HLMP-0504 [BOARDCOM]
2.5 mm x 7.6 mm Rectangular LED Lamps;
| 型号： | HLMP-0504 |
| 厂家： | 
Broadcom Corporation. |
| 描述： | 2.5 mm x 7.6 mm Rectangular LED Lamps 功效 光电 |
| 文件： | 总8页 (文件大小：223K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504
2.5 mm x 7.6 mm Rectangular LED Lamps
Data Sheet
Description
Features
The HLMP-R100, -0301, -0401, -0504 are solid state • Rectangular light emitting surface
lamps encapsulated in a radial lead rectangular epoxy
• Flat high sterance emitting surface
package. They utilize
a tinted, diffused epoxy to
• Stackable on 2.54 mm (0.100 inch) centers
• Ideal as flush mounted panel indicators
• Ideal for backlighting legends
• Long life: solid state reliability
• Choice of 4 bright colors
– DH AS AlGaAs Red
provide high on-off contrast and a flat high intensity
emitting surface. Borderless package design allows
creation of uninterrupted light emitting areas.
The HLMP-R100 uses a double heterojunction (DH)
absorbing substrate (AS) aluminum gallium arsenide
(AlGaAs) red LED chip in a light red epoxy package. This
combination produces outstanding light output over a
wide range of drive currents.
– High Efficiency Red
The HLMP-0301 has a high efficiency red GaAsP on
GaP LED chip in a light red epoxy package.
– Yellow
– High Performance Green
The HLMP-0401 provides a yellow GaAsP on GaP LED chip
in a yellow epoxy package.
• IC compatible/low current requirements
The HLMP-0504 provides a green GaP LED chip in a green
epoxy package.
Package Dimensions
7.62 (0.300)
7.11 (0.280)
7.62 (0.300)
6.99 (0.275)
0.46 (0.018)
SQ. NOMINAL
2.54 (0.100)
NOMINAL
CATHODE LEAD
29.21 (1.15) MIN.
BOTTOM VIEW
8.00 (0.315)
7.37 (0.290)
1.27 (0.50)
NOMINAL
NOTES:
1. ALL DIMENSIONS ARE IN
MILLIMETERS (INCHES).
2.54 (0.100)
2.16 (0.085)
2.54 (0.100)
2.29 (0.090)
2. AN EPOXY MENISCUS MAY EXTEND
ABOUT 1 mm (0.040") DOWN THE LEADS.
3. THERE IS A MXIMUM 1° TAPER FROM
BASE TO THE TOP OF LAMP.
SIDE VIEW
Selection Guide
Luminous Intensity
Iv (mcd) at 20 mA
Color
Part Number
Min.
2.1
5.4
2.1
1.3
2.1
1.3
3.6
1.4
3.6
2.2
3.6
2.6
1.6
4.2
2.6
2.6
Typ.
–
DH AlGaAs Red
HLMP-R100
HLMP-R100-FG0xx
HLMP-0301
17.2
–
Red
HLMP-0301-C00xx
HLMP-0301-DECxx
HLMP-0301-CD0xx
HLMP-0401
–
6.8
4.2
–
Yellow
HLMP-0401-B00xx
HLMP-0401-D00xx
HLMP-0401-CD0xx
HLMP-0401-DEBxx
HLMP-0504
–
–
7.2
11.4
–
Green
HLMP-0504-B00xx
HLMP-0504-DECxx
HLMP-0504-CD0xx
HLMP-0504-C00xx
–
13.4
8.4
–
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
DD: Ammo Pack, Straight Leads
Color Bin Options
0: Full Color Bin Distribution
B: Color Bins 2 & 3 only
C: Color Bins 3 & 4 only
Maximum Iv Bin Options
0: Open (No Maximum Limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Color Options
1. As AlGaAs Red
3. High Efficiency Red
4. Yellow
5. Green
Package Options
R,0: Rectangular 2.5 mm x 7.6 mm
2
Absolute Maximum Ratings at T = 25°C
A
Parameter
HLMP-R100
HLMP-0301
HLMP-0401
HLMP-0504
Units
mA
mA
mA
mW
V
Peak Forward Current
Average Forward Current[1]
DC Current[2]
300
90
60
90
20
25
20
25
30
30
20
30
Power Dissipation
87
135
85
135
Reverse Voltage (IR = 100 μA)
Transient Forward Current[3] (10 μs Pulse)
Operating Temperature Range
5
5
5
5
500
500
500
500
mA
°C
-20 to +100
-40 to +100
-40 to +100
-40 to +100
-40 to +100
-40 to +100
-20 to +100
-40 to +100
Storage Temperature Range
Notes:
1. See Figure 5 to establish pulsed operating conditions.
2. For AlGaAs Red, Red, and Green Series derate linearly from 50°C at 0.5 mA/°C. For Yellow Series derate linearly from 50°C at 0.2 mA/°C.
3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak current beyond the peak forward current listed in the Absolute Maximum
Ratings.
3
Electrical/Optical Characteristics at T = 25°C
A
HLMP-R100
HLMP-0301
HLMP-0401
HLMP-0504
Test
Sym.
Description
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units
Conditions
2q1/2
Included Angle
Between Half
Luminous
100
645
100
100
100
Deg.
Note 1.
Fig. 6
Intensity Points
lP
Peak Wavelength
635
583
565
nm
Measure-
ment at
Peak
ld
Dominant
Wavelength
637
20
626
40
585
36
569
28
nm
nm
Note 2.
Dl1/2
Spectral Line
Halfwidth
ts
Speed of Response
Capacitance
30
30
90
16
90
18
500
18
ns
C
pF
VF = 0;
f = 1 MHz
RqJ-PIN Thermal Resistance
260
260
260
260
°C/W
Junction
to Cathode
Lead
VF
VR
Forward Voltage
1.8 2.2
1.9 2.6
2.1 2.6
2.2 3.0
V
IF = 20 mA
Figure 2.
