ACMD-7409-BLK [BOARDCOM]
Miniature PCS Band Duplexer;
| 型号： | ACMD-7409-BLK |
| 厂家： | 
Broadcom Corporation. |
| 描述： | Miniature PCS Band Duplexer PCS 过程控制系统 |
| 文件： | 总10页 (文件大小：1142K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ACMD-7409
Miniature PCS Band Duplexer
Data Sheet
Description
Features
The Avago ACMD-7409 is a miniature duplexer designed •ꢀ Miniature size
for US PCS handsets.
– 3.8 x 3.8 mm footprint size
– 1.3 mm max height
The ACMD-7409 is designed with Avago Technologies’
Film Bulk Acoustic Resonator (FBAR) technology, which
makes possible ultra-small, high-Q filters at a fraction of
their usual size.
•ꢀ High power rating size
– +33 dBm max Tx power
•ꢀ Environmental
– RoHS Compliant
– Halogen Free
– TBBPA Free
The ACMD-7409 also utilizes Avago’s innovative Microcap
bonded-wafer, chip scale packaging technology. This
process allows the filters to be assembled in a molded
chip-on-board module that is less than 1.3 mm high with
a footprint of only 3.8 x 3.8 mm.
Specifications
The ACMD-7409 enhances the sensitivity and dynamic
range of PCS receivers by providing more than 54 dB
attenuation of the transmitted signal at the receiver input
and more than 45 dB rejection of transmit-generated
noise in the receive band.
•ꢀ Performance guaranteed –30 to +85°C
•ꢀ Rx band performance (1930.5 – 1989.5 mHz) size
– Insertion loss: 3.8 dB max size
– Noise blocking: 43 dB min
•ꢀ Tx band performance (1850.5 – 1909.5 mHz) size
– Insertion loss: 3.5 dB max size
Maximum Insertion Loss in the Tx channel is only 3.5 dB,
which minimizes current drain from the power amplifier.
Insertion Loss in the Rx channel is 3.8 dB max, improving
receiver sensitivity.
– Interferer blocking: 52 dB min
Applications
The excellent power handling capability of the FBAR bulk-
mode resonators supports the high output power levels
needed in PCS handsets while adding virtually no distor-
tion.
•ꢀ Handsets or data terminals operating in the US PCS
frequency band
The ACMD-7409 is an environmentally green version of
the ACMD-7402 duplexer.
Functional Block Diagram
ANT PORT 3
Tx
Rx
PORT 1
PORT 2
[1,2]
ACMD-7409 Electrical Specifications, Z = 50 Ω, T
as indicated
0
C
[2]
[2]
[2]
– 30°C
+25°C
Min
+85°C
Min
[3]
[3]
[3]
Symbol Parameter
Units Min
Typ
Max
Typ
Max
Typ
Max
Antenna Port to Receive Port
S23
Insertion Loss in Receive Band
(1930.5 – 1989.5 MHz)
dB
3.8
3.0
1.5
3.5
2.6
3.5
2.6
ΔS23
Ripple (p-p) in Receive Band
dB
dB
1.5
17
S22
Return Loss of Receive Port
in Receive Band
9.5
52
9.5
52
9.5
52
S23
Attenuation in Transmit Band
(1850.5 – 1909.5 MHz)
dB
56
S23
S23
Attenuation 0 – 1600 MHz
dB
dB
20
18
31
19
Attenuation in Receive 2nd
Harmonic Band
(3861 – 3979 MHz)
Transmit Port to Antenna Port
S31
Insertion Loss in Transmit Band
(1850.5 – 1909.5 MHz)
dB
3.0
2.3
1.1
3.0
2.3
3.5[4]
2.8
ΔS31
Ripple (p-p) in Transmit Band
dB
dB
0.9
20
S11
Return Loss of Transmit Port
in Transmit Band
9.5
43
9.5
43
9.5
43
S31
Attenuation in Receive Band
(1930.5 – 1989.5 MHz)
dB
48
S31
S31
Attenuation 0 – 1600 MHz
dB
dB
22
8
34
13
Attenuation in Transmit 2nd
Harmonic Band
(3701 – 3819 MHz)
Antenna Port
S33
Return Loss of Antenna Port in
Receive Band
(1930.5 – 1989.5 MHz)
dB
dB
9
9
9
9
16
19
9
9
S33
Return Loss of Antenna Port in
Transmit Band
(1850.5 – 1909.5 MHz)
Isolation Transmit Port to Receive Port
S21
Tx-Rx Isolation in Receive Band
(1930.5 – 1989.5 MHz)
dB
dB
45
54
45
54
48
58
45
54
S21
Tx-Rx Isolation in Transmit Band
(1850.5 – 1909.5 MHz)
Notes:
1. TC is the case temperature and is defined as the temperature of the underside of the Duplexer where it makes contact with the circuit board.
