HLMP-AM65-140XX [BOARDCOM]

Precision Optical Performance Red Green and Blue New 5mm Mini Oval LEDs;


型号：	HLMP-AM65-140XX
厂家：	Broadcom Corporation.
描述：	Precision Optical Performance Red Green and Blue New 5mm Mini Oval LEDs
文件：	总12页 (文件大小：231K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HLMP-AG64/65, HLMP-AM64/65, HLMP-AB64/65

Precision Optical Performance Red Green and Blue

New 5mm Mini Oval LEDs

Data Sheet

Description

Features

 Well deﬁned spatial radiation pattern

 High brightness material

 Available in red, green and blue color

Red AlInGaP 626 nm

Green InGaN 525nm

Blue InGaN 470nm

 Superior resistance to moisture

 Standoﬀ Package

These Precision Optical Performance Oval LEDs are spe-

ciﬁcally designed for full color/video and passenger infor-

mation signs. The oval shaped radiation pattern and high

luminous intensity ensure that these devices are excellent

for wide ﬁeld of view outdoor applications where a wide

viewing angle and readability in sunlight are essential.

The package epoxy contains both UV-A and UV-B inhibi-

tors to reduce the eﬀects of long term exposure to direct

sunlight.

 Tinted and diﬀused

 Typical viewing angle 30° x 70°

Applications

 Full color signs

Package Dimensions

Package drawing A

0.ꢀ

0.032

max.

3.ꢀ0 0.200

0.150 0.00ꢀ

0.50 0.10

sq. typ.

ꢀ.70 0.20

0.342 0.00ꢀ

0.020 0.004

0.70

0.02ꢀ

max.

5.20 0.200

0.205 0.00ꢀ

2.54 0.3

0.100 0.012

cathode lead

min.

1.00

min.

24.00

0.945

0.03ꢀ

Package drawing B

1.50 0.15

0.0591 0.006

0.50 0.10

sq. typ.

11.70 0.50

0.4606 0.020

3.ꢀ0 0.200

0.150 0.00ꢀ

0.020 0.004

0.70

0.02ꢀ

max.

5.20 0.20

0.205 0.00ꢀ

2.54 0.3

0.100 0.012

cathode lead

min.

24.00

0.945

ꢀ.70 0.20

0.342 0.00ꢀ

1.00

min.

0.ꢀ

0.032

max.

0.03ꢀ

Notes:

All dimensions in millimeters (inches).

Caution: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate

precautions during handling and processing. Refer to Application Note AN – 1142 for additional details.

Device Selection Guide

Color and Dominant

Wavelength d (nm) Typ (mcd) at 20 mA-Min

Red 626

Luminous Intensity Iv

(mcd) at 20 mA-Max

Package

Drawing

Part Number

Standoﬀ

HLMP-AG64-X10xx

HLMP-AG65-X10xx

HLMP-AM64-140xx

HLMP-AM65-140xx

HLMP-AB64-TW0xx

HLMP-AB65-TW0xx

1660

2900

800

3500

6050

1660

Red 626

Yes

Green 525

Blue 470

Yes

800

Yes

Tolerance for each intensity limit is 15ꢀ.

Notes:

1. The luminous intensity is measured on the mechanical axis of the lamp package.

Part Numbering System

H L M P - A x 6 x – x x x x x

Packaging Option

DD: Ammopack

ZZ: Flexi Ammopack

Color Bin Selection

0: Open distribution

Maximum Intensity Bin

0: No maximum intensity limit

Minimum Intensity Bin

Refer to Device Selection Guide.

Standoff/ Non Standoff

4: Non Standoff

5: Standoff

Color

G: Red 626

M: Green 525

B: Blue 470

Package

A: 5mm Mini Oval 30° x 70°

Note:

Please refer to AB 5337 for complete information about part numbering system.

