ASMW-LR00-ASU0E [BOARDCOM]
0.5W 2835 Surface-Mount LED;
| 型号： | ASMW-LR00-ASU0E |
| 厂家： | 
Broadcom Corporation. |
| 描述： | 0.5W 2835 Surface-Mount LED 光电 |
| 文件： | 总13页 (文件大小：897K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ASMW-LA00, ASMW-LH00, ASMW-LR00
0.5W 2835 Surface-Mount LED
Data Sheet
Description
Features
The ASMW-Lx00 surface-mount LEDs use AlInGaP chip
technology with superior package design to enable them to
produce higher light output with better flux performance. They
can be driven at high current and are able to dissipate the heat
more efficiently resulting in better performance with higher
reliability.
Available in amber, red orange, and red
Moisture sensitivity level 3
High reliability with silicone encapsulation
Low package profile and large emitting area
Enhanced corrosion resistance
These LEDs are able to be operated under a wide range of
environment conditions, making it ideal for various
applications.
Applications
Specialty and architectural lighting
Gaming and vending machine backlighting
Industrial lighting, for example, tower light
Industrial equipment indicator
To facilitate easy pick-and-place assembly, the LEDs are packed
in tape and reel. Every reel is shipped in single flux and color
bin to provide good uniformity.
CAUTION: This LED is Class 2 ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling
and processing. Refer to Application Note AN-1142 for additional details.
Broadcom
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ASMW-LA00, ASMW-LH00, ASMW-LR00
Data Sheet
Figure 1 Package Dimensions
NOTE
All dimensions are in mm.
Dimensions in brackets are for reference only.
Tolerance 0.2 mm unless otherwise specified.
Encapsulation = silicone.
Terminal finish = silver plating.
Device Selection Guide (TJ = 25°C, IF = 150 mA)
Luminous Flux (lm)a, b
Typ.
Luminous Intensity (cd)c
Typ.
Part Number
Color
Min.
Max.
ASMW-LA00-AUW0E
ASMW-LH00-AUW0E
ASMW-LR00-ASU0E
Amber
Red orange
Red
26.0
26.0
21.0
28.5
29.2
24.3
35.0
35.0
29.0
9.7
10.1
8.4
a.
b. Luminous flux tolerance: 12ꢀ.
c. For reference only.
Luminous flux is the total flux output as measured with an integrating sphere at a single current pulse condition.
Broadcom
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ASMW-LA00, ASMW-LH00, ASMW-LR00
Data Sheet
Absolute Maximum Ratings
Parameter
Amber/Red Orange/ Red
Units
DC Forward Current[a
200
300
mA
mA
mW
Peak Forward Currentb
Power Dissipation
520
Not recommended for reverse bias
125
Reverse Voltage
Junction Temperature
Operating Temperature Range
Storage Temperature Range
°C
°C
°C
–40 to +100
–40 to +100
a.
Derate linearly as shown in Figure 9 and Figure 10.
b. Duty Factor = 10ꢀ, Frequency = 1kHz.
Broadcom
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ASMW-LA00, ASMW-LH00, ASMW-LR00
Data Sheet
Optical and Electrical Characteristics (TJ = 25°C)
Amber
Parameter
Min.
Typ.
Max.
Units
Remark
a
—
120
—
Deg
Viewing Angle, 21/2
b
1.8
—
2.30
—
2.6
10
V
IF =150 mA
VR = 4V
Forward Voltage, VF
c
μA
Reverse Current, IR
Dominant wavelength
Peak wavelength
584.5
—
589.0
592.0
25
597.0
—
nm
nm
IF =150 mA
IF =150 mA
Thermal Resistance, RJ-S
—
—
°C/W
LED junction to solder point
a.
b. Forward voltage tolerance = 0.1V.
c. Indicates production final test condition only. Long-term reverse biasing is not recommended.
21/2 is the off axis angle where the luminous intensity is ½ of the peak intensity.
Red Orange
Parameter
Min.
Typ.
Max.
Units
Remark
a
—
120
—
Deg
Viewing Angle, 21/2
b
1.8
—
2.16
—
2.6
10
V
IF =150 mA
VR = 4V
Forward Voltage, VF
c
μA
Reverse Current, IR
Dominant wavelength
Peak wavelength
611.0
—
613.0
620.0
25
620.0
—
nm
nm
IF =150 mA
IF =150 mA
Thermal Resistance, RJ-S
—
—
°C/W
LED junction to solder point
a.
b. Forward voltage tolerance = 0.1V.
c. Indicates production final test condition only. Long-term reverse biasing is not recommended.
21/2 is the off axis angle where the luminous intensity is ½ of the peak intensity.
