REG102GA-3 [BB]

DMOS 250mA Low-Dropout Regulator; DMOS 250毫安低压差稳压器
REG102GA-3
型号: REG102GA-3
厂家: BURR-BROWN CORPORATION    BURR-BROWN CORPORATION
描述:

DMOS 250mA Low-Dropout Regulator
DMOS 250毫安低压差稳压器

稳压器
文件: 总23页 (文件大小:550K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
REG102  
R
E
G
1
0
2
R
E
G
1
0
2
SBVS024F – NOVEMBER 2000 – REVISED SEPTEMBER 2005  
DMOS  
250mA Low-Dropout Regulator  
DESCRIPTION  
FEATURES  
The REG102 is a family of low-noise, low-dropout linear  
regulators with low ground pin current. The new DMOS  
topology provides significant improvement over previous  
designs, including low-dropout voltage (only 150mV typ at  
full load), and better transient performance. In addition, no  
output capacitor is required for stability, unlike conventional  
low-dropout regulators that are difficult to compensate and  
require expensive low ESR capacitors greater than 1µF.  
NEW DMOS TOPOLOGY:  
Ultra Low Dropout Voltage:  
150mV typ at 250mA  
Output Capacitor not Required for Stability  
FAST TRANSIENT RESPONSE  
VERY LOW NOISE: 28µVrms  
HIGH ACCURACY: ±1.5% max  
HIGH EFFICIENCY:  
Typical ground pin current is only 600µA (at IOUT = 250mA)  
and drops to 10nA when not enabled. Unlike regulators with  
PNP pass devices, quiescent current remains relatively con-  
stant over load variations and under dropout conditions.  
IGND = 600µA at IOUT = 250mA  
Not Enabled: IGND = 0.01µA  
2.5V, 2.8V, 2.85V, 3.0V, 3.3V, AND 5.0V  
ADJUSTABLE OUTPUT VERSIONS  
The REG102 has very low output noise (typically 28µVrms  
for VOUT = 3.3V with CNR = 0.01µF), making it ideal for use  
in portable communications equipment. On-chip trimming  
results in high output voltage accuracy. Accuracy is main-  
tained over temperature, line, and load variations. Key pa-  
rameters are tested over the specified temperature range  
(–40°C to +85°C).  
OTHER OUTPUT VOLTAGES AVAILABLE UPON  
REQUEST  
FOLDBACK CURRENT LIMIT  
THERMAL PROTECTION  
SMALL SURFACE-MOUNT PACKAGES:  
SOT23-5, SOT223-5, and SO-8  
The REG102 is well protected—internal circuitry provides a  
current limit that protects the load from damage; furthermore,  
thermal protection circuitry keeps the chip from being dam-  
aged by excessive temperature. The REG102 is available in  
SOT23-5, SOT223-5, and SO-8 packages.  
APPLICATIONS  
PORTABLE COMMUNICATION DEVICES  
BATTERY-POWERED EQUIPMENT  
PERSONAL DIGITAL ASSISTANTS  
MODEMS  
BAR-CODE SCANNERS  
BACKUP POWER SUPPLIES  
Enable  
Enable  
VOUT  
VIN  
VOUT  
VIN  
REG102  
(Fixed Voltage  
Versions)  
+
R1  
Adj  
R2  
+
+
+
0.1µF  
(1)  
(1)  
COUT  
REG102-A  
COUT  
0.1µF  
NR  
GND  
GND  
NOTE: (1) Optional.  
NR = Noise Reduction  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright © 2000-2005, Texas Instruments Incorporated  
www.ti.com  
ABSOLUTE MAXIMUM RATINGS(1)  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
This integrated circuit can be damaged by ESD. Texas  
Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper han-  
dling and installation procedures can cause damage.  
Supply Input Voltage, VIN .......................................................0.3V to 12V  
Enable Input Voltage, VEN ....................................................... 0.3V to VIN  
Feedback Voltage, VFB ........................................................ 0.3V to 6.0V  
NR Pin Voltage, VNR .............................................................0.3V to 6.0V  
Output Short-Circuit Duration ...................................................... Indefinite  
Operating Temperature Range (TJ) ................................ 55°C to +125°C  
Storage Temperature Range (TA) ................................... 65°C to +150°C  
Lead Temperature (soldering, 3s).................................................. +240°C  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet its  
published specifications.  
NOTE: (1) Stresses above these ratings may cause permanent damage.  
Exposure to absolute maximum conditions for extended periods may degrade  
device reliability.  
PACKAGE/ORDERING INFORMATION(1)  
(2)  
PRODUCT  
VOUT  
REG102xx-yyyy/zzz  
XX is package designator.  
YYYY is typical output voltage (5 = 5.0V, 2.85 = 2.85V, A = Adjustable).  
