUT VOLTAGE
2.5
1
2
0.8
1.5
1
0.6
0.4
0.2
0.5
0
0
-0.2
-0.4
-0.6
-0.5
-1
-1.5
-2
-0.8
-1
-2.5
-2.5
-2
-1
0
1
2
2.5
-1
-0.5
0
V - Input Voltage - V
I
0.5
1
V
- Input Voltage - V
I
Figure 20.
Figure 21.
10
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, RBIAS = 19kΩ, AVDD = 5V, DVDD = 3V, fCLK = 60MHz, VREF = 3V, MODE = 00,and VCM = 2.5V (unless
otherwise noted).
NOISE HISTOGRAM (With Inputs Shorted)
OUTPUT DATA RATE
vs POWER CONSUMPTION
25k
20k
1000
900
800
700
600
500
400
VIN = 0 V
R
= 19 KW
bias
R
= 25 KW
bias
15k
1k
500
0
R
= 37 KW
bias
8
R
= 31 KW
bias
−6
−4
−2
0
Output Code (LSB)
2
4
6
1
2
3
4
5
6
7
Output Data Rate - Mhz
9
10
Figure 22.
Figure 23.
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OVERVIEW
ANALOG INPUTS (AINP, AINN)
The ADS1610 is a high-performance, delta-sigma
ADC. The modulator uses an inherently stable,
The ADS1610 supports a very wide range of input
signals. Having such a wide input range makes
out-of-range signals unlikely. However, should an
out-of-range signal occur, the digital output OTR will
go high.
pipelined,
delta-sigma
modulator
architecture
incorporating proprietary circuitry that allows for very
linear high-speed operation. The modulator samples
the input signal at 60MSPS (when fCLK = 60MHz). A
low-ripple linear phase digital filter decimates the
modulator output by 6 to provide data output word
rates of 10MSPS with a signal passband out to
4.9MHz.
To achieve the highest analog performance, it is
recommended that the inputs be limited to no greater
than 0.891VREF (-1dBFS). For VREF = 3V, the
corresponding recommended input range is 2.67V.
The analog inputs must be driven with a differential
signal to achieve optimum performance. The
recommended common-mode voltage of the input
AINP ) AINN
Conceptually, the modulator and digital filter
measure the differential input signal, VID = (AINP –
AINN), against the differential reference, Vref
=
V
+
(VREFP – VREFN), as shown in Figure 11. A 16-bit
parallel data bus, designed for direct connection to
DSPs, outputs the data. A separate power supply for
the I/O allows flexibility for interfacing to different
logic families. Out-of-range conditions are indicated
with a dedicated digital output pin. Analog power
dissipation is controlled using an external resistor.
This allows reduced dissipation when operating at
slower speeds. When not in use, power consumption
can be dramatically reduced using the PD pin.
CM
2
signal,
is 2.5V.
In addition to the differential and common-mode
input voltages, the absolute input voltage is also
important. This is the voltage on either input (AINP or
AINN) with respect to AGND. The range for this
voltage is:
*0.1 V t (AINN or AINP) t 4.2 V
(1)
If either input is taken below –0.1V, ESD protection
diodes on the inputs will turn on. Exceeding 4.2V on
either input will result in linearity performance
degradation. ESD protection diodes will also turn on
if the inputs are taken above AVDD (+5V).
VREFP VREFN
Σ
VREF
OTR
Parallel
DOUT[15:0]
Digital
Filter
Interface
VIN
AINP
AINN
Σ∆
Σ
Modulator
MODE[1:0]
Figure 24. Conceptual Block Diagram
circuits. Switches S2 represent the net effect of the
modulator circuitry in discharging the sampling
capacitors, the actual implementation is different.
The timing for switches S1 and S2 is shown in
Figure 26.
INPUT CIRCUITRY
The ADS1610 uses switched-capacitor circuitry to
measure the input voltage. Internal capacitors are
charged by the inputs and then discharged internally
with this cycle repeating at the frequency of CLK.
