HSMZ-A100-R00J1 [BOARDCOM]
PLCC-2, Surface Mount LED Indicator;型号: | HSMZ-A100-R00J1 |
厂家: | Broadcom Corporation. |
描述: | PLCC-2, Surface Mount LED Indicator 光电 |
文件: | 总17页 (文件大小:788K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Data Sheet
HSMx-A10x-xxxxx
PLCC-2, Surface Mount LED Indicator
Description
Features
This family of SMT LEDs is packaged in the industry
standard PLCC-2 package. These SMT LEDs have high
reliability performance and are designed to work under a
wide range of environmental conditions. This high reliability
feature makes them ideally suited to be used under harsh
interior automotive as well as interior signs application
conditions.
Industry standard PLCC-2 package
High reliability LED package
High brightness using AlInGaP and InGaN dice
technologies
Available in full selection of colors
Super wide viewing angle at 120
Available in 8 mm carrier tape on 7 inch reel (2000
pieces)
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel will be
shipped in single intensity and color bin, except red color, to
provide close uniformity.
Compatible with both IR and TTW soldering process
Applications
Interior automotive
These LEDs are compatible with IR solder reflow process.
Due to the high reliability feature of these products, they can
also be mounted using through-the-wave soldering process.
– Instrument panel backlighting
– Central console backlighting
– Switch/push button backlighting
Electronic signs and signals
– Interior full color sign
The super wide viewing angle at 120° makes these LEDs
ideally suited for panel, push button, or general backlighting
in automotive interior, office equipment, industrial
equipment, and home appliances. The flat top emitting
surface makes it easy for these LEDs to mate with light
pipes. With the built-in reflector pushing up the intensity of
the light output, these LEDs are also suitable to be used as
LED pixels in interior electronic signs.
– Variable message sign
Office automation, home appliances, industrial
equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
CAUTION! HSMN, M, and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during
handling and processing. Refer to Broadcom Application Note AN-1142 for additional details.
Broadcom
AV02-0198EN
February 16, 2018
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Package Dimensions
ꢁ.8 0.ꢁ
ꢂ.9 0.ꢁ
ꢁ.ꢁ 0.ꢁ
0.ꢂ TYP.
0.8 0.ꢂ
ꢀ.ꢁ 0.ꢁ
ꢀ.5 0.ꢁ
0.8 0.ꢀ
0.5 0.ꢂ
CATHODE MARKING
(ANODE MARKING FOR AlGaAs DEVICES)
TOP MOUNT
ꢁ.8 0.ꢁ
ꢁ.ꢁ 0.ꢁ
ꢂ.9 0.ꢁ
5.ꢁ 0.ꢁ
ꢀ.ꢁ 0.ꢁ
0.ꢂ TYP.
CATHODE MARKING
REVERSE MOUNT
0.5 0.ꢂ
NOTE: ALL DIMENSIONS IN MILLIMETERS.
Broadcom
AV02-0198EN
2
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Device Selection Guide
Red
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA) Dice Technology
HSMS-A100-J00J1
HSMS-A100-L00J1
HSMS-A100-J80J2
HSMH-A100-L00J1
HSMH-A100-N00J1
HSMC-A100-Q00J1
HSMC-A100-R00J1
HSMC-A101-S00J1
HSMZ-A100-T00J1
HSMC-A100-N00H1
HSMC-A100-Q70J1
HSMC-A101-S30J1
HSMC-A101-S40J1
HSMZ-A100-R00J1
HSMZ-A100-T70J1
4.50
11.20
15.00
15.00
—
—
—
20
20
10
20
20
20
20
20
20
20
20
20
20
20
20
GaP
GaP
5.60
14.00
—
GaP
11.20
15.00
50.00
100.00
140.00
220.00
350.00
—
AlGaAs
AlGaAs
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
28.50
71.50
112.50
180.00
285.00
28.50
90.00
180.00
180.00
112.50
355.00
—
—
—
—
—
—
—
180.0
