HLMP-4000 [BOARDCOM]
T-1 3/4, 2 mm x 5 mm Rectangular Bicolor LED Lamps;
| 型号： | HLMP-4000 |
| 厂家： | 
Broadcom Corporation. |
| 描述： | T-1 3/4, 2 mm x 5 mm Rectangular Bicolor LED Lamps PC 功效 光电 |
| 文件： | 总6页 (文件大小：192K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-40xx, HLMP-08xx
T-1 3/4, 2 mm x 5 mm Rectangular Bicolor LED Lamps
Data Sheet
Description
Features
The T-1 3/4 HLMP-40xx and 2 mm by 5 mm rectangular
HLMP-08xx are three leaded bicolor light sources de-
signed for a variety of applications where dual state illu-
mination is required in the same package. There are two
LED chips, mounted on a central common cathode lead
for maximum on-axis viewability. Colors between the two
chips can be generated by independently pulse width
modulating the LED chips.
• Two color operation
• Three leads with one common cathode
• Option of straight or spread leads configuration
Selection Guide
Min. Luminous Intensity Iv (mcd)
Package
Part Number
HLMP-4000
HLMP-4000#xxx
HLMP-4015
HLMP-0800
HLMP-0805
Color
Package lens
Green
4.2
Red
2.1
2.1
Yellow
I (mA)
F
T-1 3/4
Green/HER
Non tinted, diffused
10
10
20
20
20
4.2
Green/Yellow
Green/HER
Non tinted, non-diffused
Non tinted, diffused
Non tinted, diffused
20.0
2.6
20
Rectangular
2.1
Green/Yellow
2.6
1.4
Part Numbering System
H L M P - X X X X # X X X
Mechanical Options
002:
010:
Tape & Reel, Straight Leads
Right Angle Housing, Even Leads
Color Options
00:
High Efficiency Red (HER)/High Efficiency Green
05/15: Yellow/High Efficiency Green
Package Options
40:
08:
T-1 3/4 (5 mm)
Rectangular
Package Dimensions
2.23 (0.088)
1.98 (0.078)
5.08 (0.200)
4.57 (0.180)
5.18 (0.204)
4.93 (0.194)
8.00 (0.315)
7.37 (0.290)
9.19 (0.362)
8.43 (0.332)
0.89 (0.035)
0.64 (0.025)
5.46 (0.215)
4.98 (0.196)
25.40
MIN.
(1.00)
COMMON
CATHODE
25.40
(1.00)
COMMON
CATHODE
MIN.
2.41 (0.095)
2.03 (0.085)
1.27 (0.050)
NOM.
0.508 (0.020)
SQ. TYP.
0.508 (0.020)
SQ. TYP.
SIDE VIEW
1.27 (0.050)
NOM.
1.27 (0.050)
NOM.
1.27 (0.050)
NOM.
2.54 (0.100)
NOM.
2.54 (0.100)
NOM.
GREEN ANODE
FLAT INDICATES
ANODE
6.10 (0.240)
5.59 (0.220)
RED OR YELLOW ANODE
(SHORT LEAD)
GREEN
ANODE
RED OR YELLOW ANODE
(SHORT LEAD)
COMMON CATHODE
COMMON CATHODE
HLMP-40xx Straight Leads
HLMP-08xx Straight Leads
Notes:
1. All dimensions are in millimeters (inches).
2. Epoxy meniscus may extend about 1 mm (0.040") down the leads.
2
Absolute Maximum Ratings at T = 25°C
A
Parameter
HER/Green
Yellow/Green
Units
mA
mA
mA
mW
°C
Peak Forward Current
90
60
Average Forward Current[1,2] (Total)
DC Current[2] (Total)
Power Dissipation[3] (Total)
Operating Temperature Range
Storage Temperature Range
Reverse Voltage (IR = 100 µA)
25
20
30
20
135
135
–20 to +100
–20 to +100
–40 to +100
–40 to +100
°C
5
5
V
Transient Forward Current[4]
(10 µsec Pulse)
500
500
mA
Notes:
1. See Figure 5 to establish pulsed operating conditions.
2. The combined simultaneous current must not exceed the maximum.
3. The combined simultaneous current must not exceed the maximum.
4. The transient peak current is the maximum non-recurring current that can be applied to the device without damaging the LED die and wirebond.
It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings.
Electrical/Optical Characteristics at T = 25˚C
A
High Efficiency Red
Min. Typ. Max. Min.
Green
Yellow
Symbol Parameter
Typ. Max. Min.
