SRSB-80T05LR [BEL]
Isolated DC-DC Converter;型号: | SRSB-80T05LR |
厂家: | BEL FUSE INC. |
描述: | Isolated DC-DC Converter |
文件: | 总22页 (文件大小:1413K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
The xRSB-80T05 Series are isolated DC/DC converters. These
secondary side control units will provide up to 100 W of output power
from a nominal 48 V input.
These converters are provided in an industry standard sixteenth brick
package.
36 - 75 VDC Input
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
5 VDC @ 20 A Output
1/16th Brick Converter
Isolated
Fixed Frequency (500 kHz)
High Efficiency
High Power Density
Low Cost
Input Under-Voltage Lockout
Start-up into Pre-biased Load
Over Temperature Protection
Remote On/Off
Output Voltage Trim
Positive/Negative Remote Sense
Output Over-Voltage Protection with Auto-recovery
Approved to IEC/EN 62368-1
Approved to UL/CSA 62368-1
Class II, Category 2, Isolated DC/DC Converter (refer to IPC-9592B)
Networking
Computers and Peripherals
Telecommunications
•
•
•
Remote ON/OFF Logic
Through hole and SMT
•
•
2
xRSB-80T05
MODEL
NUMBER
OUTPUT
VOLTAGE
INPUT
VOLTAGE
MAX. OUTPUT
CURRENT
MAX. OUTPUT
POWER
TYPICAL
EFFICIENCY
0RSB-80T05LG
0RSB-80T050G
SRSB-80T05LG
SRSB-80T050G
SRSB-80T05LR
SRSB-80T050R
5 VDC
36 - 75 VDC
20 A
100 W
92%
x
R
SB
-
80
T
05
x
y
RoHS
Status
Series
Name
Output
Power
Input
Range
Output
Voltage
Mounting Type
Active Logic
Package Type
0 - Through Hole Mount
L – Active Low
0 – Active High
G – Tray Package
R – Tape and Reel Package
1/16th
Brick
RoHS
100 W
36 – 75 V
5 V
S – Surface Mount
PARAMETER
DESCRIPTION
MIN
-0.3
-
TYP
MAX
75
UNITS
Continuous non-operating Input Voltage
Input Transient Voltage
Remote On/Off
-
-
-
-
-
-
-
V
V
100 ms maximum
100
18
-0.3
-
V
I/O Isolation Voltage
Ambient Temperature
Storage Temperature
Altitude
1500
85
V
-40
-55
-
C
C
m
125
2000
NOTE: Ratings used beyond the maximum ratings may cause a reliability degradation of the converter or may permanently damage the device.
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3
xRSB-80T05
All specifications are typical at 25°C unless otherwise stated.
PARAMETER
DESCRIPTION
MIN
TYP
48
-
MAX
75
2
UNIT
V
Operating Input Voltage
Input Current (full load)
Input Current (no load)
Remote Off Input Current
Input Reflected Ripple Current (rms)
36
-
A
-
40
2
70
5
mA
mA
mA
-
With simulated source impedance of 10 µH,
5 Hz to 20 MHz. Use a 150 µF, ESR< 0.1 Ω @
100 kHz, 20C Al-electrolytic capacitor and
3*2.2 µF/100 V ceramic capacitor with ESR
< 0.01 Ω @ 100 kHz, 20C.
-
6
12
Input Reflected Ripple Current (pk-pk)
-
20
30
mA
I2t Inrush Current Transient
Turn-on Voltage Threshold
Turn-off Voltage Threshold
Input UV Lockout Hysteresis
-
-
1
A2s
V
32.5
31
34
32
2
35.5
34
V
1.5
2.5
V
CAUTION: This converter is not internally fused. An input line fuse must be used in application. Recommend a fast-acting fuse with
maximum rating of 5 A on system board. Refer to the fuse manufacture’s datasheet for further information.
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Asia-Pacific
Europe, Middle East
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+86 755 298 85888
+353 61 225 977
© 2021 Bel Power Solutions & Protection
BCD.20105_AF
4
xRSB-80T05
All specifications are typical at nominal input, full load at 25°C unless otherwise stated.
PARAMETER
DESCRIPTION
MIN
TYP
5.000
±8
±8
±30
-
MAX
5.075
±15
±15
±50
5.15
70
UNIT
V
Output Voltage Set Point
Load Regulation
4.925
Vin = 48 V, Io = 0% load at 25C ambient.
Io = 0 A to full load
-
mV
mV
mV
V
Line Regulation
Vin =36 to 75 V
-
Regulation Over Temperature
Total Output Voltage Range
Ripple and Noise (pk-pk)
Ripple and Noise (rms)
Output Current Range
Output DC Current Limit
Short Circuit Surge Transient
Rise Time
Ambient temperature = -40°C to 85°C
Over sample load, line and temperature
-
4.85
Vin = 48 V,0-20 MHz BW, with 500 µF
ceramic capacitor and 2200 µF Al-electrolytic
capacitor at output.
