MF-SMDF0502 [BOURNS]
RESISTOR, TEMPERATURE DEPENDENT, PTC RESETTABLE FUSE, SURFACE MOUNT, CHIP, 2018, ROHS COMPLIANT;
| 型号： | MF-SMDF0502 |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | RESISTOR, TEMPERATURE DEPENDENT, PTC RESETTABLE FUSE, SURFACE MOUNT, CHIP, 2018, ROHS COMPLIANT 过载保护 电阻器 |
| 文件： | 总4页 (文件大小：365K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
Applications
■ Very low profile
■ Power Over Ethernet (IEEE 802.3 af) port
protection
■ Automotive electronic control module
protection
■ Telecom equipment low voltage
protection
■ Very fast tripping time
■ High voltage
■ RoHS compliant* and halogen free**
■ Symmetrical
■ 2018 footprint
■ Agency recognition:
MF-SMDF Series - PTC Resettable Fuses
Electrical Characteristics
Tripped
Power
Dissipation
Max. Time
To Trip
I
I
Resistance
hold
trip
V max.
I max.
Amps
Model
Volts
Amperes
Ohms
at 23 °C
R
Amperes
Seconds
at 23 °C
Watts
at 23 °C
at 23 °C
at 23 °C
R
Hoꢂd
Trip
1.20
3.00
4.00
Tꢁp.
0.9
1.1
1.1
Min.
1Max.
1.0
0.17
MF-SMDF050
MF-SMDF150***
MF-SMDF200****
60
15
10
10
40
40
0.55
1.5
0.200
0.05
0.03
2.5
8.0
8.0
3.0
0.8
2.40
2.0
0.100
*** UL approved, TÜV pending.
****Agencꢁ approvaꢂ pending.
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................. 125 °C
Passive Aging....................................................... +85 °C, 1000 hours............................................... 5 ꢀ tꢁpicaꢂ resistance change
Humiditꢁ Aging..................................................... +85 °C, 85 ꢀ R.H. 1000 hours............................. 5 ꢀ tꢁpicaꢂ resistance change
Thermaꢂ Shock ..................................................... +85 °C to -40 °C, 20 times ................................... 10 ꢀ tꢁpicaꢂ resistance change
Soꢂvent Resistance............................................... MIL-STD-202, Method 215................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,.......................... No change
.............................................................................. Condition A
Test Procedures And Requirements For Model MF-SMDF Series
Test
Test Conditions
Accept/Reject Criteria
Visuaꢂ/Mech.......................................................... Verifꢁ dimensions and materiaꢂs........................... Per MF phꢁsicaꢂ description
Resistance............................................................ In stiꢂꢂ air @ 23 °C.................................................. Rmin ≤ R ≤ R1max
Time to Trip........................................................... At specified current, Vmax, 23 °C ........................ T ≤ max. time to trip (seconds)
Hoꢂd Current......................................................... 30 min. at Ihoꢂd..................................................... No trip
Trip Cꢁcꢂe Life....................................................... Vmax, Imax, 100 cꢁcꢂes........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Soꢂderabiꢂitꢁ.......................................................... ANSI/J-STD-002................................................... 95 ꢀ min. coverage
UL Fiꢂe Number .................................................... E174545
http://www.uꢂ.com/ Foꢂꢂow ꢂink to Certifications, then UL Fiꢂe No., enter E174545
CSA Fiꢂe Number.................................................. CA110338
http://directories.csa-internationaꢂ.org/ Under “Certification Record” and “Fiꢂe Number”
enter 110338-0-000
TÜV Certificate Number ....................................... R 02057213
http://www.tuvdotcom.com/ Foꢂꢂow ꢂink to “other certificates”, enter Fiꢂe No. 2057213
Thermal Derating Chart - I
/I
(Amps)
hold trip
Ambient Operating Temperature
23 °C 40 °C 50 °C
Model
-40 °C
-20 °C
0 °C
60 °C
70 °C
85 °C
MF-SMDF050
MF-SMDF150
MF-SMDF200
0.87 / 1.90 0.77 / 1.68 0.67 / 1.46 0.55 / 1.20 0.46 / 1.00 0.41 / 0.89 0.36 / 0.79 0.31 / 0.68 0.23 / 0.50
2.38 / 4.76 2.10 / 4.20 1.82 / 3.64 1.50 / 3.00 1.27 / 2.54 1.13 / 2.26 0.99 / 1.98 0.85 / 1.70 0.64 / 1.28
2.95 / 5.90 2.65 / 5.30 2.35 / 4.70 2.00 / 4.00 1.74 / 3.48 1.59 / 3.18 1.44 / 2.88 1.29 / 2.58 1.06 / 2.12
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
**To be considered halogen free, each homogenous material can have a maximum concentration of 900 ppm of either bromine or chlorine.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-SMDF Series - PTC Resettable Fuses
Product Dimensions
A
B
C
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
Model
Min.
