HLMP-AG65-X10XX [BOARDCOM]
Precision Optical Performance Red Green and Blue New 5mm Mini Oval LEDs;型号: | HLMP-AG65-X10XX |
厂家: | Broadcom Corporation. |
描述: | Precision Optical Performance Red Green and Blue New 5mm Mini Oval LEDs |
文件: | 总12页 (文件大小:231K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HLMP-AG64/65, HLMP-AM64/65, HLMP-AB64/65
Precision Optical Performance Red Green and Blue
New 5mm Mini Oval LEDs
Data Sheet
Description
Features
Well defined spatial radiation pattern
High brightness material
Available in red, green and blue color
Red AlInGaP 626 nm
Green InGaN 525nm
Blue InGaN 470nm
Superior resistance to moisture
Standoff Package
These Precision Optical Performance Oval LEDs are spe-
cifically designed for full color/video and passenger infor-
mation signs. The oval shaped radiation pattern and high
luminous intensity ensure that these devices are excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
The package epoxy contains both UV-A and UV-B inhibi-
tors to reduce the effects of long term exposure to direct
sunlight.
Tinted and diffused
Typical viewing angle 30° x 70°
Applications
Full color signs
Package Dimensions
Package drawing A
0.ꢀ
0.032
max.
3.ꢀ0 0.200
0.150 0.00ꢀ
0.50 0.10
sq. typ.
ꢀ.70 0.20
0.342 0.00ꢀ
0.020 0.004
0.70
0.02ꢀ
max.
5.20 0.200
0.205 0.00ꢀ
2.54 0.3
0.100 0.012
cathode lead
min.
1.00
min.
24.00
0.945
0.03ꢀ
Package drawing B
1.50 0.15
0.0591 0.006
0.50 0.10
sq. typ.
11.70 0.50
0.4606 0.020
3.ꢀ0 0.200
0.150 0.00ꢀ
0.020 0.004
0.70
0.02ꢀ
max.
5.20 0.20
0.205 0.00ꢀ
2.54 0.3
0.100 0.012
cathode lead
min.
24.00
0.945
ꢀ.70 0.20
0.342 0.00ꢀ
1.00
min.
0.ꢀ
0.032
max.
0.03ꢀ
Notes:
All dimensions in millimeters (inches).
Caution: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN – 1142 for additional details.
Device Selection Guide
Color and Dominant
Wavelength d (nm) Typ (mcd) at 20 mA-Min
Red 626
Luminous Intensity Iv
Luminous Intensity Iv
(mcd) at 20 mA-Max
Package
Drawing
Part Number
Standoff
No
HLMP-AG64-X10xx
HLMP-AG65-X10xx
HLMP-AM64-140xx
HLMP-AM65-140xx
HLMP-AB64-TW0xx
HLMP-AB65-TW0xx
1660
1660
2900
2900
800
3500
3500
6050
6050
1660
1660
A
B
A
B
A
B
Red 626
Yes
Green 525
Green 525
Blue 470
Blue 470
No
Yes
No
800
Yes
Tolerance for each intensity limit is 15ꢀ.
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
Part Numbering System
H L M P - A x 6 x – x x x x x
Packaging Option
DD: Ammopack
ZZ: Flexi Ammopack
Color Bin Selection
0: Open distribution
Maximum Intensity Bin
0: No maximum intensity limit
Minimum Intensity Bin
Refer to Device Selection Guide.
Standoff/ Non Standoff
4: Non Standoff
5: Standoff
Color
G: Red 626
M: Green 525
B: Blue 470
Package
A: 5mm Mini Oval 30° x 70°
Note:
Please refer to AB 5337 for complete information about part numbering system.
