OPA4336EA/2K5G4 [BB]

SINGLE-SUPPLY, microPower CMOS OPERATIONAL AMPLIFIERS CMOS OPERATIONAL AMPLIFIERS; 单电源,微功耗CMOS运算放大器CMOS运算放大器
OPA4336EA/2K5G4
型号: OPA4336EA/2K5G4
厂家: BURR-BROWN CORPORATION    BURR-BROWN CORPORATION
描述:

SINGLE-SUPPLY, microPower CMOS OPERATIONAL AMPLIFIERS CMOS OPERATIONAL AMPLIFIERS
单电源,微功耗CMOS运算放大器CMOS运算放大器

运算放大器
文件: 总19页 (文件大小:1062K)
中文:  中文翻译
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OPA4336  
OPA336  
OPA2336  
OPA4336  
OPA336  
OPA2336  
SBOS068C – JANUARY 1997 – REVISED JANUARY 2005  
SINGLE-SUPPLY, microPower  
CMOS OPERATIONAL AMPLIFIERS  
microAmplifier Series  
FEATURES  
DESCRIPTION  
SINGLE-SUPPLY OPERATION  
OPA336 series microPower CMOS operational amplifiers  
are designed for battery-powered applications. They  
operate on a single supply with operation as low as 2.1V.  
The output is rail-to-rail and swings to within 3mV of the  
supplies with a 100kload. The common-mode range  
extends to the negative supply—ideal for single-supply  
applications. Single, dual, and quad versions have identical  
specifications for maximum design flexibility.  
RAIL-TO-RAIL OUTPUT (within 3mV)  
microPOWER: IQ = 20µA/Amplifier  
microSIZE PACKAGES  
LOW OFFSET VOLTAGE: 125µV max  
SPECIFIED FROM VS = 2.3V to 5.5V  
SINGLE, DUAL, AND QUAD VERSIONS  
In addition to small size and low quiescent current  
(20µA/amplifier), they feature low offset voltage  
(125µV max), low input bias current (1pA), and high open-  
loop gain (115dB). Dual and quad designs feature  
completely independent circuitry for lowest crosstalk and  
freedom from interaction.  
APPLICATIONS  
BATTERY-POWERED INSTRUMENTS  
PORTABLE DEVICES  
HIGH-IMPEDANCE APPLICATIONS  
PHOTODIODE PRE-AMPS  
PRECISION INTEGRATORS  
MEDICAL INSTRUMENTS  
TEST EQUIPMENT  
OPA336 packages are the tiny SOT23-5 surface mount  
and SO-8 surface-mount. OPA2336 come in the miniature  
MSOP-8 surface-mount, SO-8 surface-mount, and DIP-8  
packages. The OPA4336 package is the space-saving  
SSOP-16 surface-mount. All are specified from  
–40°C to +85°C and operate from –55°C to +125°C.  
A macromodel is available for download (at www.ti.com)  
for design analysis.  
