S558-0139-00 [BEL]

HIGH SPEED LAN MAGNETICS; 高速局域网MAGNETICS
S558-0139-00
型号: S558-0139-00
厂家: BEL FUSE INC.    BEL FUSE INC.
描述:

HIGH SPEED LAN MAGNETICS
高速局域网MAGNETICS

局域网
文件: 总2页 (文件大小:305K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
defining a degree of excellence  
HIGHSPEEDLANMAGNETICS  
960025A  
• For use in 100Base-TX, 10/100Base-TX, ATM 155 or  
100 Mbps TP-FDDI applications  
• Low profile, surface mount packaging available  
• Low cost, transmit or receive channel solution  
• 2000 Vrms isolation  
• Compatible with multiple PHY transceivers  
• 350 µH min OCL (inductance) with 8mA DC bias  
ELECTRICALS AT 25°C  
Insertion Loss  
(dB) Typ  
Return Loss  
(dB) Min  
Part No.  
1MHz-100MHz  
1MHz-30MHz  
30MHz-60MHz  
60MHz-80MHz  
Schematic  
S558-0139-00  
S558-3855-00  
S558-5999-02  
S558-5999-19  
-1.0  
-1.0  
-1.0  
-1.0  
-16  
-16  
-16  
-16  
16-20log((f/30MHz)  
16-20log((f/30MHz)  
16-20log((f/30MHz)  
16-20log((f/30MHz)  
-10  
-10  
-10  
-10  
A
B
A
B
SCHEMATICS  
A
B
MECHANICAL  
Specifications subject to change without notice.  
Bel Fuse Inc. 198 Van Vorst Street, Jersey City, NJ 07302 • Tel: 201-432-0463 • Fax: 201-432-9542 • E-Mail: BelFuse@belfuse.com  
Website: http://www.belfuse.com  
defining a degree of excellence  
HIGHSPEEDLANMAGNETICS  
960025A  
APPLICATION CIRCUIT  
APPLICATION NOTES  
• These Bel part types have been designed for use in 100 Mbps TP-FDDI, 100Base-TX, 10/100Base-TX and ATM  
155 Mbps applications over Category 5 UTP or STP cable.  
• Each Bel part type is designed with high voltage isolation transformers and common mode chokes and can be  
used on both the transmit and receive channels. The designs have been created to provide 350µH OCL with 8mA  
DC bias applied. Consult the Bel short form catalog and applicable application circuit for the specific configuration  
of each individual part type.  
• Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped  
on tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility  
with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability.  
Each part is optically inspected to meet rigid coplanarity requirements.  
Corporate Office  
Bel Fuse Inc.  
198 Van Vorst Street, Jersey City, NJ 07302-4496  
Tel: 201-432-0463  
Fax: 201-432-9542  
E-Mail: BelFuse@belfuse.com  
Internet: http://www.belfuse.com  
Far East Office  
Bel Fuse Ltd.  
8F/8 Luk Hop Street  
European Office  
Bel Fuse Europe Ltd.  
Preston Technology Management Centre  
Marsh Lane, Preston PR1 8UD  
Lancashire, U.K.  
Tel: 44-1772-556601  
Fax: 44-1772-888366  
San Po Kong  
Kowloon, Hong Kong  
Tel: 852-2328-5515  
Fax: 852-2352-3706  

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