SRF2012-300YA [BOURNS]
Ferrite Chip, HALOGEN FREE AND ROHS COMPLIANT PACKAGE-4;
| 型号： | SRF2012-300YA |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | Ferrite Chip, HALOGEN FREE AND ROHS COMPLIANT PACKAGE-4 |
| 文件： | 总2页 (文件大小：374K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
Applications
■ High impedance value
■ Current rating up to 450 mA
■ RoHS compliant*
■ Noise suppression
■ Personal computers
■ Display panels
SRF2012 Series - Common Mode Chip Inductors
Electrical Specifications
General Specifications
Reflow soldering.....230 °C; 50 sec max.
Operating Temperature ..-55 °C to +125 °C
(Temperature rise included)
Storage Temperature..-55 °C to +125 °C
Resistance to Soldering Heat
............................260 °C, 10 sec. max.
Impedance
@ 100 MHz
Rated Withstanding Insulation
DCR
Max.
(Ω)
IDC
Max.
(mA)
Voltage
(DC)
Voltage
(DC)
Resistance
Bourns Part No.
SRF2012-300Y
SRF2012-670Y
SRF2012-900Y
SRF2012-121Y
SRF2012-161Y
SRF2012-181Y
SRF2012-201Y
SRF2012-221Y
SRF2012-261Y
SRF2012-301Y
SRF2012-361Y
SRF2012-371Y
SRF2012-501Y
SRF2012-671Y
SRF2012-901Y
(Ω)
Tolerance (%)
(MΩ)
30
67
90
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
0.20
0.25
0.35
0.30
0.40
0.35
0.35
0.35
0.40
0.40
0.45
0.45
0.55
0.60
0.60
450
400
330
370
300
330
330
310
300
290
280
280
170
140
80
Materials
120
160
180
200
220
260
300
360
370
500
670
900
Core...............................................Ferrite
Wire.............................Enameled copper
Terminal.....................................Ag/Ni/Sn
Packaging...................2000 pcs. per reel
Product Dimensions
2.05 0.2
(.081 .008)
1.25 0.2
(.049 .008)
Impedance vs. Frequency
1
4
2
3
Common Mode
Normal Mode
CH1
Z
T & B 3.5 kΩ, 1 Ω
0.40
(.016)
371
TYP.
1000
+
IP
121
670
100
0.40
(.016)
TYP.
0.45
(.018)
TYP.
0.45
(.018)
TYP.
181
300
371
261
900
261
181
10
1
161
121
1.25 0.2
(.049 .008)
900
670
161
300
0.1
1
0
100
1000
Common Mode
Normal Mode
Recommended Layout
(f)
1 MHz 3 MHz 10 MHz 30 MHz 100 MHz 300 MHz 1 GHz 1 MHz 3 MHz 10 MHz 30 MHz 100 MHz 300 MHz 1 GHz
Z
0.35
(.014)
REF.
300
670
900
121
161
171
261
371
0.64
1.45
1.04
2.64
1.79
1.94
5.99
14.34
31.33
70.17
90.46
53.67
93.89 0.200 0.240 0.470 1.180
3.490
3.830
4.150
4.710
5.290
5.050
5.770
5.760
9.850 34.370
10.560 34.260
11.260 38.760
13.030 43.460
14.560 53.660
13.770 48.810
15.820 62.080
15.600 72.730
4.42 13.62 32.45
3.09 10.14 28.96
117.65 201.20 0.250 0.290 0.550 1.340
254.50 491.35 0.280 0.330 0.610 1.520
7.96 23.80 56.67 126.11 218.67 417.23 0.330 0.380 0.670 1.640
5.35 17.50 49.70 153.36 327.38 574.77 0.390 0.440 0.760 1.850
0.50
(.020)
REF.
0.35
(.014)
REF.
3.87 11.68 35.09 82.74 180.25 314.98 587.53 0.400 0.450 0.750 1.800
5.33 15.85 46.54 109.83 263.01 479.42 895.05 0.450 0.500 0.850 2.040
4.16 12.42 40.38 113.88 369.14 802.72 1135.60 0.510 0.560 0.890 2.070
0.90
(.035)
REF.
0.80
(.032)
REF.
0.90
(.035)
REF.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MM
(INCHES)
DIMENSIONS:
SRF2012 Series - Common Mode Chip Inductors
Soldering Profile
Electrical Schematic
275
225
175
125
75
N1
<1> Maximum of 10 seconds between
+255°C and +260°C
260°C peak
<1> 255°C
220°C
1
2
3
Ramp Down
6°C/second
maximum
4
190°C
60 - 90
seconds
N2
150°C
120 - 150 seconds
10 seconds minimum
Ramp Up
3°C/second maximum
25
0
50
100
150
200
250
300
Rev. 02/22/05
Time (seconds)
Packaging Specifications
2.0 0.5
(.079 .020)
178
(7.00)
DIA.
16.5
(.650)
13.0
(.512)
DIA.
21.0 0.8
(.827 .031)
50.0 - 0
(1.969 - 0)
13.0
(.512)
DIA.
14 + 0
(.551 + 0)
4.0
(.157)
4.0
(.157)
START
END
MM
(INCHES)
DIMENSIONS:
NO COMPONENT
200
(7.87)
NO COMPONENT
400
(15.75)
COMPONENTS
USER DIRECTION OF FEED
QTY: 2000 PCS. PER REEL
REV. 02/08
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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