OPA336  
Out  
V–  
1
2
3
5
4
V+  
OPA4336  
Out A  
–In A  
+In A  
V+  
1
2
3
4
5
6
7
8
16 Out D  
15 –In D  
14 +In D  
13 V–  
+In  
–In  
A
B
D
C
SOT23-5  
OPA2336  
OPA336  
Out A  
1
2
3
4
8
7
6
5
V+  
NC  
–In  
+In  
V–  
1
2
3
4
8
7
6
5
NC  
V+  
+In B  
–In B  
Out B  
NC  
12 +In C  
11 –In C  
10 Out C  
A
–In A  
+In A  
V–  
Out B  
–In B  
+In B  
B
Output  
NC  
9
NC  
DIP-8, SO-8, MSOP-8  
SO-8  
SSOP-16  
NC = No Connection  
NC = No Connection  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright © 1997-2005, Texas Instruments Incorporated  
www.ti.com  
PACKAGE/ORDERING INFORMATION(1)  
PACKAGE  
DRAWING  
DESIGNATOR  
PACKAGE  
MARKING  
PRODUCT  
PACKAGE-LEAD  
Single  
OPA336N  
OPA336NA  
OPA336NJ  
OPA336U  
OPA336UA  
OPA336UJ  
SOT23-5  
SOT23-5  
SOT23-5  
DBV  
DBV  
DBV  
D
D
D
A36(2)  
A36(2)  
J36  
OPA336U  
OPA336UA  
OPA336UJ  
SO-8 Surface-Mount  
SO-8 Surface-Mount  
SO-8 Surface-Mount  
Dual  
OPA2336E  
OPA2336EA  
OPA2336P  
MSOP-8 Surface-Mount  
MSOP-8 Surface-Mount  
DIP-8  
DGK  
DGK  
P
B36(2)  
B36(2)  
OPA2336P  
OPA2336PA  
DIP-8  
P
OPA2336PA  
OPA2336U  
OPA2336UA  
SO-8 Surface-Mount  
SO-8 Surface-Mount  
D
D
OPA2336U  
OPA2336UA  
Quad  
OPA4336EA  
SSOP-16 Surface-Mount  
DBQ  
OPA4336EA  
NOTES: (1) For the most current package and ordering information, see the package option addendum at the end of this data sheet. (2) Grade will be marked on  
the Reel.  
ABSOLUTE MAXIMUM RATINGS(1)  
ELECTROSTATIC  
Supply Voltage ................................................................................... 7.5V  
DISCHARGE SENSITIVITY  
Signal Input Terminals, Voltage(2) .....................(V–) –0.3V to (V+) +0.3V  
Current(2) .................................................... 10mA  
This integrated circuit can be damaged by ESD. Texas  
Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper han-  
dling and installation procedures can cause damage.  
Output Short-Circuit(3) .............................................................. Continuous  
Operating Temperature ..................................................55°C to +125°C  
Storage Temperature .....................................................55°C to +125°C  
Junction Temperature ...................................................................... 150°C  
Lead Temperature (soldering, 10s)................................................. 300°C  
ESD Rating:  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet its  
published specifications.  
Charged Device Model, OPA336 NJ and UJ only (CDM)(4) ....... 1000V  
Human Body Model (HBM)(4) ......................................................... 500V  
Machine Model (MM)(4) .................................................................. 100V  
NOTES: (1) Stresses above these ratings may cause permanent damage.  
Exposure to absolute maximum conditions for extended periods may  
degrade device reliability. These are stress ratings only. Functional opera-  
tion of the device at these conditions, or beyond the specified operating  
conditions, is not implied. (2) Input terminals are diode-clamped to the power  
supply rails. Input signals that can swing more than 0.3V beyond the supply  
rails should be current-limited to 10mA or less. (3) Short-circuit to ground,  
one amplifier per package. (4) OPA336 NJ and UJ have been tested to CDM  
of 1000V. All other previous package versions have been tested using HBM  
and MM. Results are shown.  
OPA336, 2336, 4336  
2
SBOS068C  
www.ti.com  
ELECTRICAL CHARACTERISTICS: VS = 2.3V to 5.5V  
Boldface limits apply over the specified temperature range, TA = –40°C to +85°C.  
At TA = +25°C, VS = +5V, and RL = 25kconnected to VS/2, unless otherwise noted.  
