OPA547TG3 [BB]
High-Voltage, High-Current OPERATIONAL AMPLIFIER; 高电压，大电流运算放大器
| 型号： | OPA547TG3 |
| 厂家： | 
BURR-BROWN CORPORATION |
| 描述： | High-Voltage, High-Current OPERATIONAL AMPLIFIER |
| 文件： | 总18页 (文件大小：742K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPA547
O
P
A
5
4
7
O
P
A
O
P
A
5
5
4
4
7
7
SBOS056F – JANUARY 2002 – JULY 2005
High-Voltage, High-Current
OPERATIONAL AMPLIFIER
DESCRIPTION
FEATURES
The OPA547 is a low-cost, high-voltage/high-current opera-
● WIDE SUPPLY RANGE
Single Supply: +8V to +60V
Dual Supply: ±4V to ±30V
tional amplifier ideal for driving a wide variety of loads. A
laser-trimmed monolithic integrated circuit provides excellent
low-level signal accuracy and high output voltage and cur-
rent.
● HIGH OUTPUT CURRENT:
500mA Continuous
The OPA547 operates from either single or dual supplies for
design flexibility. In single-supply operation, the input com-
mon-mode range extends below ground.
● WIDE OUTPUT VOLTAGE SWING
● FULLY PROTECTED:
Thermal Shutdown
The OPA547 is internally protected against over-temperature
conditions and current overloads. In addition, the OPA547
was designed to provide an accurate, user-selected current
limit. Unlike other designs which use a “power” resistor in
series with the output current path, the OPA547 senses the
load indirectly. This allows the current limit to be adjusted
from 0mA to 750mA with a 0 to 150µA control signal. This is
easily done with a resistor/potentiometer or controlled digi-
tally with a voltage-out or current-out DAC.
Adjustable Current Limit
● OUTPUT DISABLE CONTROL
● THERMAL SHUTDOWN INDICATOR
● HIGH SLEW RATE: 6V/µs
● LOW QUIESCENT CURRENT
● PACKAGES:
7-Lead TO-220, Zip and Straight Leads
7-Lead DDPAK Surface-Mount
The Enable/Status (E/S) pin provides two functions. An input
on the pin not only disables the output stage to effectively
disconnect the load, but also reduces the quiescent current
to conserve power. The E/S pin output can be monitored to
determine if the OPA547 is in thermal shutdown.
APPLICATIONS
● VALVE, ACTUATOR DRIVERS
● SYNCHRO, SERVO DRIVERS
● POWER SUPPLIES
The OPA547 is available in an industry-standard
7-lead staggered and straight lead TO-220 package, and a
7-lead DDPAK surface-mount plastic power package. The
copper tab allows easy mounting to a heat sink or circuit
board for excellent thermal performance. It is specified for
operation over the extended industrial temperature range,
–40°C to +85°C.
● TEST EQUIPMENT
● TRANSDUCER EXCITATION
● AUDIO AMPLIFIERS
V+
VI–N
OPA547
VO
VI+N
ILIM
RCL (1/4 Watt Resistor)
RCL sets the current limit
value from 0 to 750mA.
E/S
V–
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002-2005, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
Output Current ................................................................. See SOA Curve
Supply Voltage, V+ to V– ................................................................... 60V
Input Voltage .................................................. (V–) – 0.5V to (V+) + 0.5V
Input Shutdown Voltage ........................................................................ V+
Operating Temperature ..................................................–40°C to +125°C
Storage Temperature .....................................................–55°C to +125°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering 10s)(2) .............................................. 300°C
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NOTES: (1) Stresses above these ratings may cause permanent damage. (2)
Vapor-phase or IR reflow techniques are recommended for soldering the
OPA547F surface-mount package. Wave soldering is not recommended due to
excessive thermal shock and “shadowing” of nearby devices.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see the Package Ordering Addendum at the end of this document, or see
the TI website at www.ti.com.
PIN CONFIGURATIONS
Top Front View
7-Lead
7-Lead
7-Lead
Stagger-Formed
TO-220 (T)
Straight-Formed
TO-220 (T-1)
DDPAK (FA)
Surface-Mount
1
2
3
4
1
2
3
4
1 2 3 4
5
5
6
7
5
6
7
6 7
VIN+
VIN–
ILIM V+ E/S
V– VO
VIN+
VIN–
VIN+
VIN–
ILIM V+ E/S
ILIM V+ E/S
V– VO
V– VO
NOTE: Tabs are electrically connected to the V– supply.