Figure 25 shows a conceptual diagram of these
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driver circuits low-thermal noise in the driver circuits
degrades the overall noise performance. When the
signal can be AC-coupled to the ADS1610 inputs, a
simple RC filter can set the input common mode
ADS1610
S1
AINP
voltage. The ADS1610 is
a high-speed, high-
S2
performance ADC. Special care must be taken when
selecting the test equipment and setup used with this
device. Pay particular attention to the signal sources
to ensure they do not limit performance when
measuring the ADS1610.
10pF
8pF
VMID
S1
AINN
S2
10pF
8pF
10pF
ADS1610
VMID
Ω
787
AGND
Ω
Ω
Ω
374
12.5
12.5
VIN
AINP
AINN
Figure 25. Conceptual Diagram of Internal
Circuitry Connected to the Analog Inputs
100pF
100pF
Ω
56.2
VCM
THS4503
Ω
374
−VIN
100pF
Ω
787
Ω
56.2
tSAMPLE = 1/fCLK
On
Off
S1
S2
10 pF
On
Off
Figure 27. Recommended Single-Ended to
Differential Conversion Circuit Using the
THS4503 Differential Amplifier
Figure 26. Timing for the Switches in Figure 25
DRIVING THE INPUTS
Ω
392
The external circuits driving the ADS1610 inputs
must be able to handle the load presented by the
switching capacitors within the ADS1610. The input
switches S1 in Figure 25 are closed approximately
one half of the sampling period, tSAMPLE, allowing
only ~8 ns for the internal capacitors to be charged
by the inputs, when fCLK = 60MHz.
20 pF
Ω
Ω
392
392
V
IN
−
2
µ
0.01
F
Ω
12.5
AINP
OPA2822
(2)
(1)
V
CM
100pF
Ω
1k
Ω
µ
1 F
392
(2)
Figure 27 and Figure 28 show the recommended
circuits when using single-ended or differential op
amps, respectively. The analog inputs must be
driven differentially to achieve optimum performance.
If only a single-ended input signal is available, the
configuration in Figure 27 can be used by shorting
–VIN to ground.
Ω
392
ADS1610
(1)
(3)
100pF
V
CM
(2)
20 pF
Ω
392
V
Ω
1k
IN
2
µ
F
0.01
Ω
12.5
AINN
OPA2822
Ω
392
(2)
(1)
V
CM
100pF
Ω
µ
F
392
1
This configuration would implement the single-ended
to differential conversion.
A GND
The external capacitors, between the inputs and from
each input to AGND, improve linearity and should be
placed as close to the pins as possible. Place the
drivers close to the inputs and use good capacitor
bypass techniques on their supplies; usually a
smaller high-quality ceramic capacitor in parallel with
a larger capacitor. Keep the resistances used in the
(1) Recommended VCM = 2.5V.
(2) Optional ac−coupling circuit provides common−mode input voltage.
≤
(3) Increase to 390pF when fIN 100kHz for improved SNR and THD.
Figure 28. Recommended Driver Circuit Using
the OPA2822
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REFERENCE INPUTS (VREFN, VREFP, VMID)
Ω
392
The ADS1610 operates from an external voltage
reference. The reference voltage (Vref) is set by the
differential voltage between VREFN and VREFP: Vref
= (VREFP – VREFN). VREFP and VREFN each use
two pins, which should be shorted together. VMID,
approximately 2.5V, is used by the modulator. VCAP
connects to an internal node and must also be
bypassed with an external capacitor.
µ
0.001
F
ADS1610
VREFP
VREFP
OPA2822
µ
10
F
4V
µ
0.1
F
392Ω
0.1µF
0.001µF
µ
22 F
22µF
The voltages applied to these pins must be within the
values specified in the Electrical Characteristics
table. Typically VREFP = 4V, VMID = 2.5V, and
VREFN = 1V. The external circuitry must be capable
of providing both a DC and a transient current.
Figure 29 shows a simplified diagram of the internal
circuitry of the reference. As with the input circuitry,
switches S1 and S2 open and close as shown in
Figure 26.