OPA336NA, UA  
OPA336N, U  
OPA2336E, P, U  
OPA2336EA, PA, UA  
OPA4336EA  
OPA336NJ, UJ  
PARAMETER  
CONDITION  
MIN  
TYP(1) MAX  
MIN  
TYP MAX MIN TYP MAX UNITS  
OFFSET VOLTAGE  
Input Offset Voltage  
vs Temperature  
vs Power Supply  
Over Temperature  
Channel Separation, dc  
VOS  
dVOS/dT  
PSRR  
±60  
±1.5  
25  
±125  
±500  
±500 ±2500  
µV  
µV/°C  
µV/V  
µV/V  
µV/V  
VS = 2.3V to 5.5V  
VS = 2.3V to 5.5V  
100  
130  
0.1  
INPUT BIAS CURRENT  
Input Bias Current  
Over Temperature  
Input Offset Current  
IB  
±1  
±1  
±10  
±60  
±10  
pA  
pA  
pA  
IOS  
NOISE  
Input Voltage Noise, f = 0.1 to 10Hz  
Input Voltage Noise Density, f = 1kHz en  
Current Noise Density, f = 1kHz  
3
40  
30  
µVp-p  
nV/Hz  
fA/Hz  
in  
INPUT VOLTAGE RANGE  
Common-Mode Voltage Range  
Common-Mode Rejection Ratio CMRR  
Over Temperature  
VCM  
–0.2  
80  
76  
(V+) –1  
76  
74  
76  
74  
V
dB  
dB  
–0.2V < VCM < (V+) –1V  
–0.2V < VCM < (V+) –1V  
90  
86  
86  
INPUT IMPEDANCE  
Differential  
Common-Mode  
1013 || 2  
1013 || 4  
|| pF  
|| pF  
OPEN-LOOP GAIN  
Open-Loop Voltage Gain  
Over Temperature  
AOL RL = 25k, 100mV < VO < (V+) – 100mV 100  
RL = 25k, 100mV < VO < (V+) – 100mV 100  
115  
106  
90  
90  
90  
90  
dB  
dB  
dB  
dB  
RL = 5k, 500mV < VO < (V+) – 500mV  
RL = 5k, 500mV < VO < (V+) – 500mV  
90  
90  
Over Temperature  
FREQUENCY RESPONSE  
Gain-Bandwidth Product  
Slew Rate  
GBW  
SR  
VS = 5V, G = 1  
VS = 5V, G = 1  
VIN • G = VS  
100  
0.03  
100  
kHz  
V/µs  
µs  
Overload Recovery Time  
OUTPUT  
Voltage Output Swing from Rail(2)  
RL = 100k, AOL 70dB  
RL = 25kΩ, AOL 90dB  
RL = 25kΩ, AOL 90dB  
RL = 5k, AOL 90dB  
RL = 5k, AOL 90dB  
3
20  
mV  
mV  
mV  
mV  
mV  
mA  
pF  
100  
100  
500  
500  
Over Temperature  
70  
Over Temperature  
Short-Circuit Current  
Capacitive Load Drive  
ISC  
CLOAD  
±5  
See Text  
POWER SUPPLY  
Specified Voltage Range  
Minimum Operating Voltage  
Quiescent Current (per amplifier)  
Over Temperature  
VS  
IQ  
2.3  
5.5  
V
V
µA  
µA  
2.1  
20  
23  
IO = 0  
32  
36  
38  
42  
IO = 0  
TEMPERATURE RANGE  
Specified Range  
Operating Range  
Storage Range  
–40  
–55  
–55  
+85  
+125  
+125  
°C  
°C  
°C  
Thermal Resistance  
SOT-23-5 Surface-Mount  
MSOP-8 Surface-Mount  
SO-8 Surface-Mount  
DIP-8  
θJA  
200  
150  
150  
100  
100  
80  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
SSOP-16 Surface-Mount  
DIP-14  
Specifications same as OPA2336E, P, U.  
NOTES: (1) VS = +5V. (2) Output voltage swings are measured between the output and positive and negative power-supply rails.  
OPA336, 2336, 4336  
3
SBOS068C  
www.ti.com  
TYPICAL CHARACTERISTICS  
At TA = +25°C, VS = +5V, and RL = 25kconnected to VS/2, unless otherwise noted.  