2. Min/Max specifications are guaranteed at the indicated temperature with the input power to the Tx ports equal to or less than +29 dBm over all Tx
frequencies unless otherwise noted.
3. Typical data is the average value of the parameter over the indicated band at the specified temperature. Typical values may vary over time. Refer
to “Characterization”section for measurement details.
4. At Tx input power between +26 dBm and +29 dBm, the Insertion Loss at the upper edge of the Tx band (1907– 1909.5 MHz) will be slightly
degraded. From 1907 to 1909.5 MHz, the maximum Insertion Loss specification at Tc = +85°C is guaranteed to +26 dBm input power.
2
[1]
Absolute Maximum Ratings
Parameter
Unit
°C
Value
Storage Temperature
–65 to +125
+33
Maximum RF Input Power
to Tx Ports
dBm
[2]
Maximum Recommended Operating Conditions
Parameter
Unit
Value
Operating Temperature, Tc[3]
Tx Power 29 dBm
,
°C
–40 to +100
Operating temperature, Tc[3]
Tx Power 30 dBm
,
°C
–40 to +85
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. The device will function over the recommended range without
degradation in reliability or permanent change in performance, but
is not guaranteed to meet electrical specifications.
3. TC is defined as case temperature, the temperature of the underside
of the Duplexer where it makes contact with the circuit board.
Characterization
A test circuit similar to that shown in Figure 1 was used
A test circuit with a ACMD-7409 mounted in place is
to measure typical device performance. This circuit is shown in Figure 2. S-parameters are then measured using
designed to interface with Air Coplanar (ACP), Ground- a network analyzer and calibrated ACP probe set.
Signal-Ground (GSG) RF probes of the type commonly
Phase data for s-parameters measured with ACP probe
used to test semiconductor wafers.
circuits are adjusted to place the reference plane at the
edge of the Duplexer
The test circuit is a 7 x 7 mm PCB with a well-grounded pad
to which the device under test (DUT) is solder-mounted.
Short lengths of 50-ohm microstripline connect the DUT
to the ACP probe patterns on the board.
Figure 1. ACP probe test circuit
Figure 2. Test circuit with ACMD-7409 duplexer
3
Typical Performance at Tc = 25°C
0.0
-1.0
-2.0
-3.0
-4.0
0.0
-1.0
-2.0
-3.0
-4.0
1850
1860
1870
1880
1890
1900
1910
1930
1940
1950
1960
1970
1980
1990
Frequency [MHz]
Frequency [MHz]
Figure 3. Tx–Ant insertion loss
Figure 4. Ant–Rx insertion loss
0
-5
0
-10
-20
-30
-40
-50
-60
-10
-15
-20
-25
1750 1800 1850 1900 1950 2000 2050 2100
Frequency [MHz]
1750 1800 1850 1900 1950 2000 2050 2100
Frequency [MHz]
Figure 5. Tx and Rx port return loss
Figure 6. Tx rejection in Rx band and Rx rejection in Tx band
-35
-40
-45
-50
-55
-60
-65
-70
-75
0
-5
-10
-15
-20
-80
-25
1750 1800 1850 1900 1950 2000 2050 2100