ZZZ is package quantity.  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.  
(2) Output voltages from 2.5V to 5.1V in 50mV increments are available; minimum order quantities apply. Contact factory for details and availability.  
PIN CONFIGURATIONS  
Top View  
SOT23-5  
SO-8  
SOT223-5  
(2)  
(2)  
(3)  
(3)  
VIN  
GND  
1
2
3
5
4
VOUT  
VOUT  
VOUT  
1
2
3
4
8
7
6
5
VIN  
VIN  
Tab is GND  
Enable  
NR/Adjust(1)  
NR/Adjust(1)  
GND  
NC  
1
2
3
4
5
Enable  
(N Package)  
VIN  
GND  
NR/Adjust(1)  
Enable  
(U Package)  
VOUT  
(G Package)  
NOTES: (1) For REG102A-A: voltage setting resistor pin.  
All other models: noise reduction capacitor pin.  
(2) Both pin 1 and pin 2 must be connected.  
(3) Both pin 7 and pin 8 must be connected.  
REG102  
2
SBVS024F  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
Boldface limits apply over the specified temperature range, TJ = 40°C to +85°C.  
At TJ = +25°C, VIN = VOUT + 1V (VOUT = 2.5V for REG102-A), VENABLE = 1.8V, IOUT = 5mA, CNR = 0.01µF, and COUT = 0.1µF(1), unless otherwise noted.  
REG102NA  
REG102GA  
REG102UA  
PARAMETER  
CONDITION  
MIN  
TYP  
MAX  
UNITS  
OUTPUT VOLTAGE  
Output Voltage Range  
REG102-2.5  
REG102-2.8  
REG102-2.85  
REG102-3.0  
REG102-3.3  
REG102-5  
REG102-A  
VOUT  
2.5  
2.8  
2.85  
3.0  
3.3  
5
V
V
V
V
V
V
V
2.5  
5.5  
Reference Voltage  
Adjust Pin Current  
Accuracy  
Over Temperature  
vs Temperature  
vs Line and Load  
Over Temperature  
VREF  
IADJ  
1.26  
0.2  
±0.5  
V
µA  
%
%
ppm/°C  
%
1
±1.5  
±2.3  
dVOUT/dT  
50  
±0.8  
IOUT = 5mA to 250mA, VIN = (VOUT + 0.4V) to 10V  
±2.0  
±2.8  
VIN = (VOUT + 0.6V) to 10V  
%
DC DROPOUT VOLTAGE(2)  
For all models  
Over Temperature  
VDROP  
IOUT = 5mA  
IOUT = 250mA  
IOUT = 250mA  
4
150  
10  
220  
270  
mV  
mV  
mV  
VOLTAGE NOISE  
f = 10Hz to 100kHz  
Vn  
Without CNR (all models)  
With CNR (all fixed voltage models)  
CNR = 0, COUT = 0  
CNR = 0.01µF, COUT = 10µF  
23µVrms/V VOUT  
7µVrms/V VOUT  
µVrms  
µVrms  
OUTPUT CURRENT  
Current Limit(3)  
Over Temperature  
Short-Circuit Current Limit  
ICL  
ISC  
340  
300  
400  
150  
470  
490  
mA  
mA  
mA  
RIPPLE REJECTION  
f = 120Hz  
65  
dB  
ENABLE CONTROL  
V
ENABLE High (output enabled)  
VENABLE Low (output disabled)  
ENABLE High (output enabled)  
VENABLE  
IENABLE  
1.8  
0.2  
VIN  
0.5  
100  
100  
V
V
nA  
nA  
µs  
ms  
I
VENABLE = 1.8V to VIN, VIN = 1.8V to 6.5(4)  
VENABLE = 0V to 0.5V  
1
2
50  
1.5  
IENABLE Low (output disabled)  
Output Disable Time  
Output Enable Softstart Time  
COUT = 1.0µF, RLOAD = 13Ω  
COUT = 1.0µF, RLOAD = 13Ω  
THERMAL SHUTDOWN  
Junction Temperature  
Shutdown  
160  
140  
°C  
°C  
Reset from Shutdown  
GROUND PIN CURRENT  
Ground Pin Current  
IGND  
IOUT = 5mA  
OUT = 250mA  
VENABLE 0.5V  
400  
600  
0.01  
500  
800  
0.2  
µA  
µA  
µA  
I
Enable Pin Low  
INPUT VOLTAGE  
VIN  
Operating Input Voltage Range(5)  
Specified Input Voltage Range  
Over Temperature  
1.8  
VOUT + 0.4  
VOUT + 0.6  
10  
10  
10  
V
V
V
VIN > 1.8V  
VIN > 1.8V  
TEMPERATURE RANGE  
Specified Range  
Operating Range  
TJ  
TJ  
TA  
40  
55  
65  
+85  
+125  
+150  
°C  
°C  
°C  
Storage Range  
Thermal Resistance  
SOT23-5 Surface-Mount  
SO-8 Surface-Mount  
SOT223-5 Surface-Mount  
θJA  
θJA  
θJC  
θJA  
Junction-to-Ambient  
Junction-to-Ambient  
Junction-to-Case  
200  
150  
15  
°C/W  
°C/W  
°C/W  
°C/W  
Junction-to-Ambient  
See Figure 8  
NOTES: (1) The REG102 does not require a minimum output capacitor for stability, however, transient response can be improved with proper capacitor selection.  