OPA547
2
SBOS056F
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ELECTRICAL CHARACTERISTICS
At TCASE = +25°C, VS = ±30V and E/S pin open, unless otherwise noted.
OPA547T, F
TYP
PARAMETER
CONDITION
MIN
MAX
UNITS
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
V
CM = 0, IO = 0
A = –40°C to +85°C
VS = ±4V to ±30V
±1
±25
10
±5
mV
µV/°C
µV/V
T
vs Power Supply
100
INPUT BIAS CURRENT(1)
Input Bias Current(2)
vs Temperature
VCM = 0V
–100
±0.5
±5
–500
±50
nA
nA/°C
nA
Input Offset Current
VCM = 0V
NOISE
Input Voltage Noise Density, f = 1kHz
Current Noise Density, f = 1kHz
90
200
nV/√Hz
fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range: Positive
Negative
Linear Operation
Linear Operation
VCM = (V–) –0.1V to (V+) –3V
(V+) –3
(V–) –0.1
80
(V+) –2.3
(V–) –0.2
95
V
V
dB
Common-Mode Rejection
INPUT IMPEDANCE
Differential
Common-Mode
107 || 6
109 || 4
Ω || pF
Ω || pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain, f = 10Hz
V
O = ±25V, RL = 1kΩ
100
115
110
dB
dB
VO = ±25V, RL = 50Ω
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Full-Power Bandwidth
Settling Time: ±0.1%
RL = 50Ω
G = 1, 50VPP, RL = 50Ω
1
MHz
V/µs
kHz
µs
6
See Typical Curve
18
G = –10, 50V Step
RL = 50Ω, G = +3V, 1W Power
Total Harmonic Distortion + Noise, f = 1kHz
0.004(3)
%
OUTPUT
Voltage Output, Positive
Negative
I
O = 0.5A
(V+) –2.2
(V–) +1.6
(V+) –1.8
(V–) +1.2
±500
(V+) –1.9
(V–) +1.3
(V+) –1.5
(V–) +0.8
V
V
V
I
O = –0.5A
IO = 0.1A
O = –0.1A
Positive
Negative
I
V
Maximum Continuous Current Output: dc
ac
mA
mArms
500
Leakage Current, Output Disabled, dc
Output Current Limit
Current Limit Range
Current Limit Equation
Current Limit Tolerance(1)
See Typical Curve
0 to ±750
LIM = (5000)(4.75)/(31600Ω + RCL
mA
A
mA
I
)
RCL = 31.6kΩ (ILIM = ±375mA),
RL = 50Ω
±10
±30
Capacitive Load Drive
See Typical Curve(4)
OUTPUT ENABLE /STATUS (E/S) PIN
Shutdown Input Mode
V
V
E/S HIGH (output enabled)
E/S LOW (output disabled)
E/S Pin Open or Forced HIGH
E/S Pin Forced LOW
E/S Pin HIGH
(V–) +2.4
V
V
µA
µA
µs
µs
(V–) +0.8
IE/S HIGH (output enabled)
E/S LOW (output disabled)
–60
–65
1
I
E/S Pin LOW
Output Disable Time
Output Enable Time
3
Thermal Shutdown Status Output
Normal Operation
Thermally Shutdown
Sourcing 20µA
Sinking 5µA, TJ > 160°C
(V–) +2.4
(V–) +3.5
(V–) +0.35
+160
V
V
°C
°C
(V–) +0.8
Junction Temperature, Shutdown
Reset from Shutdown
+140
POWER SUPPLY
Specified Voltage
Operating Voltage Range
Quiescent Current
±30
V
V
mA
mA
±4
±30
±15
I
LIM Connected to V–, IO = 0
±10
±4
Quiescent Current, Shutdown Mode
ILIM Connected to V–
TEMPERATURE RANGE
Specified Range
Operating Range
–40
–40
–55
+85
+125
+125
°C
°C
°C
Storage Range
Thermal Resistance, θJC
7-Lead DDPAK, 7-Lead TO-220
7-Lead DDPAK, 7-Lead TO-220
Thermal Resistance, θJA
7-Lead DDPAK, 7-Lead TO-220
f > 50Hz
dc
2
3
°C/W
°C/W
No Heat Sink
65
°C/W
NOTES: (1) High-speed test at TJ = +25°C. (2) Positive conventional current flows into the input terminals. (3) See Total Harmonic Distortion+Noise in the Typical
Characteristics section for additional power levels. (4) See Small-Signal Overshoot vs Load Capacitance in the Typical Characteristics section.
