DAC7541AJP [BB]

Low Cost 12-Bit CMOS Four-Quadrant Multiplying DIGITAL-TO-ANALOG CONVERTER; 低成本12位CMOS四象限乘法数位类比转换器
DAC7541AJP
型号: DAC7541AJP
厂家: BURR-BROWN CORPORATION    BURR-BROWN CORPORATION
描述:

Low Cost 12-Bit CMOS Four-Quadrant Multiplying DIGITAL-TO-ANALOG CONVERTER
低成本12位CMOS四象限乘法数位类比转换器

转换器
文件: 总10页 (文件大小:154K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
®
DAC7541A  
Low Cost 12-Bit CMOS  
Four-Quadrant Multiplying  
DIGITAL-TO-ANALOG CONVERTER  
FEATURES  
DESCRIPTION  
FULL FOUR-QUADRANT  
The Burr-Brown DAC7541A is a low cost 12-bit,  
four-quadrant multiplying digital-to-analog converter.  
Laser-trimmed thin-film resistors on a monolithic  
CMOS circuit provide true 12-bit integral and differ-  
ential linearity over the full specified temperature  
range.  
MULTIPLICATION  
12-BIT END-POINT LINEARITY  
DIFFERENTIAL LINEARITY ±1/2LSB MAX  
OVER TEMPERATURE  
MONOTONICITY GUARANTEED OVER  
DAC7541A is a direct, improved pin-for-pin replace-  
ment for 7521, 7541, and 7541A industry standard  
parts. In addition to a standard 18-pin plastic package,  
the DAC7541A is also available in a surface-mount  
plastic 18-pin SOIC.  
TEMPERATURE  
TTL-/CMOS-COMPATIBLE  
SINGLE +5V TO +15V SUPPLY  
LATCH-UP RESISTANT  
7521/7541/7541A REPLACEMENT  
PACKAGES: Plastic DIP, Plastic SOIC  
LOW COST  
VREF  
10k  
10kΩ  
10kΩ  
10kΩ  
20kΩ  
20kΩ  
20kΩ  
20kΩ  
20kΩ  
20kΩ  
SPDT NMOS  
Switches  
IOUT 2  
IOUT 1  
10kΩ  
Bit 1  
(MSB)  
Bit 2  
Bit 3  
Bit 11  
Bit 12  
(LSB)  
RFB  
Digital Inputs (DTL-/TTL-/CMOS-compatible)  
Logic: A switch is closed to IOUT 1 for its digital input in a “HIGH” state.  
Switches shown for digital inputs “HIGH”.  
International Airport Industrial Park  
Mailing Address: PO Box 11400  
Cable: BBRCORP  
Tucson, AZ 85734  
Street Address: 6730 S. Tucson Blvd.  
Tucson, AZ 85706  
Tel: (520) 746-1111 Twx: 910-952-1111  
Telex: 066-6491  
FAX: (520) 889-1510  
Immediate Product Info: (800) 548-6132  
©1987 Burr-Brown Corporation  
PDS-639C  
Printed in U.S.A. September, 1993  
SBAS147  
SPECIFICATIONS  
ELECTRICAL  
At +25°C, +VDD = +12V or +15V, VREF = +10V, VPIN 1 = VPIN 2 = 0V, unless otherwise specified.  
DAC7541A  
(1)  
PARAMETER  
GRADE  
TA = +25°C TA = TMAX, TMIN  
UNITS  
TEST CONDITIONS/COMMENTS  
ACCURACY  
Resolution  
Relative Accuracy  
All  
J
K
J
K
J
K
12  
±1  
±1/2  
±1  
±1/2  
±6  
±1  
12  
±1  
±1/2  
±1  
±1/2  
±8  
±3  
Bits  
LSB max  
LSB max  
LSB max  
LSB max  
LSB max  
LSB max  
±1LSB = ±0.024% of FSR.  
±1/2LSB = ±0.012% of FSR.  
All grades guaranteed monotonic to 12 bits,  
TMIN to TMAX.  
Measured using internal RFB and includes effect  
of leakage current and gain T.C.  
Gain error can be trimmed to zero.  
Differential Non-linearity  
Gain Error  
Gain Temperature Coefficient  
(∆Gain/Temperature)  
Output Leakage Current: Out1 (Pin 1)  
Out2 (Pin 2)  
ALL  
J, K  
J, K  
5
±10  
±10  
ppm/°C max  
nA max  
nA max  
Typical value is 2ppm/°C.  
