HLMP-Y601-J00XX [BOARDCOM]
T-1 (3 mm) AlInGaP LED Lamps;
| 型号： | HLMP-Y601-J00XX |
| 厂家： | 
Broadcom Corporation. |
| 描述： | T-1 (3 mm) AlInGaP LED Lamps |
| 文件： | 总6页 (文件大小：456K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-Yxxx
T-1 (3 mm) AlInGaP LED Lamps
Data Sheet
Description
Features
This family of T-1 lamps is widely used in general purpose • High luminous intensity output
indicator and back lighting applications. The optical
design is balanced to yield superior light output and wide
viewing angles. Several intensity choices are available in
each color for increased design flexibility.
• Low power consumption
• Choice of bright colors
– Deep Red
– Red
Applications
– Red-Orange
– Orange
– Amber
• Status indicator
• Backlighting front panels
• Light pipe sources
• Lighted switches
– Green
• High efficiency
• Versatile mounting on PCB or panel
• I.C. Compatible/low current requirement
• Popular T-1 diameter package
• Reliable and rugged
• RoHS compliant
Package Dimension
5.2
0.205
(MIN)
24.0
0.945
4.1 0.2
0.161 0.008
(MAX)
1.0
0.04
(MIN)
1.0
0.04
CATHODE
3.8 3.5
3.1 0.2
2.54
0.1
0.15 0.138 0.122 0.008
0.45 x 0.4 TYP
(0.018 x 0.016)
Notes:
1. All dimensions are in millimeter (inches).
2. Tolerance is ±±.2ꢀmm (.±1±) unless otherwise stated.
3. Lead spacing is measured where the leads emerge from the package.
Selection Guide
Luminous Intensity, Iv (mcd) @ 20 mA
Viewing Angle,
Color
Part Number
Package Description
Min.
14±
24±
31±
24±
24±
14±
11±
Typ.
3±±
68±
68±
68±
68±
4±±
24±
Max.
2θ½ (°)
Deep Red
Red
HLMP-Y6ꢀ1-G±±xx
HLMP-Y6±1-J±±xx
HLMP-Y9ꢀ1-K±±xx
HLMP-Y9±1-J±±xx
HLMP-Y9±2-J±±xx
HLMP-Y7±1-G±±xx
HLMP-Y8±2-F±±xx
Untinted, Non-diffused
Untinted, Non-diffused
Untinted, Non-diffused
Untinted, Non-diffused
Tinted, Non-diffused
Untinted, Non-diffused
Tinted, Non-diffused
4ꢀ
Red-Orange
Yellow Orange
Amber
Green
Part Numbering System
HLMP - Y x x x - x x x xx
Mechanical Options
00: Bulk
Color Bin Options
0: Full Color Bin Distribution
Maximum IV Bin Options
0: Open (no max. limit)
Others: Please refer to the IV Bin Table
Minimum IV Bin Options
Please refer to the IV Bin Table
2
Absolute Maximum Ratings at T = 25°C
A
Parameter
HLMP-Yxxx
Units
mA
DC Forward Current
2±
6±
Peak Forward Current
mA
(1/1± Duty Cycle, ±.1ms Pulse Width)
Reverse Voltage (IR = 1±±µA)
Junction Temperature
ꢀ
V
11±
°C
mW
°C
°C
Power Dissipation
48
Storage Temperature Range
Operating Temperature Range
-4± to +1±±
-4± to +1±±
Electrical /Optical Characteristic at T = 25°C
A
Description
Symbol
Part Number
Min.
Typ.
Max.
Units
Test Conditions
Peak Wavelength
λPEAK
HLMP-Y6ꢀ1
HLMP-Y6±1
HLMP-Y9ꢀ1
HLMP-Y9±x
HLMP-Y7±1
HLMP-Y8±2-F±±xx
6ꢀ2
633
622
611
ꢀ9ꢀ
ꢀ7ꢀ
nm
Measurement at peak
Dominant Wavelength λd
HLMP-Y6ꢀ1
HLMP-Y6±1
HLMP-Y9ꢀ1
HLMP-Y9±x
HLMP-Y7±1
HLMP-Y8±2-F±±xx
63ꢀ.±
62±.±
61±.±
ꢀ99.ꢀ
ꢀ82.±
ꢀ64.ꢀ
638.±
627.±
61ꢀ.±
6±ꢀ.±
ꢀ92.±
ꢀ72.±
646.±
63ꢀ.±
62±.±
61±.ꢀ
ꢀ97.±
ꢀ76.ꢀ
nm
nm
V
Note 1
Spectrum Half Width
∆λ
HLMP-Y6ꢀ1
HLMP-Y6±1
HLMP-Y9ꢀ1
HLMP-Y9±x
HLMP-Y7±1
HLMP-Y8±2-F±±xx
1ꢀ
1ꢀ
17
17
1ꢀ
11
Forward Voltage
VF
HLMP-Y6ꢀ1
HLMP-Y6±1
HLMP-Y9ꢀ1
HLMP-Y9±x
HLMP-Y7±1
HLMP-Y8±2-F±±xx
2.±
2.±
2.±
2.±
2.±
2.1
2.2
2.2
2.2
2.4
2.2
2.4
IF = 2±mA
(Figure 1)
Notes:
1. The dominant wavelength, λ , is derived from the Chromaticity Diagram and represents the color of the lamp.
d
3
20
18
16
14
12
10
8
1
0.8
0.6
0.4
0.2
0
GREEN
DEEP RED, RED
RED-ORANGE, AMBER
YELLOW-ORANGE
6
4
2
0
0
0.5
1
1.5
2
2.5
0
5
10
15
20
DC FORWARD CURRENT - mA
FORWARD VOLTAGE-V
Figure 1. Forward Current vs. Forward Voltage.