355.0
450.0
—
—
—
—
—
715.0
Red Orange
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA) Dice Technology
HSMJ-A100-Q00J1
HSMJ-A101-S00J1
HSMJ-A100-T40J1
HSMV-A100-T00J1
HSMJ-A100-R40J1
71.50
180.00
285.00
285.00
112.50
100.00
200.00
—
—
—
20
20
20
20
20
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
715.00
—
350.00
—
285.00
Orange
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA) Dice Technology
HSMD-A100-J00J1
HSMD-A100-L00J1
HSMD-A100-K4PJ2
HSML-A100-Q00J1
HSML-A101-S00J1
4.50
11.20
7.20
15.00
15.00
—
—
—
20
20
10
20
20
GaP
GaP
18.00
—
GaP
71.50
180.00
100.00
220.00
AlInGaP
AlInGaP
—
Broadcom
AV02-0198EN
3
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Yellow/Amber
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA) Dice Technology
HSMY-A100-J00J1
HSMY-A100-L00J1
HSMA-A100-Q00J1
HSMA-A101-S00J1
HSMU-A100-S00J1
HSMA-A101-R8WJ1
HSMA-A100-Q00H1
HSMA-A100-R40J1
HSMA-A100-R45J1
HSMA-A101-S3WJ1
4.50
12.00
12.00
100.00
220.00
320.00
—
—
—
20
20
20
20
20
20
20
20
20
20
GaP
11.20
GaP
71.50
—
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
180.00
180.00
140.00
71.50
—
—
355.00
—
—
112.50
12.50
—
285.00
285.00
355.00
—
180.00
—
Yellow Green
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA) Dice Technology
HSMG-A100-J02J1
HSMG-A100-K72J2
HSME-A100-M02J1
HSME-A100-N82J1
4.50
9.00
18.00
—
—
20
10
20
20
GaP
GaP
18.00
—
18.00
35.50
70.00
—
AlInGaP
AlInGaP
90.00
Emerald Green
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA) Dice Technology
HSMG-A100-H01J1
HSME-A100-L01J1
HSME-A100-M3PJ1
HSMG-A100-K42J2
HSMG-A100-L02J1
2.80
11.20
18.00
7.20
8.00
40.00
—
—
—
20
20
20
20
20
GaP
AlInGaP
AlInGaP
GaP
35.50
18
—
11.20
—
—
GaP
Green
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA) Dice Technology
HSMM-A101-R00J1
HSMM-A100-S00J1
HSMM-A100-U4PJ1
HSMM-A101-R00H1
112.50
180.00
450.00
112.50
200.00
350.00
—
—
—
20
20
20
20
InGaN
InGaN
InGaN
InGaN
1125.00
—
—
Broadcom
AV02-0198EN
4
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Blue
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA) Dice Technology
HSMN-A101-N00J1
HSMN-A100-P00J1
HSMN-A100-S4YJ1
HSMN-A100-R8YJ1
HSMN-A100-R00J1
28.50
45.00
50.00
70.00
—
—
—
20
20
20
20
20
InGaN
InGaN
InGaN
InGaN
InGaN
180.00
140.00
112.50
450.00
355.00
—
—
—
Part Numbering System
HSM x - A x x x - x x x x x
8 9
1
2
3
4
5
6
7
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (T = 25°C)
A
Parameters
DC Forward Currenta
HSMS/D/Y/G
30 mA
HSMH
30 mA
HSMC/J/L/A
HSME
HSMZ/V/U
HSMM/N
30 mAb, c
100 mA
20 mAc
100 mA
30 mAb, c
100 mA
30 mA
100 mA
114 mA
Peak Forward Currentd
Power Dissipation
100 mA
100 mA
60 mW
63 mW
63 mW
48 mW
63 mW
Reverse Voltage
5V
110°C
Junction Temperature
Operating Temperature
Storage Temperature
a. Derate linearly as shown in Figure 4.
–55°C to +100°C
–55°C to +100°C
b. Drive current between 10 mA and 30 mA is recommended for best long term performance.
c. Operation at current below 5 mA is not recommended.
d. Duty factor = 10%, Frequency = 1 kHz.
Broadcom
AV02-0198EN
5
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Optical Characteristics (T = 25°C)
A
Luminous
Dominant
Wavelengtha
λD (nm)
Viewing Angle
Peak
Luminous
Intensity/Total
Flux Iv(mcd)/
c
b
Efficacy ηv
(lm/W)
Wavelength
λPEAK (nm)
2 θ1/2
Dice
(Degrees)
Typ.
Φv(mlm) Typ.
Color
Red
Part Number
Technology
Typ.
Typ.
Typ.