VMID
OPA2822
10µF
2.5V
µ
0.1
F
Ω
392
0.001µF
µ
22
F
VREFN
VREFN
OPA2822
1V
µ
µ
µ
10
F
0.1
0.1
F
F
VCAP
ADS1610
AGND
S1
VREFP
VREFP
Figure 30. Recommended Reference
Buffer Circuit
Ω
300
50pF
VREFN
VREFN
S1
S2
CLOCK INPUT (CLK)
The ADS1610 uses an external clock signal to be
applied to the CLK input pin. The sampling of the
modulator is controlled by this clock signal. As with
any high-speed data converter, a high quality clock is
essential for optimum performance. Crystal clock
oscillators are the recommended CLK source; other
sources, such as frequency synthesizers may not be
adequate. Make sure to avoid excess ringing on the
CLK input; keeping the trace as short as possible will
help.
Figure 29. Conceptual Circuitry for the Reference
Inputs
Figure 30 shows the recommended circuitry for
driving these reference inputs. Keep the resistances
used in the buffer circuits low to prevent excessive
thermal noise from degrading performance. Layout of
these circuits is critical, make sure to follow good
high-speed layout practices. Place the buffers and
especially the bypass capacitors as close to the pins
as possible.
Measuring high-frequency, large-amplitude signals
requires tight control of clock jitter. The uncertainty
during sampling of the input from clock jitter limits the
maximum achievable SNR. This effect becomes
more pronounced with higher frequency and larger
magnitude inputs. The ADS1610 oversampling
topology reduces clock jitter sensitivity over that of
Nyquist rate converters like pipeline and successive
approximation converters by a factor of √6.
In order to not limit the ADS1610 SNR performance,
keep the jitter on the clock source below the values
shown in Table 1. When measuring lower frequency
and lower amplitude inputs, more CLK jitter can be
tolerated. In determining the allowable clock source
jitter, select the worst-case input (highest frequency,
largest amplitude) that will be seen in the application.
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DATA FORMAT
OUT-OF-RANGE INDICATION (OTR)
The 16-bit output data is in binary two's complement
format, as shown in Table 2. When the input is
positive out-of-range, exceeding the positive
full-scale value of VREF, the output clips to all 7FFFH
and the OTR output goes high.
If the output code on DOUT[15:0] exceeds the
positive or negative full-scale, the out-of-range digital
output (OTR) will go high on the falling edge of
DRDY. When the output code returns within the
full-scale range, OTR returns low on the falling edge
of DRDY.
Table 1. Maximum Allowable Clock Source Jitter
for Different Input Signal Frequencies and
Amplitude
DATA RETRIEVAL
Data retrieval is controlled through a simple parallel
interface. The falling edge of the DRDY output
indicates new data is available. To activate the
output bus, both CS and RD must be low, as shown
in Table 3. Make sure the DOUT bus does not drive
heavy loads (> 20pF), as this will degrade
performance. Use an external buffer when driving an
edge connector or cables.
INPUT SIGNAL
MAXIMUM
ALLOWABLE
CLOCK SOURCE
JITTER
MAXIMUM
MAXIMUM
FREQUENCY
AMPLITUDE
4MHz
4MHz
2MHz
2MHz
1MHz
1MHz
100kHz
100kHz
–1dB
–20dB
–1dB
1.6ps
14ps
3.3ps
29ps
6.5ps
58ps
65ps
581ps
–20dB
–1dB
Table 3. Truth Table for CS and RD
–20dB
–1dB
CS
0
RD
0
DOUT [15:0]
Active
–20dB
0
1
High impedance
High impedance
High impedance
1
0
Table 2. Output Code Versus Input Signal
1
1
INPUT SIGNAL
(INP – INN)
IDEAL OUTPUT
CODE(1)
OTR
SYNCHRONISING MULTIPLE ADS1610s
≥ +Vref (> 0dB)
7FFFH
7FFFH
0001H
1
0
0
The ADS1610 is asynchronously reset when the
SYNC pin is taken low. During reset, all of the digital
circuits are cleared, DOUT[15:0] are forced low, and
DRDY forced high. It is recommended that the SYNC
pin be released on the falling edge of CLK.