Figure 2. Relative Luminous Intensity vs. Forward Current.
25
20
15
10
5
1
0.75
0.5
0.25
0
0
-90
-60
-30
0
30
60
90
0
10 20 30 40 50 60 70 80 90 100 110
AMBIENT TEMPERATURE - °C
ANGULAR DISPLACEMENT - DEGREES
Figure 3. Ambient Temperature vs. Maximum DC Forward Current.
Figure 4. Relative Luminous Intensity vs. Angular Displacement for
HLMP-Y651, HLMP-Y601, HLMP-Y951 and HLMP-Y701.
1
0.75
0.5
0.25
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
Figure 5. Relative Luminous Intensity vs. Angular Displacement for
HLMP-Y90x and HLMP-Y80x.
Figure 6. Wavelength vs. Relative Luminous Intensity.
4
Intensity Bin Limits
Precautions:
Intensity Range (mcd)
Min.
Assembly method:
This product is not meant for auto-insertion.
Bin
F
Max.
11±.±
14±.±
18±.±
24±.±
31±.±
4±±.±
ꢀ2±.±
68±.±
88±.±
11ꢀ±.±
1ꢀ±±
Lead Forming:
G
H
J
14±.±
• The leads of an LED lamp may be preformed or cut to
18±.±
length prior to insertion and soldering into PC board.
24±.±
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
K
31±.±
L
4±±.±
M
N
P
ꢀ2±.±
68±.±
88±.±
• During lead forming, the leads should be bent at a
point at least 3mm from the base of the lens. Do not
use the base of the lead frame as a fulcrum during
forming. Lead forming must be done before soldering
at normal temperature.
Q
11ꢀ±
Tolerance for each bin limit is 1ꢀ%.
Color Bin Limits Table
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Lambda (nm)
Color
Category #
Min.
Max.
Red-Orange
1
2
3
2
3
4
ꢀ
1
2
4
6
7
2
3
4
ꢀ
61±.ꢀ
613.ꢀ
616.ꢀ
ꢀ99.ꢀ
6±2.±
6±4.ꢀ
6±7.ꢀ
ꢀ84.ꢀ
ꢀ87.±
ꢀ89.ꢀ
ꢀ92.±
ꢀ94.ꢀ
ꢀ73.ꢀ
ꢀ7±.ꢀ
ꢀ67.ꢀ
ꢀ64.ꢀ
613.ꢀ
616.ꢀ
619.ꢀ
6±2.±
6±4.ꢀ
6±7.ꢀ
61±.ꢀ
ꢀ87.±
ꢀ89.ꢀ
ꢀ92.±
ꢀ94.ꢀ
ꢀ97.±
ꢀ76.ꢀ
ꢀ73.ꢀ
ꢀ7±.ꢀ
ꢀ67.ꢀ
Yellow-
Orange
Amber
Green
Tolerance for each bin limit is ±1.± nm.
ꢀ
Precautions: (cont.)
Soldering Conditions:
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.ꢀ9
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
• Recommended soldering conditions:
• Therefore, the soldered PCB must be allowed to cool to
room temperature, 2ꢀ°C, before handling.
Manual Solder
Dipping
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
Wave Soldering
1±ꢀ°C Max.
6± sec Max.
2ꢀ±°C Max.
3 sec Max.
Pre-heat Temperature
Pre-heat Time
–
–
• Recommended PC board plated through hole sizes for
Peak Temperature
Dwell Time
26±°C Max.
ꢀ sec Max.
LED component leads:
LED Component
Lead Size
Plated Through
Hole Diameter
Diagonal
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
±.4ꢀ7 x ±.4ꢀ7 mm
±.646 mm
±.976 to 1.±78 mm
(±.±38 to ±.±42 inch)
(±.±18 x ±.±18 inch) (±.±2ꢀ inch)
±.ꢀ±8 x ±.ꢀ±8 mm ±.718 mm
(±.±2± x ±.±2± inch) (±.±28 inch)
1.±49 to 1.1ꢀ± mm
(±.±41 to ±.±4ꢀ inch)
Note: Refer to application note AN1±27 for more information on
soldering LED components.
Recommended solder:
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
Sn63 (Leaded solder alloy)
250
SAC305 (Lead free solder alloy)
Flux: Rosin ꢀux
200
150
100
Solder bath temperature:
245°C 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
suꢁciently cooled to room
temperature before exerting
mechanical force.
50
PREHEAT
100
80
0
60
90
20
30
70
10
40
50
TIME (SECONDS)
Figure 7. Recommended wave soldering profile.
Avago’s products and software are not specifically designed, manufactured or authorized for sale as
parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
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to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use.
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Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved.
AV02-1664EN - July 26, 2014
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