2NBS16-RF3221331LF
更新时间：2024-09-18 18:22:17
品牌：BOURNS
描述：RESISTOR, NETWORK, FILM, TERMINATOR, 1W, SURFACE MOUNT, SOIC, ROHS COMPLIANT
概述
规格参数
数据手册2NBS16-RF3221331LF 概述
RESISTOR, NETWORK, FILM, TERMINATOR, 1W, SURFACE MOUNT, SOIC, ROHS COMPLIANT 阵列/网络电阻器
2NBS16-RF3221331LF 规格参数
| 是否Rohs认证： | 符合 | 生命周期： | Obsolete |
| 包装说明： | , | Reach Compliance Code： | compliant |
| ECCN代码： | EAR99 | HTS代码： | 8533.21.00.20 |
| 风险等级： | 5.82 | 其他特性： | DUAL TERMINATOR |
| 元件功耗： | 0.1 W | 第一元件电阻： | 220 Ω |
| JESD-609代码： | e3 | 安装特点： | SURFACE MOUNT |
| 网络类型： | TERMINATOR | 元件数量： | 2 |
| 功能数量： | 14 | 端子数量： | 16 |
| 最高工作温度： | 125 °C | 最低工作温度： | -55 °C |
| 封装形状： | RECTANGULAR PACKAGE | 包装方法： | TR, 13 INCH |
| 额定功率耗散 (P)： | 1 W | 额定温度： | 70 °C |
| 电阻器类型： | ARRAY/NETWORK RESISTOR | 第二/最后一个元素电阻： | 330 Ω |
| 表面贴装： | YES | 技术： | THIN FILM |
| 温度系数： | 100 ppm/°C | 温度系数跟踪： | 25 ppm/°C |
| 端子面层： | Tin (Sn) | 端子形状： | GULL WING |
| 容差： | 1% | 工作电压： | 50 V |
| Base Number Matches： | 1 |
2NBS16-RF3221331LF 数据手册
通过下载2NBS16-RF3221331LF数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载Models 2QSP-XX3 and 2NBS-XX3
are obsolete and not recommended
for new designs.
Features
■ RoHS compliant*
■ Multiple SCSI termination resistors
■ Stable thin-film-on-silicon technology
■ Ultra-miniature packages to JEDEC
standards
Applications
■ Single-ended SCSI termination
■ SCSI host adaptor cards
■ All SCSI bus devices
Thin Film on Silicon 2QSP / 2NBS-XX3 Dual Terminator
General Information
Package Schematic
16
9
Dual Terminator networks are used to correctly terminate
single-ended SCSI bus lines. The standard R1, R2 combina-
tion ensures that the high frequency component of a signal
transition will see an impedance at the termination equal to
the characteristic impedance of the line. Fabricated with
Tantalum Nitride on Silicon, these resistors feature excellent
stability, TCR and tracking performance. The JEDEC
standard miniature packages offer the most space-efficient
Dual Terminator resistor array available.
R1 R2
R1
R2
1
8
Electrical & Environmental Characteristics
Electrical Characteristics
Symbol
Minim
Nominal
Maximum
Unit
Resistance Range
R
220
750
Ω
Tolerance:
Absolute
Ratio
1 ꢀ
0.5 ꢀ
5 ꢀ
2 ꢀ
Ω
Ω
TCR:
Absolute
Tracking
100
25
ppm/°C
ppm/°C
Operating Voltage
50
V
Environmental Characteris
ESD
2 K
-55
-65
V
°C
Operating Temperature
T
J
+125
+150
0.1
Storage Temperature
T
°C
stg
Power Rating per Resistor @ 70 °C
Power Rating per Package @ 70 °C:
Watt
QSOP:
16 Pin
20, 24 Pin
28 Pin
0.75
1.00
1.12
Watt
Watt
Watt
NBSOIC: 8 Pin
14, 16 Pin
0.60
1.00
Watt
Watt
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Thin Film on Silicon 2QSP / 2NBS -XX3 Dual Terminator
Mechanical Characteristics
QSOP Package Dimensions
Narrow-Body SOIC Package Dimensions
A
A
1.27
(.050)
.635
(.025)
TYP.
