SRU1063-1R6Y [BOURNS]

General Purpose Inductor, 1.6uH, 30%, 1 Element, Ferrite-Core, SMD, 3939, ROHS COMPLIANT;
SRU1063-1R6Y
型号: SRU1063-1R6Y
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

General Purpose Inductor, 1.6uH, 30%, 1 Element, Ferrite-Core, SMD, 3939, ROHS COMPLIANT

测试 功率感应器 电感器
文件: 总2页 (文件大小:327K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Applications  
Maximum height of 6.7 mm  
Current up to 8 A  
RoHS compliant*  
Input/output of DC/DC converters  
Power supplies for:  
• Portable communication equipment  
• Camcorders  
• LCD TVs  
• Car radios  
0
10  
SRU1063 Series - Shielded SMD Power Inductors  
Electrical Specifications  
General Specifications  
Test Voltage......................................0.1 V  
Inductance  
Test  
Freq.  
(MHz)  
I rms  
Max.  
(A)  
SRF  
Typ.  
RDC  
Max.  
(mΩ)  
I sat  
Typ.  
(A)  
Reflow Soldering.... 230 °C, 50 sec. max.  
Operating Temp........... -40 °C to +125 °C  
(Temperature rise included)  
@ 100 KHz  
Tol.  
Q
Bourns  
**K-  
Part Number  
Factor  
Ref.  
(MHz)  
L (µH)  
(%)  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
Storage Temperature .. -40 °C to +125 °C  
Resistance to Soldering Heat  
133  
95  
68  
49  
41  
33  
26  
22  
20  
15  
SRU1063-1R6Y  
SRU1063-2R2Y  
SRU1063-4R7Y  
SRU1063-100Y  
SRU1063-150Y  
SRU1063-220Y  
SRU1063-330Y  
SRU1063-470Y  
SRU1063-680Y  
SRU1063-101Y  
1.6  
2.2  
4.7  
10  
13  
10  
11  
14  
12  
15  
12  
10  
8
7.96  
7.96  
7.96  
2.52  
2.52  
2.52  
2.52  
2.52  
2.52  
2.52  
65  
65  
30  
18  
14  
10  
8
9
11  
14  
38  
42  
60  
105  
150  
210  
320  
8.00  
7.50  
5.50  
3.80  
3.20  
3.00  
2.20  
1.40  
1.20  
1.10  
10.00  
8.50  
5.70  
4.00  
3.40  
3.20  
2.40  
1.60  
1.35  
1.20  
...............................+260 °C for 10 sec.  
Materials  
15  
Core......................Ferrite DR and RI core  
Wire..............................Enameled copper  
Terminal......................................Ag/Ni/Sn  
Rated Current  
22  
33  
47  
6
.....................Ind. drop 35 % typ. at Isat  
Temperature Rise  
68  
5
100  
12  
4
.......................40 °C max. at rated Irms  
Packaging .....................500 pcs. per reel  
**K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(µH) x Δ I (peak-to-peak ripple current, A),  
determine core loss from Core Loss vs. Flux Density plot.  
Electrical Schematic  
Recommended Layout  
Product Dimensions  
REF.  
10.0 0.ꢀ0  
(.ꢀ94 .01ꢁ2  
1.80  
(.0712  
7.ꢁ0  
(.ꢁ8ꢀ2  
1.80  
(.0712  
REF.  
REF.  
1.80  
(.0712  
REF.  
10.0 0.ꢀ0  
(.ꢀ94 .01ꢁ2  
7.ꢁ0  
(.ꢁ8ꢀ2  
REF.  
ꢀ.80  
(.1502  
REF.  
6.50 0.ꢀ0  
1.80  
(.0712  
REF.  
(.ꢁ56 .01ꢁ2  
ꢀ.80  
(.1502  
REF.  
Core Loss vs. Flux Density  
10000  
7.90  
(.ꢀ112  
TYP.  
ꢀ.ꢀ0  
(.1ꢀ02  
TYP.  
1000  
100  
10  
ꢀ.40  
(.1ꢀ42  
TYP.  
1 MHz  
500 KHz  
300 KHz  
200 KHz  
100 KHz  
50 KHz  
ꢀ.ꢀ0  
(.1ꢀ02  
TYP.  
MM  
(INCHES2  
DIMENSIONS:  
1
*
RoHS Directive ꢁ00ꢁ/95/EC Jan. ꢁ7, ꢁ00ꢀ including  
annex and RoHS Recast ꢁ011/65/EU June 8, ꢁ011.  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data  
sheet can and do vary in different applications and  
actual device performance may vary over time.  
Users should verify actual device performance in their  
specific applications.  
0.1  
100  
1000  
10000  
Flux Density Bp-p (gauss)  
SRU1063 Series - Shielded SMD Power Inductors  
Packaging Specifications  
330  
(12.99)  
2.0 0.ꢀ  
(.079 .020)  
30.4  
(1.20)  
DIA.  
13.0 0.ꢀ  
21.0 0.ꢁ  
(.ꢁ27 .031)  
(.ꢀ12 .020)  
DIA.  
ꢀ0.0  
(1.969)  
13.0 0.ꢀ  
(.ꢀ12 .020)  
DIA.  
24  
(.945)  
26  
(1.02)  
4
(.157)  
END  
START  
4R7  
4R7  
4R7  
16  
(.63)  
NO COMPONENT  
200  
(7.874)  
NO COMPONENT  
400  
(15.748)  
COMPONENTS  
USER DIRECTION OF FEED  
QTY: 500 PCS. PER REEL  
MM  
DIMENSIONS:  
(INCHES)  
REV. 11/13  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  

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