AH211Z4-BE1

更新时间:2024-09-18 05:37:35
品牌:BCDSEMI
描述:TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT

AH211Z4-BE1 概述

TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT 两相霍尔效应锁存器中FG输出 磁场传感器

AH211Z4-BE1 规格参数

生命周期:TransferredReach Compliance Code:unknown
风险等级:5.22主体宽度:1.62 mm
主体长度或直径:5.13 mm滞后:6 mT
最大磁场范围:9 mT最小磁场范围:-9 mT
安装特点:THROUGH HOLE MOUNT最大工作电流:8 mA
最高工作温度:85 °C最低工作温度:-20 °C
封装形状/形式:RECTANGULAR传感器/换能器类型:MAGNETIC FIELD SENSOR,HALL EFFECT
最大供电电压:16 V最小供电电压:3.5 V
表面贴装:NO端接类型:SOLDER
Base Number Matches:1

AH211Z4-BE1 数据手册

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Data Sheet  
TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT  
AH211  
General Description  
Features  
The AH211 is an integrated Hall sensor with output  
driver and frequency generator designed for electronic  
commutation of brush-less DC motor applications. The  
device includes an on-chip Hall sensor for magnetic  
sensing, an amplifier that amplifies the Hall voltage, a  
Schmitt trigger to provide switching hysteresis for  
noise rejection, a temperature compensation circuit to  
compensate the temperature drift of Hall sensitivity,  
two complementary open-collector drivers for sinking  
large load current. It also includes an internal band-gap  
regulator which is used to provide bias voltage for  
internal circuits.  
·
On-Chip Hall Sensor  
3.5V to 16V Supply Voltage  
400mA (avg) Output Sink Current  
·
·
·
·
·
·
o
o
-20 C to 85 C Operating Temperature  
Built-in FG Output  
Low Profile TO-94 (SIP-4L) Package  
ESD Rating: 300V (Machine Model)  
Applications  
·
·
·
·
Dual-Coil Brushless DC Motor  
Dual-Coil Brushless DC Fan  
Revolution Counting  
Place the device in a variable magnetic field, while the  
magnetic flux density is larger than threshold BOP, DO  
will be turned on (low) and DOB (and FG) will be  
turned off (high). This output state is held till the mag-  
netic flux density reversal falls below BRP causing DO  
to be turned off (high) and DOB (and FG) turned on  
(low).  
Speed Measurement  
AH211 is available in TO-94 (SIP-4L) package.  
TO-94  
Figure 1. Package Type of AH211  
Mar. 2007 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
1
Data Sheet  
TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT  
AH211  
Pin Configuration  
Z4 Package  
(TO-94)  
4
3
2
1
GND  
DOB  
DO  
FG  
Figure 2. Pin Configuration of AH211 (Front View)  
Pin Description  
Pin Number  
Pin Name  
FG  
Function  
1
2
3
4
Frequency Generation  
Output 1  
DO  
DOB  
GND  
Output 2  
Ground  
Mar. 2007 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
2
Data Sheet  
TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT  
AH211  
Functional Block Diagram  
2
Temperature  
Compensation  
DO  
Regulator  
Hall  
Sensor  
Schmitt  
Trigger  
Output  
Driver  
Amplifier  
3
DOB  
4
GND  
1
FG  
Figure 3. Functional Block Diagram of AH211  
Ordering Information  
AH211  
-
Circuit Type  
Package  
E1: Lead Free  
Magnetic Characteristics  
A: 5 to 60 Gauss  
B: 90 Gauss  
Z4: TO-94 (SIP-4L)  
Package  
Temperature Range  
Part Number  
AH211Z4-AE1  
AH211Z4-BE1  
Marking ID  
AH211  
AH211  
Packing Type  
Bulk  
-20 to 85 oC  
TO-94  
Bulk  
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant.  
Mar. 2007 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
3
Data Sheet  
TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT  
AH211  
Absolute Maximum Ratings (Note 1)  
o
(T =25 C)  
A
Parameter  
Symbol  
Value  
Unit  
Supply Voltage  
VCC  
20  
V
Magnetic Flux Density  
B
Unlimited  
400  
Gauss  
mA  
Continuous  
Hold  
Output Current  
IO  
600  
mA  
Peak (start up)  
800  
mA  
