CI160808_MDS [BOURNS]

Multilayer Chip Bead; 叠层片式磁珠
CI160808_MDS
型号: CI160808_MDS
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

Multilayer Chip Bead
叠层片式磁珠

文件: 总1页 (文件大小:301K)
下载:  下载PDF数据表文档文件

CI160808-10NJ

Multi-Layer Chip Inductors

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51 BOURNS

CI160808-10NJ

General Purpose Inductor, 0.01uH, 5%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

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0 BOURNS

CI160808-12NJ

Multi-Layer Chip Inductors

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23 BOURNS

CI160808-15NJ

Multi-Layer Chip Inductors

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63 BOURNS

CI160808-15NJ

General Purpose Inductor, 0.015uH, 5%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

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0 BOURNS

CI160808-18NJ

Multi-Layer Chip Inductors

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35 BOURNS

CI160808-1N0D

Multi-Layer Chip Inductors

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30 BOURNS

CI160808-1N0D

General Purpose Inductor, 0.001uH, 30%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

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0 BOURNS

CI160808-1N2D

Multi-Layer Chip Inductors

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29 BOURNS

CI160808-1N5D

Multi-Layer Chip Inductors

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42 BOURNS

CI160808-1N5D

General Purpose Inductor, 0.0015uH, 20%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

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0 BOURNS

CI160808-1N8D

Multi-Layer Chip Inductors

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19 BOURNS

CI160808-22NJ

Multi-Layer Chip Inductors

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57 BOURNS

CI160808-22NJ

General Purpose Inductor, 0.022uH, 5%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

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0 BOURNS

CI160808-27NJ

Multi-Layer Chip Inductors

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18 BOURNS