Afterwards, DRDY goes low on the second rising
edge of CLK. Allow 55 DRDY cycles for the digital
filter to settle before retrieving data. See Figure 3 for
the timing specifications.
Vref (0dB)
) V
REF
215 * 1
0
0000H
FFFFH
0
0
*V
REF
215 * 1
215
215 * 1
8000H
8000H
0
1
REFǒ
Ǔ
*V
Reset can be used to synchronize multiple
ADS1610s. All devices to be synchronized must use
a common CLK input. With the CLK inputs running,
pulse SYNC on the falling edge of CLK, as shown in
Figure 31. Afterwards, the converters will be
converting synchronously with the DRDY outputs
updating simultaneously. After synchronization, allow
55 DRDY cycles (t11) for output data to fully settle.
215
215 * 1
REFǒ
Ǔ
v *V
(1)Excludes effects of noise, INL, offset and gain errors.
Likewise, when the input is negative out-of-range by
going below the negative full-scale value of Vref, the
output clips to 8000H and the OTR output goes high.
The OTR remains high while the input signal is
out-of-range.
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Figure 32 shows the settling error as a function of
time for a full-scale signal step applied at t = 0, with
MODE = 00 (See Table 4). This figure uses DRDY
cycles for the ADS1610 for the time scale (X-axis).
After 55 DRDY cycles, the settling error drops below
0.001%. For fCLK = 60MHz, this corresponds to a
settling time of 5.5µs.
ADS1610
1
DRDY
DRDY
1
SYNC
Clock
SYNC
CLK
DOUT[15:0]
DOUT[15:0]
1
101
100
ADS1610
2
DRDY
DRDY
2
SYNC
CLK
DOUT[15:0]
DOUT[15:0]
2
10−
1
10−
2
CLK
10−3
10−4
10−5
SYNC
t11
DRDY
1
30
35
40
45
50
55
60
Settling Time (DRDY cycles)
Settled
Data
DOUT[15:0]
1
Figure 32. Settling Time
DRDY
2
IMPULSE RESPONSE
Settled
Data
DOUT[15:0]
2
Figure 33 plots the normalized response for an input
applied at t = 0, with MODE = 00. The X-axis units of
time are DRDY cycles for the ADS1610. As shown in
Figure 33, the peak of the impulse takes 30 DRDY
cycles to propagate to the output. For fCLK = 60 MHz,
Synchronized
a
DRDY cycle is 0.1µs in duration and the
propagation time (or group delay) is 30 × 0.1µs =
3.0 µs.
Figure 31. Synchronizing Multiple Converters
SETTLING TIME
1.0
0.8
0.6
0.4
0.2
0
The settling time is an important consideration when
measuring signals with large steps or when using a
multiplexer in front of the analog inputs. The
ADS1610 digital filter requires time for an
instantaneous change in signal level to propagate to
the output.
Be sure to allow the filter time to settle after applying
a large step in the input signal, switching the channel
on a multiplexer placed in front of the inputs,
resetting the ADS1610, or exiting the power-down
mode.
−
−
0.2
0.4
0
10
20
30
40
50
60
Time (DRDY cycles)
Figure 33. Impulse Response
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FREQUENCY RESPONSE
0
1
2
3
4
5
6
7
The linear phase FIR digital filter sets the overall
frequency response. The decimation rate is set to 6
(MODE = 00) for all the figures shown in this section.
Figure 34 shows the frequency response from DC to
30 MHz for fCLK = 60 MHz. The frequency response
of the ADS1610 filter scales directly with CLK
frequency. For example, if the CLK frequency is
decreased by half (to 30 MHz), the values on the
X-axis in Figure 34 would need to be scaled by half,
with the span becoming DC to 15MHz.