OPA547
SBOS056F
3
www.ti.com
TYPICAL CHARACTERISTICS
At TCASE = +25°C, VS = ±30V, and E/S pin open, unless otherwise noted.
OPEN-LOOP GAIN AND PHASE
vs FREQUENCY
120
INPUT BIAS CURRENT vs TEMPERATURE
–160
–140
–120
–100
–80
–60
–40
–20
0
VS = ±5V
RL = 50Ω
100
G
80
0
VS = ±30V
IB
60
40
20
0
φ
–45
–90
–135
–180
–20
1
10
100
1k
10k
100k
1M
10M
–75 –50 –25
0
25
50
75
100 125 150
Frequency (Hz)
Temperature (°C)
CURRENT LIMIT vs TEMPERATURE
CURRENT LIMIT vs SUPPLY VOLTAGE
±600
±500
±400
±300
±200
±100
±600
±550
±500
±450
+400
±350
±300
±250
±200
+ILIM
–ILIM
RCL = 15.9kΩ
RCL = 15.9kΩ
RCL = 31.6kΩ
RCL = 31.6kΩ
RCL = 63.4kΩ
RCL = 63.4kΩ
±15
–75 –50 –25
0
25
50
75
100 125 150
0
±5
±10
±20
±25
±30
Temperature (°C)
Supply Voltage (V)
VOLTAGE NOISE DENSITY vs FREQUENCY
QUIESCENT CURRENT vs TEMPERATURE
400
300
200
100
0
±12
±10
±8
VS = ±30V
IQ
VS = ±5V
±6
VS = ±30V
IQ Shutdown
±4
VS = ±5V
±2
1
10
100
1k
10k
100k
1M
–75 –50 –25
0
25
50
75
100 125 150
Frequency (Hz)
Temperature (°C)
OPA547
4
SBOS056F
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, VS = ±30V, and E/S pin open, unless otherwise noted.
POWER SUPPLY REJECTION
vs FREQUENCY
COMMON-MODE REJECTION vs FREQUENCY
100
120
100
80
60
40
20
0
90
80
70
60
50
40
30
20
+PSRR
–PSRR
10
100
1k
10k
100k
1M
1
10
100
1k
Frequency (Hz)
10k
100k
1M
Frequency (Hz)
OPEN-LOOP GAIN, COMMON-MODE REJECTION,
AND POWER SUPPLY REJECTION vs TEMPERATURE
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
105
100
95
120
50
40
3
AOL
115
100
95
CMRR
G = +1
G = –1
PSRR
20
10
0
90
85
90
–75 –50 –25
0
25
50
75
100 125 150
0
2k
4k
6k
8k 10k 12k 14k 16k 18k 20k
Temperature (°C)
Load Capacitance (pF)
GAIN-BANDWIDTH PRODUCT AND
SLEW RATE vs TEMPERATURE
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
1.25
1
7.5
7
0.1
0.01
RL = 50Ω
G = +3
GBW
1W
SR+
0.1W
0.75
0.5
0.25
0
6.5
6
6.25W
0.001
0.0001
SR–
5.5
5
–75 –50 –25
0
25
50
75
100 125 150
20
100
1k
Frequency (Hz)
10k 20k
Temperature (°C)
OPA547
SBOS056F
5
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, VS = ±30V, and E/S pin open, unless otherwise noted.
