AFBR-5205ATZ [BOARDCOM]
ATM Multimode Fiber Transceivers for SONET OC-3/SDH STM-1 in Low Cost 1x9 Package Style;
| 型号： | AFBR-5205ATZ |
| 厂家： | 
Broadcom Corporation. |
| 描述： | ATM Multimode Fiber Transceivers for SONET OC-3/SDH STM-1 in Low Cost 1x9 Package Style ATM 异步传输模式 光纤 |
| 文件： | 总19页 (文件大小：559K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AFBR-5205Z
ATM Multimode Fiber Transceivers for SONET OC-3/SDH STM-1
in Low Cost 1x9 Package Style
Data Sheet
Description
Features
The AFBR-5200Z family of transceivers from Avago Tech- Full compliance with ATM Forum UNI SONET OC-3
nologies provide the system designer with products
to implement a range of solutions for multimode fiber
SONET OC-3 (SDH STM-1) physical layers for ATM and
other services.
Multimode Fiber Physical Layer Specification
Multisourced 1x9 package style with choice of duplex
SC or duplex ST* receptacle
Wave solder and aqueous wash process compatibility
RoHS Compliance
These transceivers are all supplied in the new industry
standard 1x9 SIP package style with either a duplex SC or
a duplex ST* connector interface.
Applications
ATM 2000 m Backbone Links
Multimode fiber ATM backbone links
Multimode fiber ATM wiring closet to desktop links
The AFBR-5205Z/-5205TZ are 1300nm products with
optical performance compliant with the SONET STS-3c
(OC-3) Physical Layer Interface Specification. This physical
layer is defined in the ATM Forum User-Network Interface
(UNI) Specification Version 3.0. This document references
the ANSIT1E1.2 specification for the details of the interface
for 2000 meter multimode fiber backbone links.
ATM 155 Mbps/194 MBd encoded links (available upon
special request)
Part Numbers
AFBR-5205Z, AFBR-5205AZ, AFBR-5205APZ,
AFBR-5205ATZ, AFBR-5205PZ, AFBR-5205TZ,
AFBR-5205PEZ 1300 nm 2 km
Selected versions of these transceivers may be used to
implement the ATM Forum UNI Physical Layer Interface at
the 155 Mbps/194 MBd rate.
The ATM 100 Mbps/125 MBd Physical Layer interface is
best implemented with the AFBR-5100Z family of FDDI
Transceivers which are specified for use in this 4B/5B
encoded physical layer per the FDDI PMD standard.
Transmitter Sections
The transmitter sections of the AFBR-5205Z series utilize
1300 nm InGaAsP LEDs. These LEDs are packaged in the
optical subassembly portion of the transmitter section.
They are driven by a custom silicon IC which converts
differential PECL logic signals, ECL referenced (shifted) to a
+5 Volt supply, into an analog LED drive current.
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
Receiver Sections
The receiver sections of the AFBR-5205Z series utilize
The electrical subassembly consists of a high volume
InGaAs PIN photodiodes coupled to a custom silicon tran- multilayer printed circuit board on which the IC chips
simpedance preamplifier IC. These are packaged in the and various surface-mounted passive circuit elements are
optical subassembly portion of the receiver.
attached.
These PIN/preamplifier combinations are coupled to a The package includes internal shields for the electrical
custom quantizer IC which provides the final pulse shaping and optical subassemblies to insure low EMI emissions
for the logic output and the Signal Detect function.
The data output is differential. The signal detect output
is single-ended. Both data and signal detect outputs are
PECL compatible, ECL referenced (shifted) to a +5 volt
power supply.
and high immunity to external EMI fields.
The outer housing including the duplex SC connector or
the duplex ST ports is molded of filled non-conductive
plastic to provide mechanical strength and electrical
isolation. The solder posts of the Avago design are isolated
from the circuit design of the transceiver and do not
require connection to a ground plane on the circuit board.
Package
The overall package concept for the Avago transceivers
consists of three basic elements; the two optical sub-
assemblies, an electrical subassembly, and the housing as
illustrated in the block diagrams in Figure1 and Figure1a.
The transceiver is attached to a printed circuit board with
the nine signal pins and the two solder posts which exit
the bottom of the housing. The two solder posts provide
the primary mechanical strength to withstand the loads
imposed on the transceiver by mating with the duplex or
simplex SC or ST connectored fiber cables.
Note: The “T” in the product numbers indicates a transceiver with a
duplex ST connector receptacle. Product numbers without a “T” indicate
transceivers with a duplex SC connector receptacle.
The package outline drawing and pin out are shown in
Figures 2, 2a, and 3. The details of this package outline
and pin out are compliant with the multisource definition
of the 1x9 SIP. The low profile of the Avago transceiver
design complies with the maximum height allowed for
the duplex SC connector over the entire length of the
package.
Application Information
The Applications Engineering group in the Avago Optical
Communication Division is available to assist you with the
technical understanding and design trade-offs associated
with these transceivers. You can contact them through
your Avago sales representative.