POWER-SUPPLY and COMMON-MODE  
REJECTION RATIO vs FREQUENCY  
OPEN-LOOP GAIN/PHASE vs FREQUENCY  
100  
100  
80  
60  
40  
20  
0
CMRR  
G
80  
60  
40  
20  
0
0
–45  
–90  
–135  
–180  
PSRR  
Φ
–20  
1
10  
100  
1k  
10k  
100k  
1M  
1
10  
100  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
QUIESCENT CURRENT vs SUPPLY VOLTAGE  
Per Amplifier  
QUIESCENT CURRENT vs TEMPERATURE  
Per Amplifier  
30  
25  
20  
15  
10  
30  
25  
20  
15  
10  
5
VS = +5V  
VS = +2.3V  
0
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
–75  
–50  
–25  
0
25  
50  
75  
100  
125  
Supply Voltage (V)  
Temperature (°C)  
SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE  
SHORT-CIRCUIT CURRENT vs TEMPERATURE  
±6  
±5  
±4  
±3  
±2  
±1  
0
8
7
6
5
4
3
2
1
0
VS = +5V  
–ISC  
+ISC  
+ISC  
+ISC  
VS = +2.3V  
–ISC  
–ISC  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
–75  
–50  
–25  
0
25  
50  
75  
100  
125  
Supply Voltage (V)  
Temperature (°C)  
OPA336, 2336, 4336  
4
SBOS068C  
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
At TA = +25°C, VS = +5V, and RL = 25kconnected to VS/2, unless otherwise noted.  
INPUT VOLTAGE AND CURRENT NOISE  
SPECTRAL DENSITY vs FREQUENCY  
CHANNEL SEPARATION vs FREQUENCY  
1k  
100  
10  
1k  
150  
140  
130  
120  
110  
Voltage Noise  
100  
10  
Dual and Quad devices, G = 1, all  
channels. Quad measured channel A  
to D or B to C—other combinations  
yield improved rejection.  
Current Noise  
1
1
10  
100  
1k  
10k  
100k  
100  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
AOL, CMRR, PSRR vs TEMPERATURE  
AOL  
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY  
VS = +5.5V  
120  
110  
100  
90  
6
5
4
3
2
1
0
PSRR  
VS = +2.3V  
CMRR  
80  
70  
–75  
–50  
–25  
0
25  
50  
75  
100  
125  
100  
1k  
10k  
100k  
Temperature (°C)  
Frequency (Hz)  
OFFSET VOLTAGE  
PRODUCTION DISTRIBUTION  
OFFSET VOLTAGE DRIFT MAGNITUDE  
PRODUCTION DISTRIBUTION  
25  
20  
15  
10  
5
25  
20  
15  
10  
5
Typical production  
distribution of  
packaged units.  
Typical production  
distribution of  
packaged units.  
0.3%  
0.1%  
0.2%  
0.1%  
0
0
Offset Voltage (µV)  
Offset Voltage Drift (µV/°C)  
OPA336, 2336, 4336  
5
SBOS068C  
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
At TA = +25°C, VS = +5V, and RL = 25kconnected to VS/2, unless otherwise noted.  
INPUT BIAS CURRENT  
INPUT BIAS CURRENT vs TEMPERATURE  
1k  
vs INPUT COMMON-MODE VOLTAGE  
4
3
2
1
0
100  
10  
1
VS = +5V  
0.1  
–75  
–50  
–25  
0
25  
50  
75  
100  
125  
0
1
2
3
4
5
Temperature (°C)  
Common-Mode Voltage (V)  
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT  
VS = +5V  
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT  
5
–2.5  
–2.0  
–1.5  
–1.0  
–0.5  
0
VS = ±2.5V  
4
3
2
1
0
–55°C  
Sourcing  
Current  
Sinking  
Current  
+125°C  
+25°C  
VS = +2.3V  
+125°C  
+125°C  
–55°C  
+25°C  
–55°C  
+25°C  
0
1
2
3
4
5
6
7
8
–0  
–1  
–2  
–3  
–4  
–5  
–6  
–7  
–8  
Output Current (mA)  
Output Current (mA)  
LARGE-SIGNAL STEP RESPONSE  
G = 1, CL = 620pF, VS = +5V  
SMALL-SIGNAL STEP RESPONSE  
G = 1, CL = 200pF, VS = +5V  
200µs/div  
50µs/div  
OPA336, 2336, 4336  
6
SBOS068C  
www.ti.com  
Normally, input bias current is approximately 1pA. How-  
ever, input voltages exceeding the power supplies can  
cause excessive current to flow in or out of the input pins.  