1750 1800 1850 1900 1950 2000 2050 2100
Frequency [MHz]
Frequency [MHz]
Figure 7. Tx–Rx isolation
Figure 8. Antenna port return loss
4
0
-10
-20
-30
-40
-50
-60
0
-10
-20
-30
-40
3700
3720
3740
3760
3780
3800
3820
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Frequency [MHz]
Frequency [GHz]
Figure 9. Tx–Ant rejection at Tx second harmonic
Figure 10. Tx–Ant and Ant–Rx wideband insertion loss
-10
-20
-30
-40
-50
-60
-10
-20
-30
-40
-50
-60
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Frequency [GHz]
Frequency [GHz]
Figure 11. Tx–Ant low frequency rejection
Figure 12. Ant–Rx low frequency rejection
5
0.8
0.5
0.1
1.8
1.4
SOLDER MASK
OVER VIAS (2 PLS)
[PRODUCT
MARKING]
Rx
Tx
Tx
Rx
Ant
3.8
Ant
1.2
1.4
1.9
2.4
Notes:
1. Dimensions in millimeters
2. Dimensions nominal unless otherwise noted
3. Tolerance:
X.X = ꢀ.1
X.XX = ꢀ.ꢀ0
4. I/O pads (3 ea), ꢀ.4ꢀ x ꢀ.4ꢀ
0. Contact areas are gold plated
6. Internal vias (2 ea) shown for reference only;
covered with Ø ꢀ.0ꢀ mm solder mask
Figure 13. Package outline drawing
PACKAGE
ORIENTATION
H = ACMD-7409
FI = Mfg Information
Y = Year
WW = Work Week
DC = Date Code
RX
TX
NNNN = Assembly Lot
ANT
Figure 14. Package marking
6
1.0
1.8
1.0
1.2
1.2
0.8
0.2
0.4
1.0
1.8
0.3
1.4
T
W
0.3
0.6
1.2
1.2
0.3
0.5
1.2
0.3
0.5
1.2
0.2
0.4
0.3
0.2
0.4
0.3
NOTES:
DIMENSIONS IN MILLIMETERS (mm)
ALL VIAS ∆ 0.40
1.4
ANGLES 45
RF PORTS ARE CPW
T AND W SELECTED FOR 50 OHMS
PATTERN CENTERED ON DUPLEXER
Figure 15. Recommended PCB land print
Figure 16. Duplexer superposed on PCB land print
7
1.00
1.00
1.63
3.40
1.25
2.70
0.40
3.25
NOTES:
1. DIMENSIONS IN MILLIMETERS (mm).
2. SOLDER STRIPES (14 PLS) ARE 0.20 WIDE, PITCH.
3. SOLDER PADS FOR I/O ARE 0.35 x 0.35.
4. STENCIL PATTERN IS CENTERED ON DUPLEXER.
Figure 17. Recommended solder stencil
Figure 18. Duplexer superposed on solder stencil
Package Moisture Sensitivity
Feature
Test Method
Performance
Moisture Sensitivity Level (MSL) at 260°C
J-STD-020C
Level 3
300
250
200
150
100
50
0
0
50
100
150
200
250
300
TIME, SECONDS
Figure 19. Verified SMT solder profile
8
4.00 0.10 SEE NOTE 2
2.00 0.05
ø 1.55 0.05
B
1.75 0.10
5.50 0.05
5° MAX.
12.00 0.10
Bo
Ko
A
A
8.00 0.10
B
ø 1.50 (MIN.)
SECTION B-B
Ao
0.30 0.05
5° MAX.
Ao = 4.10
Bo = 4.10
Ko = 1.45
NOTES:
1. Ao and Bo MEASURED AT 0.3 mm ABOVE BASE OF POCKET.
2. 10 PITCHES CUMULATIVE TOLERANCE 0.2 mm.
PITCH = 8.00
WIDTH = 12.00
SECTION A-A
Figure 20. SMD tape packing
SPROCKET HOLES
PACKAGE PIN 1
ORIENTATION
TAPE
WIDTH
POCKET
CAVITY
Figure 21. Unit orientation In tape
9
Ordering Information
Part Number
No. of Devices
Container
ACMD-7409-BLK
ACMD-7409-TR1
25
Anti-static Bag
7-inch Reel
1000
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-1824EN - March 24, 2009
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