Red
Parameter
Min.
Typ.
Max.
Units
Remark
a
—
120
—
Deg
Viewing Angle, 21/2
b
1.8
—
2.13
—
2.6
10
V
IF =150 mA
VR = 4V
Forward Voltage, VF
c
μA
Reverse Current, IR
Dominant wavelength
Peak wavelength
620.0
—
623.0
633.0
25
635.0
—
nm
nm
IF =150 mA
IF =150 mA
Thermal Resistance, RJ-S
—
—
°C/W
LED junction to solder point
a.
21/22 is the off axis angle where the luminous intensity is ½ of the peak intensity.
b. Forward voltage tolerance = 0.1V.
c.
Indicates production final test condition only. Long-term reverse biasing is not recommended.
Broadcom
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ASMW-LA00, ASMW-LH00, ASMW-LR00
Data Sheet
Part Numbering System
A
S
M
W
–
L
x1
0
0
–
x2 x3 x4 x5 x6
Code
Description
Options
Remark
x1
x2
Color
A
Amber
H
R
Red orange
Red
Die technology
A
AlInGaP
x3
x
Minimum flux bin
Maximum flux bin
S
21.0–23.0 lm
T
23.0–26.0 lm
U
V
W
0
B
C
D
E
26.0–29.0 lm
29.0–32.0 lm
32.0–35.0 lm
x5
Color bin
Full color distribution
Color bin 2 and 3 only
Color bin 3 and 4 only
Color bin 4 and 5 only
Color bin 5 and 6 only
Color bin 2, 3, and 4 only
Color bin 3, 4, and 5 only
Color bin 4, 5, and 6 only
Color bin 2, 3, 4, and 5 only
Color bin 3, 4, 5, and 6 only
Color bin 2, 3, 4, 5, and 6 only
Test current = 150 mA
H
J
K
N
P
S
x6
Test option
E
Part Number Example:
ASMW-LA00-AUW0E
x = A
Amber Color
AlInGaP die
1
x = A
2
x = U
Minimum flux bin U
Maximum flux bin W
Full color distribution
3
x = W
4
x = 0
5
x = E
Test current = 150 mA
6
Broadcom
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ASMW-LA00, ASMW-LH00, ASMW-LR00
Data Sheet
Bin Information
Forward Voltage Bin (VF)
Flux Bin (CAT)
Forward Voltage (V)
Min. Max.
Luminous Flux (lm)
Bin ID
Bin ID
Min.
Max.
H11
H12
H13
H14
H15
H16
H17
H18
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
S
T
21.0
23.0
26.0
29.0
32.0
23.0
26.0
29.0
32.0
35.0
U
V
W
Tolerance: 12ꢀ
Color Bin (BIN) – Amber
Tolerance: 0.1V
Bin ID
Min. (nm)
Max. (nm)
2
3
4
5
6
584.5
587.0
589.5
592.0
594.5
587.0
589.5
592.0
594.5
597.0
Tolerance: 1nm
Color Bin (BIN) – Red Orange
Bin ID
Min. (nm)
Max. (nm)
1
2
611.0
616.0
616.0
620.0
Tolerance: 1nm
Color Bin (BIN) – Red
Bin ID
Min. (nm)
Max. (nm)
—
620.0
635.0
Tolerance: 1nm
Example of bin information on reel and packaging label:
CAT: S
BIN: 2
Flux bin S
Color bin 2
Vf bin H14
VF: H14
Broadcom
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ASMW-LA00, ASMW-LH00, ASMW-LR00
Data Sheet
Figure 2 Relative Luminous Flux vs. Forward Current
Figure 3 Forward Current vs. Forward Voltage
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
320
Red
Amber
280
240
200
160
120
80
Red Orange
40
0
0
40
80
120 160 200 240
1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
DC FORWARD CURRENT - mA
FORWARD VOLTAGE - V
Figure 4 Dominant Wavelength Shift vs. Forward Current
Figure 5 Relative Luminous Flux vs. Junction Temperature
3
2.0
Red
Amber
Red Orange
Red
Amber
Red Orange
1.8
2
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1
0
-1
-2
-3
0
40
80
120 160 200 240
FORWARD CURRENT -mA
-40 -20
0
20 40 60 80 100 120 140
JUNCTION TEMPERATURE, TJ -°C
Figure 6 Forward Voltage Shift vs. Junction Temperature
Figure 7 Dominant Wavelength Shift vs. Junction Temperature
0.4
12.0
Red
Amber
Red Orange
Red
10.0
8.0
Amber
0.3
Red Orange
0.2
6.0
4.0
0.1
0.0
2.0
0.0
-2.0
-4.0
-6.0
-8.0
-0.1
-0.2
-0.3
-40 -20
0
20 40 60 80 100 120 140
-40 -20
0
20 40 60 80 100 120 140
JUNCTION TEMPERATURE, TJ -°C
JUNCTION TEMPERATURE,TJ - °C
Broadcom
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ASMW-LA00, ASMW-LH00, ASMW-LR00
Data Sheet
Figure 8 Relative Spectral Emission
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Red
Amber
Red Orange
380
430
480
530
580
630
680
730
780
WAVELENGTH - nm