FG Current  
IFG  
PD  
20  
mA  
Power Dissipation  
550  
227  
mW  
oC/W  
oC/W  
Die to atmosphere  
Die to package case  
θJA  
θJC  
TSTG  
Thermal Resistance  
Storage Temperature  
49  
oC  
V
-50 to 150  
ESD (Machine Model)  
300  
ESD (Human Body Model)  
3000  
V
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.  
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated  
under "Recommended Operating Conditions" is not implied. "Absolute Maximum Ratings" for extended period may affect  
device reliability.  
Recommended Operating Conditions  
o
(T =25 C)  
A
Parameter  
Symbol  
VCC  
Min  
3.5  
Max  
16  
Unit  
Supply Voltage  
Ambient Temperature  
V
oC  
TA  
-20  
85  
Mar. 2007 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
4
Data Sheet  
TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT  
AH211  
Electrical Characteristics  
o
(T =25 C, V =14V, unless otherwise specified)  
A
CC  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
B>150Gauss, VCC=3.5V,  
VDOB=VCC, IDO=100mA  
(or B<-150Gauss, VCC=3.5V,  
VDO=VCC, IDOB=100mA)  
1.1  
V
VSAT  
Output Saturation Voltage  
B>150Gauss,  
VDOB=VCC, IDO=400mA  
1.05  
1.3  
V
(or B<-150Gauss, VDO=VCC  
,
IDOB=400mA)  
B<-150Gauss, VDO=VCC  
,
VSATF  
IOLF  
ICC  
FG Saturation Voltage  
FG Leakage Current  
Supply Current  
0.35  
0.1  
8
0.6  
10  
10  
V
I
FG=20mA  
B>150Gauss, VDOB=VCC  
,
µA  
mA  
VFG=16V  
B>150Gauss, VDOB=VCC  
,
(or B<-150Gauss, VDO=VCC  
)
Output Rise Time  
tr  
tf  
RL=1k, CL=10pF  
RL=1k, CL=10pF  
RL=1k, CL=10pF  
3.0  
0.3  
3.0  
55  
10  
1.0  
10  
µs  
µs  
µs  
V
Output Fall Time  
Switch Time Differential  
Output Zener Breakdown Voltage  
t  
VZ  
Magnetic Characteristics  
o
(T =25 C)  
A
Parameter  
Symbol  
Grade  
Min  
Typ  
Max  
Unit  
A
B
A
B
5
30  
-30  
60  
60  
90  
-5  
Gauss  
Gauss  
Gauss  
Gauss  
Gauss  
BOP  
Operating Point  
-60  
-90  
BRP  
Releasing Point  
Hysteresis  
BHYS  
Mar. 2007 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
5
Data Sheet  
TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT  
AH211  
Magnetic Characteristics (Continued)  
+14V  
AH211  
S
DO  
DOB GND  
FG  
Marking Side  
1
2
4
3
FG (VFG  
)
R1  
1k  
R2  
DO (VOUT1  
)
1kΩ  
DOB (VOUT2  
)
R3  
N
1kΩ  
C1  
C2  
C3  
10pF 10pF 10pF  
Figure 4. Basic Test Circuit  
DO (V)  
16  
DOB (V)  
16  
VCC  
VCC  
14  
12  
10  
8
14  
12  
10  
8
6
6
4
4
2
2
VSAT  
VSAT  
-40  
-20  
0
20  
40  
-40  
-20  
0
20  
40  
Magnetic Flux Density B (Gauss)  
Magnetic Flux Density B (Gauss)  
Figure 5. VDO vs. Magnetic Flux Density  
Figure 6. VDOB vs. Magnetic Flux Density  
Mar. 2007 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
6
Data Sheet  
TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT  
AH211  
Typical Performance Characteristics  
80  
8
7
60  
40  
20  
6
5
4
3
2
1
0
BOP  
BRP  
BHYS  
0
-20  
-40  
-60  
0
2
4
6
8
10  
12  
14  
16  
18  
20  
22  
24  
4.0  
6.0  
8.0  
10.0  
12.0  
14.0  
16.0  
VCC (V)  
VCC (V)  
Figure 7. ICC vs. VCC  
Figure 8. BOP/BRP/BHYS vs. VCC  
80  
60  
40  
20  
0
800  
600  
400  
200  
0
BOP  
BRP  
BHYS  
-20  
-40  
-60  
-20  
-10  
0
10  
20  
30  
40  
50  
60  
70  
80  
-25  
0
25  
50  
75  
100  
125  
150  
TA (oC)  
TA (oC)  
Figure 9. BOP/BRP/BHYS vs. Ambient Temperature  
Figure 10. PD vs. Ambient Temperature  
Mar. 2007 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
7
Data Sheet  
TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT  
AH211  
Typical Performance Characteristics (Continued)  
1200  
1100  
1000  
900  
12  
11  
10  
9
PIN2  
PIN3  
VCC=14V  
IO=300mA  
IO=400mA  
VCC=14V  
8
7
6
800  
5
4
700  
3
