CAT25-910JA [BOURNS]
Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.5W, 91ohm, 25V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0816, CHIP;
| 型号： | CAT25-910JA |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.5W, 91ohm, 25V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0816, CHIP |
| 文件： | 总2页 (文件大小：187K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
■ Concave terminals
■ E 24 Series from 10 ohms to 1 megohm
■ Lead free version available (see How to
Order “Termination” options)
■ RoHS compliant*
■ 8 bit multiple applications
■ Smallest bussed chip array
CAT25 - Thick Film Chip Resistor Arrays
Electrical Characteristics
How To Order
CA T 25 - 103 J A __
Parameters
CAT25
8
10 ohms to 1 megohm
5 %
62.5 mW
+70 °C
+/-200 ppm/°C
25 V
-55 °C to +125 °C
Test Method
JIS-C-5202.5.1
JIS-C-5202.5.2
Product
CA = Chip Array
Number of Resistors
Resistance Range E24
Resistance Tolerance
Power Rating/Resistor
Rating Temperature
T.C.R.
Pin Style
T = Concave
Model
Resistance Value
103 = 10K ohms
Maximum Operating Voltage
Operating Temperature
Tolerance
J = 5 %
Electrical Circuit
A = 8 Resistors, Bussed Type
Environmental Characteristics
Terminations
LF = Tin-plated (lead free)
Blank = Solder-plated
Specification
Short Time Overload
Load Life
Characteristics
+/-(3 % +0.1 ohm)
+/-(5 % +0.1 ohm)
+/-(3 % +0.1 ohm)
+/-(1 % +0.1 ohm)
+/-(1 % +0.1 ohm)
+/-(2 % +0.1 ohm)
+/-(1 % +0.1 ohm)
1000 megohms minimum
50 VRMS
Test Method
JIS-C-5202.5.5
JIS-C-5202.7.10
JIS-C-5202.7.9
JIS-C-5202.6.4
JIS-C-5202.6.
JIS-C-5202.7.4
JIS-C-5202.6.3
JIS-C-5202.5.6
JIS-C-5202.5.7
JIS-C-5202.6.5
For Standard Values Used in Capacitors,
Inductors, and Resistors, click here.
Humidity Load Life
Resistance to Soldering Heat
Terminal Strength
Temperature Cycle
Vibration
Insulation Resistance
Dielectric Withstanding Voltage
Lead Solderability
>95 %
Outline Drawing
Land Pattern
4.8 - 5.2
(.190 - .205)
0.25 0.20
(.010 .008)
2.10 0.20
(.083 .008)
2.8 - 3.0
0.9 - 1.1
(.035 - .043)
103
(.110 - .118)
0.30 0.20
3.2 - 3.5
(.125 - .138)
(.012 .008)
0.55 0.10
(.022 .004)
0.80 0.10
3.3 - 3.4
(.032 .004)
(.130 - .133)
4.00 0.20
(.157 .008)
0.35 0.20
(.014 .008)
0.50 0.20
(.020 .008)
0.4 - 0.5
(.01ꢀ - .020)
0.80
(.032)
Electrical Circuit
0.25 0.15
DIA.
(.010 .00ꢀ)
0.40 0.20
(.01ꢀ .008)
MM
(INCHES)
DIMENSIONS ARE:
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CAT25 - Thick Film Chip Resistor Arrays
Soldering Profile for Lead Free Chip Resistors and Arrays
275
<1>
Maximum of 20 seconds between
+255 °C and +2ꢀ0 °C
2ꢀ0 °C peak
<1>
255 °C
225
175
125
75
220 °C
190 °C
ꢀ0 - 90
seconds
Ramp Down
3 °C/second
150 °C
ꢀ0 - 120 seconds
10 seconds minimum
Ramp Up
3 °C/second maximum
25
0
50
100
150
Time (seconds)
200
250
300
Material
Packaging
12
(.472)
4,000 pcs. per reel
Substrate
Element
Coating
Terminal
Alumina 96
Ruthenium Oxide
Glass
embossed tape
AgPb, Plated Ni+SnPb
REV. 04/0ꢀ
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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