2302LM-E1 [BCDSEMI]
2A DDR TERMINATION REGULATOR; 2A DDR终端稳压器
| 型号： | 2302LM-E1 |
| 厂家： | 
BCD SEMICONDUCTOR MANUFACTURING LIMITED |
| 描述： | 2A DDR TERMINATION REGULATOR |
| 文件： | 总12页 (文件大小：140K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary Datasheet
2A DDR TERMINATION REGULATOR
AP2302L
General Description
Features
·
Support Both DDR I (1.25V ) and DDR II
TT
The AP2302L linear regulator is designed to meet the
JEDEC specification SSTL-2 and SSTL-18 for termi-
nation of DDR-SDRAM. The regulator can sink or
source up to 2A current continuously, providing
enough current for most DDR applications. Output
voltage is designed to track the reference voltage
within a ± 20mV tolerance for load regulation while
preventing shooting through on the output stage. On-
chip thermal limiting provides protection against a
combination of high current and ambient temperature
which would create an excessive junction temperature.
(0.9V ) Requirements
TT
·
·
·
Source and Sink Current up to 2A
High Accuracy Output Voltage at Full-load
Adjustable V
by External Resistors
OUT
·
Shutdown for Standby or Suspend Mode
Operation with High-impedance Output
Applications
The AP2302L, used in conjunction with series termi-
nation resistors, provides an excellent voltage source
for active termination schemes of high speed transmis-
sion lines as those seen in high speed memory buses
and distributed backplane designs.
·
·
·
DDR-SDRAM Termination
DDR-II Termination
SSTL-2 Termination
The AP2302L is available in SOIC-8 and TO-252-5L
packages.
TO-252-5L
SOIC-8
Figure 1. Package Types of AP2302L
Jul. 2006 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
1
Preliminary Datasheet
2A DDR TERMINATION REGULATOR
AP2302L
Pin Configuration
M Package
(SOIC-8)
D Package
(TO-252-5L)
VIN
VOUT
5
4
8
7
6
5
VCNTL
VCNTL
VCNTL
VCNTL
1
2
3
4
REFEN
GND
VCNTL (TAB)
3
2
REFEN
VOUT
GND
VIN
1
Figure 2. Pin Configuration of AP2302L (Top View)
Pin Description
Pin Number
Pin Name
Function
SOIC-8
TO-252-5L
VIN
1
2
3
4
1
2
4
5
Power Input.
Ground.
GND
REFEN
VOUT
Reference Voltage Input and Chip Enable.
Output Voltage.
Supply Voltage for Internal Circuit (Internally Connected for SOIC-8), (TAB
for TO-252-5L).
VCNTL
5, 6, 7, 8
3
Jul. 2006 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
2
Preliminary Datasheet
2A DDR TERMINATION REGULATOR
AP2302L
Functional Block Diagram
VCNTL(TAB)
V
IN
1 (1)
5,6,7,8 (3)
CURRENT
LIMIT
A(B)
A for SOIC-8
B for TO-252-5L
BANDGAP
3 (4)
OUTPUT
CONTROL
4 (5)
2 (2)
REFEN
VOUT
GND
START UP
THERMAL
PROTECT
Figure 3. Functional Block Diagram of AP2302L
Ordering Information
AP2302L
-
E1: Lead Free
Blank: Tin Lead
Circuit Type
Package
M: SOIC-8
D: TO-252-5L
TR: Tape and Reel
Blank: Tube
Package
Temperature Range
Part Number
Marking ID
Packing Type
Tube
AP2302LM-E1
AP2302LMTR-E1
AP2302LD-E1
2302LM-E1
0 to 125oC
SOIC-8
2302LM-E1
Tape ＆Reel
Tube
AP2302LD-E1
AP2302LD-E1
0 to 125oC
TO-252-5L
AP2302LDTR-E1
Tape ＆Reel
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant.
Jul. 2006 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
3
Preliminary Datasheet
2A DDR TERMINATION REGULATOR
AP2302L
Absolute Maximum Ratings (Note 1)
Value
Parameter
Symbol
VCNTL
PD
Unit
Supply Voltage for Internal Circuit
Power Dissipation
7
V
Internally Limited
W
ESD (Human Body Model)
Junction Temperature
ESD
TJ
2
KV
oC
oC
150
TSTG
Storage Temperature Range
-65 to 150
260
oC
TLEAD
Lead Temperature (Soldering, 10sec)
SOIC-8
TO-252-5L
160
130
oC/W
θJA
Package Thermal Resistance (Free Air)
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VCNTL (Note 2, 3)ꢀ
Supply Voltage for Internal Circuit
3.3
6
V
DDR I
2.5
1.8
VIN
TJ
VCNTL
Power Input
1.6
0
V
DDR II
oC
Junction Temperature
125
Note 2: Keep VCNTL ≥VIN in operation power on and power off sequences.
Note 3: For safe operation, VCNTL MUST be tied to 3.3V rather than 5V.
Jul. 2006 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
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Preliminary Datasheet
2A DDR TERMINATION REGULATOR
AP2302L
Electrical Characteristics
(TJ=25oC, VIN=2.5V, VCNTL=3.3V, VREFEN=1.25V, COUT=10µF (Ceramic), unless otherwise specified.)
