HLMP-CM1H-350DD [BOARDCOM]
T-1¾ (5 mm) InGaN Blue and Green LEDs;型号: | HLMP-CM1H-350DD |
厂家: | Broadcom Corporation. |
描述: | T-1¾ (5 mm) InGaN Blue and Green LEDs |
文件: | 总14页 (文件大小:977K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Data Sheet
HLMP-CBxx, HLMP-CMxx
T-1¾ (5 mm) InGaN Blue and Green LEDs
Description
Features
These high-intensity blue and green LEDs are based on the
most efficient and cost-effective InGaN material technology.
Viewing angle: 15°, 23°, and 30°
Well-defined spatial radiation pattern
High luminous output
These LED lamps are untinted and non-diffused T-1¾
packages incorporating second generation optics producing
well-defined spatial radiation patterns at specific viewing
cone angles.
Available in blue and green
– Blue 470 nm
– Green 525 nm
Superior resistance to moisture
Standoff and non-standoff package
These lamps are made with an advanced optical grade
epoxy offering superior high temperature and high moisture
resistance performance in outdoor signal and sign
applications. The epoxy contains UV inhibitors to reduce the
effects of long term exposure to direct sunlight.
Applications
Traffic signs
Variable message signs
Commercial outdoor advertising
CAUTION! INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN–1142 for additional details.
Broadcom
AV02-3140EN
March 12, 2018
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
Figure 1: Package Dimensions
Drawing A (Non-standoff)
1.00 0.20
0.039 0.008
5.80 0.20
8.70 0.20
0.343 0.008
0.228 0.008
0.70 max
0.028
0.50 0.10 sq. typ.
0.020 0.004
5.00 0.20
2.54 0.38
0.197 0.008
0.100 0.015
Cathode
31.60 min
1.244
1.00 min
0.039
cathode
flat
Drawing B (Standoff)
1.00 0.20
0.039 0.008
1.30 0.15
0.051 0.006
5.80 0.20
0.228 0.008
8.70 0.20
0.343 0.008
0.70 max
0.028
0.50 0.10 sq. typ.
0.020 0.004
5.00 0.20
0.197 0.008
2.54 0.38
0.100 0.015
Cathode
1.00 min
0.039
d
cathode
flat
31.60 min
1.244
Part Number
Dimension ‘d’
HLMP-Cx1H
HLMP-Cx2H
HLMP-Cx3H
12.39 mm ± 0.25 mm
12.35 mm ± 0.25 mm
11.93 mm ± 0.25 mm
NOTE:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.20 mm unless other specified.
3. Leads are mild steel with tin plating.
4. The epoxy meniscus is 1.5 mm maximum.
Broadcom
AV02-3140EN
2
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
Device Selection Guide
Luminous Intensity Iv (mcd) at 20 mAb c d
Color and Dominant
Wavelength d (nm)
,
,
Typical Viewing
Part Number
Typ.a [3]
Min
Max
Standoff
Angle (°)e
HLMP-CB1G-XZ0DD
HLMP-CB1H-XZ0DD
HLMP-CM1G-350DD
HLMP-CM1H-350DD
HLMP-CB2G-UW0DD
HLMP-CB2H-UW0DD
HLMP-CM2G-130DD
HLMP-CM2H-130DD
HLMP-CB3G-TV0DD
HLMP-CB3H-TV0DD
HLMP-CM3G-Y10DD
HLMP-CM3H-Y10DD
Blue 470
7200
7200
27000
27000
3200
3200
16000
16000
2500
2500
9300
9300
16000
16000
59000
59000
7200
No
Yes
No
15
Blue 470
Green 525
Green 525
Blue 470
Yes
No
23
30
Blue 470
7200
Yes
No
Green 525
Green 525
Blue 470
35000
35000
5500
Yes
No
Blue 470
5500
Yes
No
Green 525
Green 525
21000
21000
Yes
a. Dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
b. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
c. The optical axis is closely aligned with the package mechanical axis.
d. Tolerance for each bin limit is ± 15%.
e. θ is the off-axis angle where the luminous intensity is half the on-axis intensity.
½
Absolute Maximum Ratings
T = 25°C
J
Parameter
Blue/Green
Unit
mA
DC Forward Currenta
30
Peak Forward Currentb
Power Dissipation
100
mA
110
110
mW
°C
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
–40 to +85
–40 to +100
°C
°C
a. Derate linearly as shown in Figure 5.
b. Duty factor 10%, frequency 1 kHz.
Broadcom
AV02-3140EN
3
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
Electrical/Optical Characteristics
T = 25°C
J
Parameter
Symbol
Min.
Typ.
Max.