OUTPUT VOLTAGE SWING vs TEMPERATURE
IO = +500mA
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
3
2.5
2
IO = +100mA
2.5
2
(V+) –VO
1.5
1
1.5
IO = –500mA
1
(V–) –VO
0.5
0
0.5
0
IO = –100mA
–75 –50 –25
0
25
50
75
100 125 150
0
100
200
300
400
500
600
Temperature (°C)
Output Current (mA)
OUTPUT LEAKAGE CURRENT
vs APPLIED OUTPUT VOLTAGE
MAXIMUM OUTPUT VOLTAGE SWING
vs FREQUENCY
1
30
25
20
15
10
5
Maximum Output
RL = 10Ω
VS = ±30V
Voltage Without
Slew Rate Induced
Distortion
0.5
0
RCL = 31.6kΩ
RCL = ∞
RCL = 0
–0.5
–1
Output Disabled
VE/S < (V–) + 0.8V
0
–40
–30
–20
–10
0
10
20
30
1k
10k
100k
Frequency (Hz)
1M
Output Voltage (V)
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
20
18
16
14
12
10
8
25
20
15
10
5
Typical production
distribution of
packaged units.
Typical production
distribution of
packaged units.
6
4
2
0
0
0
5
10 15 20 25 30 35 40 45 50 55 60 65 70
–5 –4 –3 –2 –1
0
1
2
3
4
5
Offset Voltage Drift (µV/°C)
Offset Voltage (mV)
OPA547
6
SBOS056F
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TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, VS = ±35V, and E/S pin open, unless otherwise noted.
SMALL SIGNAL STEP RESPONSE
G = 1, CL = 1000pF
SMALL SIGNAL STEP RESPONSE
G = 3, CL = 1000pF
2µs/div
2µs/div
LARGE SIGNAL STEP RESPONSE
G = 3, CL = 100pF, RL = 50Ω
5µs/div
OPA547
SBOS056F
7
www.ti.com
With the OPA547, the simplest method for adjusting the
current limit uses a resistor or potentiometer connected
between the ILIM pin and V– according to the Equation 1:
APPLICATIONS INFORMATION
Figure 1 shows the OPA547 connected as a basic noninverting
amplifier. The OPA547 can be used in virtually any op amp
configuration.
(5000)(4.75)
(1)
RCL
=
– 31.6kΩ
Power-supply terminals should be bypassed with low series
impedance capacitors. The technique shown, using a ce-
ramic and tantalum type in parallel, is recommended. Power-
supply wiring should have low series impedance.
ILIM
The low-level control signal (0µA to 150µA) also allows the
current limit to be digitally controlled with a current-out or
voltage-out DAC reference to V– according to the equations
given in Figure 3.
V+
Figure 3 shows a simplified schematic of the internal circuitry
used to set the current limit. Leaving the ILIM pin open
programs the output current to zero, while connecting ILIM
directly to V– programs the maximum output current limit,
typically 750mA.
10µF
R2
R1
+
G = 1+
0.1µF(2)
R1
R2
5
E/S
SAFE OPERATING AREA
7
2
6
Stress on the output transistors is determined both by the
output current and by the output voltage across the conduct-
ing output transistor, VS – VO. The power dissipated by the
output transistor is equal to the product of the output current
and the voltage across the conducting transistor, VS – VO.
The Safe Operating Area (SOA curve, Figure 2) shows the
permissible range of voltage and current.
VO
OPA547
VIN
3
ZL
1
(1)
ILIM
4
0.1µF(2)
10µF
+
V–
SAFE OPERATING AREA
1k
NOTES: (1) ILIM connected to V– gives the maximum
Current-Limited
current limit, 750mA (peak). (2) Connect 0.1µF capacitors
directly to package power-supply pins.
TC = 25°C
Output current may
TC = 85°C
be limited to less
FIGURE 1. Basic Circuit Connections.
than 500mA—see text.
TC = 125°C
100
POWER SUPPLIES
The OPA547 operates from single (+8V to +60V) or dual
(±4V to ±30V) supplies with excellent performance. Most
behavior remains unchanged throughout the full operating
voltage range. Parameters which vary significantly with oper-
ating voltage are shown in the typical characteristic curves.
Pulse Operation Only (<50% Duty-Cycle)
10
1
2
5
10
20
50
100
VS – VO (V)
FIGURE 2. Safe Operating Area.
Some applications do not require equal positive and negative
output voltage swing. Power-supply voltages do not need to
be equal. The OPA547 can operate with as little as 8V
between the supplies and with up to 60V between the
supplies. For example, the positive supply could be set to
55V with the negative supply at –5V, or vice-versa.