Typ. Max. Units Test Condition
lPEAK
Peak
Wavelength
635
626
90
568
583
585
90
nm
nm
ns
20 mA
ld
Dominant
570
260
18
20 mA
Wavelength[1]
ts
Speed of
Response
C
Capacitance
11
15
pF
V
VF = 0, f =1 MHz
20 mA
VF
Forward
Voltage
1.9
2.6
2.2
3.0
2.1
5
2.6
VR
Reverse
Voltage
5
5
V
IR = 100 µA
RqJ-PIN
2q1/2
Thermal
Resistance
210
210
210
65
°C/W Junction-to-
Cathode Lead
Included Angle between half luminous intensity points [2]
HLMP-40xx
65
65
de-
gree
HLMP-08xx
100
145
100
595
100
500
hV
Luminous
Efficacy[3]
lm/W
Notes:
1. The dominant wavelength, l , is derived from the CIE Chromaticity Diagram and represents the single wavelength which defines the color of the
d
device.
2. q is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
1/2
3. Radiant intensity, le, in watts steradian, may be found from the equation le = Iv/h where Iv is the luminous intensity in candelas and h V is the
V,
luminous efficacy in lumens/watt.
3
1.0
ORANGE
T = 25° C
A
EMERALD GREEN
HIGH
PERFORMANCE
GREEN
HIGH EFFICIENCY RED
0.5
YELLOW
0
500
550
600
650
700
750
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
HIGH EFFICIENCY RED, ORANGE,
YELLOW, AND HIGH PERFORMANCE
GREEN, EMERALD GREEN
HER, ORANGE, YELLOW, AND HIGH
PERFORMANCE GREEN, EMERALD GREEN
100
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
HIGH
PERFORMANCE
GREEN,
80
EMERALD GREEN
HIGH
60
40
20
0
EFFICIENCY
RED/ORANGE
YELLOW
0
1.0
2.0
3.0
4.0
5.0
0
5
10
15
20
25
30
V
– FORWARD VOLTAGE – V
F
I
– DC CURRENT PER LED – mA
DC
Figure 2. Forward current vs. forward voltage characteristics.
Figure 3. Relative luminous intensity vs. DC forward current.
HER, ORANGE, YELLOW, HIGH
PERFORMANCE GREEN, EMERALD GREEN
1.3
6
5
EMERALD GREEN
YELLOW
1.2
1.1
1.0
10 KHz
30 KHz
300 Hz
4
3
1 KHz
HIGH EFFICIENCY
RED/ORANGE
100 KHz
3 KHz
100 Hz
0.9
0.8
0.7
0.6
HIGH PERFORMANCE GREEN
2
0.5
0.4
1
0
10 20 30 40 50 60 70 80 90
– PEAK SEGMENT CURRENT – mA
1.0
10
100
1000
10,000
I
t
– PULSE DURATION – µs
PEAK
P
Figure 4. Relative efficiency (luminous intensity per unit current)
vs. peak LED current.
Figure 5. Maximum tolerable peak current vs. pulse duration.
(IDC Max. as per maximum ratings.)
4
0°
1.0
10°
20°
30°
0.8
0.6
0.4
0.2
40°
50°
60°
70°
80°
90°
10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
Figure 6. Relative luminous intensity vs. angular displacement for HLMP-40xx.
0°
1.0
10°
20°
30°
0.8
0.6
0.4
0.2
40°
50°
60°
70°
80°
90°
10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
Figure 7. Relative luminous intensity vs. angular displacement for HLMP-08xx.
Mechanical Option Matrix
Mechanical Option Code
Definition
002
010
Tape & Reel, straight leads, minimum increment 1300 pcs/bag
Right Angle Housing, even leads, minimum increment 500 pcs/bag
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago represen-
tative for further clarification/information.
5
Precautions:
Lead Forming
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
inducedtoLEDpackage. Otherwise, cuttheleadsofLED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended PC board plated through hole sizes for
LED component leads:
• Recommended soldering conditions:
LED Component
Lead Size
Diagonal
Plated Through
Hole Diameter
Wave
Soldering
Manual Solder
Dipping
0.457 x 0.457 mm
0.646 mm
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Pre-heat Temperature
Pre-heat Time
105 °C Max.
30 sec Max.
250 °C Max.
3 sec Max.
–
(0.018 x 0.018 inch) (0.025 inch)
0.508 x 0.508 mm 0.718 mm
(0.020 x 0.020 inch) (0.028 inch)
–
Peak Temperature
Dwell Time
260 °C Max.
5 sec Max.
Note: Refer to application note AN1027 for more information on solder-
ing LED components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
BOTTOM SIDE
OF PC BOARD
250
200
150
100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
FLUXING
PREHEAT
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
50
30
0
10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
Figure 8. Recommended wave soldering profile.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes 5989-4264E
AV02-1552EN - August 21, 2014
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