-
-
35
3
mV
mV
A
10
0
24
-
-
20
27
-
32
A
3
A2s
ms
ms
ms
%
3
-
5
8
From Vin to 90% of Vout.
15
30
0
30
Turn on Time
From on/off to 90% of Vout.
-
50
Overshoot at Turn on
Output Capacitance
-
1
100 µF Tan capacitor for minimal capacitor.
Typically 50% ceramic+50% electrolytic
capacitors for maximum capacitor.
100
-
5000
µF
Transient Response
△V 50%~75% of Max Load
Settling Time
-
-
-
-
130
100
130
100
180
200
180
200
mV
µs
di/dt = 1 A/µs, Vin = 48 VDC, Ta = 25°C, with
500 µF ceramic capacitor and 2200 µF
Al-electrolytic capacitor at output.
△V 75%~50% of Max Load
Settling Time
mV
µs
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5
xRSB-80T05
PARAMETER
DESCRIPTION
MIN
TYP
MAX
UNIT
The efficiency is measured at Vin = 48 V,
full load and Ta = 25°C.
Efficiency
90
92
-
%
Switching Frequency
-
-
-
-
500
146
6.8
-
-
-
-
kHz
-
Calculated Per Telcordia SR-332
(Vin=48 V, Vo=4.8 V, Io=16 A, Ta = 25°C,
FIT= 109/MTBF
FIT
MTBF
Mhrs
°C
Over Temperature Protection
125
This voltage is achieved by trimming up
output slowly.
Over Voltage Protection (Static)
Weight
5.8
-
6.2
6.4
-
V
15.5
g
1.30 x 0.90 x 0.453
inch
mm
inch
mm
Through Hole Mount
Surface Mount
33.02 x 22.86 x 11.50
1.30 x 0.90 x 0.422
33.02 x 22.86 x 10.72
Dimensions (L × W × H)
Isolation Characteristics
Input to Output
-
10M
-
-
-
1500
VDC
Ohm
pF
Isolation Resistance
Isolation Capacitance
-
-
1000
100.00%
95.00%
90.00%
85.00%
80.00%
75.00%
70.00%
65.00%
60.00%
36 V
48 V
75 V
1
2
4
6
8
10 12 14 16 18 20
OUTPUT CURRENT(A)
Figure 1. Efficiency data
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BCD.20105_AF
6
xRSB-80T05
PARAMETER
DESCRIPTION
MIN
-0.3
2.4
-0.3
2.4
0
TYP
MAX
0.8
18
UNIT
Signal Low (Unit On)
Signal High (Unit Off)
Signal Low (Unit Off)
Signal High (Unit On)
Current Sink
-
-
-
-
-
V
V
Active Low
Active High
Remote On/Off pin is open, the module is off.
0.8
18
V
Remote On/Off pin is open, the module is on.
V
1
mA
Recommended remote on/off circuit for active low
Vin+
Vin+
On/off
On/off
Vin-
Vin-
Figure 2. Control with open collector/drain circuit
Figure 3. Control with photocoupler circuit
Vin+
Vin+
Vcc
On/off
On/off
Vin-
Vin-
Figure 4. Control with logic circuit
Figure 5. Permanently on
Recommended remote on/off circuit for active high
Vin+
On/off
Vin-
Vin+
On/off
Vin-
Figure 6. Control with open collector/drain circuit
Figure 7. Control with photocoupler circuit
Vin+
Vin+
Vcc
On/off
On/off
Vin-
Vin-
Figure 8. Control with logic circuit
Figure 9. Permanently on
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7
xRSB-80T05
This module has remote sense compensation feature which can minimize the effects of resistance between output and load in system
layout and facilitate accurate voltage regulation at load terminals or other selected point.
1. The remote sense lines carry very little current and hence do not require a large cross-sectional area.
2. This module compensates for a maximum drop of 10% of the nominal output voltage.
3. If the unit is already trimmed up, the available remote sense compensation range should be correspondingly reduced. The total
voltage increased by trim and remote sense should not exceed 10% of the nominal output voltage.
4. When using remote sense compensation, all the resistance, parasitic inductance and capacitance of the system are incorporated
within the feedback loop of this module which can make an effect on the module's compensation, affecting the stability and dynamic
response. A 0.1µF ceramic capacitor can be connected at the point of load to de-couple noise on the sense wires.
5. Recommend the connection of remote sense compensation as below figure. There are a resistor RS+ (100 ohm) from Vo+ to
Sense+ and a resistor RS- (11.3 ohm)) from Vo- to Sense- inside of this module.