TYP.
3.81 - 3.99
3.81 - 3.99
(.150 - .157)
(.150 - .157)
.21 - .31
(.008 - .012)
0- 0.46
(.014 - .018)
PIN 1
PIN
1.35 5
(.053 - .069)
1.35 - 1.75
(.053 - .069)
.10 - .25
(.004 - .010)
.10 - .25
(.004 - .010)
.19 - .25
(.007 - .010)
0-8 °
.25
(.010)
0-8 °
.41 - 1.27
(.016 - .050)
5.80 - 6.20
(.228 - .244)
.41 - 1.27
(.016 - .050)
5.80 - 6.20
(.228 - .244)
Model
2QSP16
2QSP20
2QSP24
2QSP28
A
Model
2NBS08
2NBS14
2NBS16
A
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-012.
JEDEC Reference Number MO-137.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Thin Film on Silicon 2QSP / 2NBS -XX3 Dual Terminator
QSOP Package Power Temperature Derating Curve
Narrow-Body SOIC Package Power Temperature Derating Curve
1.25
1.0
.75
.50
.25
1.0
.8
2QSP28
2NBS14, 2NBS16
2NBS08
2QSP20, 2QSP24
2QSP16
.6
.4
.2
0
25
50
75
100
125
150
0
25
50
75
100
125
150
°
AMBIENT TEMPERATURE ( C )
°
AMBIENT TEMPERATURE ( C )
Schematic
R
R
2
1
R
R
1
2
8 PIN
14 P
16 PIN
IN
2
28
Typical Part Marking
Standard Resistance Values
Represents total content. Layout may vary.
Resistor
Designator
Resistance
(ohms)
Resistance
Code
PIN COUNT
R1
R2
220
330
221
331
MODEL
GRADE
QSP16J
3-221331
YYWW
CIRCUIT
RESISTANCE
CODE
R1
R2
330
680
331
681
PIN 1 INDICATOR
(MOLDED INDENT)
DATE CODE
MANUFACTURER'S
TRADEMARK
R1
R2
750
750
751
751
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Thin Film on Silicon 2QSP / 2NBS -XX3 Dual Terminator
Dispensing
For large quantities, the product will be dispensed in Tape and Reel (see diagram below).
A
0
DIMENSIONS = MM (INCHES)
B
0
No. of Pieces No. of Pieces
Package
A
0
B
K
0
Wth
Ph
0
per 13 reel
per tube
QSOP
16 Pin
6.4 (0.252)
6.5 (0.256)
6.5 (0.256) 10.3 (0.40) (0.)
5.2 (0.205)
9.0 (0.354)
2.1 (0.083
.1 (3)
12 (0.4
6 (0630)
6 (0.630)
8 (0.315)
8 (0.315)
8 (0.315)
3,500
3,500
3,500
98
56
49
20, 24 Pin
28 Pin
NBSOIC
8 Pin
6.4 (0.252)
6.5 (0.25
6.5 .256
0 (0
0 (0.354)
9.0 354)
2.1 (0.083)
2.1 (0.083)
2.1 (0.083)
12 (0.472)
16 (0.630)
16 (0.630)
8 (0.315)
8 (0.315)
8 (0.315)
3,500
3,500
3,500
98
56
49
14 Pin
16 Pin
How To Order
2 QSP 20 - T J 3 221331 LF
Product Class
Thin-Film-on-Silicon
Standard Package Style
QSP = QSOP
NBS = Narrow-Body SOIC
Pin Count
QSP = 16, 20, 24, 28
NBS = 8, 14, 16
Dispensing
R
T
=
=
Reel
Tube
Asia-Pacific:
Standard Grade
Tolerance
J =
G =
F =
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
5 ꢀ
2 ꢀ
1 ꢀ
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
Circuit
3 = Dual Terminator
Resistance Value Code
1st three digits specify R1 resistance code.
Last three digits specify R2 resistance code.
Terminations
• LF = 100 ꢀ Sn (RoHS Compliant)
REV. 11/10
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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