Figure 9 Derating Curve According to Ambient Temperature –TA
Figure 10 Derating Curve According to Solder Point Temperature –TS
240
200
240
200
160
120
80
160
RθJ-A= 100°C/W
RθJ-A= 115°C/W
RθJ-A= 130°C/W
120
80
40
0
40
0
0
20
40
60
80
100 120
0
20
40
60
80
100 120
AMBIENT TEMPERATURE, TA - °C
SOLDER POINT TEMPERATURE, TS - °C
Figure 11 Pulse Handing Capability at TS ≤ 100°C
Figure 12 Radiation Pattern
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.35
D =
0.01
0.05
0.10
0.30
0.25
0.50
1.00
0.25
0.20
0.15
-90
-60
-30
0
30
60
90
1.0E-03
1.0E-02
1.0E-01
1.0E+00
ANGULAR DISPLACEMENT - DEGREES
tp - PULSE DURATION - sec
Broadcom
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ASMW-LA00, ASMW-LH00, ASMW-LR00
Data Sheet
Figure 13 Recommended Soldering Land Pattern (in mm)
Maximize anode
copper pad area for
better heat dissipation
Solder mask
Copper pad
Figure 14 Carrier Tape Dimensions
F
P0
P1
P2
D0
E1
W
T
B0
K0
A0
3.5 0.05
4.0 0.10
4.0 0.1
2.0 0.05
1.55 0.05 1.75 0.10
8.0 0.20
0.20 0.05 3.80 0.10 1.05 0.10
3.1 0.10
Broadcom
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ASMW-LA00, ASMW-LH00, ASMW-LR00
Data Sheet
Figure 15 Reel Dimension
9.0
PRODUCT LABEL
USER FEED DIRECTION
Unit: mm.
Broadcom
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ASMW-LA00, ASMW-LH00, ASMW-LR00
Data Sheet
Do not touch the silicone encapsulant. Uncontrolled force
acting on the silicone encapsulant might result in
excessive stress on the wire bond. Hold the LED only by the
body.
Precautionary Notes
Soldering
Do no stack assembled PCBs together. Use an appropriate
rack to hold the PCBs.
Figure 16 Recommended Pb-free Reflow Soldering Condition
The surface of silicone material attracts dust and dirt easier
than epoxy due to its surface tackiness. To remove foreign
particles on the surface of the silicone, use a cotton bud
with isopropyl alcohol (IPA). During cleaning, rub the
surface gently without putting much pressure on the
silicone. Ultrasonic cleaning is not recommended.
For automated pick and place, Broadcom has tested the
following nozzle size to work well with this LED. However,
due to the possibility of variations in other parameters,
such as pick and place machine maker/model and other
settings of the machine, verify that the selected nozzle will
not damage the LED.
Figure 17 Nozzle Size
Reflow soldering must not be done more than twice.
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Use hand soldering
only for rework if unavoidable, but it must be strictly
controlled to the following conditions:
—
—
—
Solder iron tip temperature = 315°C maximum
Solder duration = 3s maximum
After hand soldering, the LED must be allowed to cool
down prior to touch up soldering.
Do not touch the LE package body with the soldering iron
except for the soldering terminals as it might cause
damage to the LED.
Confirm beforehand whether the functionality and
performance of the LED is affected by soldering with hand
soldering.
Handling of Moisture-Sensitive Devices
This product has a Moisture Sensitive Level 3 rating per JEDEC
J-STD-020. Refer to Broadcom Application Note AN5305,
Handling of Moisture Sensitive Surface Mount Devices, for
additional details and a review of proper handling procedures.
Handling Precautions
The encapsulation material of the LED is made of silicone for
better product reliability. Compared to epoxy encapsulant that
is hard and brittle, silicone is softer and flexible. Special
handling precaution must be observed during assembly of
silicone encapsulated LED products. Failure to comply might
lead to damage and premature failure of the LED. Refer to
Application Note AN5288, Silicone Encapsulation for LED:
Advantages and Handling Precautions, for more information.