(2) Dropout voltage is defined as the input voltage minus the output voltage that produces a 2% change in the output voltage from the value at VIN = VOUT  
+ 1V at fixed load.  
(3) Current limit is the output current that produces a 10% change in output voltage from VIN = VOUT + 1V and IOUT = 5mA.  
(4) For VENABLE > 6.5V, see typical characteristic IENABLE vs VENABLE  
.
(5) The REG102 no longer regulates when VIN < VOUT + VDROP (MAX). In dropout, the impedance from VIN to VOUT is typically less than 1at TJ = +25°C.  
REG102  
SBVS024F  
3
www.ti.com  
TYPICAL CHARACTERISTICS  
For all models, at TJ = +25°C and VENABLE = 1.8V, unless otherwise noted.  
OUTPUT VOLTAGE CHANGE vs IOUT  
(VIN = VOUT + 1V, Output Voltage % Change  
Referred to IOUT = 125mA at +25°C)  
0.80  
LOAD REGULATION vs TEMPERATURE  
(VIN = VOUT + 1V)  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.60  
0.40  
+25°C  
25mA < IOUT < 250mA  
5mA < IOUT < 250mA  
0.20  
+125°C  
0
0.20  
0.40  
55°C  
0.60  
0.80  
0
0
0
25 50  
75 100 125 150 175 200 225 250  
IOUT (mA)  
50  
25  
0
25  
50  
75  
100  
125  
125  
125  
Temperature (°C)  
LINE REGULATION  
(Referred to VIN = VOUT + 1V at IOUT = 125mA)  
LINE REGULATION vs TEMPERATURE  
IOUT = 250mA  
0
0.05  
0.10  
0.15  
0.20  
0.25  
0.30  
20  
15  
All Fixed Output  
Voltage Versions  
10  
IOUT = 5mA  
5
(VOUT + 1V) < VIN < 10V  
IOUT = 125mA  
0
5  
10  
15  
20  
(VOUT + 0.4V) < VIN < 10V  
IOUT = 250mA  
50  
25  
0
25  
50  
75  
100  
1
2
3
4
5
6
7
8
Temperature (°C)  
VIN VOUT (V)  
DC DROPOUT VOLTAGE vs IOUT  
DC DROPOUT VOLTAGE vs TEMPERATURE  
IOUT = 250mA  
250  
200  
150  
100  
50  
250  
200  
150  
100  
50  
+125°C  
+25°C  
55°C  
0
50  
0
25  
0
25  
50  
75  
100  
50  
100  
150  
200  
250  
Temperature (°C)  
IOUT (mA)  
REG102  
4
SBVS024F  
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
For all models, at TJ = +25°C and VENABLE = 1.8V, unless otherwise noted.  
OUTPUT VOLTAGE DRIFT HISTOGRAM  
OUTPUT VOLTAGE ACCURACY HISTOGRAM  
18  
30  
25  
20  
15  
10  
5
16  
14  
12  
10  
8
6
4
2
0
0
VOUT Drift (ppm/°C)  
Error (%)  
OUTPUT VOLTAGE vs TEMPERATURE  
(Output Voltage % Change Refered  
to IOUT = 125mA at +25°C)  
GROUND PIN CURRENT, NOT ENABLED  
vs TEMPERATURE  
1µ  
100n  
10n  
0.80  
VENABLE = 0.5V  
0.60  
0.40  
VIN = VOUT + 1V  
IOUT = 5mA  
IOUT = 125mA  
0.20  
0
0.20  
0.40  
0.60  
0.80  
1.00  
IOUT = 250mA  
1n  
100p  
50  
25  
0
25  
50  
75  
100  
125  
50  
25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
Temperature (°C)  
GROUND PIN CURRENT vs TEMPERATURE  
VOUT = 5V  
GROUND PIN CURRENT vs IOUT  
VOUT = 5.0V  
750  
725  
700  
675  
650  
625  
600  
575  
550  
800  
700  
600  
500  
400  
300  
200  
100  
0
IOUT = 250mA  
VOUT = 3.3V  
VOUT = 3.3V  
VOUT = 2.5V  
VOUT = 2.5V  
50  
25  
0
25  
50  
75  
100  
125  
0
25  
50 75 100 125 150 175 200 225 250  
IOUT (mA)  
Temperature (°C)  
REG102  
SBVS024F  
5
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
For all models, at TJ = +25°C and VENABLE = 1.8V, unless otherwise noted.  
