CG0402MLU [BOURNS]
ChipGuard MLU Series - ESD Protectors Memory protection Automotive; ChipGuard MLU系列 - ESD保护器内存保护汽车
| 型号： | CG0402MLU |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | ChipGuard MLU Series - ESD Protectors Memory protection Automotive |
| 文件： | 总3页 (文件大小：255K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
■ RoHS compliant*
Applications
■ HDMI 1.4
■ ESD protection >25 kV
■ Low capacitance <0.05 pF
■ Low leakage current <5 nA
■ Digital Visual Interface (DVI)
■ USB 3.0 / USB OTG
■ Memory protection
■ SIM card ports
■ Automotive
ChipGuard® MLU Series - ESD Protectors
General Information
Device Symbol
®
The ChipGuard MLU Series has been specifically designed to protect sensitive electronic
components from electrostatic discharge damage. The MLU family has been designed to
protect equipment to IEC61000-4-2, Level 4 (±± kV Contact ꢀ ±15 kV Air Discharge) ESD
specifications targeted for high speed USB 3.0ꢀUSB OTG, HDMI 1.4, DVI or IEEE1394
applications.
V
®
The ChipGuard MLU Series has been manufactured to provide low 0.05 pF capacitance
and leakage currents less than 5 nA with excellent clamp qualities, making the family almost
transparent under normal working conditions.
Electrical Characteristics @ 25 °C (unless otherwise noted)
CG0402MLU / CG0603MLU (Note 3)
Parameter
Symbol
3.3x
3.3
05x
5
12x
12
24x
24
Unit
V
V
pF
nA
V
Typical Continuous Operating Voltage
Typical Clamping Voltage (Note 1)
Maximum Capacitance @ 1 VRMS 1 MHz
Maximum Leakage Current @ Max. VDC
Typical Trigger Voltage (Note 2)
Maximum ResponseTime
ESD Protection: Per IEC 61000-4-2
Min. Contact Discharge (>1000 Reps)
Min. Air Discharge (>1000 Reps)
V
V
C
I
V
R
DC
25
0.05
5
250
1
C
O
L
T
T
ns
±±
kV
kV
±15
Operating Temperature
Storage Temperature
T
T
-40 to +125
-55 to +150
˚C
˚C
OPR
STG
Notes: 1. Per IEC 61000-4-2, Level 4 ± kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 ± kV Contact Discharge. Measurement at maximum pulse voltage.
3. Part number suffix “x” can be E for 0603 size or G for 0402 size to indicate tape & reel quantity.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® MLU Series - ESD Protectors
Product Dimensions
Recommended Pad Layout
A
A
MM
(INCHES)
W
DIMENSIONS:
B
B
C
L
D
CG0402
Series
CG0603
Series
CG0402
Series
CG0603
Series
Dimension
Dim.
1.00 0.1ꢀ
1.60 0.ꢁ0
0.ꢀ1
0.76
L
A
(0.04 0.006ꢂ
(0.064 0.00ꢃꢂ
(0.0ꢁ0ꢂ
(0.030ꢂ
0.ꢀ0 0.10
0.ꢃ0 0.ꢁ0
0.61
1.0ꢁ
W
A
B
C
D
(0.0ꢁ 0.004ꢂ
(0.03ꢁ 0.00ꢃꢂ
(0.0ꢁ4ꢂ
(0.040ꢂ
0.36 0.0ꢀ
0.4ꢀ 0.10
0.ꢀ1
0.ꢀ0
(0.014 0.00ꢁꢂ
(0.01ꢃ 0.004ꢂ
(0.0ꢁ0ꢂ
(0.0ꢁ0ꢂ
0.ꢁꢀ 0.1ꢀ
0.30 0.ꢁ0
1.70
ꢁ.ꢀ4
B
(0.10 0.006ꢂ
(0.01ꢁ 0.00ꢃꢂ
(0.067ꢂ
(0.100ꢂ
Solder Reflow Recommendations
Preheat Stages 1-3
Soldering
Cooling
300
250
200
150
100
50
A
Stage 1 Preheat
Ambient to Preheating
Temperature
30 s to 60 s
B
C
D
Stage ꢁ Preheat
Stage 3 Preheat
Main Heating
140 °C to 160 °C
Preheat to ꢁ00 °C
ꢁ00 °C
ꢁ10 °C
ꢁꢁ0 °C
ꢁ30 °C
ꢁ40 °C
60 s to 1ꢁ0 s
ꢁ0 s to 40 s
60 s to 70 s
ꢀꢀ s to 6ꢀ s
ꢀ0 s to 60 s
40 s to ꢀ0 s
30 s to 40 s
0
E
Cooling
ꢁ00 °C to 100 °C
1 °C/s to 4 °C/s
110 sec. (min.)