All digital inputs = 0V.  
All digital inputs = VDD.  
±5  
±5  
REFERENCE INPUT  
Voltage (Pin 17 to GND)  
Input Resistance (Pin 17 to GND)  
All  
All  
–10/+10  
7-18  
–10/+10  
7-18  
V min/max  
kmin/max  
Typical input resistance = 11k.  
Typical input resistance temperature coefficient is  
–50ppm/°C.  
DIGITAL INPUTS  
V
V
IN (Input HIGH Voltage)  
IL (Input LOW Voltage)  
All  
All  
All  
2.4  
0.8  
±1  
2.4  
0.8  
±1  
V min  
V max  
µA max  
I
IN (Input Current)  
Logic inputs are MOS gates.  
I
IN typ (25°C) = 1nA  
C
IN (Input Capacitance)(2)  
All  
All  
All  
8
8
pF max  
VIN = 0V  
POWER SUPPLY REJECTION  
Gain/VDD  
±0.01  
±0.02  
% per % max  
VDD = +11.4V to +16V  
POWER SUPPLY  
VDD Range  
+5 to +16  
+5 to +16  
V min to  
V max  
Accuracy is not guaranteed over this range.  
IDD  
All  
All  
2
100  
2
500  
mA max  
µA max  
All digital inputs VIL or VIN  
All digital inputs 0V or VDD.  
.
NOTES: (1) Temperature ranges are: = 0°C to + 70°C for JP, KP, JU and KU versions. (2) Guaranteed by design but not production tested.  
AC PERFORMANCE CHARACTERISTICS  
These characteristics are included for design guidance only and are not production tested.  
VDD = +15V, VREF = +10V except where stated, VPIN 1 = VPIN 2 = 0V, output amp is OPA606 except where stated.  
DAC7541A  
(1)  
PARAMETER  
GRADE  
TA = +25°C TA = TMAX, TMIN  
UNITS  
TEST CONDITIONS/COMMENTS  
PROPAGATION DELAY  
(from Digital Input change to 90% of  
final Analog Output)  
Out1 Load = 100, CEXT = 13pF.  
Digital Inputs = 0V to VDD or VDD to 0V.  
All  
All  
100  
ns typ  
DIGITAL-TO-ANALOG GLITCH  
IMPULSE  
VREF = 0V, all digital inputs 0V to VDD or VDD to  
0V. Measured using OPA606 as output amplifier.  
1000  
nV-s typ  
MULTIPLYING FEEDTHROUGH  
ERROR  
(VREF to Out1)  
All  
1.0  
mVp-p max  
VREF = ±10V, 10kHz sine wave.  
OUTPUT CURRENT SETTLING TIME  
All  
All  
0.6  
1.0  
µs typ  
To 0.01% of Full Scale Range.  
Out1 Load = 100, CEXT = 13pF.  
Digital Inputs: 0V to VDD or VDD to 0V.  
µs max  
OUTPUT CAPACITANCE  
COUT 1 (Pin 1)  
COUT 2 (Pin 2)  
COUT 1 (Pin 1)  
COUT 2 (Pin 2)  
All  
All  
All  
All  
100  
60  
70  
100  
60  
70  
pF max  
pF max  
pF max  
pF max  
Digital Inputs = VIH  
Digital Inputs = VIH  
Digital Inputs = VIL  
Digital Inputs = VIL  
100  
100  
NOTE: (1) Temperature ranges are: = 0°C to + 70°C for JP, KP, JU and KU versions.  