RIPPLE REJECTION vs FREQUENCY  
RIPPLE REJECTION vs (VIN VOUT  
)
80  
30  
25  
20  
15  
10  
5
IOUT = 2mA  
70  
IOUT = 2mA  
OUT = 10µF  
60  
C
IOUT = 100mA  
50  
40  
30  
20  
10  
0
COUT = 10µF  
IOUT = 100mA  
Frequency = 100kHz  
OUT = 10µF  
OUT = 3.3V  
IOUT = 100mA  
C
V
COUT = 0µF  
0
10  
100  
1k  
10k  
100k  
1M  
10M  
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1  
0
Frequency (Hz)  
VIN VOUT (V)  
RMS NOISE VOLTAGE vs CNR  
RMS NOISE VOLTAGE vs COUT  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
60  
50  
40  
30  
20  
10  
0
REG102-5.0  
REG102-5.0  
REG102-3.3  
REG102-3.3  
REG102-2.5  
REG102-2.5  
COUT = 0µF  
10Hz < BW < 100kHz  
COUT = 0.01µF  
10Hz < BW < 100kHz  
1
10  
100  
1k  
10k  
0.1  
1
10  
CNR (pF)  
COUT (µF)  
NOISE SPECTRAL DENSITY  
NOISE SPECTRAL DENSITY  
10  
1
10  
1
IOUT = 100mA  
NR = 0µF  
IOUT = 100mA  
NR = 0.01µF  
C
C
COUT = 1µF  
COUT = 1µF  
COUT = 0µF  
0.1  
0.01  
0.1  
0.01  
COUT = 0µF  
COUT = 10µF  
COUT = 10µF  
10  
100  
1k  
10k  
100k  
10  
100  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
REG102  
6
SBVS024F  
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
For all models, at TJ = +25°C and VENABLE = 1.8V, unless otherwise noted.  
CURRENT LIMIT FOLDBACK  
3.5  
CURRENT LIMIT vs TEMPERATURE  
VIN = VOUT + 1V  
450  
400  
350  
300  
250  
200  
150  
100  
3.0  
ICL = Current Limit  
REG102-3.3  
2.5  
ICL  
2.0  
1.5  
ISC = Short-Circuit Current  
1.0  
ISC  
0.5  
0
0
50  
100 150 200 250 300 350 400 450  
Output Current (mA)  
50  
25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
LINE TRANSIENT RESPONSE  
LOAD TRANSIENT RESPONSE  
REG102-3.3  
OUT = 250mA  
REG102-3.3  
IN = 4.3V  
I
V
COUT = 0  
COUT = 0µF  
VOUT  
VOUT  
COUT = 10µF  
VOUT  
COUT = 10µF  
VOUT  
IOUT  
5.3V  
4.3V  
250mA  
25mA  
VIN  
50µs/div  
10µs/div  
TURN-ON  
TURN-OFF  
COUT = 0µF  
RLOAD = 660Ω  
COUT = 10µF  
RLOAD = 13Ω  
VOUT  
VOUT  
COUT = 0µF  
RLOAD = 13Ω  
COUT = 1.0µF  
RLOAD = 13Ω  
COUT = 10µF  
RLOAD = 13Ω  
COUT = 0µF  
RLOAD = 660Ω  
VENABLE  
VENABLE  
REG102-3.3  
V
IN = VOUT + 1V  
C
NR = 0.01µF  
REG102-3.3  
250µs/div  
200µs/div  
REG102  
SBVS024F  
7
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
For all models, at TJ = +25°C and VENABLE = 1.8V, unless otherwise noted.  
