SF-0603FP063 [BOURNS]
Fast Acting Precision Surface Mount Fuses;
| 型号： | SF-0603FP063 |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | Fast Acting Precision Surface Mount Fuses |
| 文件： | 总4页 (文件大小：621K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SinglFuse™ꢀSF-0603FPꢀSeriesꢀFeatures
nꢀ Fastꢀactingꢀprecisionꢀthinꢀfilmꢀchipꢀfuseꢀforꢀꢀ
ꢀ
overcurrentꢀprotection
nꢀ 1608ꢀ(EIAꢀ0603)ꢀminiatureꢀfootprint
nꢀ Surfaceꢀmountꢀpackagingꢀforꢀautomatedꢀꢀ
ꢀ
assembly
nꢀ ULꢀlistedꢀ(ULꢀ248-14)
nꢀ RoHSꢀcompliant*ꢀandꢀhalogenꢀfree**
SF-0603FPꢀSeriesꢀ-ꢀFastꢀActingꢀPrecisionꢀSurfaceꢀMountꢀFuses
Electrical Characteristics
Resistance
Rated Current
Typical
Model
Fusing Time
Tolerance ±25 % Rated Voltage Breaking Capacity
(Amps)
I2t (A2s) ****
(mΩ) ***
DC 50 V
50 A
SF-0603FP050
0.50
260
DC 50 V
DC 32 V
0.088
SF-0603FP063
SF-0603FP080
SF-0603FP100
SF-0603FP125
SF-0603FP150
SF-0603FP160
SF-0603FP200
SF-0603FP250
SF-0603FP300
SF-0603FP315
SF-0603FP400
SF-0603FP500
0.63
0.80
1.00
1.25
1.50
1.60
2.00
2.50
3.00
3.15
4.00
5.00
218
132
84.5
63
50.5
46
32
25.5
20
0.0125
0.0206
0.0211
0.0472
0.0623
0.0817
0.1176
0.1807
0.3177
0.3615
0.5348
0.7726
Open within 5 sec.
at 200 % rated
current
DC 32 V
50 A
19
13
10
*** Resistance value measured with less than 10 % of rated current. Tolerance ±25 %.
2
****Typical I t value measured at 10x rated current.
Reliability Testing
Parameter
Requirement
Test Method
Carrying Capacity..................................... No fusing....................................................Rated current, 4 hours
Fusing Time.............................................. Within 5 seconds........................................200 % of its rated current
Interrupting Ability..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test............................................. No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm,1time, 30 seconds
Resistance to Solder Heat........................ ±20 %.........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability.............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise..................................... <75 ° C.......................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 %.........................................................105 °C ±5 °C,1000 hours
Resistance to Solvent............................... No evident damage on protective..............23 °C ±5 °C of isopropyl alcohol, 90 seconds
coating and marking
Residual Resistance................................. 10k ohms or more......................................Measure DC resistance after fusing
Thermal Shock ......................................... DR < 10 %..................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
UL File Number .........................................E198545
ꢀ
http://www.ul.com/ꢀFollowꢀlinkꢀtoꢀOnlineꢀCertificatesꢀDirectory,ꢀthenꢀenterꢀULꢀFileꢀNo.ꢀE198545,
or click here
Environmental Characteristics
Operating Temperature..................................................................................-20 °C to +105 °C
Storage Conditions
Asia-Pacific:
Tel: +886-2 2562-4117
Temperature ................................................................................................+5 °C to +35 °C
Humidity...........................................................................................................40 % to 75 %
Shelf Life........................................................................... 2 years from manufacturing date
Moisture Sensitivity Level........................................................................................................1
ESDꢀClassificationꢀ(HBM)..............................................................................................Class 6
Email: asiacus@bourns.com
Europe:
Tel: +36 88 520 390
Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500
Email: americus@bourns.com
www.bourns.com
*ꢀꢀRoHSꢀDirectiveꢀ2015/863,ꢀMarꢀ31,ꢀ2015ꢀandꢀAnnex.ꢀ
**Bournsꢀconsidersꢀaꢀproductꢀtoꢀbeꢀ“halogenꢀfree”ꢀifꢀ(a)ꢀtheꢀBromineꢀ(Br)ꢀcontentꢀisꢀ900ꢀppmꢀorꢀless;ꢀꢀ
ꢀꢀꢀꢀ(b)ꢀtheꢀChlorineꢀ(Cl)ꢀcontentꢀisꢀ900ꢀppmꢀorꢀless;ꢀandꢀ(c)ꢀtheꢀtotalꢀBromineꢀ(Br)ꢀandꢀChlorineꢀ(Cl)ꢀcontentꢀisꢀ1500ꢀppmꢀorꢀless.
“SinglFuse”ꢀisꢀaꢀtrademarkꢀofꢀBourns,ꢀInc.ꢀ
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.