®
2
DAC7541A  
ABSOLUTE MAXIMUM RATINGS(1)  
PIN CONNECTIONS  
VDD (Pin 16) to Ground ...................................................................... +17V  
Top View  
DIP/SOIC  
VREF (Pin 17) to Ground ..................................................................... +25V  
VRPB (Pin 18) to Ground ..................................................................... ±25V  
Digital Input Voltage (pins 4-15) to Ground ...............................0.4V, VDD  
VPIN 1, VPIN 2 to Ground ............................................................. –0.4V, VDD  
Power Dissipation (any Package):  
To +75°C ..................................................................................... 450mW  
Derates above +75°C .............................................................. –6mW/°C  
Lead Temperature (soldering, 10s)................................................ +300°C  
Storage Temperature: Plastic Package ......................................... +125°C  
1
2
3
4
5
6
7
8
9
18 RFB  
IOUT 1  
IOUT 2  
17 VREF  
16 +VDD  
15 Bit 12 (LSB)  
14 Bit 11  
13 Bit 10  
12 Bit 9  
GND  
Bit 1 (MSB)  
Bit 2  
DAC7541A  
NOTE: (1) Stresses above those listed above may cause permanent damage to  
the device. This is a stress rating only and functional operation of the device at  
these or any other condition above those indicated in the operational sections of  
thisspecificationisnotimplied.Exposuretoabsolutemaximumratingconditions  
for extended periods may affect device reliability.  
Bit 3  
Bit 4  
Bit 5  
11 Bit 8  
Bit 6  
10 Bit 7  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
PACKAGE INFORMATION  
PACKAGE DRAWING  
NUMBER(1)  
The DAC7541A is an ESD (electrostatic discharge) sensi-  
tive device. The digital control inputs have a special FET  
structure, which turns on when the input exceeds the supply  
by 18V, to minimize ESD damage. However, permanent  
damage may occur on unconnected devices subject to high  
energy electrostatic fields. When not in use, devices must be  
stored in conductive foam or shunts. The protective foam  
should be discharged to the destination socket before  
devices are removed.  
MODEL  
PACKAGE  
DAC7541JP  
DAC7541KP  
Plastic DIP  
Plastic DIP  
218  
218  
DAC7541JU  
DAC7541KU  
Plastic SOIC  
Plastic SOIC  
219  
219  
DAC7541JP-BI  
DAC7541KP-BI  
Plastic DIP  
Plastic DIP  
218  
218  
NOTE: (1) For detailed drawing and dimension table, please see end of data  
sheet, or Appendix D of Burr-Brown IC Data Book.  
BURN-IN SCREENING  
Burn-in screening is an option available for the models in the  
Ordering Information table. Burn-in duration is 160 hours at  
the indicated temperature (or equivalent combination of time  
and temperature).  
All units are tested after burn-in to ensure that grade speci-  
fications are met. To order burn-in, add “-BI” to the base  
model number.  
ORDERING INFORMATION  
TEMPERATURE  
RELATIVE  
MODEL  
PACKAGE  
RANGE  
ACCURACY (LSB)  
GAIN ERROR (LSB)  
DAC7541AJP  
DAC7541AKP  
DAC7541AJU  
DAC7541AKU  
Plastic DIP  
Plastic DIP  
Plastic SOIC  
Plastic SOIC  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
±1  
±1/2  
±1  
±6  
±1  
±6  
±1  
±1/2  
BURN-IN SCREENING OPTION  
See text for details.  
TEMPERATURE  
RANGE  
RELATIVE  
ACCURACY (LSB)  
BURN-IN TEMP.  
(160 Hours)(1)  
MODEL  
PACKAGE  
DAC7541AJP-BI  
DAC7541AKP-BI  
Plastic DIP  
Plastic DIP  
0°C to +70°C  
0°C to +70°C  
±1  
±1/2  
+85°C  
+85°C  
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN  
assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject  
to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not  
authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.  
®
3
DAC7541A  
PAD  
FUNCTION  
PAD  
FUNCTION  
1
2
3
4
5
6
7
8
9
IOUT1  
IOUT2  
GND  
Bit 1 (MSB)  
Bit 2  
10  
11  
12  
13  
14  
15  
16  
17  
18  
Bit 7  
Bit 8  
Bit 9  
Bit 10  
Bit 11  
Bit 12 (LSB)  
+VDD  
VREF  
RFEEDBACK  
Bit 3  
Bit 4  
Bit 5  
Bit 6  
Substrate Bias: Isolated.  
NC: No Connection.  
MECHANICAL INFORMATION  
MILS (0.001")  
MILLIMETERS  
Die Size  
Die Thickness  
Min. Pad Size  
104 x 105 ±5  
20 ±3  
2.64 x 2.67 ±0.13  
0.51 ±0.08  
0.10 x 0.10  
4 x 4  
Metalization  
Aluminum  
DIE TOPOLOGY DAC7541A  
TYPICAL PERFORMANCE CURVES  
TA = +25°C, VDD = +15V, unless otherwise noted.  
