MF-PSMF110X [BOURNS]

MF-PSMF Series - PTC Resettable Fuses; MF- PSMF系列 - PTC自恢复保险丝
MF-PSMF110X
型号: MF-PSMF110X
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

MF-PSMF Series - PTC Resettable Fuses
MF- PSMF系列 - PTC自恢复保险丝

文件: 总3页 (文件大小:300K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Applications  
Compact design to save board space -  
USB port protection - USB 2.0, 3.0 & OTG  
HDMI 1.4 Source protection  
0805 footprint  
Small size results in very fast time to react  
to fault events  
Symmetrical design  
Low profile  
RoHS compliant* and halogen free**  
Agency recognition:  
PC motherboards - Plug and Play  
protection  
Mobile phones - Battery and port protection  
PDAs / digital cameras  
Game console port protection  
MF-PSMF Series - PTC Resettable Fuses  
Electrical Characteristics  
Tripped  
Power  
Dissipation  
Max. Time  
To Trip  
I
I
Resistance  
hold  
trip  
V max.  
I max.  
Amps  
Model  
Volts  
Amperes  
Ohms  
at 23 °C  
R
Amperes  
Seconds  
at 23 °C  
Watts  
at 23 °C  
at 23 °C  
at 23 °C  
R
1.0  
0.65  
Hoꢂd  
Trip  
0.30  
0.50  
0.75  
1.00  
1.50  
2.20  
Tp.  
0.5  
0.5  
0.5  
0.5  
0.6  
0.6  
Min.  
1Max.  
7.5  
3.5  
MF-PSMF010X  
MF-PSMF020X  
MF-PSMF035X  
MF-PSMF050X  
MF-PSMF075X  
MF-PSMF110X  
15  
9
6
6
6
40  
40  
40  
40  
40  
40  
0.10  
0.20  
0.35  
0.50  
0.75  
1.10  
0.5  
1.5  
8.00  
8.00  
8.00  
8.00  
8.00  
0.02  
0.10  
0.10  
0.20  
0.30  
0.250  
0.150  
0.090  
0.060  
1.200  
0.900  
0.350  
0.210  
6
Environmental Characteristics  
Operating Temperature......................................... -40 °C to +85 °C  
Maximum Device Surface Temperature  
in Tripped State .................................................... 125 °C  
Passive Aging....................................................... +85 °C, 1000 hours............................................... 5 ꢀ tꢁpicaꢂ resistance change  
Humiditꢁ Aging..................................................... +85 °C, 85 ꢀ R.H. 1000 hours............................. 5 ꢀ tꢁpicaꢂ resistance change  
Thermaꢂ Shock ..................................................... +85 °C to -40 °C, 20 times ................................... 10 ꢀ tꢁpicaꢂ resistance change  
Soꢂvent Resistance............................................... MIL-STD-202, Method 215................................... No change  
Vibration ............................................................... MIL-STD-883C, Method 2007.1,.......................... No change  
Condition A  
Test Procedures And Requirements For Model MF-PSMF Series  
Test  
Test Conditions  
Accept/Reject Criteria  
Visuaꢂ/Mech.......................................................... Verifꢁ dimensions and materiaꢂs........................... Per MF phꢁsicaꢂ description  
Resistance............................................................ In stiꢂꢂ air @ 23 °C.................................................. Rmin R R1max  
Time to Trip........................................................... At specified current, Vmax, 23 °C ........................ T max. time to trip (seconds)  
Hoꢂd Current......................................................... 30 min. at Ihoꢂd..................................................... No trip  
Trip Cꢁcꢂe Life....................................................... Vmax, Imax, 100 cꢁcꢂes........................................ No arcing or burning  
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning  
Soꢂderabiꢂitꢁ.......................................................... ANSI/J-STD-002................................................... 95 ꢀ min. coverage  
UL Fiꢂe Number .................................................... E174545  
http://www.uꢂ.com/ Foꢂꢂow ꢂink to Certifications, then UL Fiꢂe No., enter E174545  
Thermal Derating Chart - I  
(Amps)  
hold  
Ambient Operating Temperature  
Model  
-40 °C  
-20 °C  
0.13  
0.25  
0.44  
0.62  
0.90  
1.35  
0 °C  
