PM1008-R22K [BOURNS]
General Purpose Inductor, 0.22uH, 10%, 1 Element, Ceramic-Core, SMD, 1111, CHIP;
| 型号： | PM1008-R22K |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | General Purpose Inductor, 0.22uH, 10%, 1 Element, Ceramic-Core, SMD, 1111, CHIP 电感器 |
| 文件： | 总1页 (文件大小：291K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
Applications
■ Mobile phones
■ Cellular phones
■ CTV, VCR, HIC, FDD
■ Formerly
model
■ 1008 size
■ Available in E12 series
■ High Q up to 60 typ.
■ High operating temperature of 125 °C
■ RoHS compliant*
PM1008 Series - High Q Chip Inductors
Electrical Specifications
General Specifications
Temperature Rise
Inductance
Test Frequency (MHz)
SRF
Min.
I rms
Max.
(mA)
.................40 ˚C max. at rated current
Operating Temperature
Q
RDC
Bourns Part No.
PM1008-10NM-RC
PM1008-12NM-RC
PM1008-15NM-RC
PM1008-18NM-RC
PM1008-22NM-RC
PM1008-27NM-RC
PM1008-33NM-RC
PM1008-39NM-RC
PM1008-47NM-RC
PM1008-56NK-RC
PM1008-68NK-RC
PM1008-82NK-RC
PM1008-R10K-RC
PM1008-R12K-RC
PM1008-R15K-RC
PM1008-R18K-RC
PM1008-R22K-RC
PM1008-R27K-RC
PM1008-R33K-RC
PM1008-R39K-RC
PM1008-R47K-RC
PM1008-R56K-RC
PM1008-R68K-RC
PM1008-R82K-RC
PM1008-1R0K-RC
PM1008-1R2K-RC
PM1008-1R5K-RC
PM1008-1R8K-RC
PM1008-2R2K-RC
PM1008-2R7K-RC
PM1008-3R3K-RC
PM1008-3R9K-RC
PM1008-4R7K-RC
PM1008-5R6K-RC
PM1008-6R8K-RC
PM1008-8R2K-RC
PM1008-100K-RC
nH
10
Tol. % Min.
L
Q
(MHz)
(Ω)
................................-40 °C to +125 °C
Storage Temperature
20
20
20
20
20
20
20
20
20
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
50
50
40
50
55
55
60
60
60
60
60
60
60
50
45
45
45
45
45
45
45
45
45
45
25
25
25
25
25
22
22
20
18
18
18
18
18
100
100
100
100
100
100
100
100
100
100
100
100
100
25
500
500
350
350
350
350
350
350
350
350
350
350
350
100
100
100
100
100
100
100
100
100
100
100
50
4100
3300
2500
2500
2400
1600
1600
1500
1500
1300
1300
1000
1000
950
850
750
700
600
570
500
450
415
375
350
290
250
200
160
160
70
0.08
0.08
0.08
0.10
0.10
0.10
0.10
0.10
0.10
0.12
0.15
0.18
0.18
0.20
0.22
0.33
0.45
0.75
0.90
1.20
1.19
1.33
1.47
1.61
1.75
2.00
2.30
2.60
2.80
1.70
1.90
2.10
2.30
4.90
6.00
8.00
4.20
600
600
500
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
500
400
470
400
400
360
330
280
280
270
250
195
185
180
175
180
150
100
200
12
................................-40 °C to +125 °C
Reflow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
15
18
22
...............................260 ˚C, 5 seconds
27
33
Materials
Core Material
39
47
-10NM thru -R82K..................Ceramic
-1R0K thru -100K ......................Ferrite
Wire ......Enamelled Copper (1W1E180)
Terminal...........................Mo/Mn+Ni+Au
Packaging..................2,000 pcs per reel
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
10000
25
Product Dimensions
25
25
1.6 ± 0.2
(.062 ± .008)
(.020)
0.5
25
25
25
25
25
25
25
2.50 ± 0.2
(.098 ± .008)
25
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
2.5
7.9
7.9
2.0 ± 0.2
(.079 ± .008)
7.9
7.9
7.9
7.9
55
0.5
(.020)
0.5
(.020)
7.9
48
7.9
43
7.9
40
7.9
25
Recommended Layout
7.9
25
7.9
40
0.65
REF.
0.65
(.026)
REF.
REF.
(.026)
Packaging Specifications
2.0 0.5
(.079 .020)
178.0
THICKNESS
12.5
(.492)
(7.00)
DIA.
0.10
(.004)
MAX.
2.3
(.091)
1.20
REF.
(.047)
13.0 0.5
(.512 .020)
DIA.
EMBOSSED
CAVITY
21.0 0.8
(.827 .031)
MM
(INCHES)
DIMENSIONS:
50.0
(1.969)
EMBOSSED
CARRIER
13.0 0.5
(.512 .020)
DIA.
8.0
(.315)
10.0
(.393)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
REV. 05/11
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