Units Test Conditions
Forward Voltage
Blue and Green
VF
2.8
3.1
3.6
V
IF = 20 mA
Reverse Voltagea
Blue and Green
VR
5
—
—
V
IR = 10 µA
Dominant Wavelengthb
d
nm
nm
IF = 20 mA
460
520
470
525
480
540
Blue
Green
Peak Wavelength
Blue
PEAK
Peak of Wavelength of Spectral Distribution
at IF = 20 mA
—
—
—
461
517
240
—
—
—
Green
Thermal resistance
RθJ-PIN
°C/W
lm/W
LED junction to pin
Luminous Efficacyc
v
Emitted Luminous Power/Emitted Radiant
Power
—
—
68
—
—
Blue
Green
475
Thermal coefficient of d
nm/°C IF = 20 mA; +25° C ≤ TJ ≤ +100° C
—
—
0.02
0.03
—
—
Blue
Green
a. Indicates product final testing condition, long-term reverse bias is not recommended.
b. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.
c. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / V where Iv is the luminous intensity in candelas and
V is the luminous efficacy in lumens/ watt.
Broadcom
AV02-3140EN
4
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
Part Numbering System
x1
x2
x3
x4
x5
x6
x7
x8
x9
H
L
M
P
-
-
Code
x1
Description
Package type
Color
Option
C
5-mm Standard Round InGaN
x2
B
Blue
M
Green
x3 x4
Viewing Angle and Lead Standoffs
1G
1H
2G
2H
3G
3H
15° without lead standoffs
15° with lead standoffs
23° without lead standoffs
23° with lead standoffs
30° without lead standoffs
30° with lead standoffs
See Device Selection Guide
x5
Minimum intensity bin
Maximum intensity bin
Color bin selection
Packaging option
x6
See Device Selection Guide
Full range
x7
0
x8 x9
DD
Ammopack
Broadcom
AV02-3140EN
5
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
Bin Information
I
ntensity Bin Limit Table (1.3:1 Iv Bin Ratio) Blue Color Bin Table
Intensity (mcd) at 20 mA
Min
Min
Dom
Max
Dom
Bin
Xmin
Ymin
Xmax Ymax
Bin
Max
1
460.0
464.0
468.0
472.0
476.0
464.0
468.0
472.0
476.0
480.0
0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
T
U
V
W
X
Y
Z
1
2500
3200
3200
4200
2
3
4
5
4200
5500
5500
7200
7200
9300
9300
12000
16000
21000
27000
35000
45000
59000
12000
16000
21000
27000
35000
45000
2
3
4
Tolerance for each bin limit is ± 0.5 nm.
5
NOTE: All bin categories are established for classification
Tolerance for each bin limit is ± 15%.
of products. Products may not be available in all
bin categories. Contact your Broadcom
®
representative for further information.
Green Color Bin Table
Broadcom Color Bin on CIE 1931
Chromaticity Diagram
Min
Dom
Max
Dom
Bin
Xmin
Ymin
Xmax Ymax
1
520.0
524.0
528.0
532.0
536.0
524.0
528.0
532.0
536.0
540.0
0.0743 0.8338 0.1856 0.6556
0.1650 0.6586 0.1060 0.8292
0.1060 0.8292 0.2068 0.6463
0.1856 0.6556 0.1387 0.8148
0.1387 0.8148 0.2273 0.6344
0.2068 0.6463 0.1702 0.7965
0.1702 0.7965 0.2469 0.6213
0.2273 0.6344 0.2003 0.7764
0.2003 0.7764 0.2659 0.6070
0.2469 0.6213 0.2296 0.7543
0.9
2
3
4
5
0.8
Green
1
2
3
4
5
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Tolerance for each bin limit is ± 0.5 nm.
Blue
5
4
3
1
2
0
0.05
0.1
0.15
0.2
0.25
0.3
Broadcom
AV02-3140EN
6
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
Figure 2: Relative Intensity vs. Wavelength
Figure 3: Forward Current vs. Forward Voltage
30
25
20
15
10
5
1.0
0.9
0.8
Blue
Green
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
380
430
480
530
580
630
0
1
2
3
4
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 4: Relative Intensity vs. Forward Current
Figure 5: Maximum Forward Current vs. Ambient
Temperature
1.4
1.2
1
35
30
25
20
15
10
5
0.8
0.6
0.4
0.2
0
0
0
5
10
15
20
25
30
35
0
20
40
60
80
100
DC FORWARD CURRENT - mA
TA - AMBIENT TEMPERATURE - C
Figure 6: Relative Dominant Wavelength Shift vs. Forward
Current
Figure 7: Representative Radiation Pattern for 15° Viewing
Angle Lamp
12
10
8
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
6
Green
4
2
Blue
0
-2
-4
0
5
10
15
20
25
30
-90
-60
-30
0
30
60
90
FORWARD CURRENT - mA
ANGULAR DISPLACEMENT - DEGREES
Broadcom
AV02-3140EN
7
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
Figure 8: Representative Radiation Pattern for 23° Viewing
Angle Lamp
Figure 9: Representative Radiation Pattern for 30° Viewing
Angle Lamp
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
ANGULAR DISPLACEMENT - DEGREES
Figure 10: Relative Light Output vs. Junction Temperature
Figure 11: Forward Voltage Shift vs. Junction Temperature
10
0.3
BLUE
GREEN
BLUE
GREEN
0.2
0.1
0
1
-0.1
-0.2
-0.3
0.1
-40
-20
0
20
40
60
80
100 120
-40
-20
0
20
40
60
80
100 120
TJ - JUNCTION TEMPERATURE
T - JUNCTION TEMPERATURE
J
Broadcom
AV02-3140EN
8
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
Set and maintain wave soldering parameters according
to the recommended temperature and dwell time.