Absolute Maximum Ratings

T = 25°C

Parameter

Red

Green and Blue

100 ^[3]

Unit

DC Forward Current ^[1]

Peak Forward Current

Power Dissipation

100 ^[2]

120

116

Reverse Voltage

5 (I_R= 100 μA)

130

5 (I_R= 10 μA)

110

LED Junction Temperature

Operating Temperature Range

Storage Temperature Range

°C

-40 to +100

-40 to +85

-40 to +100

°C

Notes:

1. Derate linearly as shown in Figure 4 and Figure 8

2. Duty Factor 30ꢀ, frequency 1KHz.

3. Duty Factor 10ꢀ, frequency 1KHz.

Electrical / Optical Characteristics

T = 25°C

Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions

Forward Voltage

V_F

I_F= 20 mA

Red

Green

Blue

1.8

2.8

2.1

3.2

2.4

3.8

Reverse Voltage

Red

V_R

I_F= 100 μA

I_F= 10 μA

Green & blue

Dominant Wavelength ^[1]

Red

Green

Blue

_d

618

520

460

626

525

470

630

540

480

I_F= 20 mA

Peak Wavelength

Red

Green

Blue

_PEAK

R_J-PIN

_V

634

516

464

Peak of Wavelength of

Spectral Distribution

at I_F= 20 mA

Thermal Resistance

240

°C/W

lm/W

LED Junction-to-Pin

Luminous Eﬃcacy ^[2]

Red

Green

Blue

150

530

Emitted Luminous Power/

Emitted Radiant Power

Notes:

1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp

2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = I / where I is the luminous intensity in candelas and  is

the luminous eﬃcacy in lumens/watt.

AlInGaP Red

0.8

0.6

0.4

0.2

550

0.5

1.5

2.5

600

650

700

FORWARD VOLTAGE - V

WAVELENGTH - nm

Figure 1. Relative Intensity vs Wavelength

Figure 2. Forward Current vs Forward Voltage

2.5

1.5

0.5

100

T_A- AMBIENT TEMPERATURE - -C

DC FORWARD CURRENT - mA

Figure 3. Relative Intensity vs Forward Current

Figure 4. Maximum Forward Current vs Ambient Temperature

InGaN Blue and Green

1.0

0.9

0.8

0.7

BLUE

0.6

GREEN

0.5

0.4

0.3

0.2

0.1

0.0

380

430

480

530

580

630

FORWARD VOLTAGE -V

WAVELENGTH - nm

Figure 5. Relative Intensity vs Wavelength

Figure 6. Forward Current vs Forward Voltage

1.6

1.4

1.2

GREEN

0.8

0.6

0.4

BLUE

0.2

100

DC FORWARD CURRENT - mA

T _A- AMBIENTTEMPERATURE - °C

Figure 7. Relative Intensity vs Forward Current

Figure ꢀ. Maximum Forward Current vs Ambient Temperature

GREEN

BLUE

-2

-4

FORWARD CURRENT - mA

Figure 9. Relative dominant wavelength vs Forward Current

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

Green

Blue

Red

Green

Blue

Red

-90

-60

-30

-90

-60

-30

ANGULAR DISPLACEMENT - DEGREE

ANGULAR DISPLACEMENT-DEGREE

Figure 11. Radiation Pattern-Minor Axis

Figure 10. Radiation Pattern-Major Axis

Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)

Intensity (mcd) at 20 mA

Green Color Bin Table

Min

Dom

Max

Dom

Bin

Xmin

Ymin

Xmax Ymax

Bin

Min

Max

520.0

524.0

528.0

532.0

536.0

524.0

0.0743 0.8338 0.1856 0.6556

0.1650 0.6586 0.1060 0.8292

0.1060 0.8292 0.2068 0.6463

0.1856 0.6556 0.1387 0.8148

0.1387 0.8148 0.2273 0.6344

0.2068 0.6463 0.1702 0.7965

0.1702 0.7965 0.2469 0.6213

0.2273 0.6344 0.2003 0.7764

0.2003 0.7764 0.2659 0.6070

0.2469 0.6213 0.2296 0.7543

800

960

1150

1380

1660

1990

2400

2900

3500

4200

5040

6050

528.0

532.0

536.0

540.0

1150

1380

1660

1990

2400

2900

3500

4200

5040

Tolerance for each bin limit is 0.5nm.