Momentary voltages greater than the power supply can be  
tolerated as long as the current on the input pins is limited  
to 10mA. This is easily accomplished with an input resis-  
tor, as shown in Figure 2.  
APPLICATIONS INFORMATION  
OPA336 series op amps are fabricated on a state-of-the-art  
0.6 micron CMOS process. They are unity-gain stable and  
suitable for a wide range of general-purpose applications.  
Power-supply pins should be bypassed with 0.01µF ceramic  
capacitors. OPA336 series op amps are protected against  
reverse battery voltages.  
OPERATING VOLTAGE  
+5V  
OPA336 series op amps can operate from a +2.1V to +5.5V  
single supply with excellent performance. Most behavior  
remains unchanged throughout the full operating voltage  
range. Parameters which vary significantly with operating  
voltage are shown in the typical characteristics. OPA336  
series op amps are fully specified for operation from +2.3V  
to +5.5V; a single limit applies over the supply range. In  
addition, many parameters are ensured over the specified  
temperature range, –40°C to +85°C.  
IOVERLOAD  
10mA max  
VOUT  
OPAx336  
VIN  
5kΩ  
FIGURE 2. Input Current Protection for Voltages Exceeding  
the Supply Voltage.  
CAPACITIVE LOAD AND STABILITY  
OPA336 series op amps can drive a wide range of capaci-  
tive loads. However, all op amps under certain conditions  
may become unstable. Op-amp configuration, gain, and  
load value are just a few of the factors to consider when  
determining stability.  
INPUT VOLTAGE  
The input common-mode range of OPA336 series op amps  
extends from (V–) – 0.2V to (V+) – 1V. For normal  
operation, inputs should be limited to this range. The  
absolute maximum input voltage is 300mV beyond the  
supplies. Thus, inputs greater than the input  
common-mode range but less than maximum input volt-  
age, while not valid, will not cause any damage to the op  
amp. Furthermore, the inputs may go beyond the power  
supplies without phase inversion, as shown in Figure 1,  
unlike some other op amps.  
When properly configured, OPA336 series op amps can  
drive approximately 10,000pF. An op amp in unity-gain  
configuration is the most vulnerable to capacitive load. The  
capacitive load reacts with the op amp’s output resistance,  
along with any additional load resistance, to create a pole in  
the response which degrades the phase margin. In unity gain,  
OPA336 series op amps perform well with a pure capacitive  
load up to about 300pF. Increasing gain enhances the  
amplifier’s ability to drive loads beyond this level.  
One method of improving capacitive load drive in the  
unity-gain configuration is to insert a 50to 100resistor  
inside the feedback loop, as shown in Figure 3. This reduces  
ringing with large capacitive loads while maintaining DC  
6V  
VOUT  
RS  
100Ω  
OPAx336  
VOUT  
0V  
VIN  
CL  
RL  
FIGURE 1. No Phase Inversion with Inputs Greater than the  
Power-Supply Voltage.  
FIGURE 3. Series Resistor in Unity-Gain Configuration  
Improves Capacitive Load Drive.  
OPA336, 2336, 4336  
7
SBOS068C  
www.ti.com  
accuracy. For example, with RL = 25k, OPA336 series op  
amps perform well with capacitive loads in excess of 1000pF,  
as shown in Figure 4. Without RS, capacitive load drive is  
typically 350pF for these conditions, as shown in Figure 5.  
Direct Current (DC) error at the output; however, this error  
may be insignificant. For instance, with RL = 100kand  
RS = 100, there is only about a 0.1% error at the output.  