Figures 2b and 2c show the outline drawings for options
that include mezzanine height and extended and flush
shields respectively.
The optical subassemblies utilize a high volume assembly
process together with low cost lens elements which result
in a cost effective building block.
ELECTRICAL SUBASSEMBLY
DUPLEX SC
RECEPTACLE
DIFFERENTIAL
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
LED
DRIVER IC
TOP VIEW
Figure 1. SC block diagram.
2
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DUPLEX ST
RECEPTACLE
DIFFERENTIAL
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
SIGNAL
DETECT OUT
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
LED
DRIVER IC
TOP VIEW
Figure 1a. ST block diagram.
39.12
(1.540)
12.70
(0.500)
6.35
(0.250)
MAX.
AREA
RESERVED
FOR
PROCESS
PLUG
25.40
MAX.
12.70
(0.500)
(1.000)
AFBR-5xxxZ
DATE CODE (YYWW)
A
5.93 0.1
(0.233 0.004)
SINGAPORE
+ 0.0ꢀ
0.75
- 0.05
+ 0.003
- 0.002
3.30 0.3ꢀ
(0.130 0.015)
10.35
(0.407)
)
(0.030
MAX.
2.92
1ꢀ.52
+ 0.25
- 0.05
(0.115)
1.27
(0.729)
φ
0.46
+ 0.010
- 0.002
4.14
(0.163)
)
(9x)
(0.050
(0.01ꢀ)
NOTE 1
NOTE 1
23.55
(0.927)
20.32
(0.ꢀ00)
16.70
(0.657)
17.32 20.32 23.32
(0.6ꢀ2) (0.ꢀ00) (0.91ꢀ)
[ꢀx(2.54/.100)]
0.ꢀ7
(0.034)
Note 1: Posphor bronse is the base material for the
posts & pins.
23.24
(0.915)
15.ꢀꢀ
(0.625)
For lead-free soldering, the solder posts have tin
copper over
nickel plating, and the electrical pins have pure tin
over nickel plating.
Figure 2. SC package outline drawing with standard height.
Dimensions are in millimeters (inches).
3
42
(1.654)
MAX.
5.99
(0.236)
24.ꢀ
(0.976)
12.7
(0.500)
25.4
(1.000)
MAX.
AFBR-5103TZ
DATE CODE (YYWW)
SINGAPORE
+ 0.0ꢀ
- 0.05
+ 0.003
- 0.002
0.5
(0.020)
(
(
12.0
(0.471)
MAX.
2.6 0.4
(0.102 0.016)
3.3 0.3ꢀ
(0.130) ( 0.015)
0.3ꢀ
0.015)
20.32
(
0.46
(0.01ꢀ)
NOTE 1
φ
2.6
φ
+ 0.25
- 0.05
1.27
(0.102)
+ 0.010
- 0.002
0.050
(
(
20.32
17.4
(0.6ꢀ5)
[(ꢀx (2.54/0.100)]
20.32
(0.ꢀ00)
(0.ꢀ00)
22.ꢀ6
(0.900)
21.4
(0.ꢀ43)
3.6
(0.142)
1.3
(0.051)
23.3ꢀ
(0.921)
1ꢀ.62
(0.733)
Note 1: Posphor bronse is the base material for the posts & pins.
For lead-free soldering, the solder posts have tin copper over
nickel plating, and the electrical pins have pure tin over nickel plating.
Dimensions are in millimeters (inches).
Figure 2a. ST package outline drawing with standard height.
4
29.6
(1.16)
UNCOMPRESSED
39.6
(1.56)
12.70
(0.50)
4.7
(0.1ꢀ5)
MAX.
AREA
RESERVED
FOR
25.4
(1.00)
12.7
(0.50)
MAX.
PROCESS
PLUG
2.0 0.1
(0.079 0.004)
0.51
(0.02)
SLOT WIDTH
SLOT DEPTH
+0.1
-0.05
+0.004
-0.002
0.25
2.09
(0.0ꢀ)
10.2
(0.40)
9.ꢀ
(0.3ꢀ6)
UNCOMPRESSED
MAX.
MAX.
(0.010
)
1.3
(0.05)
3.3 0.3ꢀ
(0.130 0.015)
20.32
(0.ꢀ0)
15.ꢀ 0.15
(0.622 0.006)
+0.25
-0.05
+0.010
0.46
+0.25
1.27
9X φ
-0.05
2X φ
(0.01ꢀ
)
+0.010
-0.002
-0.002
(0.050
)
2.54
(0.100)
ꢀX
20.32
(0.ꢀ00)
23.ꢀ
(0.937)
20.32
(0.ꢀ00)
1.3
(0.051)
2X φ
Dimensions are in millimeters (inches).
All dimensions are 0.025mm unless otherwise specified.
Figure 2b. Package outline drawing with mezzanine height and extended shield.
5
39.6
(1.56)
12.7
(0.50)
MAX.