4.72
(0.186)
4.72
(0.186)
4.72
Max.
5.44
(0.214)
5.44
(0.214)
5.44
Min.
4.22
(0.166)
4.22
(0.166)
4.22
Max.
4.93
(0.194)
4.93
(0.194)
4.93
Min.
0.79
(0.031)
0.55
(0.022)
0.55
Max.
1.09
(0.043)
0.85
(0.033)
0.85
MF-SMDF050
MF-SMDF150
MF-SMDF200
(0.186)
(0.214)
(0.166)
(0.194)
(0.022)
(0.033)
(0.012)
MM
(INCHES)
Packaging: 6000 pcs. per reel.
DIMENSIONS:
Terminal material:
Top and Bottom View
Side View
Recommended Pad Layout
Electroless Ni under immersion Au
ꢁ.5 ꢀ.ꢀ5
(.ꢀ59 .ꢀꢀ0)
ꢁ.5 ꢀ.ꢀ5
(.ꢀ59 .ꢀꢀ0)
A
C
Termination pad solderability:
Standard Au finish:
4.6 ꢀ.ꢁ
(.ꢁ8ꢁ .ꢀꢀ4)
Meets ANSI/J-STD-002 Category 2.
B
Recommended Storage:
3.4 ꢀ.ꢁ
(.ꢁ34 .ꢀꢀ4)
40 °C max./70 % RH max.
D
Typical Time to Trip at 23 ˚C
ꢁꢀꢀ
The Time to Trip curves represent typical
performance of a device in a simulated
application environment. Actual perfor-
mance in specific customer applications
may differ from these values due
ꢁꢀ
to the influence of other variables.
MF-SMDFꢀ5ꢀ
ꢁ
MF-SMDF0ꢀꢀ
ꢀ.ꢁ
ꢀ.ꢀꢁ
MF-SMDFꢁ5ꢀ
ꢀ.ꢀꢀꢁ
ꢁ
ꢁꢀ
ꢁꢀꢀ
ꢀ.ꢁ
Fault Current (Amps)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-SMDF Series - PTC Resettable Fuses
Solder Reflow Recommendations
How to Order
MF - SMDF 050 - 2
Preheating
Soldering
Cooling
300
250
200
150
100
50
Multifuse® Product
Designator
Series
SMDF = 2018 Surface Mount
Component
Hold Current, Ihold
050, 150, 200 (0.50 - 2.00 Amps)
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
Typical Part Marking
0
Represents total content. Layout may vary.
BI-WEEKLY DATE CODE:
WEEKS 49-50 = Y
160–220
10–20
120
Time (seconds)
YEAR CODE:
5 = 2005
Notes:
PART
•
•
MF-SMDF models cannot be wave soldered. Please contact Bourns for hand soldering recommendations.
IDENTIFICATION:
50 = MF-SMDF050
15 = MF-SMDF150
20 = MF-SMDF200
If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
•
•
Compatible with Pb and Pb-free solder reflow profiles.
Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse®
Polymer PTC Soldering Recommendation guidelines.
MF-SMDF SERIES, REV. R, 02/10
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-SMDF Series Tape and Reel Specifications
MF-SMDF Series
per EIA 481-2
Tape Dimensions
16.0 0.ꢀ
(0.6ꢀ0 0.012)
W
4.0 0.1
(0.157 0.004)
P
0
8.0 0.1
(0.ꢀ15 0.004)
P
1
2.0 0.1
(0.079 0.004)
P
2
5.1 0.15
(0.201 0.006)
A
0
5.6 0.2ꢀ
(0.220 0.009)
B
0
12.1
(0.476)
B
max.
min.
1
1.5 + 0.1/-0.0
(0.059 + 0.004/-0)
7.5 0.10
(0.295 0.004)
1.75 0.10
D
F
E
0
(0.069 0.004)
1
2
14.25
(0.561)
E
0.6
(0.024)
0.1
T max.
max.
T
(0.004)
1
1.0 0.15
(0.0ꢀ9 0.015)
K
0
ꢀ90
(15.ꢀ5)
160
(6.ꢀ0)
Leader min.
Trailer min.
Reel Dimensions
A max.
ꢀꢀ1
(1ꢀ.0ꢀ)
50
(1.97)
N min.
16.4 + 2.0/ -0.0
(0.646 + 0.079/-0.0)
W
1
22.4
(0.882)
W
max.
2
MM
UNIT =
P
0
(INCHES)
T
D
P
2
E
0
1
W (MEASURED
2
AT HUB)
COVER
TAPE
F
A
N(HUB DIA.)
E
2
W
B
1
B
0
W
(MEASURED
AT HUB)
1
P
1
K
T
0
1
A
0
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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