GAIN ERROR vs SUPPLY VOLTAGE  
3
FEEDTHROUGH ERROR vs FREQUENCY  
10  
1
5/2  
2
3/2  
1
0.10  
0.010  
0.001  
1/2  
0
0
5
10  
15  
100  
1k  
10k  
100k  
1M  
Supply Voltage (V)  
Frequency (Hz)  
LINEARITY vs SUPPLY VOLTAGE  
SUPPLY CURRENT vs SUPPLY VOLTAGE  
3/2  
5/4  
1
3/2  
5/4  
1
3/4  
1/2  
3/4  
1/2  
VIH = +2.4V  
1/4  
0
1/4  
0
VIH = VDD  
0
5
10  
15  
0
5
10  
15  
Supply Voltage (V)  
Supply Voltage (V)  
®
4
DAC7541A  
DISCUSSION  
OF SPECIFICATIONS  
CIRCUIT DESCRIPTION  
The DAC7541A is a 12-bit multiplying D/A converter  
consisting of a highly stable thin-film R-2R ladder network  
and 12 pairs of current steering switches on a monolithic  
chip. Most applications require the addition of a voltage or  
current reference and an output operational amplifier.  
RELATIVE ACCURACY  
This term (also known as linearity) describes the transfer  
function of analog output to digital input code. The linearity  
error describes the deviation from a straight line between  
zero and full scale.  
A simplified circuit of the DAC7541A is shown in Figure 1.  
The R-2R inverted ladder binarily divides the input currents  
that are switched between IOUT 1 and IOUT 2 bus lines. This  
switching allows a constant current to be maintained in each  
ladder leg independent of the input code.  
DIFFERENTIAL NONLINEARITY  
Differential nonlinearity is the deviation from an ideal 1LSB  
change in the output, from one adjacent output state to the  
next. A differential nonlinearity specification of ±1.0LSB  
guarantees monotonicity.  
The input resistance at VREF (Figure 1) is always equal to  
RLDR (RLDR is the R/2R ladder characteristic resistance and  
is equal to value “R”). Since RIN at the VREF pin is constant,  
the reference terminal can be driven by a reference voltage  
or a reference current, AC or DC, of positive or negative  
polarity.  
GAIN ERROR  
Gain error is the difference in measure of full-scale output  
versus the ideal DAC output. The ideal output for the  
DAC7541A is –(4095/4096) X (VREF). Gain error may be  
adjusted to zero using external trims.  
VREF  
10kΩ  
10kΩ  
10kΩ  
OUTPUT LEAKAGE CURRENT  
The measure of current which appears at Out1 with the DAC  
loaded with all zeros, or at Out2 with the DAC loaded with  
all ones.  
20kΩ  
S1  
20kΩ  
S2  
20kΩ  
S3  
20kΩ  
S12  
20kΩ  
IOUT 2  
IOUT 1  
RFB  
MULTIPLYING FEEDTHROUGH ERROR  
This is the AC error output due to capacitive feedthrough  
from VREF to Out1 with the DAC loaded with all zeros. This  
test is performed at 10kHz.  
Bit 1  
(MSB)  
Bit 2  
Bit 3  
Bit 12  
(LSB)  
Digital Inputs (DTL-/TTL-/CMOS-compatible)  
Switches shown for digital inputs “HIGH”.  
OUTPUT CURRENT SETTLING TIME  
This is the time required for the output to settle to a tolerance  
of ±0.5LSB of final value from a change in code of all zeros  
to all ones, or all ones to all zeros.  
FIGURE 1. Simplified DAC Circuit.  
EQUIVALENT CIRCUIT ANALYSIS  
Figures 2 and 3 show the equivalent circuits for all digital  
inputs low and high, respectively. The reference current is  
switched to IOUT 2 when all inputs are low and IOUT 1 when  
inputs are high. The IL current source is the combination of  
surface and junction leakages to the substrate; the  
1/4096 current source represents the constant one-bit current  
drain through the ladder terminal.  
PROPAGATION DELAY  
This is the measure of the delay of the internal circuitry and  
is measured as the time from a digital code change to the  
point at which the output reaches 90% of final value.  