2
Absolute Maximum Ratings
T = 25°C
A
Parameter
Red
Green and Blue
30
100 [3]
Unit
mA
mA
mW
V
DC Forward Current [1]
Peak Forward Current
Power Dissipation
50
100 [2]
120
116
Reverse Voltage
5 (IR = 100 μA)
130
5 (IR = 10 μA)
110
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
°C
-40 to +100
-40 to +100
-40 to +85
-40 to +100
°C
°C
Notes:
1. Derate linearly as shown in Figure 4 and Figure 8
2. Duty Factor 30ꢀ, frequency 1KHz.
3. Duty Factor 10ꢀ, frequency 1KHz.
Electrical / Optical Characteristics
T = 25°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
VF
V
IF = 20 mA
Red
Green
Blue
1.8
2.8
2.8
2.1
3.2
3.2
2.4
3.8
3.8
Reverse Voltage
Red
VR
V
5
5
IF = 100 μA
IF = 10 μA
Green & blue
Dominant Wavelength [1]
Red
Green
Blue
d
618
520
460
626
525
470
630
540
480
nm
IF = 20 mA
Peak Wavelength
Red
Green
Blue
PEAK
RJ-PIN
V
634
516
464
nm
Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
Thermal Resistance
240
°C/W
lm/W
LED Junction-to-Pin
Luminous Efficacy [2]
Red
Green
Blue
150
530
65
Emitted Luminous Power/
Emitted Radiant Power
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = I / where I is the luminous intensity in candelas and is
V
V
V
V
the luminous efficacy in lumens/watt.
3
AlInGaP Red
1
50
40
30
20
10
0.8
0.6
0.4
0.2
0
550
0
0
0.5
1
1.5
2
2.5
600
650
700
FORWARD VOLTAGE - V
WAVELENGTH - nm
Figure 1. Relative Intensity vs Wavelength
Figure 2. Forward Current vs Forward Voltage
2.5
2
60
50
40
30
20
10
0
1.5
1
0.5
0
0
20
40
60
80
100
0
10
20
30
40
50
TA- AMBIENT TEMPERATURE - -C
DC FORWARD CURRENT - mA
Figure 3. Relative Intensity vs Forward Current
Figure 4. Maximum Forward Current vs Ambient Temperature
4
InGaN Blue and Green
30
25
20
15
10
5
1.0
0.9
0.8
0.7
BLUE
0.6
GREEN
0.5
0.4
0.3
0.2
0.1
0.0
0
380
430
480
530
580
630
0
1
2
3
4
FORWARD VOLTAGE -V
WAVELENGTH - nm
Figure 5. Relative Intensity vs Wavelength
Figure 6. Forward Current vs Forward Voltage
35
30
25
20
15
10
5
1.6
1.4
1.2
1
GREEN
0.8
0.6
0.4
BLUE
0.2
0
0
0
5
10
15
20
25
30
35
0
20
40
60
80
100
DC FORWARD CURRENT - mA
T A - AMBIENTTEMPERATURE - °C
Figure 7. Relative Intensity vs Forward Current
Figure ꢀ. Maximum Forward Current vs Ambient Temperature
16
14
12
10
8
GREEN
6
4
2
BLUE
0
-2
-4
0
5
10
15
20
25
30
35
FORWARD CURRENT - mA
Figure 9. Relative dominant wavelength vs Forward Current
5
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Green
Blue
Red
Green
Blue
Red
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREE
ANGULAR DISPLACEMENT-DEGREE
Figure 11. Radiation Pattern-Minor Axis
Figure 10. Radiation Pattern-Major Axis
6
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Intensity (mcd) at 20 mA
Green Color Bin Table
Min
Dom
Max
Dom
Bin
Xmin
Ymin
Xmax Ymax
Bin
T
Min
Max
1
520.0
524.0
528.0
532.0
536.0
524.0
0.0743 0.8338 0.1856 0.6556
0.1650 0.6586 0.1060 0.8292
0.1060 0.8292 0.2068 0.6463
0.1856 0.6556 0.1387 0.8148
0.1387 0.8148 0.2273 0.6344
0.2068 0.6463 0.1702 0.7965
0.1702 0.7965 0.2469 0.6213
0.2273 0.6344 0.2003 0.7764
0.2003 0.7764 0.2659 0.6070
0.2469 0.6213 0.2296 0.7543
800
960
U
V
960
1150
1380
1660
1990
2400
2900
3500
4200
5040
6050
2
3
4
5
528.0
532.0
536.0
540.0
1150
1380
1660
1990
2400
2900
3500
4200
5040
W
X
Y
Z
1
2
3
4
Tolerance for each bin limit is 0.5nm.