HSMS-A100
HSMH-A100
HSMC-A10x
HSMZ-A100
HSMJ-A10x
HSMV-A100
HSMD-A100
HSML-A10x
HSMY-A100
HSMA-A10x
HSMU-A100
HSMG-A100
HSME-A100
HSMG-A100
HSME-A100
HSMM-A10x
HSMN-A10x
GaP
635
645
635
635
621
623
600
609
583
592
594
565
575
558
566
523
468
626
637
626
626
615
617
602
605
585
590
592
569
570
560
560
525
470
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
120
63
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
AlGaAs
AlInGaP
AlInGaP
AlInGaP
AlInGaP
GaP
150
155
240
263
380
320
520
480
500
590
560
650
610
500
75
Red
Orange
Orange
AlInGaP
GaP
Amber
AlInGaP
AlInGaP
GaP
Yellow
Green
AlInGaP
GaP
Emerald
Green
AlInGaP
InGaN
InGaN
Green
Blue
a. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
b. θ1/2 is the off -axis angle where the luminous intensity is 1/2 the peak intensity.
c. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv
is the luminous efficacy in lumens/watt.
Electrical Characteristics (T = 25°C)
A
Forward Voltage VF (Volts) at IF = 20 mA
Reverse Voltage VR Reverse Voltage VR Thermal Resistance
RθJP (°CW)
Part Number
Typ.
Max.
at 100 µA Min.
at 10 µA Min.
HSMS/D/Y/G
HSMH
2.2
1.9
1.9
1.9
3.4
2.6
2.6
5
5
5
5
180
180
280
280
280
HSMC/J/L/A/E
HSMZ/V/U
HSMM/N
2.4
2.4
4.05
5
Broadcom
AV02-0198EN
6
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Figure 1: Relative Intensity vs. Wavelength
ꢂ.0
BLUE
EMERALD GREEN
YELLOW GREEN
0.9
0.8
GREEN
0.7
AMBER
0.6
0.5
0.4
0.ꢀ
ORANGE
RED ORANGE
RED
0.ꢁ
0.ꢂ
0
ꢀ80
4ꢀ0
480
5ꢀ0
580
6ꢀ0
680
7ꢀ0
780
WAVELENGTH – nm
ꢂ.0
0.8
0.6
0.4
0.ꢁ
0
GaP
EMERALD
GREEN
GaP
YELLOW
GREEN
GaP YELLOW
GaP ORANGE
GaP RED
ꢀ80
4ꢀ0
480
5ꢀ0
580
6ꢀ0
680
7ꢀ0
780
WAVELENGTH – nm
Broadcom
AV02-0198EN
7
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Figure 2: Forward Current vs. Forward Voltage
Figure 3: Relative Intensity vs. Forward Current
ꢂ.8
ꢂ.6
ꢂ.4
ꢂ.ꢁ
ꢂ.0
0.8
0.6
0.4
0.ꢁ
0
ꢀ5
Gap
ꢀ0
HSMS/D/Y/G
AlInGaP
AlGaAs
ꢁ5
InGaN
ꢁ0
HSMH
ꢂ5
HSMC/J/L/A/E/Z/V/U
HSMM/N
ꢂ0
5
0
0
5
ꢂ0
ꢂ5
ꢁ0
ꢁ5
ꢀ0
ꢀ5
0
ꢂ
ꢁ
ꢀ
4
5
DC FORWARD CURRENT – mA
FORWARD VOLTAGE – V
Figure 4: Maximum Forward Current vs. Ambient Temper-
ature, Derated Based on TJMAX = 110°C, RθJA = 500 °C/W
Figure 5: Maximum Forward Current vs. Solder Point
Temperature, Derated Based on TJMAX = 110°C, RθJA = 180
°C/W or 280 °C/W
ꢀ5
ꢀ5
ꢀ0
HSMS/D/G/
ꢀ0
Y/H/Z/V/U
ꢁ5
HSMS/D/G/Y/H
HSMC/J/L/A
ꢁ5
HSMC/J/L/A
ꢁ0
HSMZ/V/U
HSME
ꢁ0
HSME
ꢂ5
HSMM/N
HSMM/N
ꢂ5
ꢂ0
5
ꢂ0
5
0
0
ꢁ0
40
60
80
ꢂ00
ꢂꢁ0
0
0
ꢁ0
40
60
80
ꢂ00
ꢂꢁ0
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 6: Dominant Wavelength vs. Forward Current (InGaN
Devices)
Figure 7: Forward Voltage Shift vs. Temperature
540
5ꢀ0
0.5
0.4
0.ꢀ
0.ꢁ
0.ꢂ
GREEN
5ꢁ0
5ꢂ0
500
490
480
GaP/AlGaAs/
AlInGaP
0
-0.ꢂ
-0.ꢁ
BLUE
470
InGaN/GaN
50
TEMPERATURE – °C
-0.ꢀ
-ꢂ00
460
-50
0
ꢂ00
ꢂ50
0
5
ꢂ0
ꢂ5
ꢁ0
ꢁ5
ꢀ0
ꢀ5
CURRENT – mA
Broadcom
AV02-0198EN
8
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Figure 8: Radiation Pattern
ꢂ.0
0.8
0.6
0.4
0.ꢁ
0
-90 -80 -70 -60 -50 -40 -ꢀ0 -ꢁ0 -ꢂ0
0
ꢂ0 ꢁ0 ꢀ0 40 50 60 70 80 90
ANGULAR DISPLACEMENT – DEGREES
NOTE: For detailed information on reflow soldering of Broadcom surface mount LEDs, refer to Broadcom Application Note
AN 1060, Surface Mounting SMT LED Indicator Components.