DIGITAL-TO-ANALOG GLITCH IMPULSE  
This is the measure of the area of the glitch energy measured  
in nV-seconds. Key contributions to glitch energy are digital  
word-bit timing differences, internal circuitry timing differ-  
ences, and charge injected from digital logic.  
DYNAMIC PERFORMANCE  
Output Impedance  
The output resistance, as in the case of the output capaci-  
tance, is also modulated by the digital input code. The  
resistance looking back into the IOUT 1 terminal may be  
anywhere between 10k(the feedback resistor alone when  
all digital inputs are low) and 7.5k(the feedback resistor  
in parallel with approximately 30kof the R-2R ladder  
network resistance when any single bit logic is high). The  
static accuracy and dynamic performance will be affected by  
this modulation. The gain and phase stability of the output  
MONOTONICITY  
Monotonicity assures that the analog output will increase or  
stay the same for increasing digital input codes. The  
DAC7541A is guaranteed monotonic to 12 bits.  
POWER SUPPLY REJECTION  
Power supply rejection is the measure of the sensitivity of  
the output (full scale) to a change in the power supply  
voltage.  
®
5
DAC7541A  
RFB  
RFB  
R = 10k  
R = 10kΩ  
IREF  
R 10kΩ  
IOUT 1  
IOUT 1  
VREF  
IL  
1/4096  
IL  
60pF  
90pF  
90pF  
55pF  
IREF  
R 10kΩ  
IOUT 2  
IOUT 2  
VREF  
1/4096  
IL  
IL  
FIGURE 2. DAC7541A Equivalent Circuit (All inputs  
LOW).  
FIGURE 3. DAC7541A Equivalent Circuit (All inputs  
HIGH).  
amplifier, board layout, and power supply decoupling will  
all affect the dynamic performance of the DAC7541A. The  
use of a compensation capacitor may be required when high-  
speed operational amplifiers are used. It may be connected  
across the amplifier’s feedback resistor to provide the nec-  
essary phase compensation to critically dampen the output.  
See Figures 4 and 6.  
BINARY INPUT  
ANALOG OUTPUT  
MSB  
LSB  
1111 1111 1111  
1000 0000 0000  
0000 0000 0001  
0000 0000 0000  
–VREF (4095/4096)  
–VREF (2048/4096)  
–VREF (1/4096)  
0V  
TABLE I. Unipolar Codes.  
C1 phase compensation (10 to 25pF) in Figure 4 may be  
required for stability when using high speed amplifiers. C1  
is used to cancel the pole formed by the DAC internal  
feedback resistance and output capacitance at Out1.  
APPLICATIONS  
OP AMP CONSIDERATIONS  
The input bias current of the op amp flows through the  
feedback resistor, creating an error voltage at the output of  
the op amp. This will show up as an offset through all codes  
of the transfer characteristics. A low bias current op amp  
such as the OPA606 is recommended.  
R1 in Figure 5 provides full scale trim capability—load the  
DAC register to 1111 1111 1111, adjust R1 for VOUT = –  
VREF (4095/4096). Alternatively, full scale can be adjusted  
by omitting R1 and R2 and trimming the reference voltage  
magnitude.  
Low offset voltage and VOS drift are also important. The  
output impedance of the DAC is modulated with the digital  
code. This impedance change (approximately 10kto 30k)  
is a change in closed-loop gain to the op amp. The result is  
that VOS will be multiplied by a factor of one to two  
depending on the code. This shows up as a linearity error.  
Offset can be adjusted out using Figure 4. Gain may be  
adjusted using Figure 5.  
BIPOLAR FOUR-QUADRANT OPERATION  
Figure 6 shows the connections for bipolar four-quadrant  
operation. Offset can be adjusted with the A1 to A2 summing  
resistor, with the input code set to 1000 0000 0000. Gain  
may be adjusted by varying the feedback resistor of A2. The  
input/output relationship is shown in Table II.  
BINARY INPUT  
ANALOG OUTPUT  
UNIPOLAR BINARY OPERATION  
(Two-Quadrant Multiplication)  
MSB  
LSB  
1111 1111 1111  
1000 0000 0000  
0111 1111 1111  
0000 0000 0000  
+VREF (2047/2048)  
0V  
–VREF (1/2048)  
–VREF (2048/2048)  
Figure 4 shows the analog circuit connections required for  
unipolar binary (two-quadrant multiplication) operation. With  
a DC reference voltage or current (positive or negative  
polarity) applied at pin 17, the circuit is a unipolar D/A  
converter. With an AC reference voltage or current, the  
circuit provides two-quadrant multiplication (digitally con-  
trolled attenuation). The input/output relationship is shown  
in Table I.  