Tolerance for each bin limit is 15ꢀ
Blue Color Bin Table
Min
Dom
Max
Dom
VF Bin Table (V at 20mA)
Bin
Xmin
Ymin
Xmax Ymax
Bin ID
VD
Min
1.8
2.0
2.2
Max
2.0
2.2
2.4
1
460.0
464.0
468.0
472.0
476.0
464.0
468.0
472.0
476.0
480.0
0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
VA
2
3
4
5
VB
Notes:
1. Tolerance for each bin limit is 0.05V
2. VF binning only applicable to Red color.
Red Color Range
Max
Min Dom Dom
Xmin
Ymin
Xmax
Ymax
618
630
0.6872
0.6690
0.3126
0.3149
0.6890
0.7080
0.2943
0.2920
Tolerance for each bin limit is 0.5nm
Note:
1. All bin categories are established for classification of products.
Products may not be available in all bin categories. Please contact
your Avago representative for further information.
Tolerance for each bin limit is 0.5nm
7
Relative Light Output vs Junction Temperature
10
1
Red
Blue
Green
0.1
-40
-20
0
20
40
60
80
100
120
140
TJ - JUNCTION TEMPERATURE - °C
Avago Color Bin on CIE 1931 Chromaticity Diagram
1.000
0.800
Green
1
2
3
4
5
0.600
0.400
0.200
0.000
Red
Blue
1
5
4
3
2
0.000
0.100
0.200
0.300
0.400
X
0.500
0.600
0.700
0.800
8
Note:
Precautions:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
2. Avago Technologies’ AllnGaP high brightness LED are using high
efficiency LED die with single wire bond as shown below. Customer
is advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature does not exceed 260°C and the
solder contact time does not exceeding 5sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Avago Technologies LED configuration
Soldering and Handling:
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
CATHODE
ANDOE
AlInGaP Device
InGaN Device
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
1.59mm
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
[1, 2]
Pre-heat temperature 105 °C Max.
-
Recommended PC board plated through holes (PTH)
size for LED component leads.
Preheat time
Peak temperature
Dwell time
60 sec Max
260 °C Max.
5 sec Max.
-
260 °C Max.
5 sec Max
LED component
lead size
Plated through
hole diameter
Diagonal
0.45 x 0.45 mm
(0.018x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.636 mm
0.98 to 1.08 mm
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
(0.020x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to Application Note 5334 for more information about soldering
and handling of high brightness TH LED lamps.
9
Example of Wave Soldering Temperature Profile for TH LED
260°C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C 5°C
(maximum peak temperature = 260°C)
105°C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
60 sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
12.70 1.00
0.500 0.039
6.35 1.30
0.250 0.051
CATHODE
20.5 1.00
0.8070 0.039ꢀ
9.125 0.625
0.3595 0.02ꢀ5
18.00 0.50
0.7085 0.0195
ꢀ.00 0.20
0.1575 0.0075
TYP.
0.70 0.20
0.276 0.0075
12.70 0.30
0.500 0.012
VIEW A - A
Note: All dimensions in millimeters (inches)
10
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 260C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
11
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 260C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB”only)
(i) Color bin only or VF bin only (Applicable for part
number with color bins but without VF bin OR part
number with VF bins and no color bin)
(ii) Color bin incorporate with VF Bin
OR
(ii) Color bin incorporated with VF Bin (Applicable for part
number that have both color bin and VF bin)
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED
OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION,
MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLI-
CATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO
OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-1510EN - April 18, 2011
相关型号:
HLMP-AG66-110DD
Single Color LED, Red, Tinted Diffused, 5.2mm, ROHS COMPLIANT, PLASTIC PACKAGE-2
AVAGO
HLMP-AG66-220DD
Single Color LED, Red, Tinted Diffused, 5.2mm, ROHS COMPLIANT, PLASTIC PACKAGE-2
AVAGO
HLMP-AG67-Z10DD
Single Color LED, Red, Tinted Diffused, 5.2mm, ROHS COMPLIANT, PLASTIC PACKAGE-2
AVAGO
©2020 ICPDF网 联系我们和版权申明