4.7
(0.1ꢀ5)
1.01
(0.40)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4
(1.00)
29.7
(1.17)
12.7
(0.50)
MAX.
2.0 0.1
(0.079 0.004)
25.ꢀ
(1.02)
2.2
(0.09)
SLOT WIDTH
MAX.
SLOT DEPTH
+0.1
-0.05
+0.004
-0.002
10.2
(0.40)
0.25
MAX.
(0.010
)
14.4
(0.57)
9.ꢀ
(0.3ꢀ6)
MAX.
22.0
(0.ꢀ7)
3.3 0.3ꢀ
(0.130 0.015)
20.32
(0.ꢀ00)
15.ꢀ 0.15
+0.25
(0.622 0.006)
0.46
-0.05
+0.25
-0.05
+0.010
-0.002
9x φ
1.27
+0.010
-0.002
2x φ
(0.01ꢀ
)
(0.050
)
AREA
RESERVED
FOR
PROCESS
PLUG
20.32
(0.ꢀ00)
23.ꢀ
(0.937)
20.32
(0.ꢀ00)
2.54
(0.100)
ꢀx
Dimensions are in millimeters (inches).
All dimensions are 0.025mm unless
otherwise specified.
1.3
(0.051)
2x φ
Figure 2c. Package outline drawing with mezzanine height and flush shield.
1 = VEE
N/C
2 = RD
3 = RD
4 = SD
5 = VCC
6 = VCC
7 = TD
ꢀ = TD
9 = VEE
Rx
Tx
N/C
TOP VIEW
Figure 3. Pin out diagram.
6
The following information is provided to answer some of
the most common questions about the use of these parts.
Premises per DIS 11801 document and the EIA/TIA-568-A
Commercial Building Telecommunications Cabling
Standard per SP-2840.
Transceiver Optical Power Budget versus Link Length
Transceiver Signaling Operating Rate Range and
BER Performance
Optical Power Budget (OPB) is the available optical power
for a fiber optic link to accommodate fiber cable losses plus
losses due to in-line connectors, splices, optical switches,
and to provide margin for link aging and unplanned losses
due to cable plant reconfiguration or repair.
For purposes of definition, the symbol (Baud) rate, also
called signaling rate, is the reciprocal of the symbol time.
Data rate (bits/sec) is the symbol rate divided by the
encoding factor used to encode the data (symbols/bit).
Figure 4 illustrates the predicted OPB associated with the
three transceivers series specified in this data sheet at
the Beginning of Life (BOL). These curves represent the
attenuation and chromatic plus modal dispersion losses
associated with the 62.5/125 m and 50/125 m fiber
cables only. The area under the curves represents the
remaining OPB at any link length, which is available for
overcoming non-fiber cable losses.
When used in 155 Mbps SONET OC-3 applications the
performance of the 1300 nm transceivers, AFBR-5205Z
is guaranteed to the full conditions listed in individual
product specification tables.
12
Avago LED technology has produced 1300 nm LED
devices with lower aging characteristics than normally
associated with these technologies in the industry. The
industry convention is 1.5 dB aging for 1300 nm LEDs. The
1300nm Avago LEDs are specified to experience less than
1 dB of aging over normal commercial equipment mission
life periods. Contact your Avago sales representative for
additional details.
AFBR-5205Z, 62.5/125 μm
10
ꢀ
AFBR-5205Z,
50/125 μm
6
Figure 4 was generated for the 1300 nm transceivers with
an Avago fiber optic link model containing the current
industry conventions for fiber cable specifications and the
draft ANSI T1E1.2. These optical parameters are reflected
in the guaranteed performance of the transceiver specifi-
cations in this data sheet. This same model has been used
extensively in the ANSI and IEEE committees, including
the ANSI T1E1.2 committee, to establish the optical per-
formance requirements for various fiber optic interface
standards. The cable parameters used come from the
ISO/IEC JTC1/SC 25/WG3 Generic Cabling for Customer
4
2
0
0.3 0.5
1.0
1.5
2.0
2.5
FIBER OPTIC CABLE LENGTH (km)
Figure 4. Optical power budget vs. fiber optic cable length.
7
The transceivers may be used for other applications The jitter specifications stated in the following 1300 nm
at signaling rates different than 155 Mbps with some transceiver specification tables are derived from the values
variation in the link optical power budget. Figure 5 gives in Table B1 of Annex B. They represent the worst case jitter
an indication of the typical performance of these products
at different rates.
contribution that the transceivers are allowed to make
to the overall system jitter without violating the Annex B
allocation example. In practice, the typical contribution
of the Avago transceivers is well below these maximum
allowed amounts.
These transceivers can also be used for applications which
require different Bit Error Rate (BER) performance. Figure
6 illustrates the typical trade-off between link BER and the
receivers input optical power level.
Recommended Handling Precautions
Transceiver Jitter Performance
Avago recommends that normal static precautions be
taken in the handling and assembly of these transceivers
to prevent damage which may be induced by electrostatic
discharge (ESD). The AFBR-5205Z series of transceivers
meet MIL-STD-883C Method 3015.4 Class 2 products.