Reverse Breakdown 5.0
Voltage
5.0
5.0
5.0
V
IR = 100 μA
hv
Luminous Efficacy
80
145
500
595
lm/W
Note 3.
Notes:
1.
q
is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
1/2
2. The dominant wavelength, l , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
d
device.
3. Radiant intensity, I , in watts/steradian, may be found from the equation I = I /h , where I is the luminous intensity in candelas and h is the
e
e
v
v
v
v
luminous efficacy in lumens/watt.
1.0
T
= 25° C
A
AlGaAs RED
GREEN
0.5
YELLOW
HIGH EFFICIENCY RED
0
500
550
600
650
WAVELENGTH – nm
700
750
Figure 1. Relative intensity vs. wavelength.
4
90
80
70
60
50
40
30
20
10
0
2.5
2.0
1.5
1.0
0.5
0
1.3
1.2
1.1
1.0
AlGaAs
RED
YELLOW
HER
HER, YELLOW, GREEN
GREEN
HER
0.9
0.8
0.7
0.6
YELLOW
AlGaAs RED
AlGaAs RED
GREEN
0.5
0.4
0
5
10
15
20
25
30
0
10 20 30 40 50 60 70 80 90
I – PEAK CURRENT PER LED – mA
PEAK
1.0
2.0
3.0
4.0
5.0
V
– FORWARD VOLTAGE – V
I
– DC CURRENT PER LED – mA
F
DC
Figure 2. Forward current vs. forward voltage.
VF (300 mA) for AlGaAs Red = 2.6 volts typical.
Figure 3. Relative luminous intensity vs. forward
current.
Figure 4. Relative efficiency (luminous intensity
per unit current) vs. peak current. hv (300 mA) for
AlGaAs Red = 0.7.
10
9
4.0
3.0
8
7
6
5
4
2.0
1.5
3
2
1.0
1
1
10
100
1000
10,000
1
10
100
1000
10000
t
– PULSE DURATION – µs
P
t
– PULSE DURATION – µs
p
HER, ORANGE, YELLOW, and GREEN
AlGaAs RED
Figure 5. Maximum tolerable peak current vs. peak duration (IPEAK MAX determined from temperature derated IDC MAX).
0°
1.0
10°
20°
30°
0.8
0.6
0.4
0.2
40°
50°
60°
70°
80°
90°
10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
Figure 6. Relative luminous intensity vs. angular displacement.
5
Intensity Bin Limits
Intensity Bin Limits, continued
Intensity Range (mcd)
Intensity Range (mcd)
Color
Bin
B
C
D
E
Color
Red
Bin
C
D
E
Min.
0.5
Max.
2.4
Min.
1.6
Max.
2.5
Yellow
2.4
3.8
2.5
4.0
3.8
6.1
4.0
6.5
F
6.1
9.7
6.5
10.3
G
H
I
9.7
15.5
F
10.3
16.6
15.5
24.8
G
H
I
16.6
26.5
24.8
39.6
26.5
42.3
J
39.6
63.4
42.3
67.7
K
63.4
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
30900.0
J
67.7
108.2
173.2
250.0
360.0
510.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
27000.0
2.9
L
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
K
L
108.2
173.2
250.0
360.0
510.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
1.8
M
N
O
P
M
N
O
P
Q
R
Q
R
S
S
T
U
V
W
X
Y
T
U
V
W
B
C
D
E
Green
Z
2.9
4.7
Maximum tolerance for each bin limit is 18ꢀ.
4.7
7.6
7.6
12.0
F
12.0
19.1
G
H
I
19.1
30.7
30.7
49.1
49.1
78.5
J
78.5
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
40000.0
K
L
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
M
N
O
P
Q
R
S
T
U
V
W
6
Color Categories
Lambda (nm)
Min.
Color
Category#
Max.
564.5
567.5
570.5
573.5
576.5
584.5
587.0
589.5
592.0
593.0
Green
6
5
4
3
2
1
3
2
4
5
561.5
564.5
567.5
570.5
573.5
582.0
584.5
587.0
589.5
592.0
Yellow
Tolerance for each bin limit is 0.5 nm.
Mechanical Option Matrix
Mechanical Option Code
Definition
00
01
02
Bulk Packaging, minimum increment 500 pcs/bag
Tape & Reel, crimped leads, minimum increment 1300 pcs/bag
Tape & Reel, straight leads, minimum increment 1300 pcs/bag
Ammo Pack, straight leads with minimum increment 2K/pack
DD
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarification/information.
7
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
inducedtoLEDpackage. Otherwise, cuttheleadsofLED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
Soldering Conditions
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
Plated Through
Hole Diameter
• Recommended soldering conditions:
Diagonal
Manual Solder
Dipping
0.457 x 0.457 mm
0.646 mm
0.976 to 1.078 mm
(0.038 to 0.042 inch)
Wave Soldering
105°C Max.
30 sec Max.
250°C Max.
3 sec Max.
(0.018 x 0.018 inch) (0.025 inch)
0.508 x 0.508 mm 0.718 mm
(0.020 x 0.020 inch) (0.028 inch)
Pre-heat Temperature
Pre-heat Time
–
1.049 to 1.150 mm
(0.041 to 0.045 inch)
–
Note: Refer to application note AN1027 for more information on
soldering LED components.
Peak Temperature
Dwell Time
260°C Max.
5 sec Max.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
200
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
150
FLUXING
100
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
50
30
PREHEAT
0
10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
Figure 7. Recommended wave soldering profile.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved.
AV02-1554EN - October 13, 2008
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