Tolerance for each bin limit is 15ꢀ

Blue Color Bin Table

Min

Dom

Max

Dom

VF Bin Table (V at 20mA)

Bin

Xmin

Ymin

Xmax Ymax

Bin ID

Min

1.8

2.0

2.2

Max

2.0

2.2

2.4

460.0

464.0

468.0

472.0

476.0

464.0

468.0

472.0

476.0

480.0

0.1440 0.0297 0.1766 0.0966

0.1818 0.0904 0.1374 0.0374

0.1374 0.0374 0.1699 0.1062

0.1766 0.0966 0.1291 0.0495

0.1291 0.0495 0.1616 0.1209

0.1699 0.1062 0.1187 0.0671

0.1187 0.0671 0.1517 0.1423

0.1616 0.1209 0.1063 0.0945

0.1063 0.0945 0.1397 0.1728

0.1517 0.1423 0.0913 0.1327

Notes:

1. Tolerance for each bin limit is 0.05V

2. VF binning only applicable to Red color.

Red Color Range

Max

Min Dom Dom

Xmin

Ymin

Xmax

Ymax

618

630

0.6872

0.6690

0.3126

0.3149

0.6890

0.7080

0.2943

0.2920

Tolerance for each bin limit is 0.5nm

Note:

1. All bin categories are established for classiﬁcation of products.

Products may not be available in all bin categories. Please contact

your Avago representative for further information.

Tolerance for each bin limit is 0.5nm

Relative Light Output vs Junction Temperature

Red

Blue

Green

0.1

-40

-20

100

120

140

T_J- JUNCTION TEMPERATURE - °C

Avago Color Bin on CIE 1931 Chromaticity Diagram

1.000

0.800

Green

0.600

0.400

0.200

0.000

Red

Blue

0.000

0.100

0.200

0.300

0.400

0.500

0.600

0.700

0.800

Note:

Precautions:

1. PCB with diﬀerent size and design (component density) will have

diﬀerent heat mass (heat capacity). This might cause a change in

temperature experienced by the board if same wave soldering

setting is used. So, it is recommended to re-calibrate the soldering

proﬁle again before loading a new type of PCB.

Lead Forming:

 The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering on PC board.

2. Avago Technologies’ AllnGaP high brightness LED are using high

eﬃciency LED die with single wire bond as shown below. Customer

is advised to take extra precaution during wave soldering to ensure

that the maximum wave temperature does not exceed 260°C and the

solder contact time does not exceeding 5sec. Over-stressing the LED

during soldering process might cause premature failure to the LED

due to delamination.

 For better control, it is recommended to use proper

tool to precisely form and cut the leads to applicable

length rather than doing it manually.

 If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms a

mechanical ground which prevents mechanical stress

due to lead cutting from traveling into LED package.

This is highly recommended for hand solder operation,

as the excess lead length also acts as small heat sink.

Avago Technologies LED conﬁguration

Soldering and Handling:

 Care must be taken during PCB assembly and soldering

process to prevent damage to the LED component.

 LED component may be eﬀectively hand soldered

to PCB. However, it is only recommended under

unavoidable circumstances such as rework. The closest

manual soldering distance of the soldering heat source

(soldering iron’s tip) to the body is 1.59mm. Soldering

the LED using soldering iron tip closer than 1.59mm

might damage the LED.

CATHODE

ANDOE

AlInGaP Device

InGaN Device

Note: Electrical connection between bottom surface of LED die and

the lead frame is achieved through conductive paste.

 Any alignment ﬁxture that is being applied during

wave soldering should be loosely ﬁtted and should

not apply weight or force on LED. Non metal material

is recommended as it will absorb less heat during wave

soldering process.

1.59mm

 At elevated temperature, LED is more susceptible to

mechanical stress. Therefore, PCB must allowed to cool

down to room temperature prior to handling, which

includes removal of alignment ﬁxture or pallet.

 ESD precaution must be properly applied on the

soldering station and personnel to prevent ESD

damage to the LED component that is ESD sensitive.

Do refer to Avago application note AN 1142 for details.

The soldering iron used should have grounded tip to

ensure electrostatic charge is properly grounded.

