JESD-A103 [BOARDCOM]
Automotive Wide Operating Temperature 1 MBd Digital Optocoupler in a Stretched 8-Pin Surface Mount Plastic Package;
| 型号： | JESD-A103 |
| 厂家： | 
Broadcom Corporation. |
| 描述： | Automotive Wide Operating Temperature 1 MBd Digital Optocoupler in a Stretched 8-Pin Surface Mount Plastic Package |
| 文件： | 总2页 (文件大小：59K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ACPL-K44T
Automotive Wide Operating Temperature 1 MBd Digital Optocoupler
in a Stretched 8-Pin Surface Mount Plastic Package
Reliability Data Sheet
Description
Definition of Failure
The reliability data shown includes Avago Technologies Inability to switch, that is, “functional failure”, is the
reliability test data from the reliability qualification done definition of failure in this data sheet. Specifically, failure
on this product family. All of these products use the occurs when the device fails to switch ON with two times
similar IC, and the same packaging materials, processes, the minimum recommended drive current (but not
stress conditions and testing. The data in Table 1 and exceeding the max rating) or fails to switch off when there
Table 2 reflect actual test data for devices on a per channel is no input current.
basis. Before stress, all devices are preconditioned at MSL
Failure Rate Projections
1 using a solder reflow process (260 °C peak temp) and 20
temperature cycles (-55 °C to +125 °C, 15 mins dwell, 1
min transfer). These data are taken from testing on Avago
Technologies devices using internal Avago Technologies'
process, material specifications, design standards, and
statistical process controls. THEY ARE NOT TRANSFERABLE
TO OTHER MANUFACTURERS’SIMILAR PART TYPES.
The demonstrated point mean time to failure (MTTF) is
measured at the absolute maximum stress condition.
The failure rate projections in Table 2 uses the Arrhenius
acceleration relationship, where a 0.43 eV activation
energy is used as in the hybrid section of MIL-HDBK-217.
Application Information
Operating Life Test
The data of Table 1 and 2 were obtained on devices with
high temperature operating life duration. An exponential
(random) failure distribution is assumed, expressed in
units of FIT (failures per billion device hours) are only
defined in the random failure portion of the reliability
curve.
For valid system reliability calculations, you must adjust
for the time when the system is not in operation. Note: if
you are using MIL-HDBK-217 for predicting component
reliability, the results may not be comparable to those
given in Table 2 due to different conditions and factors
that have been accounted for in MIL-HDBK-217. For
example, it is unlikely that your application will exercise
all available channels at full rated power with the IC
always ON as Avago Technologies testing does. Therefore,
carefully consider your application total power and duty
cycle when you compare Table 2 to predictions using MIL-
HDBK-217.
Table 1. Demonstrated Operating Life Test Performance
Stress Test
Condition
Total Device
Tested
Total Device
Hours
Number of
Failed Units
Demonstrated
MTTF (hr) @
T = +125 °C
a
Demonstrated
FITs @
T = +125 °C
a
Ta = 150 °C
If = 20 mA
Vcc = 30 V
462
346,500
0
> 689,863
< 1,450
Iout = 10 mA
Table 2. Reliability Projection for Device Listed in Title
Ambient
Temperature
(°C)
Junction
Temperature
(°C)
Typical (60% Confidence)
MTTF FITs
90% Confidence
MTTF
FITs
9
9
(Hr/fail)
(Fail/10 h)
(Hr/fail)
(Fail/10 h)
125
120
110
100
90
80
70
60
50
40
30
140
135
125
115
105
95
85
75
65
55
752,887
872,850
1,328
1,146
843
610
435
304
208
140
91
299,604
347,342
472,081
651,847
915,563
1,309,936
1,912,063
2,852,293
4,356,761
6,828,903
11,010,679
14,142,196
3,338
2,879
2,118
1,534
1,092
763
523
351
230
146
1,186,313
1,638,053
2,300,757
3,291,792
4,804,902
7,167,645
10,948,285
17,160,634
27,669,193
35,538,513
58
36
28
45
40
91
71
25
Table 3. Mechanical Tests (Testing done on a constructional basis)
Test Name
Reference Standard
Test Conditions
Units Tested
Units Failed
Temp Cycling
JESD-A104
-65 to 150 °C
Transfer = 1 min
Dwell = 15 mins
500 cycles
507
0
Physical Dimensions
JESD-B100
JESD-B102
Conformance to datasheet
package drawings
50
30
0
0
Solderability
(RoHS condition)
8 hrs steam aging (93 °C),
followed by solder dip
(260 °C, 5 sec)
Preconditioning
J-STD-020
JA113
As per reference standard (to
conform to MSL 1)
1611
0
Table 4. Environmental Testing
Test Name
Reference Standard
Test Conditions
Units Tested
Units Failed
Highly Accelerated
Stress Test (Biased)
JESD-A110
Ta = 130 °C, RH=85%
Vcc = 5.5 V
552
0
Vin= 5 V
Vout= 5.5V
Time = 96 hours
High Temperature Bake JESD-A103
Ta = 150 °C
135
231
0
0
Unbiased
Time = 1000 hours
Unbiased HAST
JESD-A118
Ta = 130 °C, RH = 85%
Unbiased
Time = 96 hours
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-3186EN - December 31, 2012
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