I
ENABLE vs VENABLE  
POWER UP/POWER DOWN  
10µ  
1.0µ  
100n  
10n  
VOUT = 3.0V  
RLOAD = 12  
T = +25°C  
T = 55°C  
T = +125°C  
1n  
1s/div  
6
7
8
9
10  
VENABLE (V)  
RMS NOISE VOLTAGE vs CADJ  
ADJUST PIN CURRENT vs TEMPERATURE  
80  
70  
60  
50  
40  
30  
20  
0.350  
0.300  
0.250  
0.200  
0.150  
0.100  
0.050  
0
VOUT = 3.3V  
COUT = 0.1µF  
10Hz < frequency < 100kHz  
10  
100  
1k  
10k  
100k  
50  
25  
0
25  
50  
75  
100  
125  
CADJ (pF)  
Temperature (°C)  
LOAD TRANSIENT-ADJUSTABLE VERSION  
COUT = 0  
LINE TRANSIENT-ADJUSTABLE VERSION  
COUT = 0  
VOUT  
200mV/div  
200mV/div  
VOUT  
VOUT  
IOUT  
50mV/div  
50mV/div  
COUT = 10µF  
VOUT  
COUT = 10µF  
REG102A  
REG102A  
VIN = 4.3V  
IOUT = 250mA  
CFB = 0.01µF  
VOUT = 3.3V  
250mA  
25mA  
5.3V  
4.3V  
VOUT = 3.3V  
VIN  
REG102  
8
SBVS024F  
www.ti.com  
BASIC OPERATION  
The REG102 series of LDO (low dropout) linear regulators  
offers a wide selection of fixed output voltage versions and  
an adjustable output version as well. The REG102 belongs  
to a family of new generation LDO regulators that use a  
DMOS pass transistor to achieve ultra low-dropout perfor-  
mance and freedom from output capacitor constraints. Ground  
pin current remains under 1mA over all line, load, and  
temperature conditions. All versions have thermal and over-  
current protection, including foldback current limit.  
Enable  
REG102  
GND NR  
VIN  
VOUT  
In  
Out  
COUT  
0.1µF  
CNR  
0.01µF  
Optional  
The REG102 does not require an output capacitor for regulator  
stability and is stable over most output currents and with almost  
any value and type of output capacitor up to 10µF or more. For  
applications where the regulator output current drops below  
several milliamps, stability can be enhanced by adding a 1kΩ  
to 2kload resistor, using capacitance values smaller than  
10µF, or keeping the effective series resistance greater than  
0.05including the capacitor ESR and parasitic resistance in  
printed circuit board traces, solder joints, and sockets.  
FIGURE 1. Fixed Voltage Nominal Circuit for the REG102.  
the regulator from damage under all load conditions. A  
characteristic of VOUT versus IOUT is given in Figure 3 and in  
the Typical Characteristics section.  
Although an input capacitor is not required, it is a good  
standard analog design practice to connect a 0.1µF low ESR  
capacitor across the input supply voltage. This is recom-  
mended to counteract reactive input sources and improve  
ripple rejection by reducing input voltage ripple.  
CURRENT LIMIT FOLDBACK  
3.5  
3
REG102-3.3  
2.5  
ICL  
2
Figure 1 shows the basic circuit connections for the fixed  
voltage models. Figure 2 gives the connections for the adjust-  
able output version (REG102A) and example resistor values for  
some commonly used output voltages. Values for other volt-  
ages can be calculated from the equation shown in Figure 2.  
1.5  
1
ISC  
0.5  
0
0
50  
100 150 200 250 300 350 400 450  
Output Current (mA)  
INTERNAL CURRENT LIMIT  
The REG102 internal current limit has a typical value of  
400mA. A foldback feature limits the short-circuit current to a  
typical short-circuit value of 150mA, which helps to protect  
FIGURE 3. Foldback Current Limit of the REG102-3.3 at 25°C.  
Enable  
5
EXAMPLE RESISTOR VALUES  
2
VOUT  
1
VOUT (V)  
2.5  
R1 ()(1)  
R2 ()(1)  
VIN  
CFB  
0.01µF  
REG102  
R1  
COUT  
IADJ  
11.3k  
1.13k  
11.5k  
1.15k  
4
0.1µF  
Load  
Adj  
R2  
3.0  
3.3  
5.0  
15.8k  
1.58k  
11.5k  
1.15k  
3
Gnd  
18.7k  
1.87k  
11.5k  
1.15k  
34.0k  
3.40k  
11.5k  
1.15k  
Optional  
NOTE: (1) Resistors are standard 1% values.  
Pin numbers for the SOT-223 package.  
VOUT = (1 + R1/R2) 1.26V  
To reduce current through divider, increase resistor  
values (see table at right).  
As the impedance of the resistor divider increases,  
I
ADJ (~200nA) may introduce an error.  
CFB improves noise and transient response.  
FIGURE 2. Adjustable Voltage Circuit for the REG102A.  
REG102  
SBVS024F  
9
www.ti.com  
ENABLE  
RMS NOISE VOLTAGE vs CNR  
The Enable pin is active high and compatible with standard  
TTL-CMOS levels. Inputs below 0.5V (max) turn the regula-  
tor off and all circuitry is disabled. Under this condition,  
ground pin current drops to approximately 10nA. When not  
used, the Enable pin can be connected to VIN. When a pull-  
up resistor is used, and operation below 1.8V is required, use  
pull-up resistor values below 50k.  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
REG102-5.0  
REG102-3.3  
REG102-2.5  
OUTPUT NOISE  
COUT = 0µF  
10Hz < BW < 100kHz  
A precision bandgap reference is used to generate the  
internal reference voltage, VREF. This reference is the domi-  
nant noise source within the REG102 and generates approxi-  
mately 29µVrms in the 10Hz to 100kHz bandwidth at the  
reference output. The regulator control loop gains up the  
reference noise, so that the noise voltage of the regulator is  
approximately given by:  
0.1  
10  
100  
1k  
10k  
CNR (pF)  
FIGURE 5. Output Noise versus Noise Reduction Capacitor.  