−
−
−
−
−
−
−
4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0
Frequency (MHz)
0
−
−
−
−
20
40
60
80
Figure 36. Passband Transition
The overall frequency response repeats at multiples
of the CLK frequency. To help illustrate this,
Figure 37 shows the response out to 180 MHz (fCLK
=
60MHz). Notice how the passband response repeats
at 60MHz, 120MHz, and 180MHz; it is important to
consider this sequence when there is high-frequency
noise present with the signal. The modulator
bandwidth extends to 100MHz. High-frequency noise
around 60MHz and 120MHz will not be attenuated
by either the modulator or the digital filter. This noise
will alias back inband and reduce the overall SNR
performance unless it is filtered out prior to the
ADS1610. To prevent this, place an anti-alias filter in
front of the ADS1610 that rolls off before 55MHz.
−
−
100
120
0
5
10
15
20
25
30
Frequency (MHz)
Figure 34. Frequency Response
Figure 35 shows the passband ripple from DC to
4.4MHz (fCLK = 60MHz). Figure 36 shows a closer
view of the passband transition by plotting the
response from 4.0MHz to 5.0MHz (fCLK = 60MHz).
0
−
−
−
−
20
40
60
80
0.00020
0.00015
0.00010
0.00005
0
−
100
120
−
−0.00005
−0.00010
−0.00015
−0.00020
0
20
40
60
80
100 120 140 160 180
Frequency (MHz)
Figure 37. Frequency Response Out to 120MHz
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Frequency (MHz)
Figure 35. Passband Ripple
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NOISE FLOOR
two samples is more than 3dB. Figure 38 below
shows the typical in-band noise spectral density of
the ADS1610. The numbers in the bottom of the
figure represent the noise distribution with respect to
a full-scale signal in different bandwidths of interest.
The shaded area represents the signal bandwidth in
the default mode of operation (10MHz output data
rate).
The ADS1610 is a delta sigma ADC and it uses
noise shaping to achieve superior SNR performance.
The noise floor of a typical successive approximation
(SAR) or a pipeline ADC remains flat until the nyquist
frequency occurs. A gain of 3dB in SNR can be
achieved by averaging two samples, thereby having
a tradeoff between output data rate and achievable
SNR. In contrast, the noise floor of the ADS1610
inside the bandwidth of interest is shaped. Hence,
the gain in SNR that can be achieved by averaging
In band
Frequency (MHz)
1
2
3
4
5
10
30
96dBFS
93dBFS
91dBFS
88.5dBFS
86dBFS
74dBFS
-
55dBFS
Figure 38. Typical Filter Bypass Mode Noise Spectral Density
By using appropriate filtering the user can achieve a tradeoff between speed and SNR. For ease of use, the
ADS1610 provides four filtering modes as explained in the next section. Figure 39 shows a conceptual diagram
of the available filtering modes. Custom filtering is achieved by taking the modulator output data and adding a
filter externally.
AIN
DOUT
5M
10M
Decimation by
2
ADS1610
Modulator
60M
20M
Mux
Decimation
by 3
Decimation
by 2
MODE[1:0]
Figure 39. Conceptual Diagram of the ADS1610 Filtering Modes
MODE SELECTION
ADS1610 offers four different modes of operation each with different output data rates. This gives users the
flexibility to choose the best output rate for their application. The outputs of all modes are MSB-aligned.
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Table 4. Four Modes of Operation(1)
Mode 1
Mode 0 OUTPUT RATE
OSR
6
SNR (TYP)
86dBFS
74dBFS
91dBFS
55dBFS
BITS
16
SETTLING TIME (DRDY cycles)
0
0
1
1
0
1
0
1
Default 10MHz mode
20MHz
55
25
55
NA
3
14
5MHz
12
1
16
60MHz bypass mode
12
(1) There is a pull-down resistor of 170kΩ on both mode pins; however, it is recommended that this pin be reduced to either high or low.
20MHz MODE
Table 5. Recommended RBIAS Resistor Values
In this mode, the oversampling ratio is three.