The safe output current decreases as VS – VO increases.
Output short-circuits are a very demanding case for SOA. A
short-circuit to ground forces the full power-supply voltage
(V+ or V–) across the conducting transistor. With TC = 25°C
the maximum output current of 500mA can be achieved
under most conditions. Increasing the case temperature
reduces the safe output current that can be tolerated without
activating the thermal shutdown circuit of the OPA547. For
further insight on SOA, consult Application Bulletin SBOA022.
ADJUSTABLE CURRENT LIMIT
The OPA547 features an accurate, user-selected current
limit. Current limit is set from 0mA to 750mA by controlling
the input to the ILIM pin. Unlike other designs which use a
power resistor in series with the output current path, the
OPA547 senses the load indirectly. This allows the current
limit to be set with a 0µA to 150µA control signal. In contrast,
other designs require a limiting resistor to handle the full
output current (750mA in this case).
POWER DISSIPATION
Power dissipation depends on power supply, signal, and load
conditions. For dc signals, power dissipation is equal to the
product of output current times the voltage across the con-
OPA547
8
SBOS056F
www.ti.com
ducting output transistor. Power dissipation can be mini-
mized by using the lowest possible power-supply voltage
necessary to assure the required output voltage swing.
ambient conditions. Consult Application Bulletin SBOA021 for
information on determining heat sink requirements. The inter-
nal protection circuitry was designed to protect against over-
load conditions. It does not activate until the junction tempera-
ture reaches approximately 160°C and was not intended to
replace proper heat sinking. Continuously running the OPA547
into thermal shutdown will degrade reliability.
For resistive loads, the maximum power dissipation occurs at
a dc output voltage of one-half the power-supply voltage.
Dissipation with ac signals is lower. Application Bulletin
SBOA022 explains how to calculate or measure power
dissipation with unusual signals and loads.
The tab of the DDPAK surface-mount version should be
soldered to a circuit board copper area for good heat dissi-
pation. Figure 4 shows typical thermal resistance from junc-
tion to ambient as a function of the copper area.
HEAT SINKING
Most applications require a heat sink to assure that the
maximum junction temperature (150°C) is not exceeded. The
heat sink required depends on the power dissipated and on
RESISTOR METHOD
DAC METHOD (Current or Voltage)
G = 5000
31.6kΩ
G = 5000
31.6kΩ
VO
VO
4.75V
4.75V
3
3
D/A
RCL
0.01µF
(optional, for noisy
environments)
4
4
V–
IDAC = ILIM /5000
VDAC = (V–) + 4.75V – (31.6kΩ) (ILIM)/5000
V–
5000 (4.75V)
ILIM
RCL
=
– 31.6kΩ
OPA547 CURRENT LIMIT: 0mA to 750mA
DESIRED
CURRENT LIMIT
RESISTOR(1)
(RCL
CURRENT DAC
VOLTAGE DAC
(VDAC
)
(IDAC
)
)
0mA
I
LIM Open
205kΩ
31.6kΩ
15.8kΩ
0µA
20µA
75µA
100µA
150µA
(V–) + 4.75V
(V–) + 4.12V
(V–) + 2.38V
(V–) + 1.59V
(V–) + 0.01V
100mA
375mA
500mA
750mA
I
LIM Shorted to V–
NOTE: (1) Resistors are nearest standard 1% values.
FIGURE 3. Adjustable Current Limit.
THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
Circuit Board Copper Area
50
40
30
20
10
0
OPA547F
Surface-Mount Package
1oz copper
OPA547
0
1
2
3
4
5
Surface-Mount Package
Copper Area (inches2)
FIGURE 4. Thermal Resistance versus Circuit Board Copper Area.
OPA547
SBOS056F
9
www.ti.com
THERMAL PROTECTION
V+
The OPA547 has thermal shutdown that protects the ampli-
fier from damage. Activation of the thermal shutdown circuit
during normal operation is an indication of excessive power
dissipation or an inadequate heat sink. Depending on load
and signal conditions, the thermal protection circuit may
cycle on and off. This limits the dissipation of the amplifier but
may have an undesirable effect on the load.