Figure 5 shows the recommended operating regions for the  
OPA336. Decreasing the load resistance generally improves  
capacitive load drive. Figure 5 also illustrates how stability  
differs depending on where the resistive load is connected.  
With G = +1 and RL = 10kconnected to VS/2, the OPA336  
can typically drive 500pF. Connecting the same load to  
ground improves capacitive load drive to 1000pF.  
RS = 100, Load = 2k|| 1000pF, VS = +5V  
10k  
Operation Above Selected Gain  
Curve Not Recommended  
G = +2  
G = +1  
RL to Ground  
RL to Ground  
1k  
50µs/div  
FIGURE 4. Small-Signal Step Response Using Series Re-  
sistor to Improve Capacitive Load Drive.  
G = +1  
L to VS/2  
R
VS = +5V, VO = VS/2  
Alternatively, the resistor may be connected in series with  
the output outside of the feedback loop. However, if there is  
a resistive load parallel to the capacitive load, it and the  
series resistor create a voltage divider. This introduces a  
100  
5
10  
100  
Resistive Load (k)  
FIGURE 5. Stability—Capacitive Load vs Resistive Load.  
OPA336, 2336, 4336  
8
SBOS068C  
www.ti.com  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Jun-2007  
PACKAGING INFORMATION  
Orderable Device  
OPA2336E/250  
OPA2336E/250G4  
OPA2336E/2K5  
OPA2336E/2K5G4  
OPA2336EA/250  
OPA2336EA/250G4  
OPA2336EA/2K5  
OPA2336EA/2K5G4  
OPA2336P  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
MSOP  
DGK  
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
5
5
5
5
5
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
MSOP  
MSOP  
MSOP  
MSOP  
MSOP  
MSOP  
MSOP  
PDIP  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
P
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
OPA2336PA  
PDIP  
P
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
OPA2336PAG4  
OPA2336PG4  
PDIP  
P
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
PDIP  
P
50 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
OPA2336U  
SOIC  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OPA2336U/2K5  
OPA2336U/2K5G4  
OPA2336UA  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SOIC  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OPA2336UA/2K5  
OPA2336UA/2K5G4  
OPA2336UAG4  
OPA2336UG4  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SOIC  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SOIC  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OPA336N/250  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
OPA336N/250G4  
OPA336N/3K  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
OPA336N/3KG4  
OPA336NA/250  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Jun-2007  
Orderable Device  
OPA336NA/250G4  
OPA336NA/3K  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-23  
DBV  
5
5
5
5
5
5
5
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
OPA336NA/3KG4  
OPA336NJ/250  
OPA336NJ/250G4  
OPA336NJ/3K  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
OPA336NJ/3KG4  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
OPA336P  
OPA336PA  
OPA336U  
OBSOLETE  
OBSOLETE  
ACTIVE  
PDIP  
PDIP  
SOIC  
P
P
D
8
8
8
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OPA336U/2K5  
OPA336U/2K5G4  
OPA336UA  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
OBSOLETE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
8
8
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
8
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OPA336UA/2K5  
OPA336UA/2K5G4  
OPA336UAG4  
D
8
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
8
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
8
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OPA336UG4  