Decreasing the OSR from 6 to 3 doubles the data
rate, at the same time the performance is reduced
from 16 bits to 14 bits. Note that all 16 bits of DOUT
remain active in this mode. For fclk = 60MHz, the
data rate is 20MSPS. In addition, the group delay
becomes 1 µs or 13 DRDY cycles. In this mode the
noise increases. Typical SNR performance degrades
by 14dB. THD remains approximately the same.
for Different CLK Frequencies
fCLK
DATA
RATE
RBIAS
TYPICAL POWER
DISSIPATION
42MHz
48MHz
54MHz
60MHz
7MHz
8MHz
9MHz
10MHz
45kΩ
37kΩ
31kΩ
19kΩ
550mW
640mW
720mW
960mW
POWER-DOWN (PD)
5MHz MODE
When not in use, the ADS1610 can be powered
down by taking the PD pin low. There is an internal
pull-up resistor of 170kΩ on the PD pin, but it is
recommended that this pin be connected to DVDD if
not used. Once the PD pin is pulled high, allow at
least t11 (see Timing Specification Table) DRDY
cycles for the modulator and the digital filter to settle
before retrieving data.
In this mode the OSR is 12 for fclk = 60MHz and the
data rate in 5MSPS. Typical SNR performance
increases by 4dB. THD remains approximately the
same.
60MHz MODE
In this mode, decimation filters are bypassed. This
data output can be filtered externally by the user. For
fclk = 60MHz, the data rate is 60MSPS.
POWER SUPPLIES
Two supplies are used on the ADS1610: analog
(AVDD), and digital (DVDD). Each supply (other than
DVDD pins 49 and 50) must be suitably bypassed to
achieve the best performance. It is recommended
that a 1µF and 0.1µF ceramic capacitor be placed as
close to each supply pin as possible. Connect each
supply-pin bypass capacitor to the associated
ground, as shown in Figure 41. Each main supply
bus should also be bypassed with a bank of
capacitors from 47µF to 0.1µF, as shown in
Figure 41.
ANALOG POWER DISSIPATION
An external resistor connected between the RBIAS
pin and the analog ground sets the analog current
level, as shown in Figure 40. The current is inversely
proportional to the resistor value. Table 5 shows the
recommended values of RBIAS for different CLK
frequencies. Notice that the analog current can be
reduced when using a slower frequency CLK input
because the modulator has more time to settle.
Avoid adding any capacitance in parallel to RBIAS,
since this will interfere with the internal circuitry used
to set the biasing.
For optimum performance, insert a 10Ω resistor in
series with the AVDD2 supply (pin 58); the modulator
clocking circuitry. This resistor decouples switching.
ADS1610
RBIAS
RBIAS
AGND
Figure 40. External Resistor Used to Set
Analog Power Dissipation
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DVDD
mF
0.1
47mF
4.7mF
1 mF
(1)
(1)
CP
CP
(1)
CP
Ω
10
AVDD
47
4.7
mF
1
0.1
mF
mF
mF
58
57
55
54
53
52
51
50
49
1
AGND
(1)
CP
2
3
AVDD
AGND
If using separate analog and
digital ground planes, connect
together on the ADS1610 PCB.
6
AGND
(1)
CP
AVDD
AGND
7
9
ADS1610
DGND
AGND
(1)
CP
AVDD
AGND
10
11
(1)
CP
12
AVDD
18
19
25
26
(1)
(1)
CP
CP
(2)
0.1mF
Bypass
NOTES: (1) CP = 1mF
capacitors not required at pins 49 and 50.
Figure 41. Recommended Power-Supply Bypassing
planes, one for the analog grounds and one for the
digital grounds. When using only one common plane,
isolate the flow of current on AGND2 (pin 57) from
pin 1; use breaks on the ground plane to accomplish
this. AGND2 carries the switching current from the
analog clocking for the modulator and can corrupt
the quiet analog ground on pin 1. When using two
planes, it is recommended that they be tied together
right at the PCB. Do not try to connect the ground
planes together after running separately through
edge connectors or cables as this reduces
performance and increases the likelihood of latch-up.