5V
OPA547
E/S
1
6
5
(1)
The thermal protection activates at a junction temperature of
approximately 160°C. However, for reliable operation, junc-
tion temperature should be limited to 150°C. To estimate the
margin of safety in a complete design (including heat sink),
increase the ambient temperature until the thermal protection
is activated. Use worst-case load and signal conditions. For
good reliability, the thermal protection should trigger more
than 35°C above the maximum expected ambient condition of
the application. This produces a junction temperature of
125°C at the maximum expected ambient condition.
HCT or TTL In
1
4
4N38
Optocoupler
V–
NOTE: (1) Optional—may be required to limit leakage
current of optocoupler at high temperatures.
FIGURE 6. Output Disable with Dual Supplies.
Thermal Shutdown Status
Internal thermal shutdown circuitry shuts down the output when
the die temperature reaches approximately 160°C, resetting
when the die has cooled to 140°C. The E/S pin can be
monitored to determine if shutdown has occurred. During
normal operation the voltage on the E/S pin is typically 3.5V
above the negative rail. Once shutdown has occurred this
voltage drops to approximately 350mV above the negative rail.
ENABLE/STATUS (E/S) PIN
The Enable/Status pin provides two functions: forcing this pin
low disables the output stage, or E/S can be monitored to
determine if the OPA547 is in thermal shutdown. One or both
of these functions can be utilized on the same device using
single or dual supplies. For normal operation (output en-
abled), the E/S pin can be left open or pulled high (at least
+2.4V above the negative rail).
Figure 7 gives an example of monitoring shutdown in a
single-supply application. Figure 8 provides a circuit for dual
supplies. External logic circuitry or an LED could be used to
indicate if the output has been thermally shutdown, see
Figure 13.
Output Disable
A unique feature of the OPA547 is its output disable capabil-
ity. This function not only conserves power during idle peri-
ods (quiescent current drops to approximately 4mA), but also
allows multiplexing in low frequency (f<10kHz), multichannel
applications. Signals that are greater than 10kHz may cause
leakage current to increase in devices that are shutdown.
Figure 15 shows the two OPA547s in a switched amplifier
configuration. The on/off state of the two amplifiers is con-
trolled by the voltage on the E/S pin.
V+
5V
OPA547
2.49kΩ
E/S
TTL
To disable the output, the E/S pin is pulled low, no greater than
0.8V above the negative rail. Typically the output is shutdown
in 1µs. Figure 5 provides an example of how to implement this
function using a single supply. Figure 6 gives a circuit for dual-
supply applications. To return the output to an enabled state,
the E/S pin should be disconnected (open) or pulled to at least
(V–) + 2.4V. It should be noted that pulling the E/S pin high
(output enabled) does not disable internal thermal shutdown.
V–
Zetex
ZVN3310
OR
HCT
FIGURE 7. Thermal Shutdown Status with a Single Supply.
5V
V+
V+
1kΩ
OPA547
2N3906
E/S
22kΩ
OPA547
E/S
470Ω
Zetex
ZVN3310
V–
CMOS or TTL
V–
FIGURE 5. Output Disable with a Single Supply.
10
FIGURE 8. Thermal Shutdown Status with Dual Supplies.
OPA547
SBOS056F
www.ti.com
Output Disable and Thermal Shutdown Status
As mentioned earlier, the OPA547’s output can be disabled
and the disable status can be monitored simultaneously.
Figures 9 and 10 provide examples using a single supply and
dual supplies, respectively.
OUTPUT PROTECTION
Reactive and EMF-generating loads can return load cur-
rent to the amplifier, causing the output voltage to exceed
the power-supply voltage. This damaging condition can be
avoided with clamp diodes from the output terminal to the
power supplies, as shown in Figure 11. Schottkey rectifier
diodes with a 1A or greater continuous rating are recom-
mended.
V+
OPA547
E/S
V+
V–
Open Drain
HCT
(Output Disable)
(Thermal Status
Shutdown)
R2
R1
5kΩ
R2
20kΩ
G = –
= –4
R1
VIN
FIGURE9. OutputDisableandThermalShutdownStatuswith
a Single Supply.