SinglFuse™ꢀSF-0603FPꢀSeriesꢀApplications
nꢀ Portableꢀmemory
nꢀ LCDꢀmonitors
nꢀ Diskꢀdrives
nꢀ PDAs
nꢀ Cellꢀphones
nꢀ Rechargeableꢀbatteryꢀpacks
nꢀ Batteryꢀchargers
nꢀ Setꢀtopꢀboxes
nꢀ Digitalꢀcameras
nꢀ DVDs
nꢀ Industrialꢀcontrollers
ꢀ
SF-0603FPꢀSeriesꢀ-ꢀFastꢀActingꢀPrecisionꢀSurfaceꢀMountꢀFuses
Solder Reflow Recommendations
250
Peak: 250 +0/-5 °C
230 °C or higher
200
150
100
PRE-HEATING ZONE
180 °C
150 °C
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 10 seconds
90 30 Seconds
30 10 Seconds
SOLDERING ZONE
50
HEATING TIME
Product Dimensions
Recommended Pad Layout
1.6 ꢀ.1
(.ꢀ63 .ꢀꢀ04
ꢀ.7 to ꢀ.9
(.ꢀꢁꢂ to .ꢀ354
ꢀ.05 ꢀ.1
(.ꢀ1ꢂ .ꢀꢀ04
ꢀ.ꢂ ꢀ.1
(.ꢀ31 .ꢀꢀ04
ꢀ.ꢂ to 1.ꢀ
(.ꢀ31 to .ꢀ394
ꢀ.35 ꢀ.ꢁ
(.ꢀ10 .ꢀꢀꢂ4
ꢀ.35 ꢀ.ꢁ
(.ꢀ10 .ꢀꢀꢂ4
ꢀ.3 ꢀ.ꢁ
(.ꢀ1ꢁ .ꢀꢀꢂ4
ꢀ.3 ꢀ.ꢁ
(.ꢀ1ꢁ .ꢀꢀꢂ4
ꢁ.ꢀ to ꢁ.ꢁ
(.ꢀ79 to .ꢀꢂ74
ꢀ
MM
(INCHES)
DIMENSIONS:
ꢀ
PACKAGING: 5,000 pcs./reel
Thermal Derating Curve
Construction & Material Content
120
OVERCOAT
110
100
90
Sn PLATING
FUSE ELEMENT
CERAMIC SUBSTRATE
Cu / Ni PLATING
80
-20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.
ꢀ
SF-0603FPꢀSeriesꢀ-ꢀFastꢀActingꢀPrecisionꢀSurfaceꢀMountꢀFuses
Average Time Current Curves
Minimum I2T V Clear Time Curves
1.50 A
1.25 A
5.00 A
1.60 A
2.00 A
100
4.00 A
3.15 A
3.00 A
2.50 A
2.00 A
1.60 A
2.50 A
1.00 A
3.00 A
3.15 A
4.00 A
0.80 A
0.63 A
0.50 A
5.00 A
100
10
1.50 A
1.25 A
10
1
1.00 A
0.80 A
0.63 A
0.50 A
1
0.1
0.1
0.01
0.01
0.001
0.001
0.001
0.01
0.1
1
0.1
1
10
100
CURRENT (A)
CLEARING TIME (S)
Typical Part Marking
How to Order
Represents total content. Layout may vary.
SF - 0603 FP 050 - 2
SinglFuse™
Product Designator
SMD Footprint
1608 (EIA 0603) size
Fuse Blow Type
RATED CURRENT (A)
FP = Fast acting precision
F = 0.50
I = 0.63
K = 0.80
L = 1.00
M = 1.25
P = 1.50
N = 1.60
S = 2.00
T = 2.50
3 = 3.00
U = 3.15
W = 4.00
Y = 5.00
Rated Current
050-500 (500 mA - 5.00 A)
Packaging Type
- 2 = Tape & Reel (5,000 pcs./reel)
REV. B 09/17
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.
ꢀ SF-0603FPꢀSeriesꢀTapeꢀandꢀReelꢀSpecifications
SF-0603FP Series
per EIA 481-2
Tape Dimensions
8.0 0.ꢀ
(.315 .008ꢁ
W
4.0 0.1
(.157 .004ꢁ
P
0
4.0 0.1
(.157 .004ꢁ
P
1
ꢀ.0 0.05
(.079 .00ꢀꢁ
P
2
1.1 0.1
(.043 .004ꢁ
A
B
F
E
1.9 0.1
(.075 .004ꢁ
3.5 0.05
(.138 .00ꢀꢁ
1.75 0.1
(.069 .004ꢁ
1.5 + 0.1/-0
(.059 + .004/-0ꢁ
D
0
0.64 0.1
(.0ꢀ5 .004ꢁ
T
Reel Dimensions
180 +0/-3.0
(7.087 +0/-.118ꢁ
A
60.0
(ꢀ.36ꢀꢁ
B Min.
13.0 1.0
(.51ꢀ .039ꢁ
C
W
T
9.0 1.0
(.354 .039ꢁ
11.4 ꢀ.0
(.449 .079ꢁ
MM
(INCHESꢁ
DIMENSIONS:
T
W
D
P
O
E
O
BOTTOM
TAPE
A
DIA.
TOP
TAPE
C DIA.
B
B
DIA.
F
W
RESISTOR
TAPE
T
P
P
2
1
A
PAPER
TAPE
DIRECTION OF UNREELING
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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