Reflow soldering must not be done more than twice. Observe necessary precautions of handling moisture sensitive device
as stated in the following section.
Figure 9: Recommended Soldering Pad Pattern
4.50
ꢂ.50
ꢁ.60
SOLDER RESIST
Broadcom
AV02-0198EN
9
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Figure 10: Tape Leader and Trailer Dimensions
TRAILER
COMPONENT
LEADER
ꢁ00 mm MIN. FOR Øꢂ80 REEL.
ꢁ00 mm MIN. FOR Øꢀꢀ0 REEL.
480 mm MIN. FOR Øꢂ80 REEL.
960 mm MIN. FOR Øꢀꢀ0 REEL.
C
A
USER FEED DIRECTION
Figure 11: Tape Dimensions
4
0.ꢂ
4
0.ꢂ
ꢁ
0.05
ꢁ.ꢁ9 0.ꢂ
ꢂ.75 0.ꢂ
+0.ꢂ
–0
Ø ꢂ.5
C
ꢀ.5 0.05
ꢀ.8ꢂ 0.ꢂ
+0.ꢀ
–0.ꢂ
8
A
+0.ꢂ
–0
ꢀ.05 0.ꢂ
Øꢂ
8°
0.ꢁꢁ9 0.0ꢂ
Broadcom
AV02-0198EN
10
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Figure 12: Reel Dimensions
Ø ꢁ0.5 0.ꢀ
+0.5
ꢁ
–0
+0
–ꢁ.5
6ꢁ.5
ꢂ80
Ø ꢂꢀ 0.ꢁ
+ꢂ.50
–0.00
8.4
(MEASURED AT OUTER EDGE)
ꢂ4.4 (MAX. MEASURED AT HUB)
LABEL AREA (ꢂꢂꢂ mm x 57 mm)
WITH DEPRESSION (0.ꢁ5 mm)
7.9 (MIN.)
ꢂ0.9 (MAX.)
Figure 13: Reeling Orientation
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Broadcom
AV02-0198EN
11
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Intensity Bin Select (X X )
Intensity Bin Limits
5 6
Individual reel will contain parts from one half bin only.
Bin ID
Min. (mcd)
Max. (mcd)
G1
G2
H1
H2
J1
1.80
2.24
2.80
3.55
4.50
5.60
7.20
9.00
X5
X6
Min. IV Bin
2.24
2.80
3.55
4.50
0
2
Full Distribution
J2
5.60
2 half bins starting from X51
3 half bins starting from X51
4 half bins starting from X51
5 half bins starting from X51
2 half bins starting from X52
3 half bins starting from X52
4 half bins starting from X52
5 half bins starting from X52
K1
K2
L1
7.20
3
4
5
6
7
8
9
9.00
11.20
11.20
14.00
18.00
22.40
28.50
35.50
45.00
56.00
71.50
90.00
112.50
140.00
180.00
224.00
285.00
355.00
450.00
560.00
715.00
900.00
1125.00
1400.00
1800.00
2240.00
14.00
L2
18.00
M1
M2
N1
N2
P1
P2
Q1
Q2
R1
R2
S1
S2
T1
T2
U1
U2
V1
V2
W1
W2
X1
X2
22.40
28.50
35.50
45.00
56.00
71.50
90.00
112.50
140.00
180.00
224.00
285.00
355.00
450.00
560.00
715.00
900.00
1125.00
1400.00
1800.00
2240.00
2850.00
Tolerance of each bin limit = ±12%
Broadcom
AV02-0198EN
12
HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Color Bin Select (X )
Color Bin Limits
7
Individual reel will contain parts from one full bin only.