2
600  
1
500  
-20.0  
0
0.0  
20.0  
40.0  
60.0  
80.0  
-20.0  
0.0  
20.0  
40.0  
60.0  
80.0  
Ambient Temparature (oC)  
Ambient Temparature (oC)  
Figure 11. Supply Current vs. Ambient Temperature  
Figure 12. VSAT vs. Ambient Temperature  
Mar. 2007 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
8
Data Sheet  
TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT  
AH211  
Application Information  
Figure 13 is the typical application circuit for AH211. According AH211's specification, if V =5V, R1 must  
DD  
Usually, there are three wires for fan connection: the  
red is input of power supply; the yellow is the output of  
FG; the black is the ground. R1 is an external pull-up  
resister for the use of measuring FG signal from fan.  
The value of R1 could be decided by the transistor  
saturation voltage (V ), sink current (I ), and pull-  
be larger than 220.  
D1 is the reverse protection diode. If the red and black  
wires reversely connected, the current will flow from  
the ground via IC and coils L1 and L2 to power supply.  
Under such circumstances, the IC and coils are easy to  
be burned out. Therefore, the reverse protection diode  
D1is necessary. However, D1 will also cause an extra  
voltage drop on the supply voltage.  
ON  
FG  
up voltage (V ). The calculation formula is:  
DD  
R1=(V -V ) / I  
DD ON  
FG  
C1 is a capacitor to reduce the ripple noise caused by  
the transient of the output stages. The amplitude of the  
ripple noise depends on the coil impedance and its  
characteristics.  
For example:  
V
=5V for TTL level.  
DD  
If saturation voltage is 0.6V (IC specification)  
=20mA ( 20mA) , then R1=220;  
I
FG  
If saturation voltage is 0.1V, I =1mA (=<20mA) , the  
FG  
value of R1=4.9kΩ  
D1  
VCC (Red Wire)  
AH211  
C1  
COIL1  
COIL2  
FG DO DOB GND  
1
2
4
3
VDD  
R1 1k  
FG (Yellow Wire)  
GND (Black Wire)  
Figure 13. AH211 Typical Application Circuit  
Mar. 2007 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
9
Data Sheet  
TWO PHASE HALL EFFECT LATCH WITH FG OUTPUT  
AH211  
Mechanical Dimensions  
TO-94  
Unit: mm(inch)  
45°TYP  
3.780(0.149)  
0.500(0.020)  
4.080(0.161)  
0.700(0.028)  
1.400(0.055)  
1.800(0.071)  
4.980(0.196)  
5.280(0.208)  
0.360(0.014)  
0.510(0.020)  
0.700(0.028)  
0.900(0.035)  
1.850(0.073)  
1.250(0.050)  
0.380(0.015)  
0.550(0.022)  
Hall Sensor Location  
0.360(0.014)  
0.500(0.020)  
14.900(0.587)  
15.300(0.602)  
1.270(0.050) TYP  
3.710(0.146)  
3.910(0.154)  
Mar. 2007 Rev. 1.3  
BCD Semiconductor Manufacturing Limited  
10  
http://www.bcdsemi.com  
IMPORTANT NOTICE  
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-  
cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any  
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use  
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or  
other rights nor the rights of others.  
MAIN SITE  
BCD Semiconductor Manufacturing Limited  
BCD Semiconductor Manufacturing Limited  
- Wafer Fab  
- IC Design Group  
Shanghai SIM-BCD Semiconductor Manufacturing Limited  
800, Yi Shan Road, Shanghai 200233, China  
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008  
Advanced Analog Circuits (Shanghai) Corporation  
8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China  
Tel: +86-21-6495 9539, Fax: +86-21-6485 9673  
REGIONAL SALES OFFICE  
Shenzhen Office  
Taiwan Office  
BCD Semiconductor (Taiwan) Company Limited  
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USA Office  
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Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Taiwan  
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