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2QSP16-RF6-253/503LF [BOURNS]

RESISTOR, NETWORK, FILM, R-2R LADDER, 0.75W, SURFACE MOUNT, 1620, QSOP, ROHS COMPLIANT;
2QSP16-RF6-253/503LF
型号： 2QSP16-RF6-253/503LF
厂家： BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述：

RESISTOR, NETWORK, FILM, R-2R LADDER, 0.75W, SURFACE MOUNT, 1620, QSOP, ROHS COMPLIANT
文件： 总4页 (文件大小：347K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
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Features  
Applications  
■ Lead free versions available  
■ RoHS compliant (lead free version)*  
■ Resistor ladder in 1:2 ratio  
■ Stable thin-film-on-silicon technology  
■ Digital to analog converters  
■ Successive approximation ADCs  
■ Ideal for space-constrained applications  
■ Ultra-miniature packages to JEDEC  
standards  
Thin Film on Silicon 2QSP / 2NBS-XX6 R2R Ladder  
General Information  
Package Schematic  
16  
15  
14  
13  
12  
11  
10  
9
The R2R Ladder Network is used in Digital to Analog and  
Analog to Digital conversion. Binary weighted currents,  
flowing in the individual ladder segments, depend on the  
integrity of the R:2R relationship for an accurate conversion  
result. Fabricated with Tantalum Nitride on Silicon, these  
resistors feature excellent stability, TCR and tracking  
performance. R2R Ladder Networks are available in a range  
of miniature packages conforming to JEDEC standards.  
2R  
R
2R  
1
2
3
4
5
6
7
8
Electrical & Environmental Characteristics  
Electrical Characteristics  
Symbol  
Minimum  
Nominal  
Maximum  
Unit  
Resistance Range  
R
10  
50 K  
Ω
Tolerance:  
Absolute  
Ratio  
1 %  
0.5 %  
5 %  
Ω
Ω
TCR:  
Absolute  
Tracking  
100  
25  
ppm/°C  
ppm/°C  
Operating Voltage  
50  
V
Environmental Characteristics  
ESD  
2 K  
-55  
-65  
V
°C  
Operating Temperature  
T
J
+125  
+150  
0.1  
Storage Temperature  
T
°C  
stg  
Power Rating per Resistor @ 70 °C  
Power Rating per Package @ 70 °C:  
Watt  
QSOP:  
16 Pin  
20, 24 Pin  
28 Pin  
0.75  
1.00  
1.12  
Watt  
Watt  
Watt  
NBSOIC: 8 Pin  
14, 16 Pin  
0.60  
1.00  
Watt  
Watt  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
Thin Film on Silicon 2QSP / 2NBS -XX6 R2R Ladder  
Mechanical Characteristics  
QSOP Package Dimensions  
Narrow-Body SOIC Package Dimensions  
A
A
1.27  
(.050)  
.635  
(.025)  
TYP.  
TYP.  
3.81 - 3.99  
3.81 - 3.99  
(.150 - .157)  
(.150 - .157)  
.21 - .31  
(.008 - .012)  
0.36 - 0.46  
(.014 - .018)  
PIN 1  
PIN 1  
1.35 - 1.75  
(.053 - .069)  
1.35 - 1.75  
(.053 - .069)  
.10 - .25  
(.004 - .010)  
.10 - .25  
(.004 - .010)  
.19 - .25  
(.007 - .010)  
0-8 °  
.19 - .25  
(.007 - .010)  
0-8 °  
.41 - 1.27  
(.016 - .050)  
5.80 - 6.20  
(.228 - .244)  
.41 - 1.27  
(.016 - .050)  
5.80 - 6.20  
(.228 - .244)  
Model  
2QSP16  
2QSP20  
2QSP24  
2QSP28  
A
Model  
2NBS08  
2NBS14  
2NBS16  
A
4.80 - 4.98 (.189 - .196)  
8.56 - 8.74 (.337 - .344)  
8.56 - 8.74 (.337 - .344)  
9.80 - 9.98 (.386 - .393)  
4.80 - 4.98 (.189 - .196)  
8.56 - 8.74 (.337 - .344)  
9.80 - 9.98 (.386 - .393)  
Governing dimensions are in mm. Dimensions in  
parentheses are in inches and are approximate.  