Perform a daily check on the soldering profile to ensure
that it is always conforming to recommended soldering
conditions.
Precautions
Lead Forming
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
NOTE: PCBs with different sizes and design (component
density) have different heat masses (heat
capacities). This might cause a change in
temperature experienced by the board if the same
wave soldering setting is used. Recalibrate the
soldering profile again before loading a new type
of PCB.
For better control, use the proper tool to precisely form
and cut the leads to applicable length rather than doing
it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground that prevents mechanical stress
due to lead cutting from traveling into LED package.
Use this method for hand soldering operatiosn, as the
excess lead length also acts as a small heat sink.
Broadcom LED Configuration
Figure 12: LED Configuration
Soldering and Handling
Take care during PCB assembly and soldering process
to prevent damage to the LED component.
The LED component may be effectively hand-soldered
to PCB; however, do this only under unavoidable
circumstances, such as rework. The closest manual
soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59 mm. Soldering
the LED using soldering iron tip closer than 1.59 mm
might damage the LED.
Cathode
1.59 mm
InGaN device
Any alignment fixture that is applied during wave
soldering must be loosely fitted and must not apply
weight or force on LED. Use nonmetal material
because it absorbs less heat during the wave soldering
process.
Apply ESD precautions on the soldering station and
personnel to prevent ESD damage to the LED
component, which is ESD sensitive. Refer to Broadcom
application note AN-1142 for details. The soldering iron
used must have a grounded tip to ensure electrostatic
charge is properly grounded.
At elevated temperatures, the LED is more susceptible
to mechanical stress. Therefore, allow the PCB to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
Recommended soldering condition:
If PCB board contains both through hole (TH) LED and
other surface-mount components, solder the
surface-mount components on the top side of the PCB.
If surface mount must be on the bottom side, solder
these components using reflow soldering prior to the
insertion of the TH LED.
Wave
Solderinga, b
Manual Solder
Dipping
Pre-heat temperature
Preheat time
105°C max.
60s max.
–
–
Peak temperature
Dwell time
260°C max.
5s max.
260°C max.
5s max.
a. The above conditions refer to measurement with a
thermocouple mounted at the bottom of the PCB.
b. Use only bottom preheaters to reduce thermal stress
experienced by the LED.
Broadcom
AV02-3140EN
9
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
The recommended PC board plated through holes
(PTH) size for LED component leads follows.
LED Component Lead
Size
Plated Through-Hole
Diameter
Diagonal
0.45 × 0.45 mm
0.636 mm
0.98 mm to 1.08 mm
(0.018 in. × 0.018 in.)
(0.025 inch) (0.039 in. to 0.043 in.)
0.707 mm 1.05 mm to 1.15 mm
(0.028 inch) (0.041 in. to 0.045 in.)
0.50 mm × 0.50 mm
(0.020 in. × 0.020 in.)
Over-sizing the PTH can lead to a twisted LED after
clinching. However, undersizing the PTH can cause
difficulty inserting the TH LED.
Refer to application note AN-5334 for more information
about soldering and handling of high brightness TH LED
lamps.
Figure 13: Example of Wave Soldering Temperature Profile for TH LED
260°C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C 5°C
(maximum peak temperature = 260°C)
105°C Max
60 sec Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Broadcom
AV02-3140EN
10
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
Figure 14: Ammo Packs Drawing
6.35 1.30
0.250 0.051
12.70 1.00
0.500 0.039
CATHODE
20.5 1.00
0.8070 0.0394
9.125 0.625
0.3595 0.0245
18.00 0.50
0.7085 0.0195
4.00 0.20
0.1575 0.0075
0.70 0.20
0.0275 0.0075
TYP.
Ø
12.70 0.30
0.500 0.012
A
A
VIEW A–A
NOTE: The ammo-packs drawing is applicable for packaging option –DD and -ZZ and regardless standoff or non-standoff.
Broadcom
AV02-3140EN
11
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
Figure 15: Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
NOTE: For InGaN devices, the ammo pack packaging box contains an ESD logo.
Broadcom
AV02-3140EN
12
HLMP-CBxx, HLMP-CMxx Data Sheet
T-1¾ (5 mm) InGaN Blue and Green LEDs
Packaging Label
Figure 16: Mother Label (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
(1P) Item: Part Number
RoHS Compliant
e3
max temp 260C
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
Figure 17: Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 260C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
BIN: Color Bin
Supplier Code:
DATECODE: Date Code
Broadcom
AV02-3140EN
13
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