The Avago 1300 nm transceivers are designed to operate
per the system jitter allocations stated inTable B1 of Annex
B of the draft ANSI T1E1.2 Revision 3 standard.
The Avago 1300 nm transmitters will tolerate the worst
case input electrical jitter allowed in Annex B without
violating the worst case output optical jitter requirements.
Care should be used to avoid shorting the receiver data or
signal detect outputs directly to ground without proper
current limiting impedance.
The Avago 1300 nm receivers will tolerate the worst case
input optical jitter allowed in Annex B without violating
the worst case output electrical jitter allowed.
2.5
1 x 10-2
1 x 10-3
2.0
1.5
1.0
1 x 10-4
AFBR-5205Z
1 x 10-5
1 x 10-6
CENTER OF SYMBOL
1 x 10-7
0.5
0
1 x 10-ꢀ
1 x 10-9
1 x 10-10
1 x 10-11
1 x 10-12
0.5
0
25
50
75 100 125 150 175 200
SIGNAL RATE (MBd)
-6
-4
-2
0
2
4
RELATIVE INPUT OPTICAL POWER – dB
CONDITIONS:
CONDITIONS:
1. PRBS 27-1
1. 155 MBd
2. PRBS 27-1
2. DATA SAMPLED AT CENTER OF DATA SYMBOL.
3. BER = 10-6
3. CENTER OF SYMBOL SAMPLING.
4. TA = 25°C
4. TA = 25° C
5. VCC = 5 Vdc
5. VCC = 5 Vdc
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
Figure 5. Transceiver relative optical power budget at constant BER vs.
signaling rate.
Figure 6. Bit error rate vs. relative receiver input optical power.
8
Solder and Wash Process Compatibility
Shipping Container
The transceivers are delivered with protective process The transceiver is packaged in a shipping container
plugs inserted into the duplex SC or duplex ST connector designed to protect it from mechanical and ESD damage
receptacle. This process plug protects the optical subas- during shipment or storage.
semblies during wave solder and aqueous wash process-
ing and acts as a dust cover during shipping.
These transceivers are compatible with either industry
standard wave or hand solder processes.
Rx
Tx
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
AFBR-520xZ
TOP VIEW
Rx
VEE
1
Rx
Tx
Tx
VEE
9
RD
2
RD
3
SD
4
VCC
VCC
TD
7
TD
ꢀ
5
6
C1
C2
VCC
R2
R3
C5
L1
C3
L2
C4
TERMINATION
AT PHY
DEVICE
R1
R4
VCC
INPUTS
R5
R7
V
CC FILTER
AT VCC PINS
TRANSCEIVER
TERMINATION
AT TRANSCEIVER
INPUTS
C6
R9
R6
Rꢀ
R10
RD
RD
SD
VCC
TD
TD
Notes:
The split-load terminations for ECL signals need to be located at the input of devices receiving those ECL signals.
Recommend 4-layer printed circuit board with 50 Ohm microstrip signal paths be used.
R1 = R4 = R6 = R8 = R10 = 130 Ohms.
R2 = R3 = R5 = R7 = R9 = 82 Ohms.
C1 = C2 = C3 = C5 = C6 = 0.1F.
C4 = 10 F.
L1 = L2 = 1 H coil or ferrite inductor.
Figure 7. Recommended decoupling and termination circuits.
9
Board Layout – Decoupling Circuit and Ground Planes
Board Layout – Hole Pattern
It is important to take care in the layout of your circuit The Avago transceiver complies with the circuit board
board to achieve optimum performance from these trans- “Common Transceiver Footprint” hole pattern defined in
ceivers. Figure 7 provides a good example of a schematic the original multisource announcement which defined the
for a power supply decoupling circuit that works well with 1x9 package style. This drawing is reproduced in Figure 8
these parts. It is further recommended that a contiguous with the addition of ANSI Y14.5M compliant dimension-
ground plane be provided in the circuit board directly ing to be used as a guide in the mechanical layout of your
under the transceiver to provide a low inductance ground circuit board.
for signal return current. This recommendation is in
keeping with good high frequency board layout practices.
1.9 0.1
.075 .004
φ
(2X)
–A–
20.32
.ꢀ00
M
φ0.000
A
0.ꢀ 0.1
.032 .004
φ
20.32
.ꢀ00
(9X)
M
φ0.000
A
2.54
.100
(ꢀX)
TOP VIEW
Figure 8. Recommended board layout hole pattern.
10
Board Layout – Mechanical
Electrostatic Discharge (ESD)
For applications interested in providing a choice of either There are two design cases in which immunity to ESD
a duplex SC or a duplex ST connector interface, while damage is important.
utilizing the same pinout on the printed circuit board,
The first case is during handling of the transceiver prior
the ST port needs to protrude from the chassis panel a
to mounting it on the circuit board. It is important to
minimum of 9.53 nm for sufficient clearance to install the
use normal ESD handling precautions for ESD sensitive
ST connector.
devices. These precautions include using grounded wrist
Please refer to Figure 8a for a mechanical layout detailing straps, work benches, and floor mats in ESD controlled
the recommended location of the duplex SC and duplex areas.
ST transceiver packages in relation to the chassis panel.
The second case to consider is static discharges to the
For both shielded design options, Figures 8b and 8c exterior of the equipment chassis containing the trans-
identify front panel aperture dimensions.
ceiver parts. To the extent that the duplex SC connector is
exposed to the outside of the equipment chassis it may be
subject to whatever ESD system level test criteria that the
equipment is intended to meet.
Regulatory Compliance
These transceiver products are intended to enable
commercial system designers to develop equipment
that complies with the various international regula-
tions governing certification of Information Technol-
ogy Equipment. See the Regulatory Compliance Table
for details. Additional information is available from your
Avago sales representative.
42.0
24.ꢀ
9.53
(NOTE 1)
12.0
0.51
12.09
25.4
39.12
11.1
6.79
0.75
25.4
Note 1: Minimum distance from front of
connector to the panel face.
Figure 8a. Recommended common mechanical layout for ST and ST 1x9 connectored transceivers.
11
0.ꢀ
(0.032)
2x
0.ꢀ
(0.032)
2x
+ 0.5
– 0.25
10.9
+ 0.02
– 0.01
(
)
0.43
6.35
27.4 0.50
(1.0ꢀ 0.02)
9.4
(0.374)
(0.25)
MODULE
PROTRUSION
Dimensions are in millimeters (inches).
All dimensions are 0.025mm unless otherwise specified.
PCB BOTTOM VIEW
Figure 8b. Dimensions shown for mounting module with extended shield to panel.
Electromagnetic Interference (EMI)
Most equipment designs utilizing these high speed trans- In all well-designed chassis, the two 0.5" holes required
ceivers from Avago will be required to meet the require- for ST connectors to protrude through, will provide
ments of FCC in the United States, CENELEC EN55022 4.6 dB more shielding than one 1.2" duplex SC rect-
(CISPR 22) in Europe and VCCI in Japan.
angular cutout. Thus, in a well-designed chassis, the
duplex ST 1x9 transceiver emissions will be identical to
the duplex SC 1x9 transceiver emissions.
These products are suitable for use in designs ranging
from a desktop computer with a single transceiver to a
concentrator or switch product with large number of
transceivers.
12
200
1ꢀ0
160
140
120
100
5
4
3
2
1
0
3.0
1.0
1.5
AFBR-5205Z SERIES
2.0
tr/f – TRANSMITTER
OUTPUT OPTICAL
RISE/FALL TIMES – ns
2.5
3.0
1260
12ꢀ0
1300
1320
1340
1360
-3
-2
-1
0
1
2
3
λC – TRANSMITTER OUTPUT OPTICAL
EYE SAMPLING TIME POSITION (ns)
CENTER WAVELENGTH –nm
CONDITIONS:
1. TA = 25°C
2. VCC = 5 Vdc
AFBR-5205Z TRANSMITTER TEST RESULTS OF λC, Δλ AND tr/f
ARE CORRELATED AND COMPLY WITH THE ALLOWED SPECTRAL
WIDTH AS A FUNCTION OF CENTER WAVELENGTH FOR VARIOUS
RISE AND FALL TIMES.
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
4. INPUT OPTICAL POWER IS NORMALIZED TO
CENTER OF DATA SYMBOL.
5. NOTE 16 AND 17 APPLY.
Figure 9. Transmitter output optical spectral width (FWHM) vs. transmitter
output optical center wavelength and rise/fall times.
Figure 10. Relative input optical power vs. eye sampling time position.
Regulatory Compliance Table
Feature
Test Method
Performance
Electrostatic Discharge
(ESD) to the Electrical Pins
MIL-STD-883C
Method 3015.4
Meets Class 2 (2000 to 3999 Volts)
Withstand up to 2200 V applied between electrical pins.
Electrostatic Discharge
(ESD) to the Duplex SC
Receptacle
Variation of
IEC 801-2
Typically withstand at least 25 kV without damage
when the Duplex SC Connector Receptacle
is contacted by a Human Body Model probe.
Electromagnetic
Interference (EMI)
FCC Class B
Typically provide 13dB margin to the noted standards
however, it should be noted that final margin depends
on the customer's board and chasis design.
CENELEC EN55022
Class B (CISPR 22B)
VCCI Class 2
Immunity
Variation of IEC 61000-4-3
Typically show no measurable effect from a
10 V/m field swept from 10 to 450 MHz applied
to the transceiver when mounted to a circuit card
without a chassis enclosure.
13
1.9ꢀ THICKER PANEL WILL RECESS MODULE.
(0.07ꢀ) THINNER PANEL WILL PROTRUDE MODULE.
1.27
(0.05)
OPTIONAL SEPTUM
30.2
(1.19)
KEEP OUT ZONE
0.36
(0.014)
10.ꢀ2
(0.426)
14.73
(0.5ꢀ)
13.ꢀ2
(0.544)
26.4
(1.04)
BOTTOM SIDE OF PCB
12.0
(0.47)
Dimensions are in millimeters (inches).
All dimensions are 0.025mm unless otherwise specified.
Figure 8c. Dimensions shown for mounting module flush to panel.
14
Immunity
Evaluation Kits
Equipment utilizing these transceivers will be subject to Avago has available three evaluation kits for the 1x9
radio-frequency electromagnetic fields in some environ- transceivers. The purpose of these kits is to provide the
ments. These transceivers have a high immunity to such necessary materials to evaluate the performance of the
fields.
AFBR-520XZ family in a pre-existing 1x13 or 2x11 pinout
system design configuration or when connectored to
various test equipment.
For additional information regarding EMI, susceptibility,
ESD and conducted noise testing procedures and results
on the 1x9 transceiver family, please refer to Applications 1. HFBR-0319 – Evaluation Test Fixture Board:
Note 1075, Testing and Measuring Electromagnetic Com-
patibility Performance of the AFBR-510XZ/-520XZ Fiber
Optic Transceivers.
This test fixture converts +5 V ECL 1x9 transceivers to
–5 V ECL BNC Coax Connections so that direct con-
nections to industry standard fiber optic test equip-
ment can be accomplished.
Transceiver Reliability and Performance
Qualification Data
Accessory Duplex SC Connectored Cable Assemblies
Avago recommends for optimal coupling the use of
flexible-body duplex SC connectored cable.
The 1x9 transceivers have passed Avago reliability and
performance qualification testing and are undergoing
ongoing quality monitoring. Details are available from
your Avago sales representative.
Accessory Duplex ST Connectored Cable Assemblies
Avago recommends the use of Duplex Push-Pull ST
connectored cable for optimal repeatibility of the optical
power coupling.
These transceivers are manufactured at the Avago
Singapore location which is an ISO 9002 certified facility.
Applications Support Materials
Contact your local Avago Component Field Sales Office
for information on how to obtain Test Boards and demo
boards for the 1x9 transceivers.
15
AFBR-5205Z Series
Absolute Maximum Ratings
Parameter
Symbol
TS
Min.
Typ.
Max.
100
260
10
Unit
°C
Reference
Storage Temperature
Lead Soldering Temperature
Lead Soldering Time
Supply Voltage
-40
TSOLD
tSOLD
VCC
°C
sec.
V
-0.5
-0.5
7.0
VCC
1.4
50
Data Input Voltage
Differential Input Voltage
Output Current
V
I
V
VD
IO
V
Note 1
mA
AFBR-5205Z Series
Recommended Operating Conditions
Parameter
Symbol
TA
Min.
0
Typ.
Max.
70
Unit
°C
V
Reference
Ambient Operating Temperature*
Supply Voltage
VCC
4.75
-1.810
-1.165
5.25
Data Input Voltage - Low
Data Input Voltage - High
Data and Signal Detect Output Load
V - VCC
IL
-1.475
-0.880
V
V - VCC
IH
V
RL
50
Note 2
*Applies to AFBR-5205Z Series except for AFBR-5205AZ and AFBR-5205ATZ. Ambient Operating Temp. for AFBR-5205AZ and AFBR-5205ATZ is
Min. -40°C and Max. 85°C.
AFBR-5205Z Series
Transmitter Electrical Characteristics
(T = 0°C to 70°C, V = 4.75 V to 5.25 V)*
A
CC
Parameter
Symbol
ICC
Min.
Typ.
145
0.76
0
Max.
185
Unit
mA
W
Reference
Supply Current
Power Dissipation
Note 3
PDISS
IIL
0.97
Data Input Current - Low
Data Input Current - High
-350
A
A
IIH
14
350
*Applies to AFBR-5205Z Series except for AFBR-5205AZ and AFBR-5205ATZ. TA for AFBR-5205AZ and AFBR-5205ATZ is -40°C and 85°C.
16
AFBR-5205Z Series
Receiver Electrical Characteristics
(T = 0°C to 70°C, V = 4.75 V to 5.25 V)*
A
CC
Parameter
Symbol
ICC
Min.
Typ.
82
Max.
145
0.5
Unit
mA
W
V
Reference
Note 4
Note 5
Note 6
Note 6
Note 7
Note 7
Note 6
Note 6
Note 7
Note 7
Supply Current
Power Dissipation
PDISS
0.3
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
VOL - VCC
-1.83
-1.085
0.35
-1.55
-0.88
2.2
VOH - VCC
V
tr
tf
ns
ns
V
Data Output Fall Time
0.35
2.2
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Output Rise Time
Signal Detect Output Fall Time
VOL - VCC
-1.83
-1.085
0.35
-1.55
-0.88
2.2
V
tr
tf
OH - VCC
V
ns
ns
0.35
2.2
*Applies to AFBR-5205Z Series except for AFBR-5205AZ and AFBR-5205ATZ. TA for AFBR-5205AZ and AFBR-5205ATZ is -40°C and 85°C.