Vo+
Sense+
Load
Sense-
Vo-
Figure 10.
6. If not using remote sense compensation, please connect sense directly to output at module's pin, that is, connect sense+ to Vo+
and sense- to Vo- at module's pin, the shorter the better. see below figure.
Vo+
Sense+
Load
Sense-
Vo-
Figure 11.
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BCD.20105_AF
8
xRSB-80T05
Maximum junction temperature of semiconductors derated to 120 ˚C.
DERATING CURVE
200LFM
300LFM
400LFM
20
18
16
14
12
10
NATURAL
CONVECTION
8
6
4
2
0
0
10
30 40 50 60 70 8085
20
AMBIENT TEMPERATURE, Ta(°C)
Output Current vs. Local Ambient
Temperature and Air Velocity
Figure 12. Derating curve under normal input
Figure 13. Ripple and noise waveform
Ripple and noise at full load, 48 VDC input, 5 VDC / 20 A output and Ta = 25 ˚C,
and with 500 µF ceramic capacitor and 2200 µF Al-electrolytic capacitor at output.
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9
xRSB-80T05
Equations for calculating the trim resistor are shown below. The Trim Down resistor should be connected between the Trim pin and
Sense (-) pin. The Trim Up resistor should be connected between the Trim pin and the Sense (+). Only one of the resistors should be
used for any given application.
Minimum trim down voltage is 4.5 V.
Maximum trim up voltage is 5.5 V.
The total voltage increased by trim and remote sense should not exceed 10% of the nominal output voltage.
Trim down test circuit
Sense(+)
511
Module
Rtrimdown =
-10.22[kW
]
Trim
delta
Rtrimdown
Sense(-)
Figure 14. Trim down test circuit
Trim up test circuit
Sense(+)
Trim
Rtrimup
(100+ delta)Vo 5.11- 626
1.225delta
Module
Rtrimup =
[
-10.22 kW
]
Sense(-)
Figure 15. Trim up test circuit
NOTE: Vo_req = Desired (trimmed) output voltage [V]
Output voltage Vo = 5.0 V
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BCD.20105_AF
10
xRSB-80T05
Under-voltage Lockout
V1 = 32V
V2 = 34V
Voltage Falling
Voltage Rising
Input Voltage (V)
V1
V2
Figure 16. Under voltage lockout
Input reflected ripple current
Testing setup
is
ic
Ls
Vin+
Vin-
+
+
Cs
Cin
Figure 17.
Notes and values in testing.
is: Input Reflected Ripple Current
ic: Input Terminal Ripple Current
Ls: Simulated Source Impedance (10 μH)
Cs: Offset possible source Impedance (none)
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11
xRSB-80T05
Cin: Electrolytic capacitor, should be as close as possible to the power module to damp ic ripple current and enhance
stability. Recommendation: 150 μF, ESR < 0.1 Ω @ 100 kHz, 20 ˚C Al-electrolytic capacitor and 3*2.2 μF/100 V ceramic
capacitor with ESR < 0.01 Ω @ 100 kHz, 20 ˚C.
Below measured waveforms are based on above simulated and recommended inductance and capacitance.
Figure 18. is (input reflected ripple current), AC component
Figure 19. ic (input terminal ripple current), AC component
Test condition: 48 VDC input, 5 VDC / 20 A output and Ta = 25 ˚C, with 500 µF ceramic capacitor and 2200 µF Al-electrolytic
capacitor at output.
Transient Response: di/dt=1 A/µs
Figure 20. Vout = 5 V, 50%-75% Load Transients
at Vin = 48 V @ Ta = 25 ˚C, with 500 µF ceramic capacitor
and 2200 µF Al-electrolytic capacitor at output.
Figure 21. Vout = 5 V, 75%-50% Load Transients
at Vin = 48 V @ Ta = 25 ˚C, with 500 µF ceramic capacitor
and 2200 µF Al-electrolytic capacitor at output
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12
xRSB-80T05
RISE TIME
Figure 22.
Test Condition: 48 Vin, 5 V, 20 A output, Cout = 500 µF ceramic + 2200 µF electrolytic
STARTUP TIME
Figure 23. Startup from Vin
Figure 24. Startup from on/off
Ch1: Vo
Ch1: Vo
Ch2: Vin
Ch2: on/off
Test Condition: Vin = 48 V, Vo = 5 V, 20 A output
Cout = 500 µF ceramic + 2200 µF electrolytic
Test Condition: Vin =48 V, Vo = 5 V, 20 A output
Cout = 500 µF ceramic + 2200 µF electrolytic
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13
xRSB-80T05
SHUTDOWN
Figure 25.