Color
Blue
Min. (nm)
Max. (nm)
X7
A
B
C
D
460.0
465.0
470.0
475.0
465.0
470.0
475.0
480.0
0
Full distribution
A and B only
Z
Y
W
V
U
T
S
Q
P
N
M
L
B and C only
C and D only
Green
D and E only
A
B
C
D
515.0
520.0
525.0
530.0
520.0
525.0
530.0
535.0
E and F only
F and G only
G and H only
A, B, and C only
B, C, and D only
C, D, and E only
D, E, and F only
E, F, and G only
F, G, and H only
A, B, C, and D only
E, F, G, and H only
B, C, D, and E only
C, D, E, and F only
A, B, C, D, and E only
B, C, D, E, and F only
Emerald Green
A
B
C
D
552.5
555.5
558.5
561.5
555.5
558.5
561.5
564.5
K
1
Yellow Green
2
E
F
564.5
567.5
570.5
573.5
567.5
570.5
573.5
576.5
3
4
G
H
5
6
Amber
A
B
C
D
E
F
582.0
584.5
587.0
589.5
592.0
594.5
584.5
587.0
589.5
592.0
594.5
597.0
Orange
A
B
C
D
E
597.0
600.0
603.0
606.0
609.0
600.0
603.0
606.0
609.0
612.0
Red Orange
A
611.0
616.0
B
616.0
620.0
Red
Full distribution
Broadcom
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HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Figure 14: Recommended Pb-Free Reflow Soldering Profile
Packaging Option (X X )
8 9
Option
Test Current
Package Type
Reel Size
ꢂ0 to ꢀ0 SEC.
J1
J4
20 mA
20 mA
20 mA
20 mA
10 mA
10 mA
10 mA
10 mA
2 mA
Top Mount
Top Mount
7 inches
13 inches
7 inches
13 inches
7 inches
13 inches
7 inches
13 inches
7 inches
ꢁ55 - ꢁ60 C
ꢀ C/SEC. MAX.
H1
H4
J2
Reverse Mount
Reverse Mount
Top Mount
ꢁꢂ7 C
ꢁ00 C
6 C/SEC. MAX.
ꢂ50 C
J5
Top Mount
H2
H5
L2
Reverse Mount
Reverse Mount
Top Mount
ꢀ C/SEC. MAX.
ꢂ00 SEC. MAX.
60 - ꢂꢁ0 SEC.
Precautionary Notes
TIME
(Acc. to J-STD-0ꢁ0C)
Soldering
Figure 15: Recommended Board Reflow Direction
Do not perform reflow soldering more than twice.
Observe necessary precautions of handling moisture-
sensitive device as stated in the following section.
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Use hand
soldering only for rework if unavoidable, but it must be
strictly controlled to following conditions:
– Soldering iron tip temperature = 315°C max.
– Soldering duration = 3s max.
– Number of cycles = 1 only
– Power of soldering iron = 50W max.
Handling Precautions
Do not touch the LED package body with the soldering
iron except for the soldering terminals, as it may cause
damage to the LED.
For automated pick and place, Broadcom has tested a
nozzle size with OD 1.5 mm to work with this LED. However,
due to the possibility of variations in other parameters such
as pick and place machine maker/model, and other settings
of the machine, verify that the selected nozzle will not cause
damage to the LED.
Confirm beforehand whether the functionality and
performance of the LED is affected by soldering with
hand soldering.
Broadcom
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HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
Handling of Moisture-Sensitive Devices Application Precautions
The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated
in the data sheet. Constant current driving is
This product has a Moisture Sensitive Level 2a rating per
JEDEC J-STD-020. Refer to Broadcom Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices for additional details and a review of proper
handling procedures.
recommended to ensure consistent performance.
Circuit design must cater to the whole range of forward
voltage (V ) of the LEDs to ensure the intended drive
F
Before use:
current can always be achieved.
– An unopened moisture barrier bag (MBB) can be
stored at <40°C/90% RH for 12 months. If the actual
shelf life has exceeded 12 months and the Humidity
Indicator Card (HIC) indicates that baking is not
required, then it is safe to reflow the LEDs per the
original MSL rating.
The LED exhibits slightly different characteristics at
different drive currents, which may result in a larger
variation of performance (meaning: intensity,
wavelength, and forward voltage). Set the application
current as close as possible to the test current to
minimize these variations.
– Do not open the MBB prior to assembly (for
example, for IQC). If unavoidable, MBB must be
properly resealed with fresh desiccant and HIC. The
exposed duration must be taken in as floor life.