D
8
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OPA4336EA/250  
OPA4336EA/250G4  
OPA4336EA/2K5  
OPA4336EA/2K5G4  
OPA4336PA  
SSOP/  
QSOP  
DBQ  
DBQ  
DBQ  
DBQ  
N
16  
16  
16  
16  
14  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SSOP/  
QSOP  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SSOP/  
QSOP  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SSOP/  
QSOP  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
PDIP  
TBD  
Call TI  
Call TI  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Jun-2007  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
OPA2336E/250  
OPA2336E/2K5  
OPA2336EA/250  
OPA2336EA/2K5  
OPA2336U/2K5  
OPA2336UA/2K5  
OPA336N/250  
OPA336N/3K  
MSOP  
MSOP  
MSOP  
MSOP  
SOIC  
DGK  
DGK  
DGK  
DGK  
D
8
8
8
8
8
8
5
5
5
5
5
5
8
8
16  
250  
2500  
250  
180.0  
330.0  
180.0  
330.0  
330.0  
330.0  
179.0  
179.0  
179.0  
179.0  
179.0  
179.0  
330.0  
330.0  
180.0  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
8.4  
5.3  
5.3  
5.3  
5.3  
6.4  
6.4  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
6.4  
6.4  
6.4  
3.4  
3.4  
3.4  
3.4  
5.2  
5.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
5.2  
5.2  
5.2  
1.4  
1.4  
1.4  
1.4  
2.1  
2.1  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
2.1  
2.1  
2.1  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
8.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q1  
Q1  
Q1  
2500  
2500  
2500  
250  
SOIC  
D
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOIC  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
D
3000  
250  
8.4  
8.0  
OPA336NA/250  
OPA336NA/3K  
OPA336NJ/250  
OPA336NJ/3K  
OPA336U/2K5  
OPA336UA/2K5  
OPA4336EA/250  
8.4  
8.0  
3000  
250  
8.4  
8.0  
8.4  
8.0  
3000  
2500  
2500  
250  
8.4  
8.0  
12.4  
12.4  
12.4  
12.0  
12.0  
12.0  
SOIC  
D
SSOP/  
QSOP  
DBQ  
OPA4336EA/2K5  
SSOP/  
QSOP  
DBQ  
16  
2500  
330.0  
12.4  
6.4  
5.2  
2.1  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
OPA2336E/250  
OPA2336E/2K5  
OPA2336EA/250  
OPA2336EA/2K5  
OPA2336U/2K5  
OPA2336UA/2K5  
OPA336N/250  
OPA336N/3K  
MSOP  
MSOP  
DGK  
DGK  
DGK  
DGK  
D
8
8
250  
2500  
250  
184.0  
346.0  
184.0  
346.0  
346.0  
346.0  
195.0  
195.0  
195.0  
195.0  
195.0  
195.0  
346.0  
346.0  
190.5  
346.0  
184.0  
346.0  
184.0  
346.0  
346.0  
346.0  
200.0  
200.0  
200.0  
200.0  
200.0  
200.0  
346.0  
346.0  
212.7  
346.0  
50.0  
29.0  
50.0  
29.0  
29.0  
29.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
29.0  
29.0  
31.8  
29.0  
MSOP  
8
MSOP  
8
2500  
2500  
2500  
250  
SOIC  
8
SOIC  
D
8
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOIC  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
D
5
5
3000  
250  
OPA336NA/250  
OPA336NA/3K  
OPA336NJ/250  
OPA336NJ/3K  
OPA336U/2K5  
OPA336UA/2K5  
OPA4336EA/250  
OPA4336EA/2K5  
5
5
3000  
250  
5
5
3000  
2500  
2500  
250  
8
SOIC  
D
8
SSOP/QSOP  
SSOP/QSOP  
DBQ  
DBQ  
16  
16  
2500  
Pack Materials-Page 2  
MECHANICAL DATA  
MPDI001A – JANUARY 1995 – REVISED JUNE 1999  
P (R-PDIP-T8)  
PLASTIC DUAL-IN-LINE  
0.400 (10,60)  
0.355 (9,02)  
8
5
0.260 (6,60)  
0.240 (6,10)  
1
4
0.070 (1,78) MAX  
0.325 (8,26)  
0.300 (7,62)  
0.020 (0,51) MIN  
0.015 (0,38)  
Gage Plane  
0.200 (5,08) MAX  
Seating Plane  
0.010 (0,25) NOM  
0.125 (3,18) MIN  
0.100 (2,54)  
0.021 (0,53)  
0.430 (10,92)  
MAX  
0.010 (0,25)  
M
0.015 (0,38)  
4040082/D 05/98  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-001  
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
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