Noise can be further reduced by carefully choosing an output  
capacitor, COUT. Best overall noise performance is achieved  
with very low (< 0.22µF) or very high (> 2.2µF) values of COUT  
(see the RMS Noise Voltage vs COUT typical characteristic).  
R1 +R2  
VOUT  
VREF  
VN = 29µVrms  
= 29µVrms•  
(1)  
R2  
As the value of VREF is 1.26V, this relationship reduces to:  
µVrms  
The REG102 uses an internal charge pump to develop an  
internal supply voltage sufficient to drive the gate of the  
DMOS pass element above VIN. The charge-pump switching  
noise (nominal switching frequency = 2MHz) is not measur-  
able at the output of the regulator over most values of IOUT  
VN = 23  
VOUT  
(2)  
V
Connecting a capacitor, CNR, from the Noise Reduction (NR)  
pin to ground forms a low-pass filter for the voltage refer-  
ence. Adding CNR (as shown in Figure 4) forms a low-pass  
filter for the voltage reference. For CNR = 10nF, the total noise  
in the 10Hz to 100kHz bandwidth is reduced by approxi-  
mately a factor of 2.8 for VOUT = 3.3V. This noise reduction  
effect is shown in Figure 5 and as RMS Noise Voltage vs CNR  
in the Typical Characteristics section.  
and COUT  
.
The REG102 adjustable version does not have the noise-  
reduction pin available; however, the adjust pin is the sum-  
ming junction of the error amplifier. A capacitor, CFB, con-  
nected from the output to the adjust pin can reduce both the  
output noise and the peak error from a load transient (see the  
typical characteristics for output noise performance).  
VIN  
NR  
(fixed output  
versions only)  
CNR  
Low-Noise  
Charge Pump  
VREF  
(optional)  
(1.26V)  
DMOS  
Output  
VOUT  
Over-Current  
Over Temp  
Protection  
R1  
R2  
Enable  
Adj  
(adjustable  
versions)  
REG102  
NOTE: R1 and R2 are internal  
on fixed output versions.  
FIGURE 4. Block Diagram.  
10  
REG102  
SBVS024F  
www.ti.com  
DROPOUT VOLTAGE  
case conditions (full-scale load change with (VIN VOUT)  
voltage drop close to DC dropout levels), the REG102 can  
take several hundred microseconds to re-enter the specified  
window of regulation.  
The REG102 uses an N-channel DMOS as the pass element.  
When (VIN VOUT) is less than the drop-out voltage (VDROP),  
the DMOS pass device behaves like a resistor; therefore, for  
low values of (VIN VOUT), the regulator input-to-output  
resistance is the RdsON of the DMOS pass element (typically  
600m). For static (DC) loads, the REG102 typically main-  
tains regulation down to a (VIN VOUT) voltage drop of 150mV  
at full rated output current. In Figure 6, the bottom line (DC  
dropout) shows the minimum VIN to VOUT voltage drop re-  
quired to prevent dropout under DC load conditions.  
TRANSIENT RESPONSE  
The REG102 response to transient line and load conditions  
improves at lower output voltages. The addition of a capacitor  
(nominal value 0.47µF) from the output pin to ground can  
improve the transient response. In the adjustable version, the  
addition of a capacitor, CFB (nominal value 10nF), from the  
output to the adjust pin can also improve the transient  
response.  
For large step changes in load current, the REG102 requires  
a larger voltage drop across it to avoid degraded transient  
response. The boundary of this transient drop-out region is  
shown as the top line in Figure 6 and values of VIN to VOUT  
voltage drop above this line insure normal transient re-  
sponse.  
THERMAL PROTECTION  
Power dissipated within the REG102 can cause the junction  
temperature to rise. The REG102 has thermal shutdown  
circuitry that protects the regulator from damage which dis-  
ables the output when the junction temperature reaches  
approximately 160°C, allowing the device to cool. When the  
junction temperature cools to approximately 140°C, the out-  
put circuitry is again enabled. Depending on various condi-  
tions, the thermal protection circuit can cycle on and off. This  
limits the dissipation of the regulator, but can have an  
undesirable effect on the load.  