The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When
driving the LED in matrix form, ensure that the reverse
bias voltage does not exceed the allowable limit of the
LED.
Control after opening the MBB:
Do not use the LED in the vicinity of material with sulfur
content or in environments of high gaseous sulfur
compounds and corrosive elements. Examples of
material that might contain sulfur are rubber gaskets,
room- temperature vulcanizing (RTV) silicone rubber,
rubber gloves, and so on. Prolonged exposure to such
environments may affect the optical characteristics and
product life.
– Read the HIC immediately upon opening of MBB.
– Keep the LEDs at <30°/60% RH at all times, and
complete all high temperature-related processes,
including soldering, curing or rework within 672
hours.
Control for unfinished reel:
Store unused LEDs in a sealed MBB with desiccant or a
desiccator at <5% RH.
White LEDs must not be exposed to acidic
environments and must not be used in the vicinity of
any compound that may have acidic outgas, such as,
but not limited to, acrylate adhesive. These
environments have an adverse effect on LED
performance.
Control of assembled boards:
If the PCB soldered with the LEDs is to be subjected to
other high-temperature processes, store the PCB in a
sealed MBB with desiccant or desiccator at <5% RH to
ensure that all LEDs have not exceeded their floor life of
168 hours.
This LED is designed to have enhanced gas corrosion
resistance. Its performance has been tested according
to the conditions below:
Baking is required if:
– The HIC indicator indicates a change in color for
10% and 5%, as stated on the HIC.
– IEC 60068-2-43: 25°C/75% RH, H2S 15 ppm, 21
days
– The LEDs are exposed to conditions of >30°C/60%
RH at any time.
– IEC 60068-2-42: 25°C/75% RH, SO2 25 ppm, 21
days
– The LED's floor life exceeded 168 hours.
– IEC 60068-2-60: 25°C/75% RH, SO2 200 ppb, NO2
200 ppb, H2S 10 ppb, Cl2 10 ppb, 21 days.
The recommended baking condition is: 60±5°C for 20
hours.
As actual application might not be exactly similar to the
test conditions, do verify that the LED will not be
damaged by prolonged exposure in the intended
environment.
Baking can only be done once.
Storage:
The soldering terminals of these Broadcom LEDs are
silver plated. If the LEDs are exposed in ambient
environment for too long, the silver plating might be
oxidized, thus affecting its solderability performance. As
such, keep unused LEDs in a sealed MBB with
desiccant or in a desiccator at <5% RH.
Avoid rapid change in ambient temperature, especially
in high-humidity environments, because they cause
condensation on the LED.
Broadcom
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HSMx-A10x-xxxxx Data Sheet
PLCC-2, Surface Mount LED Indicator
If the LED is intended to be used in harsh or outdoor
environment, protect the LED against damages caused
by rain water, water, dust, oil, corrosive gases, external
mechanical stresses, and so on.
T can be easily measured by mounting a thermocouple on
S
the soldering joint as shown in preceding figure, while R
θJ-S
is provided in the data sheet. Verify the T of the LED in the
S
final product to ensure that the LEDs are operating within all
maximum ratings stated in the data sheet.
Thermal Management
Eye Safety Precautions
The optical, electrical, and reliability characteristics of the
LED are affected by temperature. Keep the junction
LEDs may pose optical hazards when in operation. Do not
look directly at operating LEDs because it might be harmful
to the eyes. For safety reasons, use appropriate shielding or
personal protective equipment.
temperature (T ) of the LED below the allowable limit at all
J
times. T can be calculated as follows:
J
T = T + R
x I x V
F Fmax
J
A
θJ-A
where;
T = ambient temperature (°C)
A
R
= thermal resistance from LED junction to ambient
θJ-A
(°C/W)
I = forward current (A)
F
V
= maximum forward voltage (V)
Fmax
The complication of using this formula lies in T and R
.
θJ-A
A
Actual T is sometimes subjective and hard to determine.
A
R
varies from system to system depending on design
θJ-A
and is usually not known.
Another way of calculating T is by using the solder point
J
temperature, TS as follows:
T = T + R
x I x V
F Fmax
J
S
θJ-S
where;
T = LED solder point temperature as shown in the
S
following figure (°C)
R
= thermal resistance from junction to solder point
θJ-S
(°C/W)
I = forward current (A)
F
V
= maximum forward voltage (V)
Fmax
Figure 16: Solder Point Temperatures on PCB
Package mark
Ts point
Broadcom
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