CAY17-393JALF [BOURNS]

Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.25W, 39000ohm, 25V, 5% +/-Tol, 250ppm/Cel, Surface Mount, 0612, CHIP, ROHS COMPLIANT;
CAY17-393JALF
型号: CAY17-393JALF
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.25W, 39000ohm, 25V, 5% +/-Tol, 250ppm/Cel, Surface Mount, 0612, CHIP, ROHS COMPLIANT

电阻器
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Features  
JA version available to 100K ohms  
Suitable for all types of soldering processes  
Paper tape on plastic reel for automatic  
placement  
10 pin with 8 resistors in bussed type for  
pull up/down circuit  
RoHS compliant*  
Convex termination style  
Resistance tolerance ±± ꢀ  
E24 Series from 10 ohms to 43K ohms  
Model CAY17 - Bussed Resistor Array  
Characteristics  
Product Dimensions  
Number of Resistors .. 8 (bussed circuit)  
Power Rating per Resistor @ 70 °C  
............................................ 0.0625 W  
Package Power Rating @ 70 °C  
0.±± 0.1  
(.022 .004)  
0.2 0.1±  
(.008 .006)  
0.3 0.2  
(.012 .008)  
1.6 0.2  
(.063 .008)  
...............................................0.250 W  
Operating Temperature Range  
R102  
...............................-55 °C to +155 °C  
Derated to 0 Load @..................+125 °C  
Max. Working Voltage......................25 V  
Max. Overload Voltage....................50 V  
Resistance Tolerance .................... 5 ꢀ  
Resistance Range/E24 Series  
0.64  
(.02±)  
0.34 0.1±  
(.013 .006)  
0.± 0.1  
(.020 .004)  
3.2 0.2  
(.126 .008)  
JA version ..... 10 ohms to 100K ohms  
JB version ....... 10 ohms to 43K ohms  
T.C.R................................. 250 ppm/°C  
Derating Curve  
Bussed Circuits - Option A  
70 °C  
125 °C  
100  
9
8
7
6
10  
80  
60  
40  
Construction  
R
R
R
R
R
R
R
Protective  
Glass Overcoat  
R
20  
0
1
2
4
3
±
Thick Film  
Resistive Element  
-55  
40 60 80 100 120 140 160  
Ambient Temp. (˚C)  
Packaging Dimensions  
4.0 ± 0.1  
(.1±8 ± .004)  
1.0  
(.039)  
1.± + 0.1 - 0  
(.0±9 + .004 - 0)  
MAX.  
Termination  
High Purity  
Alumina  
Substrate  
3.± ± 0.0±  
(.138 ± .002)  
8.0 ± 0.2  
(.31± ± .008)  
3.6 ± 0.2  
How To Order  
(.142 ± .008)  
2.0 ± 0.2  
(.079 ± .008)  
1.4  
(.0±±)  
MAX.  
CA Y 17 - 103 J A LF  
4.0 ± 0.1  
(.1±7 ± .004)  
Chip Arrays  
Type  
2.0 ± 0.±  
(.079 ± .020)  
Y = Convex  
13.0 ± 0.2  
(.±11 ± .008)  
Model  
17 = 1206 Package Size  
Resistance Code  
60  
(2.362)  
• <10 ohms: “R” represents decimal  
point (example: 4R7 = 4.7 ohms).  
• ≥10 ohms: First two digits are signifi-  
cant, third digit represents number of  
zeros to follow (example: 474 = 470k  
ohms)  
9.0 ± 0.3  
(.3±4 ± .012)  
21.0 ± 0.8  
(.827 ± .031)  
180  
(7.087)  
11.4 ± 1.0  
(.449 ± .040)  
(JA range: 10 ohms to 100K ohms;  
JB range: 10 ohms to 43K ohms)  
Resistance Tolerance  
MM  
(INCHES)  
DIMENSIONS:  
J = 5 ꢀ  
Resistors  
A = Common from terminal 5 to 10  
B = Common from terminal 1 to 6  
Terminations  
*RoHS Directive 2002/9±/EC Jan. 27, 2003 including annex and RoHS Recast 2011/6±/EU June 8, 2011.  
Specifications are subject to change without notice.  
LF = Tin-plated (RoHS compliant)  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device  
performance may vary over time.  
For Standard Values Used in Capacitors,  
Inductors, and Resistors, click here.  
Users should verify actual device performance in their specific applications.  
Model CAY17 - Bussed Resistor Array  
Soldering Profile for RoHS Compliant Chip Resistors and Arrays  
275  
<1>  
Maximum of 20 seconds between  
+255 °C and +260 °C  
260 °C peak  
<1>  
255 °C  
225  
175  
125  
75  
220 °C  
190 °C  
60 - 90  
seconds  
Ramp Down  
6 °C/second  
150 °C  
60 - 120 seconds  
10 seconds minimum  
Ramp Up  
3 °C/second maximum  
25  
0
50  
100  
150  
Time (seconds)  
200  
250  
300  
REV. 01/15  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  

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