LAYOUT ISSUES
The ADS1610 is a very high-speed, high-resolution
data converter. In order to achieve the maximum
performance, careful attention must be given to the
printed circuit board (PCB) layout. Use good
high-speed techniques for all circuitry. Critical
capacitors should be placed close to pins as
possible. These include capacitors directly connected
to the analog and reference inputs and the power
supplies. Make sure to also properly bypass all
circuitry driving the inputs and references.
Two approaches can be used for the ground planes:
either a single common plane; or two separate
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In general, keep the resistances used in the driving
circuits for the inputs and reference low to prevent
excess thermal noise from degrading overall
performance. Avoid having the ADS1610 digital
outputs drive heavy loads. Buffers on the outputs are
recommended unless the ADS1610 is connected
directly to a DSP or controller situated nearby.
Additionally, make sure the digital inputs are driven
with clean signals as ringing on the inputs can
introduce noise.
The ADS1610 uses TI PowerPAD™ technology. The
PowerPAD is physically connected to the substrate
of the silicon inside the package and must be
soldered to the analog ground plane on the PCB
using the exposed metal pad underneath the
package for proper heat dissipation. See application
report SLMA002, located at www.ti.com, for more
details on the PowerPAD package.
APPLICATION INFORMATION
spaces (address or data). This can help reduce the
possibility of digital noise coupling into the ADS1610.
When not using this signal, replace NAND gate U1
with an inverter between R/W and RD. Two signals,
IOSTRB and A15, combine using NAND gate U2 to
select the ADS1610. If there are no additional
devices connected to the TMS320C5400 I/O space,
U2 can be eliminated. Simply connect IOSTRB
directly to CS. The ADS1610 16-bit data output bus
is directly connected to the TMS320C5400 data bus.
The data ready output (DRDY) from the ADS1610
drives interrupt INT3 on the TMS320C5400.
INTERFACING THE ADS1610 TO THE
TMS320C6000
Figure 42 illustrates how to directly connect the
ADS1610 to the TMS320C6000 DSP. The processor
controls reading using output ARE. The ADS1610 is
selected using the DSP control output, CE2. The
ADS1610 16-bit data output bus is directly connected
to the TMS320C6000 data bus. The data ready
output (DRDY) from the ADS1610 drives interrupt
EXT_INT7 on the TMS320C6000.
ADS1610
TMS320C5400
ADS1610
TMS320C6000
16
16
DOUT[15:0]
D[15:0]
DOUT[15:0]
XD[15:0]
DRDY
CS
INT3
DRDY
CS
EXT_INT7
CE2
IOSTRB
A15
U2
U1
R/W
IS
RD
RD
ARE
Figure 43. ADS1610 – TMS320C5400 Interface
Connection
Figure 42. ADS1610 – TMS320C6000 Interface
Connection
Code Composer Studio, available from TI, provides
support for interfacing TI DSPs through a collection
of data converter plug-ins. Check the TI website,
located at www.ti.com/sc/dcplug-in, for the latest
information on ADS1610 support.
INTERFACING THE ADS1610 TO THE
TMS320C5400
Figure 43 illustrates how to connect the ADS1610 to
the TMS320C5400 DSP. The processor controls the
reading using the outputs R/W and IS. The I/O
space-select signal (IS) is optional and is used to
prevent the ADS1610 RD input from being strobed
when the DSP is accessing other external memory
21
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
20-Oct-2006
PACKAGING INFORMATION
Orderable Device
ADS1610IPAPR
ADS1610IPAPRG4
ADS1610IPAPT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
HTQFP
PAP
64
64
64
64
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
HTQFP
HTQFP
HTQFP
PAP
PAP
PAP
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
ADS1610IPAPTG4
250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
20-Oct-2006
PACKAGING INFORMATION
Orderable Device
ADS1610IPAPR
ADS1610IPAPRG4
ADS1610IPAPT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
HTQFP
PAP
64
64
64
64
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
HTQFP
HTQFP
HTQFP
PAP
PAP
PAP
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
ADS1610IPAPTG4
250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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