Before use:
—
An unopened moisture barrier bag (MBB) can be
stored at < 40°C / 90ꢀ RH for 12 months. If the actual
shelf life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required, it is safe to reflow the LEDs per the original
MSL rating.
Do not poke sharp objects into the silicone encapsulant.
Sharp objects, such as tweezers or syringes, might apply
excessive force or even pierce through the silicone and
induce failures to the LED die or wire bond.
—
Do not open the MBB prior to assembly (for example,
for IQC).
Control after opening the MBB:
Read the HIC immediately upon opening of MBB.
—
Broadcom
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ASMW-LA00, ASMW-LH00, ASMW-LR00
Data Sheet
—
Keep the LEDs at < 30°C / 60ꢀ RH at all times. All high
— IEC 60068-2-60: 25°C/75ꢀ RH, SO 200 ppb, NO
2 2
temperature-related processes, including soldering,
curing, or rework, must be completed within
168 hours.
200 ppb, H S 10 ppb, Cl2 10 ppb, 21 days
2
As actual application conditions might not be exactly
similar to the test conditions, verify that the LED will not be
damaged by prolonged exposure in the intended
environment.
Control for unfinished reel:
Store unused LEDs in a sealed MBB with desiccant or
desiccators at < 5ꢀ RH.
Avoid rapid change in ambient temperature, especially in
high humidity environments because this will cause
condensation on the LED.
If the LED is intended to be used in harsh or outdoor
environments, protect the LED by means of protective
cover against damages caused by rain water, dust, oil,
corrosive gases, external mechanical stress, and so on.
Control of assembled boards:
If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, store the PCB in a
sealed MBB with desiccant or desiccators at < 5ꢀ RH to
ensure that all LEDs have not exceeded their floor life of
168 hours.
Baking is required if the following conditions exist:
Thermal Management
—
—
—
The HIC indicator indicates a change in color for
10 percent and 5 percent as stated on the HIC.
The LEDs are exposed to condition of > 30°C / 60ꢀ RH
at any time.
Optical, electrical and reliability characteristics of LED are
affected by temperature. Keep the junction temperature (T ) of
the LED below allowable limit at all times. T can be calculated
as follows:
J
J
The LED floor life exceeded 168 hours.
The recommended baking condition is: 60°C 5ºC for
20 hours.
T = T + R × I × V
J
S
JS
F
fmax
Baking should only be done once.
Storage:
where T =
LED solder point temperature as shown in
Figure 18 (°C)
S
R
Thermal resistance from junction to solder
point (°C/W)
The soldering terminals of these Broadcom LEDs are silver
plated. If the LEDs are exposed in an ambient environment
for too long, the silver plating might oxidize, thus affecting
its solderability performance. As such, keep unused LEDs
in a sealed MBB with desiccant or in desiccators at
< 5ꢀ RH.
JS
I
=
Forward current (A)
F
V
=
Maximum forward voltage (V)
fmax
Figure 18 LED Solder Point
LED Anode Mark
TS Point
Application Precautions
Printed
Circuit Board
The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated in
the data sheet. Constant current driving is recommended
to ensure consistent performance.
LEDs exhibit slightly different characteristics at different
drive currents that might result in larger performance
variation (for example, intensity, wavelength, and forward
voltage). Set the application current as close as possible to
the test current to minimize these variations.
To measure the soldering point temperature, mount a
thermocouple on the T point as shown in Figure 18. Verify the
S
T of the LED in the final product to ensure that the LEDs are
operated within all maximum ratings stated in the data sheet.
S
The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When driving
the LED in matrix form, ensure that the reverse bias voltage
does not exceed the allowable limit of the LED.
This LED is designed to have enhanced gas corrosion
resistance. Its performance has been tested according to
the following conditions:
Eye Safety and Precautions
LEDs may pose optical hazards when in operation. Do not look
directly at operating LEDs as it may be harmful to the eyes. For
safety reasons, use appropriate shielding or personnel
protection equipments.
—
—
IEC 60068-2-43: 25°C/75ꢀ RH, H S 15 ppm, 21 days
2
IEC 60068-2-42: 25°C/75ꢀ RH, SO 25 ppm, 21 days
2
Broadcom
- 12 -
Disclaimer
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For product information and a complete list of distributors, please go to our web
site: www.broadcom.com.
Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago,
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Copyright © 2017 by Broadcom. All Rights Reserved.
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Information furnished by Broadcom is believed to be accurate and reliable.
However, Broadcom does not assume any liability arising out of the application
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described herein, neither does it convey any license under its patent rights nor
the rights of others.
ASMW-LXXX-DS100 – February 27, 2017
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