AFBR-5205Z/-5205AZ/-5205ATZ/-5205PZ/-5205TZ/-5205PEZ
Transmitter Optical Characteristics
(T = 0°C to 70°C, V = 4.75 V to 5.25 V)*
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Output Optical Power
62.5/125 μm, NA = 0.275 Fiber
BOL
EOL
PO
-19
-20
-14
dBm avg. Note 8
Output Optical Power
50/125 m, NA = 0.20 Fiber
BOL
EOL
PO
-22.5
-23.5
-14
dBm avg. Note 8
Optical Extinction Ratio
10
dB
Note 9
Output Optical Power at
Logic "0" State
PO ("0")
-45
dBm avg. Note 10
Center Wavelength
C
tr
1270
1310
1380
nm
Note 23
Figure 9
Spectral Width – FWHM
– nm RMS
137
58
nm
nm RMS
Note 11, 23
Figure 9
Optical Rise Time
0.6
0.6
1.0
2.1
0.04
0
3.0
ns
Note 12, 23
Figure 9
Optical Fall Time
tf
3.0
ns
Note 12, 23
Figure 9
Systematic Jitter Contributed
by the Transmitter
SJ
RJ
1.2
ns p-p
ns p-p
Note 13
Random Jitter Contributed
by the Transmitter
0.52
Note 14
*Applies to 5205Z Series except for AFBR-5205AZ/-5205ATZ. TA for AFBR-5205AZ/-5205ATZ is -40°C and 85°C.
17
AFBR-5205Z/-5205AZ/-5205ATZ/-5205PZ/-5205TZ/-5205PEZ
Receiver Optical and Electrical Characteristics
(T = 0°C to 70°C, V = 4.75 V to 5.25 V)*
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Input Optical Power
Minimum at Window Edge
PIN Min. (W)
-30
dBm avg. Note 15
Figure 10
Input Optical Power
Minimum at Eye Center
PIN Min. (C)
-31
dBm avg. Note 16
Figure 10
Input Optical Power Maximum
Operating Wavelength
PIN Max.
-14
dBm avg. Note 15
nm
1270
1380
1.2
Systematic Jitter Contributed
by the Receiver
SJ
0.2
1
ns p-p
Note 17
Random Jitter Contributed
by the Receiver
RJ
1.91
-31
ns p-p
Note 18
Signal Detect - Asserted
Signal Detect - Deasserted
Signal Detect - Hysteresis
P
A
PD + 1.5 dB
dBm avg. Note 19
dBm avg. Note 20
dB
PD
-45
1.5
0
P - PD
A
Signal Detect Assert Time
(off to on)
55
100
130
350
s
s
s
Note 21
Note 21
Note 22
Signal Detect Assert Time
(off to on) for -40°C to 0°C
Max
0
0
55
Signal Detect Deassert Time
(on to off)
110
*Applies to 5205Z Series except for AFBR-5205AZ. T for AFBR-5205AZ is -40°C to 85°C.
A
Notes:
1. This is the maximum voltage that can be applied across the Differential Transmitter Data Inputs to prevent damage to the input ESD protection
circuit.
2. The outputs are terminated with 50 connected to V -2 V.
CC
3. The power supply current needed to operate the transmitter is provided to differential ECL circuitry. This circuitry maintains a nearly constant
current flow from the power supply. Constant current operation helps to prevent unwanted electrical noise from being generated and conducted
or emitted to neighboring circuitry.
4. This value is measured with the outputs terminated into 50 connected to V -2 V and an Input Optical Power level of -14 dBm average.
CC
5. The power dissipation value is the power dissipated in the receiver itself. Power dissipation is calculated as the sum of the products of supply
voltage and currents, minus the sum of the products of the output voltages and currents.
6. This value is measured with respect to V with the output terminated into 50 connected to V -2 V.
CC
CC
7. The output rise and fall times are measured between 20% and 80% levels with the output connected to V -2 V through 50 .
CC
8. These optical power values are measured with the following conditions:
The Beginning of Life (BOL) to the End of Life (EOL) optical power degradation is typically 1.5dB per the industry convention for long wavelength
LEDs. The actual degradation observed in Avago’s 1300 nm LED products is <1 dB, as specified in this datasheet.
Over the specified operating voltage and temperature ranges.
With 25 MBd (12.5 MHz square-wave) input signal.
At the end of one meter of noted optical fiber with cladding modes removed. The average power value can be converted to a peak power value
by adding 3 dB. Higher output optical power transmitters are available on special request.
9. The Extinction Ratio is a measure of the modulation depth of the optical signal. The data“1”peak output optical power is compared to the data“0”
output optical power and expressed in decibels. With the transmitter driven by a 25 MBd (12.5 MHz square-wave) input signal, the average optical
power is measured. The data “1” peak power is then calculated by adding 3dB to the measured average optical power. The data “0”output optical
power is found by measuring the optical power when the transmitter is driven by a logic “0” input. The extinction ratio is the ratio of the optical
power at the “1”level compared to the optical power at the “0”level expressed in decibels.