DROPOUT VOLTAGE vs IOUT  
350  
300  
250  
0mA to IOUT Transient  
200  
Any tendency to activate the thermal protection circuit indi-  
cates excessive power dissipation or an inadequate heat  
sink. For reliable operation, junction temperature must be  
limited to 125°C, maximum. To estimate the margin of safety  
in a complete design (including heat sink), increase the  
ambient temperature until the thermal protection is triggered;  
use worst-case loads and signal conditions. For good reliabil-  
ity, thermal protection should trigger more than 35°C above  
the maximum expected ambient condition of the application.  
This produces a worst-case junction temperature of 125°C at  
the highest expected ambient temperature and worst-case  
load.  
150  
DC  
100  
50  
0
0
50  
100  
150  
200  
250  
IOUT (mA)  
FIGURE 6. Transient and DC Dropout.  
In the transient dropout region between DC and Transient,  
transient response recovery time increases. The time required  
to recover from a load transient is a function of both the  
magnitude and rate of the step change in load current and the  
available headroom VIN to VOUT voltage drop. Under worst-  
The internal protection circuitry of the REG102 is designed to  
protect against overload conditions and is not intended to  
replace proper heat sinking. Continuously running the REG102  
into thermal shutdown will degrade reliability.  
REG102  
SBVS024F  
11  
www.ti.com  
POWER DISSIPATION  
PD = (VIN VOUT) IOUT  
(3)  
The REG102 is available in three different package configu-  
rations. The ability to remove heat from the die is different for  
each package type and, therefore, presents different consid-  
erations in the printed circuit board (PCB) layout. The PCB  
area around the device that is free of other components  
moves the heat from the device to the ambient air. Although  
it is difficult to impossible to quantify all of the variables in a  
thermal design of this type, performance data for several  
simplified configurations are shown in Figure 7. In all cases,  
the PCB copper area is bare copper (free of solder resist  
mask), not solder plated, and are for 1-ounce copper. Using  
heavier copper will increase the effectiveness in moving the  
heat from the device. In those examples where there is  
copper on both sides of the PCB, no connection has been  
provided between the two sides. The addition of plated  
through holes will improve the heat sink effectiveness.  
Power dissipation can be minimized by using the lowest  
possible input voltage necessary to assure the required  
output voltage.  
REGULATOR MOUNTING  
The tab of the SOT-223 package is electrically connected to  
ground. For best thermal performance, this tab must be  
soldered directly to a circuit-board copper area. Increasing  
the copper area improves heat dissipation, as shown in  
Figure 8.  
Although the tab of the SOT-223 is electrical ground, it is not  
intended to carry current. The copper pad that acts as a heat  
sink should be isolated from the rest of the circuit to prevent  
current flow through the device from the tab to the ground  
pin. Solder pad footprint recommendations for the various  
REG102 devices are presented in Application Bulletin Solder  
Pad Recommendations for Surface-Mount Devices  
(SBFA015), available from the Texas Instruments web site  
(www.ti.com).  
Power dissipation depends on input voltage, load conditions,  
and duty cycle and is equal to the product of the average  
output current times the voltage across the output element,  
VIN to VOUT voltage drop.  
DEVICE DISSIPATION vs TEMPERATURE  
2.5  
CONDITIONS  
#1  
2
1.5  
1
#2  
#3  
#4  
CONDITION  
PACKAGE  
PCB AREA  
θJA  
1
2
3
4
SOT-223  
SOT-223  
SO-8  
4in2 Top Side Only  
0.5in2 Top Side Only  
53°C/W  
110°C/W  
150°C/W  
200°C/W  
SOT-23  
0.5  
0
0
25  
50  
75  
100  
125  
Ambient Temperature (°C)  
FIGURE 7. Maximum Power Dissipation versus Ambient Temperature for the Various Packages and PCB Heat Sink Configurations.  
THERMAL RESISTANCE vs PCB COPPER AREA  
180  
160  
140  
120  
100  
80  
Circuit-Board Copper Area  
REG102  
Surface-Mount Package  
1 oz. copper  
θ
60  
40  
20  
REG102  
SOT-223 Surface-Mount Package  
0
0
1
2
3
4
5
Copper Area (inches2)  
FIGURE 8. Thermal Resistance versus PCB Area for the Five-Lead SOT-223.  