0.12  
0.23  
0.39  
0.55  
0.79  
1.20  
23 °C  
0.10  
0.20  
0.35  
0.50  
0.75  
1.10  
40 °C  
0.09  
0.17  
0.30  
0.40  
0.63  
0.92  
50 °C  
0.08  
0.14  
0.27  
0.37  
0.57  
0.84  
60 °C  
0.07  
0.12  
0.24  
0.33  
0.53  
0.75  
70 °C  
0.06  
0.10  
0.20  
0.29  
0.42  
0.65  
85 °C  
0.05  
0.07  
0.14  
0.23  
0.35  
0.52  
MF-PSMF010X  
MF-PSMF020X  
MF-PSMF035X  
MF-PSMF050X  
MF-PSMF075X  
MF-PSMF110X  
0.15  
0.28  
0.47  
0.68  
1.00  
1.45  
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.  
**To be considered halogen free, each homogenous material can have a maximum concentration of 900 ppm of either bromine or chlorine.  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
Additional Applications  
Automotive electronic control modules  
MF-PSMF Series - PTC Resettable Fuses  
Product Dimensions  
A
B
C
D
Min.  
0.20  
Model  
Min.  
2.00  
Max.  
2.30  
Min.  
1.20  
Max.  
1.50  
Min.  
0.48  
Max.  
0.85  
MF-PSMF010X  
MF-PSMF020X  
MF-PSMF035X  
MF-PSMF050X  
MF-PSMF075X  
MF-PSMF110X  
(0.079)  
2.00  
(0.079)  
2.00  
(0.079)  
2.00  
(0.079)  
2.00  
(0.079)  
2.00  
(0.091)  
2.30  
(0.091)  
2.30  
(0.091)  
2.30  
(0.091)  
2.30  
(0.091)  
2.30  
(0.047)  
1.20  
(0.047)  
1.20  
(0.047)  
1.20  
(0.047)  
1.20  
(0.047)  
1.20  
(0.059)  
1.50  
(0.059)  
1.50  
(0.059)  
1.50  
(0.059)  
1.50  
(0.059)  
1.50  
(0.019)  
0.48  
(0.019)  
0.48  
(0.019)  
0.48  
(0.019)  
0.75  
(0.030)  
0.75  
(0.033)  
0.85  
(0.033)  
0.85  
(0.033)  
0.85  
(0.033)  
1.25  
(0.049)  
1.25  
(0.008)  
0.20  
(0.008)  
0.20  
(0.008)  
0.20  
(0.008)  
0.20  
(0.008)  
0.20  
(0.079)  
(0.091)  
(0.047)  
(0.059)  
(0.030)  
(0.049)  
(0.008)  
MM  
(INCHES)  
Packaging: 3000 pcs. per reel.  
DIMENSIONS:  
Top View  
Bottom View  
Side View  
Recommended Pad Layout  
Terminal material:  
Nickel/gold plated.  
A
C
Termination pad solderability:  
Standard Au finish:  
Meets ANSI/J-STD-002 Category 2.  
1.50 0.10  
(.059 .00ꢀ)  
B
4
Recommended Storage:  
40 °C max./70 % RH max.  
D
1.00 0.05  
1.20 0.10  
(.039 .002)  
(.0ꢀ7 .00ꢀ)  
Typical Time to Trip at 23 ˚C  
How to Order  
MF - PSMF 050 X - 2  
10  
MF-PSMF035X  
MF-PSMF050X  
MF-PSMF075X  
Multifuse® Product  
Designator  
MF-PSMF020X  
Series  
PSMF = 0805 Surface Mount  
Component  
MF-PSMF110X  
1
Hold Current, Ihold  
010-110 (0.10 - 1.10 Amps)  
Multifuse® freeXpansionDesign  
Packaging  
Packaged per EIA 481-1  
-2 = Tape and Reel  
MF-PSMF010X  
0.1  
Typical Part Marking  
Represents total content. Layout may vary.  
0.01  
PART IDENTIFICATION:  
MF-PSMF010X = 1  
MF-PSMF020X = 2  
MF-PSMF035X = 3  
MF-PSMF050X = ꢀ  
MF-PSMF075X = 5  
MF-PSMF110X = 6  
4
0.001  
0.1  
1
10  
100  
BIWEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL:  
WEEK 1 AND 2 = A  
WEEK 51 AND 52 = Z  
Current (Amps)  
The Time to Trip curves represent typical performance of a device in a simulated application  
environment. Actual performance in specific customer applications may differ from these values due  
to the influence of other variables.  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
MF-PSMF Series - PTC Resettable Fuses  
Solder Reflow Recommendations  
Preheating  
Soldering  
Cooling  
300  
250  
200  
150  
100  
50  
Notes:  
MF-NSMF models cannot be wave soldered. Please contact Bourns for  
hand soldering recommendations.  
If reflow temperatures exceed the recommended profile, devices may not  
meet the performance requirements.  
Compatible with Pb and Pb-free solder reflow profiles.  
Excess solder may cause a short circuit, especially during hand soldering.  
Please refer to the Multifuse® Polymer PTC Soldering Recommendation  
guidelines.  
0
160–220  
10–20  
120  
Time (seconds)  
MF-PSMF SERIES, REV. M, 05/11  
“freeXpansion Design” is a trademark of Bourns, Inc.  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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