10. The transmitter will provide this low level of Output Optical Power when driven by a logic “0”input. This can be useful in link trouble-shooting.
11. The relationship between Full Width Half Maximum and RMS values for Spectral Width is derived from the assumption of a Gaussian shaped
spectrum which results in a 2.35 X RMS = FWHM relationship.
12. The optical rise and fall times are measured from 10% to 90% when the transmitter is driven by a 25 MBd (12.5 MHz square-wave) input signal.
The ANSI T1E1.2 committee has designated the possibility of defining an eye pattern mask for the transmitter optical output as an item for further
study. Avago will incorporate this requirement into the specifications for these products if it is defined. The AFBR-5205Z products typically comply
with the template requirements of CCITT (now ITU-T) G.957 Section 3.2.5, Figure 2 for the STM-1 rate, excluding the optical receiver filter normally
associated with single mode fiber measurements which is the likely source for the ANSI T1E1.2 committee to follow in this matter.
13. Systematic Jitter contributed by the transmitter is defined as the combination of Duty Cycle Distortion and Data Dependent Jitter.
7
Systematic Jitter is measured at 50% threshold using a 155.52 MBd (77.5 MHz square-wave), 2 - 1 psuedorandom data pattern input signal.
14. Random Jitter contributed by the transmitter is specified with a 155.52 MBd (77.5 MHz square-wave) input signal.
18
15. This specification is intended to indicate the performance of the receiver section of the transceiver when Input Optical Power signal characteristics
are present per the following definitions. The Input Optical Power dynamic range from the minimum level (with a window time-width) to the
maximum level is the range over which the receiver is guaranteed to provide output data with a Bit Error Ratio (BER) better than or equal to 1 x
-10
10
.
At the Beginning of Life (BOL)
Over the specified operating temperature and voltage ranges
Input is a 155.52 MBd, 223 - 1 PRBS data pattern with 72 “1”s and 72 “0”s inserted per the CCITT (now ITU-T)
recommendation G.958 Appendix I.
Receiver data window time-width is 1.23 ns or greater for the clock recovery circuit to operate in. The actual test data window time-width is set
to simulate the effect of worst case optical input jitter based on the transmitter jitter values from the specification tables. The test window time-
width is as follows: HFBR-5205 is 3.32 ns.
Transmitter operating with a 155.52 MBd, 77.5 MHz square-wave, input signal to simulate any cross-talk present between the transmitter and
receiver sections of the transceiver.
16. All conditions of Note 15 apply except that the measurement is made at the center of the symbol with no window time-width.
17. Systematic Jitter contributed by the receiver is defined as the combination of Duty Cycle Distortion and Data Dependent Jitter. Systematic
7
Jitter is measured at 50% threshold using a 155.52 MBd (77.5 MHz square-wave), 2 - 1 psuedo-random data pattern input signal.
18. Random Jitter contributed by the receiver is specified with a 155.52 MBd (77.5 MHz square-wave) input signal.
19. This value is measured during the transition from low to high levels of input optical power.
20. This value is measured during the transition from high to low levels of input optical power.
21. The Signal Detect output shall be asserted within 100 μs after a step increase of the Input Optical Power (130 s for -40°C to 0°C).
22. Signal detect output shall be de-asserted within 350 μs after a step decrease in the Input Optical Power.
23. The AFBR-5205Z transceiver complies with the requirements for the tradeoffs between center wave-length, spectral width, and rise/fall times
shown in Figure 9. This figure is derived from the FDDI PMD standard (ISO/IEC 9314-3 : 1990 and ANSI X3.166 - 1990) per the description in ANSI
T1E1.2 Revision 3. The interpretation of this figure is that values of Center Wavelength and Spectral Width must lie along the appropriate Optical
Rise/Fall Time curve.
Ordering Information
The following 1300 nm transceivers are available for production orders through the Avago Component Field Sales
Offices and Authorized Distributors world wide.
1300nm LED, ATM/SONET OC-3, 155MBd
temperature range 0°C to +70°C
1300nm LED, 155MBd
temperature range -40°C to +85°C
AFBR-5205Z
AFBR-5205TZ
AFBR-5205PZ
DUPLEX SC Connector 1X9, 2KM
AFBR-5205AZ ATM/SONET
Connector 1X9
OC-3
DUPLEX
SC
Duplex ST Connector 1X9
AFBR-5205ATZ ATM/SONET OC-3 DUPLEX ST
Connector 1X9
Duplex SC Connector 1x9,
Mezzanine Height
AFBR-5205PEZ Duplex SC Connector 1x9,
Mezzanine Height with Extended Shield
*For flush shield options, please contact Field Sales Offices and Authorized Distributors world wide.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-2296EN
AV02-3673EN - June 22, 2012
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