Test Condition: 48 Vin, 5 V, 20 A output, Cout = 500 µF ceramic + 2200 µF electrolytic
The SRSB-80T05x modules are designed to be compatible with a Paste-In-Hole assembly process. The suggested Pb-free solder
paste is Sn/Ag/Cu(SAC). The recommended reflow profile using Sn/Ag/Cu solder is shown in the following. Recommended reflow
peak temperature is 245°C while the part can withstand peak temperature of 260°C maximum for 10seconds. This profile should
be used only as a guideline. Many other factors influence the success of SMT reflow soldering. Since your production environment
may differ, please thoroughly review these guidelines with your process engineers.
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BCD.20105_AF
14
xRSB-80T05
Figure 26. Soldering temperature
The SRSB-80T05x modules have a MSL rating of 3.
The SRSB-80T05x modules are designed to be compatible with J-STD-033 Rev:A (Handling, Packing, Shipping and Use of Moisture
/Reflow Sensitive surface Mount devices). Moisture barrier bags (MBB) with desiccant are applied. The recommended storage
environment and handling procedure is detailed in J-STD-033.
This component has been designed, handled, and packaged ready for pb-free reflow soldering. If the assembly shop follows J-
STD-033 guidelines, no pre-bake of this component is required before being reflowed to a PCB. However, if the J-STD-033
guidelines are not followed by the assembler, Bel recommends that the modules should be pre-baked @ 120~125°C for a minimum
of 4 hours (preferably 24 hours) before reflow soldering.
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15
xRSB-80T05
Figure 27. 0RSB-80T05x outline
NOTE: These parts are not however compatible with the higher temperatures associated with lead free solder processes and must
be soldered using a reflow profile with a peak temperature of no more than 260 C.
NOTES:
1) All Pins: Material - Copper Alloy;
Finish – 3 micro inches minimum Gold over 50 micro inches minimum Nickel plate.
2) Un-dimensioned components are shown for visual reference only.
3) All dimensions in inch [mm]; Tolerances: x.xx +/-0.02 inch [0.51 mm].
x.xxx +/-0.010 inch [0.25 mm]. Unless otherwise stated
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BCD.20105_AF
16
xRSB-80T05
Figure 28. 0RSB-80T05x pins
PIN
1
FUNCTION
Vin (+)
PIN
5
FUNCTION
Sense (-)
Trim
2
Remote On/Off
Vin (-)
6
3
7
Sense (+)
Vout (+)
4
Vout (-)
8
Figure 29. 0RSB-80T05x Recommended pad layout
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17
xRSB-80T05
Figure 30. SRSB-80T05x outline
NOTES:
1) All Pins: Material - Copper Alloy;
Finish – 3 micro inches minimum Gold over 50 micro inches minimum Nickel plate.
2) Un-dimensioned components are shown for visual reference only.
3) All dimensions in inch [mm]; Tolerances: x.xx +/-0.02 inch [0.51 mm].
x.xxx +/-0.010 inch [0.25 mm]. Unless otherwise stated
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Asia-Pacific
Europe, Middle East
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BCD.20105_AF
18
xRSB-80T05
Figure 31. SRSB-80T05x pin
PIN
1
FUNCTION
Vin (+)
PIN
5
FUNCTION
Sense (-)
Trim
2
Remote On/Off
Vin (-)
6
3
7
Sense(+)
Vout (+)
4
Vout (-)
8
Figure 32. SRSB-80T05x Recommended pad layout
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19
xRSB-80T05
SRSB-80T05LR / SRSB-80T050R
250
375
3.625
Figure 33. SRSB-80T05LR / SRSB-80T050R packaging information-1
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+1 408 785 5200
Asia-Pacific
+86 755 298 85888
Europe, Middle East
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BCD.20105_AF
20
xRSB-80T05
Figure 34. SRSB-80T05LR / SRSB-80T050R packaging information-2
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21
xRSB-80T05
0RSB-80T05xG / SRSB-80T05xG
Figure 35. 0RSB-80T05xG / SRSB-80T05xG packaging information
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BCD.20105_AF
22
xRSB-80T05
DATE
REVISION
CHANGES DETAIL
APPROVAL
J.Yan
2017-06-29
2017-08-30
2018-7-23
2019-07-16
2019-08-06
AA
AB
AC
AD
AE
First release
Update soldering information
J.Yan
Update mechanical dimensions and change max output current to 20A
Update output capacitance
J.Yao
XF.Jiang
XF.Jiang
Update derating curve
Add object ID. Update safety certificate. Update SRSB-80T05x mechanical outline
for changing the height.
2021-05-28
AF
XF.Jiang
NUCLEAR AND MEDICAL APPLICATIONS - Products are not designed or intended for use as critical components in life support systems,
equipment used in hazardous environments, or nuclear control systems.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on
the date manufactured. Specifications are subject to change without notice.
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