Parameter
Symbol
Conditions
ΙL=0Α (Note 4)
Min
Typ
Max Unit
Output Offset Voltage
VOS
-20
0
20
mV
IL=0 to 2A
DDR I
-20
-20
0
20
IL=0 to -2A
Load
Regulation
mV
∆VOUT
IL=0 to 2A
DDR II
0
20
IL=0 to -2A
Quiescent Current of VCNTL
Leakage Current in Shutdown Mode
Protection
IQ
No Load
3
3
5
6
mA
ISHDN
VREFEN<0.2V, RL=180Ω
µA
Current Limit
ILIMIT
TSHDN
2.6
0.8
A
oC
oC
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Shutdown Function
3.3V ≤VCNTL ≤5V
150
50
Output=High
Output=Low
Shutdown Threshold Trigger
V
0.2
Note 4: VOS is the voltage measurement defined as VOUT subtracted from VREFEN
.
Jul. 2006 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
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Preliminary Datasheet
2A DDR TERMINATION REGULATOR
AP2302L
Typical Performance Characteristics
6
4
2
6
4
VCNTL=3.3V
VIN=2.5V
VCNTL=3.3V
VIN=2.5V
VOUT=1.25V
VOUT=1.25V
2
-40
-40
-20
0
20
40
60
80
100
120
-20
0
20
40
60
80
100
120
Junction Temperature (oC)
Junction Temperature (oC)
Figure 4. Sourcing Current vs. Junction Temperature
Figure 5. Sinking Current vs. Junction Temperature
650
600
650
600
550
550
VCNTL=5.0V
VCNTL=3.3V
VIN=2.5V
VIN=2.5V
500
500
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
120
Junction Temperature (oC)
Junction Temperature (oC)
Figure 7. Threshold Voltage vs. Junction Temperature
Figure 6. Threshold Voltage vs. Junction Temperature
Jul. 2006 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
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Preliminary Datasheet
2A DDR TERMINATION REGULATOR
AP2302L
Typical Performance Characteristics (Continued)
40
20
0
40
20
0
-20
-20
2
0
2
0
-2
-4
-2
-4
Time (µs)
Time (µs)
Figure 8. 0.9VTT at 2A Transient Response
(Conditions:VIN=2.5V, VCNTL=3.3V, COUT=10µF)
Figure 9. 1.25VTT at 2A Transient Response
(Conditions:VIN=2.5V, VCNTL=3.3V, COUT=10µF)
0.30
0.30
VIN=0.9V
VIN=0.85V
VIN=0.8V
VIN=0.9V
VIN=0.85V
VIN=0.8V
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.28
0.26
0.24
0.22
0.20
0.18
0.16
VCNTL=3.3V
VREFEN=1.0V
VCNTL=5V
VREFEN=1.0V
25
50
75
100
125
25
50
75
100
125
Junction Temperature (oC)
Junction Temperature (oC)
Figure 11. RDS(on) vs. Junction Temperature
Figure 10. RDS(on) vs. Junction Temperature
Jul. 2006 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
7
Preliminary Datasheet
2A DDR TERMINATION REGULATOR
AP2302L
Typical Performance Characteristics (Continued)
350
350
Package: TO-252-5L
No Heatsink
Package: SOIC-8
No Heatsink
300
300
TC=25oC
TC=50oC
TC=65oC
250
200
150
100
250
200
150
100
TC=25oC
TC=50oC
TC=65oC
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
Power Dissipation (W)
Power Dissipation (W)
Figure 13. Copper Area vs. Power Dissipation
Figure 12. Copper Area vs. Power Dissipation
Jul. 2006 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
8
Preliminary Datasheet
2A DDR TERMINATION REGULATOR
AP2302L
Typical Application
VCNTL = 3.3V
VIN = 2.5V
RTT
CCNTL
CIN
VIN
REFEN
VCNTL
AP2302L VOUT
GND
R1
EN
R2
CSS
COUT RDUMMY
Figure 14. Typical Application of AP2302L
R1 = R2 = 100KΩ, RTT = 50Ω / 33Ω / 25Ω
RDUMMY = 1KΩ, as for VOUT discharge when VIN is not present but VCNTL is present
CSS = 1µF, CIN = 470µF, CCNTL = 47µF, COUT =470µF
Jul. 2006 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
9
Preliminary Datasheet
2A DDR TERMINATION REGULATOR
AP2302L
Mechanical Dimensions
SOIC-8
Unit: mm(inch)
4.800(0.189)
5.000(0.197)
0.320(0.013)
1.350(0.053)
1.750(0.069)
0.675(0.027)
0.725(0.029)
D
5.800(0.228)
6.200(0.244)
1.270(0.050)
TYP
D
20:1
φ
0.800(0.031)
0.200(0.008)
0.100(0.004)
0.300(0.012)
0°
8°
1.000(0.039)
3.800(0.150)
4.000(0.157)
1°
5°
0.330(0.013)
0.510(0.020)
0.900(0.035)
6)
00
(0.
50
.1
R0
0.190(0.007)
0.250(0.010)
Jul. 2006 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
10
Preliminary Datasheet
2A DDR TERMINATION REGULATOR
AP2302L
Mechanical Dimensions (Continued)
TO-252-5L
Unit: mm(inch)
6.350(0.250)
6.700(0.264)
4.300(0.169)
5.500(0.217)
2.180(0.086)
2.400(0.094)
4.800(0.189)
MIN
0.430(0.017)
0.600(0.023)
0.900(0.035)
1.250(0.049)
5.970(0.235)
6.220(0.245)
9.500(0.374)
10.400(0.410)
4.300(0.169)
5.400(0.213)
0.000(0.000)
0.250(0.010)
2.550(0.100)
3.200(0.126)
2.540(0.100)BSC
0.450(0.018)
0.700(0.028)
0.430(0.017)
0.600(0.023)
5.080(0.200)
BSC
1.400(0.055)
1.780(0.070)
Jul. 2006 Rev. 1. 2
BCD Semiconductor Manufacturing Limited
11
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