D1
OPA547
OUTPUT STAGE COMPENSATION
3Ω
(Carbon)
D2
Motor
The complex load impedances common in power op amp
applications can cause output stage instability. For normal
operation output compensation circuitry is not typically re-
quired. However, if the OPA547 is intended to be driven into
current limit, a R/C network may be required. Figure 11
shows an output series R/C compensation (snubber) net-
work (3Ω in series with 0.01µF) which generally provides
excellent stability. Some variations in circuit values may be
required with certain loads.
0.01µF
V–
D1, D2 : International Rectifier 11DQ06.
FIGURE 11. Motor Drive Circuit.
V+
5V
5V
1
6
5
4
OPA547
E/S
7.5kΩ
1W
TTL Out
1
6
2
(1)
Zetex
ZVN3310
4N38
5
4
Optocoupler
HCT or TTL In
2
4N38
Optocoupler
V–
NOTE: (1) Optional—may be required to limit leakage
current of optocoupler at high temperatures.
FIGURE 10. Output Disable and Thermal Shutdown Status with Dual Supplies.
OPA547
SBOS056F
11
www.ti.com
PROGRAMMABLE POWER SUPPLY
VOLTAGE SOURCE APPLICATION
A programmable power supply can easily be built using the
OPA547. Both the output voltage and output current are
user-controlled. Figure 13 shows a circuit using potentiom-
eters to adjust the output voltage and current while Figure 14
uses DACs. An LED tied to the E/S pin through a logic gate
indicates if the OPA547 is in thermal shutdown.
Figure 12 illustrates how to use the OPA547 to provide an
accurate voltage source with only three external resistors.
First, the current limit resistor, RCL, is chosen according to
the desired output current. The resulting voltage at the ILIM
pin is constant and stable over temperature. This voltage,
VCL, is connected to the noninverting input of the op amp and
used as a voltage reference, thus eliminating the need for an
external reference. The feedback resistors are selected to
gain VCL to the desired output voltage level.
R1
R2
V+
VO = VCL (1 + R2/R1)
4.75V
31.6kΩ
5000 (4.75V)
IO
=
VCL
31.6kΩ + RCL
ILIM
V–
For Example:
RCL
0.01µF
If ILIM = 375mA, RCL = 31.6kΩ
31.6kΩ • 4.75V
(Optional, for noisy
environments)
VCL
=
= 2.375V
(31.6kΩ + 31.6kΩ)
19
Uses voltage developed at ILIM pin
as a moderately accurate reference
voltage.
Desired VO = 19V, G =
= 8
2.375
1 = 1kΩ and R2 = 7kΩ
R
FIGURE 12. Voltage Source.
1kΩ
9kΩ
9kΩ
G = 1 +
= 10
1kΩ
+5V
+30V
V+
5
14.7kΩ
2
6
V
O = 0.8V to 25V(1)
OPA547
0.8V to 2.5V
Output
Adjust
E/S
7
1
4
74HCT04
ILIM
R ≥ 250Ω
3
4.7kΩ
V–
+5V
Thermal
Shutdown Status
(LED)
0V to 4.75V
1kΩ
Current
Limit
Adjust
NOTES: (1) For VO = 0V, V– = –1V.
(2) Optional: Improves noise
immunity.
0.01µF(2)
20kΩ
FIGURE 13. Resistor-Controlled Programmable Power Supply.
12
OPA547
SBOS056F
www.ti.com
1kΩ
9kΩ
+10V
VREF
OUTPUT ADJUST
+30V
G = 10
+5V
VREF A
+5V
RFB A
VO = 0.8 to 25V(1)
OPA547
10pF
IOUT A
IO = 0 to 750mA
1/2
OPA2336
74HCT04
1/2 DAC7800/1/2(3)
DAC A
R ≥ 250Ω
E/S
V–
AGND A
ILIM
Thermal
(LED)
Shutdown Status
VREF B
RFB B
10pF
IOUT B
1/2
OPA2336
1/2 DAC7800/1/2(3)
DAC B
0.01µF(2)
DGND
AGND B
CURRENT LIMIT ADJUST
NOTES: (1) For VO = 0V, V– = –1V. (2) Optional, improves noise immunity. (3) Chose DAC780X based on
digital interface: DAC7800—12-bit interface, DAC7801—8-bit interface + 4 bits, DAC7802—serial interface.