120 sec. (min.)
30-70
sec.
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 1ꢀ0 to ꢁ00 um recommended.
Solder gun tip temperature should be kept below ꢁꢃ0 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® MLU Series - ESD Protectors
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 ± 0.30
(0.32 ± 0.012)
4.00 ± 0.10
(0.16 ± 0.004)
C
1.50 ± 0.10
62.0 ± 1.50
(2.48 ± 0.06)
(0.06 ± 0.004)
2.0 ± 0.50
(0.08 ± 0.02)
L
13.0 ± 0.50
(0.52 ± 0.02)
TOP
TAPE
G
D
21.0 ± 0.80
(0.84 ± 0.032)
180.8 ± 2.0
(7.12 ± 0.08)
3.50 ± 0.05
(0.14 ± 0.002)
W
NOTES: TAPE MATERIAL IS PAPER.
0.60 ± 0.05
(0.024 ± 0.002)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
TAPE THICKNESS IS
MM
(INCHES)
DIMENSIONS:
9.0 ± 0.50
(0.36 ± 0.02)
CG0402
CG0603
Series
Dimension
Series
1.75 ꢀ.ꢀ5
1.75 ꢀ.1ꢀ
C
(ꢀ.ꢀ4 ꢀ.ꢀꢀ02
(ꢀ.ꢀ4 ꢀ.ꢀꢀ42
0.ꢀꢀ ꢀ.ꢀ0
0.ꢀꢀ ꢀ.ꢀ5
D
L
(ꢀ.ꢀ8 ꢀ.ꢀꢀꢀ82
(ꢀ.ꢀ8 ꢀ.ꢀꢀ02
1.10 ꢀ.ꢀꢁ
1.8ꢀ ꢀ.0ꢀ
(ꢀ.ꢀ45 ꢀ.ꢀꢀ102
(ꢀ.ꢀ70 ꢀ.ꢀꢀ82
ꢀ.60 ꢀ.ꢀꢁ
ꢀ.9ꢀ ꢀ.0ꢀ
W
G
(ꢀ.ꢀ05 ꢀ.ꢀꢀ102
(ꢀ.ꢀꢁ6 ꢀ.ꢀꢀ82
0.ꢀ ꢀ.ꢀ5
4.ꢀ ꢀ.ꢀ5
(ꢀ.ꢀ8 ꢀ.ꢀꢀ02
(ꢀ.16 ꢀ.ꢀꢀ02
How to Order
CG 0n0n MLU - n.n x
®
ChipGuard
Product Designator
Package Option
ꢀ4ꢀ0 = ꢀ4ꢀ0 Package
ꢀ6ꢀꢁ = ꢀ6ꢀꢁ Package
Multilayer Series Designator
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
Operating Voltage**
ꢁ.ꢁ = ꢁ.ꢁ V
ꢀ5 = 5 V
10 = 10 V
04 = 04 V
Tape & Reel Packaging
E = 5,ꢀꢀꢀ pcs. per reel (ꢀ6ꢀꢁ Package2
G = 1ꢀ,ꢀꢀꢀ pcs. per reel (ꢀ4ꢀ0 Package2
** Only models lower than 1ꢀ volts require
decimal point.
REV. K 06/13
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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