Governing dimensions are in mm. Dimensions in  
parentheses are in inches and are approximate.  
JEDEC Reference Number MS-012.  
JEDEC Reference Number MO-137.  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
Thin Film on Silicon 2QSP / 2NBS -XX6 R2R Ladder  
QSOP Package Power Temperature Derating Curve  
Narrow-Body SOIC Package Power Temperature Derating Curve  
1.25  
1.0  
.75  
.50  
.25  
1.0  
.8  
2QSP28  
2NBS14, 2NBS16  
2NBS08  
2QSP20, 2QSP24  
2QSP16  
.6  
.4  
.2  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
°
AMBIENT TEMPERATURE ( C )  
°
AMBIENT TEMPERATURE ( C )  
Schematic  
2R  
R
2R  
8 PIN  
14 PIN  
16 PIN  
20 PIN  
24 PIN  
28 PIN  
Typical Part Marking  
Standard Resistance Values  
Represents total content. Layout may vary.  
R1  
R2  
Value  
(ohms)  
Value  
(ohms)  
Resistance  
Code  
PIN COUNT  
MODEL  
GRADE  
QSP16J  
10 K  
25 K  
20 K  
50 K  
103  
253  
6-103  
YYWW  
CIRCUIT  
RESISTANCE  
CODE  
PIN 1 INDICATOR  
(MOLDED INDENT)  
DATE CODE  
MANUFACTURER'S  
TRADEMARK  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
Thin Film on Silicon 2QSP / 2NBS -XX6 R2R Ladder  
Dispensing  
For large quantities, the product will be dispensed in Tape and Reel (see diagram below).  
A
0
DIMENSIONS = MM (INCHES)  
B
0
K
0
No. of Pieces No. of Pieces  
Package  
A
B
K
0
Width  
Pitch  
0
0
per 13 ” reel  
per tube  
QSOP  
16 Pin  
6.4 (0.252)  
6.5 (0.256)  
6.5 (0.256) 10.3 (0.406) 2.1 (0.083)  
5.2 (0.205)  
9.0 (0.354)  
2.1 (0.083)  
2.1 (0.083)  
12 (0.472)  
16 (0.630)  
16 (0.630)  
8 (0.315)  
8 (0.315)  
8 (0.315)  
3,500  
3,500  
3,500  
98  
56  
49  
20, 24 Pin  
28 Pin  
NBSOIC  
8 Pin  
6.4 (0.252)  
6.5 (0.256)  
6.5 (0.256)  
9.0 (0.354)  
9.0 (0.354)  
9.0 (0.354)  
2.1 (0.083)  
2.1 (0.083)  
2.1 (0.083)  
12 (0.472)  
16 (0.630)  
16 (0.630)  
8 (0.315)  
8 (0.315)  
8 (0.315)  
3,500  
3,500  
3,500  
98  
56  
49  
14 Pin  
16 Pin  
How To Order  
2 QSP 20 - T J 6 - 103 __  
Product Class  
Thin-Film-on-Silicon  
Standard Package Style  
QSP = QSOP  
NBS = Narrow-Body SOIC  
Pin Count  
QSP = 16, 20, 24, 28  
NBS = 8, 14, 16  
Reliable Electronic Solutions  
Dispensing  
R = Reel  
Asia-Pacific:  
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116  
T
= Tube  
Europe:  
Standard Grade  
Tolerance  
Tel: +41-41 768 5555 • Fax: +41-41 768 5510  
The Americas:  
Tel: +1-951 781-5500 • Fax: +1-951 781-5700  
www.bourns.com  
J =  
G =  
F =  
5 %  
2 %  
1 %  
Circuit  
6 = R/2R Ladder  
Resistance Value Code  
1st three digits specify R1 resistance code.  
Terminations  
• LF = 100 % Sn (lead free)  
• Blank = Sn/Pb  
04/05  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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