REG102  
12  
SBVS024F  
www.ti.com  
PACKAGE OPTION ADDENDUM  
www.ti.com  
7-May-2007  
PACKAGING INFORMATION  
Orderable Device  
REG102GA-2.5  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-223  
DCQ  
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102GA-2.5/2K5  
REG102GA-2.5/2K5G4  
REG102GA-2.5G4  
REG102GA-2.8  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
DCQ  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102GA-2.8/2K5  
REG102GA-2.8/2K5G4  
REG102GA-2.85  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102GA-2.85/2K5  
REG102GA-2.85G4  
REG102GA-2.8G4  
REG102GA-3  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102GA-3.3  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102GA-3.3/2K5  
REG102GA-3.3/2K5G4  
REG102GA-3.3G4  
REG102GA-3/2K5  
REG102GA-3/2K5G4  
REG102GA-3G4  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102GA-5  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102GA-5/2K5  
REG102GA-5/2K5G4  
REG102GA-5G4  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102GA-A  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102GA-A/2K5  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
7-May-2007  
Orderable Device  
REG102GA-A/2K5G4  
REG102GA-AG4  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-223  
DCQ  
6
6
6
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SOT-223  
SOT-223  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DCQ  
DCQ  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102GA2.85/2K5G4  
REG102NA-2.5/250  
REG102NA-2.5/250G4  
REG102NA-2.5/3K  
REG102NA-2.5/3KG4  
REG102NA-2.8/250  
REG102NA-2.8/250G4  
REG102NA-2.8/3K  
REG102NA-2.8/3KG4  
REG102NA-2.85/250  
REG102NA-2.85/3K  
REG102NA-2.85/3KG4  
REG102NA-285/250G4  
REG102NA-3.3/250  
REG102NA-3.3/250G4  
REG102NA-3.3/3K  
REG102NA-3.3/3KG4  
REG102NA-3/250  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
REG102NA-3/250G4  
REG102NA-3/3K  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
REG102NA-3/3KG4  
REG102NA-5/250  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
REG102NA-5/250G4  
REG102NA-5/3K  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
7-May-2007  
Orderable Device  
REG102NA-5/3KG4  
REG102NA-A/250  
REG102NA-A/250G4  
REG102NA-A/3K  
REG102NA-A/3KG4  
REG102UA-2.5  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-23  
DBV  
5
5
5
5
5
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
DBV  
DBV  
DBV  
DBV  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102UA-2.5/2K5  
REG102UA-2.5/2K5G4  
REG102UA-2.5G4  
REG102UA-2.8  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102UA-2.8/2K5  
REG102UA-2.8/2K5G4  
REG102UA-2.85  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102UA-2.85/2K5  
REG102UA-2.85G4  
REG102UA-2.8G4  
REG102UA-3  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102UA-3.3  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102UA-3.3/2K5  
REG102UA-3.3/2K5G4  
REG102UA-3.3G4  
REG102UA-3/2K5  
REG102UA-3/2K5G4  
REG102UA-3G4  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102UA-5  
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102UA-5/2K5  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
7-May-2007  
Orderable Device  
REG102UA-5/2K5G4  
REG102UA-5G4  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
8
8
8
8
8
8
8
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102UA-A  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102UA-A/2K5  
REG102UA-A/2K5G4  
REG102UA-AG4  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
REG102UA2.85/2K5G4  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
7-May-2007  
TAPE AND REEL INFORMATION  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
7-May-2007  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
177  
177  
177  
177  
177  
177  
177  
177  
177  
177  
177  
177  
177  
177  
(mm)  
REG102NA-2.5/250  
REG102NA-2.5/3K  
REG102NA-2.8/250  
REG102NA-2.8/3K  
REG102NA-2.85/250  
REG102NA-2.85/3K  
REG102NA-3.3/250  
REG102NA-3.3/3K  
REG102NA-3/250  
REG102NA-3/3K  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
8
8
8
8
8
8
8
8
8
8
8
8
8
8
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
4
4
4
4
4
4
4
4
4
4
4
4
4
4
8
8
8
8
8
8
8
8
8
8
8
8
8
8
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
NONE  
REG102NA-5/250  
REG102NA-5/3K  
REG102NA-A/250  
REG102NA-A/3K  
TAPE AND REEL BOX INFORMATION  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
REG102NA-2.5/250  
REG102NA-2.5/3K  
REG102NA-2.8/250  
REG102NA-2.8/3K  
REG102NA-2.85/250  
REG102NA-2.85/3K  
REG102NA-3.3/250  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
195.0  
195.0  
195.0  
195.0  
195.0  
195.0  
195.0  
200.0  
200.0  
200.0  
200.0  
200.0  
200.0  
200.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
7-May-2007  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
REG102NA-3.3/3K  
REG102NA-3/250  
REG102NA-3/3K  
REG102NA-5/250  
REG102NA-5/3K  
REG102NA-A/250  
REG102NA-A/3K  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
NSE  
195.0  
195.0  
195.0  
195.0  
195.0  
195.0  
195.0  
200.0  
200.0  
200.0  
200.0  
200.0  
200.0  
200.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
Pack Materials-Page 3  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its  
representatives against any damages arising out of the use of TI products in such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is  
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connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
microcontroller.ti.com  
www.ti.com/lpw  
Low Power  
Wireless  
Telephony  
www.ti.com/telephony  
Video & Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  

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