(4) Can use OPA2237, IO = 100mA to 750mA.
FIGURE 14. Digitally-Controlled Programmable Power Supply.
R1
R2
VIN1
OPA547
ILIM
AMP1
E/S
RC1
RC2
Close for high current
(Could be open drain
output of a logic gate).
VO
R3
R4
VE/S
VIN2
AMP2
V–
E/S
FIGURE 16. Multiple Current Limit Values.
VE/S > (V–) +2.4V: Amp 1 is on, Amp 2 if off
VO = –VIN1 R2
(R )
1
VE/S < (V–) +2.4V: Amp 2 is on, Amp 1 if off
VO = –VIN2 R4
(R )
3
FIGURE 15. Swap Amplifier.
OPA547
SBOS056F
13
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
OPA547F
OBSOLETE DDPAK
KTW
7
7
TBD
Call TI
CU SN
Call TI
OPA547F/500
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK
DDPAK
DDPAK
DDPAK
TO-220
TO-220
TO-220
TO-220
KTW
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
OPA547F/500G3
OPA547FKTWT
OPA547FKTWTG3
OPA547T
KTW
KTW
KTW
KVT
KC
7
7
7
7
7
7
7
500 Green (RoHS &
no Sb/Br)
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
50 Green (RoHS &
no Sb/Br)
50 Green (RoHS &
no Sb/Br)
49 Green (RoHS &
no Sb/Br)
OPA547T-1
49 Green (RoHS &
no Sb/Br)
OPA547T-1G3
OPA547TG3
KC
49 Green (RoHS &
no Sb/Br)
KVT
49 Green (RoHS &
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPSF015 – AUGUST 2001
KTW (R-PSFM-G7)
PLASTIC FLANGE-MOUNT
0.304 (7,72)
0.296 (7,52)
0.300 (7,62)
0.252 (6,40)
0.410 (10,41)
0.385 (9,78)
–A–
0.006
–B–
0.303 (7,70)
0.297 (7,54)
H
0.0625 (1,587)
0.0585 (1,485)
0.055 (1,40)
0.045 (1,14)
0.064 (1,63)
0.056 (1,42)
0.187 (4,75)
0.179 (4,55)
0.370 (9,40)
0.330 (8,38)
0.605 (15,37)
0.595 (15,11)
H
A
0.012 (0,305)
0.000 (0,00)
C
0.104 (2,64)
0.096 (2,44)
H
0.019 (0,48)
0.017 (0,43)
0.050 (1,27)
0.026 (0,66)
C
0.014 (0,36)
0.034 (0,86)
0.022 (0,57)
0°~3°
C
F
0.010 (0,25)
M
B
A M
C M
0.183 (4,65)
0.170 (4,32)
4201284/A 08/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead width and height dimensions apply to the
plated lead.
D. Leads are not allowed above the Datum B.
E. Stand–off height is measured from lead tip
with reference to Datum B.
F. Lead width dimension does not include dambar
protrusion. Allowable dambar protrusion shall not
cause the lead width to exceed the maximum
dimension by more than 0.003”.
G. Cross–hatch indicates exposed metal surface.
H. Falls within JEDEC MO–169 with the exception
of the dimensions indicated.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSOT010 – OCTOBER 1994
KC (R-PSFM-T7)
PLASTIC FLANGE-MOUNT PACKAGE
0.156 (3,96)
0.146 (3,71)
DIA
0.420 (10,67)
0.380 (9,65)
0.185 (4,70)
0.175 (4,46)
0.055 (1,40)
0.045 (1,14)
0.113 (2,87)
0.103 (2,62)
0.147 (3,73)
0.137 (3,48)
0.335 (8,51)
0.325 (8,25)
1.020 (25,91)
1.000 (25,40)
1
7
0.125 (3,18)
(see Note C)
0.122 (3,10)
0.102 (2,59)
0.030 (0,76)
0.026 (0,66)
0.010 (0,25)
0.050 (1,27)
0.300 (7,62)
M
0.025 (0,64)
0.012 (0,30)
4040251/B 01/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead dimensions are not controlled within this area.
D. All lead dimensions apply before solder dip.
E. The center lead is in electrical contact with the mounting tab.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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