TABLE II. Bipolar Codes.  
®
6
DAC7541A  
MSB  
B1  
• B12  
B1  
2
B2  
4
B3  
8
B12  
VOUT = –VREF  
+
+
+ • • • +  
(
)
4096  
4
5
6
7
8
9
10 11 12 13 14 15  
RF  
Out1  
Out2  
C1  
16  
17  
18  
1
+15V  
–10V VREF +10V  
DAC7541A  
VOUT  
4095  
0 VOUT –  
VREF  
OPA604  
VREF  
4096  
2
3
Where: BN = 1 if the BN digital input is HIGH.  
BN = 0 if the BN digital input is LOW.  
10kΩ  
Single-Point Ground  
+VCC  
FIGURE 4. Basic Connection With Op Amp VOS Adjust: Unipolar (two-quadrant) Multiplying Configuration.  
MSB  
B1  
R1  
200Ω  
B12  
R2  
200kΩ  
4
5
6
7
8
9
10 11 12 13 14 15  
16  
17  
18  
+15V  
1
DAC7541A  
OPA604  
VREF  
2
3
10kΩ  
+VCC  
FIGURE 5. Basic Connection With Gain Adjust (allows adjustment up or down).  
47Ω  
+VDD  
20kΩ  
20kΩ  
OPA604  
or  
1/2 OPA2604  
C1  
33pF  
16  
18  
1
10kΩ  
VREF  
17  
A1  
DAC7541A  
VOUT  
A2  
4...15  
2
OPA604  
or  
1/2 OPA2604  
3
5kΩ  
Bits 1-12  
B1  
1
B2  
B3  
4
B12  
VOUT = +VREF  
+
+
+ • • • +  
– 1  
(
)
2
2048  
FIGURE 6. Bipolar Four-Quadrant Multiplier.  
®
7
DAC7541A  
DIGITALLY CONTROLLED GAIN BLOCK  
The DAC7541A may be used in a digitally controlled gain  
block as shown in Figure 7. This circuit gives a range of gain  
from one (all bits = one) to 4096 (LSB = one). The transfer  
function is:  
Bits 1 to 12  
VIN  
VDD  
18  
DAC7541A  
17  
16  
–VIN  
VOUT  
=
1
B1  
2
B2  
4
B3  
8
B12  
2
3
+
+
+ • • • +  
(
)
4096  
All bits off is an illegal state, as division by zero is impos-  
sible (no op amp feedback). Also, errors increase as gain  
increases, and errors are minimized at major carries (only  
one bit on at a time).  
VOUT  
OPA604  
FIGURE 7. Digitally Programmable Gain Block.  
®
8
DAC7541A  
PACKAGE OPTION ADDENDUM  
www.ti.com  
8-Jan-2007  
PACKAGING INFORMATION  
Orderable Device  
DAC7541AJP  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
PDIP  
N
18  
18  
18  
18  
18  
18  
18  
18  
18  
18  
20 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
DAC7541AJPG4  
DAC7541AJU  
PDIP  
SOP  
SOP  
PDIP  
PDIP  
SOP  
SOP  
SOP  
SOP  
N
20 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
DTC  
DTC  
N
43 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
DAC7541AJUG4  
DAC7541AKP  
43 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
20 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
DAC7541AKPG4  
DAC7541AKU  
N
20 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
DTC  
DTC  
DTC  
DTC  
43 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
DAC7541AKU/1K  
DAC7541AKU/1KG4  
DAC7541AKUG4  
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
43 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to  
discontinue any product or service without notice. Customers should obtain the latest relevant information  
before placing orders and should verify that such information is current and complete. All products are sold  
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent  
TI deems necessary to support this warranty. Except where mandated by government requirements, testing  
of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible  
for their products and applications using TI components. To minimize the risks associated with customer  
products and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent  
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,  
or process in which TI products or services are used. Information published by TI regarding third-party  
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www.ti.com/audio  
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www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
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Copyright © 2007, Texas Instruments Incorporated  

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