 If PCB board contains both through hole (TH) LED and

other surface mount components, it is recommended

that surface mount components be soldered on the

top side of the PCB. If surface mount need to be on the

bottom side, these components should be soldered

using reﬂow soldering prior to insertion the TH LED.

 Recommended soldering condition:

Wave

Soldering

Manual Solder

Dipping

[1, 2]

Pre-heat temperature 105 °C Max.

 Recommended PC board plated through holes (PTH)

size for LED component leads.

Preheat time

Peak temperature

Dwell time

60 sec Max

260 °C Max.

5 sec Max.

260 °C Max.

5 sec Max

LED component

lead size

Plated through

hole diameter

Diagonal

0.45 x 0.45 mm

(0.018x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)

0.636 mm

0.98 to 1.08 mm

Note:

1. Above conditions refers to measurement with thermocouple

mounted at the bottom of PCB.

0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm

2. It is recommended to use only bottom preheaters in order to

reduce thermal stress experienced by LED.

(0.020x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)

 Wave soldering parameters must be set and maintained

according to the recommended temperature and dwell

time. Customer is advised to perform daily check on the

soldering proﬁle to ensure that it is always conforming

to recommended soldering conditions.

 Over-sizing the PTH can lead to twisted LED after

clinching. On the other hand under sizing the PTH can

cause diﬃculty inserting the TH LED.

Refer to Application Note 5334 for more information about soldering

and handling of high brightness TH LED lamps.

Example of Wave Soldering Temperature Proﬁle for TH LED

260°C Max

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

Flux: Rosin ﬂux

Solder bath temperature: 255°C 5°C

(maximum peak temperature = 260°C)

105°C Max

Dwell time: 3.0 sec - 5.0 sec

(maximum = 5sec)

60 sec Max

Note: Allow for board to be suﬃciently

cooled to room temperature before

exerting mechanical force.

TIME (sec)

Ammo Packs Drawing

12.70 1.00

0.500 0.039

6.35 1.30

0.250 0.051

CATHODE

20.5 1.00

0.8070 0.039ꢀ

9.125 0.625

0.3595 0.02ꢀ5

18.00 0.50

0.7085 0.0195

ꢀ.00 0.20

0.1575 0.0075

TYP.

0.70 0.20

0.276 0.0075

12.70 0.30

0.500 0.012

VIEW A - A

Note: All dimensions in millimeters (inches)

Packaging Box for Ammo Packs

FROM LEFT SIDE OF BOX

ADHESIVE TAPE MUST BE

FACING UPWARDS.

LABEL ON THIS

SIDE OF BOX

ANODE LEAD LEAVES

THE BOX FIRST.

Note: For InGaN device, the ammo pack packaging box contain ESD logo

Packaging Label

(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)

STANDARD LABEL LS0002

RoHS Compliant

(1P) Item: Part Number

max temp 260C

(Q) QTY: Quantity

(1T) Lot: Lot Number

LPN:

CAT: Intensity Bin

BIN: Refer to below information

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

(9D) Date Code: Date Code

Made In: Country of Origin

DeptID:

(ii) Avago Baby Label (Only available on bulk packaging)

RoHS Compliant

e3 max temp 260C

Lamps Baby Label

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

QUANTITY: Packing Quantity

C/O: Country of Origin

Customer P/N:

CAT: Intensity Bin

Supplier Code:

BIN: Refer to below information

DATECODE: Date Code

Acronyms and Deﬁnition:

BIN:

Example:

(i) Color bin only or VF bin only

BIN: 2 (represent color bin 2 only)

BIN: VB (represent VF bin “VB”only)

(i) Color bin only or VF bin only (Applicable for part

number with color bins but without VF bin OR part

number with VF bins and no color bin)

(ii) Color bin incorporate with VF Bin

(ii) Color bin incorporated with VF Bin (Applicable for part

number that have both color bin and VF bin)

BIN: 2VB

VB: VF bin “VB”

2: Color bin 2 only

DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED

OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION,

MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLI-

CATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO

OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-1510EN - April 18, 2011

HLMP-AM65-140XX [BOARDCOM]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB