MLC_09 [BOURNS]
ESD Protectors; ESD保护器
| 型号： | MLC_09 |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | ESD Protectors |
| 文件： | 总3页 (文件大小：210K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
■ RoHS compliant*
Applications
■ HDMI 1.4
■ ESD protection >25 kV
■ Low capacitance <0.5 pF
■ Low leakage current <50 nA
■ Digital Visual Interface (DVI)
■ USB 3.0 / USB OTG
■ Memory protection
■ SIM card ports
ChipGuard® MLC Series - ESD Protectors
General Information
Device Symbol
The ChipGuard® MLC Series has been specifically designed to protect sensitive electronic
components from electrostatic discharge damage. The MLC family has been designed to
protect equipment to IEC61000-4-2, Level 4 (±± kV Contact ꢀ ±15 kV Air Discharge) ESD
specifications targeted for high speed USB 3.0ꢀUSB OTG, HDMI 1.4, DVI or IEEE1394
applications.
V
The ChipGuard® MLC Series has been manufactured to provide low 0.5 pF capacitance and
leakage currents less than 50 nA with excellent clamp qualities, making the family almost
transparent under normal working conditions.
Electrical Characteristics @ 25 °C (unless otherwise noted)
CG0402MLC-
CG0603MLC-
Parameter
Symbol
Unit
3.3LG 05LG 12LG 3.3LGA 05LGA 12LGA 3.3LE 05E 05LE 12E
12LE 3.3LEA
05LEA 12LEA
Typical Continuous
Operating Voltage
Typical Clamping
Voltage (Note 1)
Maximum Capacitance
@ 1 VRMS 1 MHz
Maximum Leakage
Current @ Max. VDC
Typical Trigger
Voltage (Note 2)
Maximum Response
Time
V
3.3
25
5
12
25
3.3
25
5
12
25
3.3
5
5
12
30
12
25
3.3
25
5
12
25
V
V
DC
V
25
25
25 20 25
0.5
25
C
C
pF
nA
V
O
I
5
5
5
5
5
5
5
50
5
50
5
5
5
5
L
V
250 250 250
250
250
250 250 150 250 150 250
1
250
250
250
T
R
ns
T
ESD Protection:
Per IEC 61000-4-2
Level 4
Min. Contact Discharge
Min. Air Discharge
Min. Air Discharge
kV
kV
kV
±±
±15 (Note 3)
±25
Operating Temperature
Storage Temperature
T
-40 to +±5
-40 to +125
-40 to +±5
-40 to +125
˚C
˚C
OPR
T
-55 to +150
STG
Notes: 1. Per IEC 61000-4-2, Level 4 ± kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 ± kV Contact Discharge. Measurement at maximum pulse voltage.
3. IEC 61000-4-2 ESD Performance for CG0603MLC-05E and CG0603MLC-12E devices will meet minimum 100 reps.
Some shifting in characteristics may occur when tested over several hundred ESD pulses. All other part numbers listed will meet
IEC 61000-4-2 ESD Performance with minimum 1000 reps without degradation in performance.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
ChipGuard® MLC Series - ESD Protectors
Product Dimensions
Recommended Pad Layout
A
A
W
MM
(INCHES)
DIMENSIONS:
B
L
B
C
D
CG0402
Series
CG0603
Series
CG0402
Series
CG0603
Series
Dimension
Dim.
1.00 0.1ꢀ
(0.04 0.006ꢂ
1.60 0.ꢁ0
(0.064 0.00ꢃꢂ
0.ꢀ1
(0.0ꢁ0ꢂ
0.76
(0.030ꢂ
L
A
0.ꢀ0 0.10
(0.0ꢁ 0.004ꢂ
0.ꢃ0 0.ꢁ0
(0.03ꢁ 0.00ꢃꢂ
0.61
(0.0ꢁ4ꢂ
1.0ꢁ
(0.040ꢂ
W
A
B
C
D
0.36 0.0ꢀ
(0.014 0.00ꢁꢂ
0.4ꢀ 0.10
(0.01ꢃ 0.004ꢂ
0.ꢀ1
(0.0ꢁ0ꢂ
0.ꢀ0
(0.0ꢁ0ꢂ
0.ꢁꢀ 0.1ꢀ
(0.10 0.006ꢂ
0.30 0.ꢁ0
(0.01ꢁ 0.00ꢃꢂ
1.70
(0.067ꢂ
ꢁ.ꢀ4
(0.100ꢂ
B
Solder Reflow Recommendations
Preheat Stages 1-3
Soldering
Cooling
300
250
200
150
100
50
A
Stage 1 Preheat
Stage ꢁ Preheat
Ambient to Preheating
Temperature
30 s to 60 s
B
C
D
140 °C to 160 °C
Preheat to ꢁ00 °C
60 s to 1ꢁ0 s
ꢁ0 s to 40 s
Stage 3 Preheat
Main Heating
ꢁ00 °C
ꢁ10 °C
ꢁꢁ0 °C
ꢁ30 °C
ꢁ40 °C
60 s to 70 s
ꢀꢀ s to 6ꢀ s
ꢀ0 s to 60 s
40 s to ꢀ0 s
30 s to 40 s
0
E
Cooling
ꢁ00 °C to 100 °C
1 °C/s to 4 °C/s
110 sec. (min.)
120 sec. (min.)
30-70
sec.
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 1ꢀ0 to ꢁ00 um recommended.
Solder gun tip temperature should be kept below ꢁꢃ0 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
ChipGuard® MLC Series - ESD Protectors
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 ± 0.30
(0.32 ± 0.012)
4.00 ± 0.10
(0.16 ± 0.004)
C
1.50 ± 0.10
62.0 ± 1.50
(2.48 ± 0.06)
(0.06 ± 0.004)
2.0 ± 0.50
(0.08 ± 0.02)
L
13.0 ± 0.50
(0.52 ± 0.02)
TOP
TAPE
G
D
21.0 ± 0.80
(0.84 ± 0.032)
180.8 ± 2.0
(7.12 ± 0.08)
3.50 ± 0.05
(0.14 ± 0.002)
W
NOTES: TAPE MATERIAL IS PAPER.
0.60 ± 0.05
(0.024 ± 0.002)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
MM
(INCHES)
TAPE THICKNESS IS
DIMENSIONS:
9.0 ± 0.50
(0.36 ± 0.02)
How to Order
CG 0402 MLC - 12 L G A
ChipGuard®
Product Designator
CG0402
Series
CG0603
Series
Dimension
1.75 0.05
(0.04 0.002)
1.75 0.10
(0.04 0.004)
C
Package Option
2.00 0.02
(0.08 0.0008)
2.00 0.05
(0.08 0.002)
D
L
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
1.12 0.03
(0.045 0.0012)
1.80 0.20
(0.072 0.008)
Operating Voltage
3.3 = 3.3 V
05 = 5 V
0.62 0.03
(0.025 0.0012)
0.90 0.20
(0.036 0.008)
W
G
12 = 12 V
Low Leakage Current Option
L = Low Leakage Current
Blank = Standard Product
2.0 0.05
(0.08 0.002)
4.0 0.05
(0.16 0.002)
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
Operating Temperature Option
A = Higher +125 °C Operating Temperature
Blank = Standard Product
Asia-Pacific: TEL +886-2 25624117 • FAX +886-2 25624116
Europe: TEL +41-41 7685555 • FAX +41-41 7685510
The Americas: TEL +1-951 781-5500 • FAX +1-951 781-5700
www.bourns.com
REV. N 11/09
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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